LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY (0.4 lnch) Pb Lead-Free Parts LFD495/62-XX/RP4-PF DATA SHEET DOC. NO : QW0905-LFD495/62-XX/RP4-PF REV. : A DATE : 25 - Apr. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 1/8 Package Dimensions 39.2(1.543") DIG.1 DIG.2 DIG.3 10.16 (0.4") 6.4(0.252") DIG.4 10.28 (0.405") 12.9 (0.508") ψ1.4(0.055") A LFD495/62-XX/RP4-PF LIGITEK F B G E C D □0.45 TYP 4.0±0.5 2.54X5=12.7 (0.5") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 2/8 Internal Circuit Diagram LFD4952-XX/RP4-PF 11 7 4 2 1 10 5 3 A B C D E F G DP A B C D E F G DP A B C D E F G DP A B C D E F G DP DIG. 1 12 DIG. 2 9 DIG. 3 8 DIG. 4 6 LFD4962-XX/RP4-PF 11 7 4 2 1 10 5 3 A B C D E F G DP A B C D E F G DP A B C D E F G DP A B C D E F G DP DIG. 1 12 DIG. 2 9 DIG. 3 8 DIG. 4 6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LFD495/62-XX/RP4-PF Electrical Connection PIN NO. LFD4952-XX/RP4-PF PIN NO. LFD4962-XX/RP4-PF 1 Anode E 1 Cathode E 2 Anode D 2 Cathode D 3 Anode DP 3 Cathode DP 4 Anode C 4 Cathode C 5 Anode G 5 Cathode G 6 Common Cathode Dig.4 6 Common Anode Dig.4 7 Anode B 7 Cathode B 8 Common Cathode Dig.3 8 Common Anode Dig.3 9 Common Cathode Dig.2 9 Common Anode Dig.2 10 Anode F 10 Cathode F 11 Anode A 11 Cathode A 12 Common Cathode Dig.1 12 Common Anode Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT G Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 120 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO λP (nm) △λ Vf(v) (nm) Iv(mcd) Min. Typ. Max. Min. Typ. 1.7 2.1 2.6 1.0 IV-M Common Cathode LFD4952-XX/RP4-PF GaP LFD4962-XX/RP4-PF Electrical 565 Green 30 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 0.5 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 6/8 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 Fig.6 Directive Radiation 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 7/8 Wave soldering Profile Temp(°C) 245°C 5sec Max 245° 5° /sec max 120° 25° 3°/sec max Soldering Soldering Iron:30W Max Temperature 300 ° C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Dip Soldering Preheat: 120°C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3°C/sec(max) Ramp-Down:-5 ° C/sec(max) Solder Bath:245 ° C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) Preheat 120 Seconds Max Wave Soldering Profile (Pb Free) Temp(°C) 265°C 5sec Max 265° 5°/sec max 140° 25° Soldering Soldering Iron:30W Max Temperature:350 °CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) 3°/sec max Preheat 120 Seconds Max Dip Soldering Preheat: 140 °C Max Preheat time: 120seconds Max Time(sec) Ramp-up 3°C/sec(max) Ramp-Down:-5 ° C/sec(max) Solder Bath:265 °C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD495/62-XX/RP4-PF Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11