LIGITEK LFD265-6A-XX-S1-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
FOUR DIGIT LED DISPLAY (0.28 Inch)
Pb
Lead-Free Parts
LFD265/6A-XX/S1-PF
DATA SHEET
DOC. NO
: QW0905- LFD265/6A-XX/S1-PF
REV.
:
DATE
: 29 - Jul. - 2006
A
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LFD265/6A-XX/S1-PF
Package Dimensions
LFD265/6A-XX/S1-PF
BIN GRADING
ORDER DATE CUSTOMER P/N
LAPLING
30.26(1.191")
6.1(0.24")
L3
DIG.1
7.0
(0.28")
DIG.2
L1 DIG.3
L2
DIG.4
10.0
(0.394")
7.62
(0.3")
ψ0.8(0.031")
A
F G
E
C
D
3.5± 0.5
ψ0.45
TYP
B
2.54X7=17.78
(0.7")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
DP
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LFD265/6A-XX/S1-PF
Internal Circuit Diagram
LFD265A-XX/S1-PF
13
15
2
6
5
16
7
A DIG.1
B
C
D
1
E
F
G
LFD266A-XX/S1-PF
13
15
2
6
5
16
7
A DIG.1
B
C
D
1
E
F
G
A DIG.2
B
C
D
14
E
F
G
A DIG.2
B
C
D
14
E
F
G
A DIG.3
B
C
D
11
E
F
G
A DIG.3
B
C
D
11
E
F
G
A DIG.4
B
C
D
8
E
F
G
A DIG.4
B
C
D
8
E
F
G
L1
L2
12
L1
L2
12
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LFD265/6A-XX/S1-PF
Electrical Connection
PIN NO.1
LFD265A-XX/S1-PF
PIN NO.1
LFD266A-XX/S1-PF
1
Common Cathode Dig.1
1
Common Anode Dig.1
2
Anode C
2
Cathode C
3
NO CONNECT
3
NO CONNECT
4
NO CONNECT
4
NO CONNECT
5
Anode E
5
Cathode E
6
Anode D
6
Cathode D
7
Anode G
7
Cathode G
8
Common Cathode Dig.4
8
Common Anode Dig.4
9
NO CONNECT
9
NO CONNECT
10
NO CONNECT
10
NO CONNECT
11
Common Cathode Dig.3
11
Common Anode Dig.3
12
Common Cathode L1,L2
12
Common Anode L1,L2
13
Anode A ,L1
13
Cathode A,L1
14
Common Cathode Dig.2
14
Common Anode Dig.2
15
Anode B,L2
15
Cathode B,L2
16
Anode F
16
Cathode F
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/8
PART NO. LFD265/6A-XX/S1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
9UG
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
60
mA
Power Dissipation Per Chip
PD
75
mW
Ir
10
μA
Electrostatic Discharge( * )
ESD
2000
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Part Selection And Application Information(Ratings at 25℃)
common
cathode
Material Emitted or anode
CHIP
PART NO
△λ
Iv(mcd)
Vf(v)
(nm)
IV-M
Min. Typ. Max. Min. Typ.
Common
Cathode
LFD265A-XX/S1-PF
AIGaINP
LFD266A-XX/S1-PF
Electrical
λD
(nm)
574
Green
20
1.7
2.1
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
5.0
8.5
2:1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD265/6A-XX/S1-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
λD
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Dominant Wavelength
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/8
PART NO. LFD265/6A-XX/S1-PF
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
1.0
2.0
3.0
4.0
1.0
5.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity @20mA
Normalize @25℃
Forward Voltage@20mA
Normaliz @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity @20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD265/6A-XX/S1-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260° C
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD265/6A-XX/S1-PF
Page 8/8
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11