LIGITEK LFD415-62-XX-SRP135-1-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
FOUR DIGIT LED DISPLAY(0.39Inch)
Pb
Lead-Free Parts
LFD415/62-XX/SRP135-1-PF
DATA SHEET
DOC. NO
:
QW0905- LFD415/62-XX/SRP135-1-PF
REV.
:
B
DATE
: 06 - Jun - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LFD415/62-XX/SRP135-1-PF
Package Dimensions
7.0
(0.276")
40.18(1.582")
10.0
(0.39")
DP1
DIG.1
DIG.2
DIG.3
DP3
DP2
DIG.4
12.8
(0.504")
10.16
(0.4")
LFD415/62-XX/SRP135-1-PF
LIGITEK
A
F
E
10.0
13.5±0.5
B
G
C
D
ψ0.45
TYP
2.54X7=17.78
(0.7")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
DP
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LFD415/62-XX/SRP135-1-PF
Internal Circuit Diagram
LFD4162-XX/SRP135-1-PF
LFD4152-XX/SRP135-1-PF
14
16
13
3
5
11
15
7
A
B DIG.
C
D
1
E
F
G
DP
A
B DIG.
C
D
2
E
F
G
DP
DP1
12
DP3
10
A
B DIG.
C
D
8
E
F
G
DP
A
B DIG.
C
D
1
E
F
G
DP
A
B DIG.
C
D
2
E
F
G
DP
DP1
2
DP2
A
B DIG.
C
D
6
E
F
G
DP
3
9
4
1
2
4
12
4
DP2
A
B DIG.
C
D
6
E
F
G
DP
9
1
14
16
13
3
5
11
15
7
DP3
3
10
A
B DIG.
C
D
8
E
F
G
DP
4
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LFD415/62-XX/SRP135-1-PF
Electrical Connection
PIN NO.
LFD4152-XX/SRP135-1-PF
PIN NO.
LFD4162-XX/SRP135-1-PF
1.
Common Cathode Dig. 1
1.
Common Anode Dig. 1
2.
Common Cathode Dig. 2
2.
Common Anode Dig. 2
3.
Anode D
3.
Cathode D
4.
Cathode DP1,DP2
4.
Anode DP1,DP2
5.
Anode E
5.
Cathode E
6.
Common Cathode Dig. 3
6.
Common Anode Dig.3 3
7.
Anode DP
7.
Cathode DP
8.
Common Cathode Dig. 4
8.
Common Anode Dig. 4
9.
Anode DP3
9.
Cathode DP3
10.
Cathode DP3
10.
Anode DP3
11.
Anode F
11.
Cathode F
12.
Anode DP1,DP2
12.
Cathode DP1,DP2
13.
Anode C
13.
Cathode C
14.
Anode A
14.
Cathode A
15.
Anode G
15.
Cathode G
16.
Anode B
16.
Cathode B
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/8
PART NO. LFD415/62-XX/SRP135-1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
G
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
120
mA
Power Dissipation Per Chip
PD
100
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃A
μ
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
common
cathode
or
anode
Material Emitted
CHIP
PART NO
λP
(nm)
△λ
Vf(v)
(nm)
Min.
Iv(mcd)
Typ. Max. Min.
IV-M
Typ.
Common
Cathode
LFD4152-XX/SRP135-1-PF
GaP
LFD4162-XX/SRP135-1-PF
Electrical
565
Green
30
1.7
2.1
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
1.75 3.05
2:1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD415/62-XX/SRP135-1-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λp
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD415/62-XX/SRP135-1-PF
Page 6/8
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.2 Relative Intensity vs. Forward Current
Fig.1 Forward current vs. Forward Voltage
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature(℃)
Ambient Temperature(℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
Fig.6 Directive Radiation
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD415/62-XX/SRP135-1-PF
Page 7/8
Wave soldering Profile
Temp(°C)
245° C 5sec Max
245°
5° /sec
max
120°
25°
3° /sec
max
Soldering
Soldering Iron:30W Max
Temperature 300 ° C Max
Soldering Time:3 Seconds Max
Distance:2mm Min(From solder joint to case)
Dip Soldering
Preheat: 120 ° C Max
Time(sec)
Preheat time: 120 seconds Max
Ramp-up
3° C/sec(max)
Ramp-Down:-5 ° C/sec(max)
Solder Bath:245 ° C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder joint to case)
Preheat
120 Seconds Max
Wave Soldering Profile (Pb Free)
Temp(°C)
265° C 5sec Max
265°
5° /sec
max
140°
25°
Soldering
Soldering Iron:30W Max
Temperature:350 ° CMax
Soldering Time:3seconds Max
Distance:2mm Min(From solder joint to case)
3° /sec
max
Preheat
120 Seconds Max
Dip Soldering
Preheat: 140° C Max
Preheat time: 120seconds Max
Time(sec) Ramp-up
3° C/sec(max)
Ramp-Down:-5 ° C/sec(max)
Solder Bath:265 ° C Max
Dipping Time:5 seconds Max
Distance:2mm Min(From solder joint to case)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/8
PART NO. LFD415/62-XX/SRP135-1-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11