LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LRGB9553/S2/TR1 DATA SHEET DOC. NO : QW0905-LRGB9553/S2/TR1 REV. : B DATE : 21 - Dec. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Features: *. P-LCC-4 package. *. White package. *. Silicon package. *. Optical indicator. *. Colorless clear window. *. Ideal for backlight and light pipe application. *. Inter reflector. *. Low (5mA) current operation. *. Wide viewing angle. *. Suitable for vapor-phase reflow,Inflow and wave solder processes. *. Computable with automatic placement equipment.. *. Available on tape and reel(9mm Tape). Descriptions: *.The LRGB9553 series is available in soft orange,red,green,blue and yellow. Due to the package design, the LED has wide viewing angle and optimized light xoupling by inter reflector. This feature makes the SMT TOP LED ideal for light pipe application.The low current requirement makes this device ideal for portable equipment or any other application where power is at a premium. Applications: *. Automotive:backlighting in dashboard and switch *. Telecommunication:indicator and backlighting in telephone and fax. *. Flat backlight for LCD's, switches and symbols. *. Light pipe application. *. General use. Page 1/10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/10 PART NO. LRGB9553/S2/TR1 Package Dimensions 3.5 3.2 3 0.7±0.05 B 1.95 2 G 2.6 0.7±0.05 2.8 R 4 0.7±0.05 1 2.2 0.7±0.05 0.6 1.95 1.05 Common Anode 4 + 1.5 0.9 0.9 1 2 3 1.Cathode Red 2.Cathode Green 3.Cathode Blue 4.Common Anode R G B Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0±0.2 2.0 0.23 1.55 1.75 5.5±0.2 12.0±0.3 4.06 9.3 4.0±0.5 3.12 Note : The tolerances unless mentioned is ± 0.2mm, Unit=mm. 2.24 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page 3/10 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2±1.0 74.0±1.5 Part No. Description Quantity/Reel LRGB9553/S2/TR1 12.0mm tape,7"reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page 4/10 Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Symbol Parameter UNIT URH DGM DBK Forward Current IF 50 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 100 100 mA Power Dissipation PD 130 120 120 mW Reverse Current @5V Ir 10 50 50 μA Electrostatic Discharge ESD 2000 1000 1000 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP/GaP Red LRGB9553/S2/TR1 InGaN/GaN Green InGaN/GaN Blue Peak Dominant wave wave length length λPnm λDnm Spectral halfwidth △λnm Forward voltage @5mA(V) Luminous Viewing intensity angle @5mA(mcd) 2 θ 1/2 (deg) Min. Typ. Max. Min. Typ. Lens --Water Clear 518 --- 630 20 1.7 ---- 2.6 32 80 120 525 36 ---- 3.0 3.5 80 160 120 470 30 ---- 3.0 3.5 12.5 30 120 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page5/10 Typical Electro-Optical Characteristics Curve UR(H) CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 1.5 2.5 3.0 1 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 1000 Forward Current(mA) Forward Voltage(V) -40 100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Fig.6 Directive Radiation 1.0 0° -30° 0.5 30° -60° 60 ° 0.0 550 600 650 Wavelength (nm) 700 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page6/10 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 2.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation 1.0 Relative Intensity@20mA 100 0° -30 ° 30 ° -60° 0.5 0.0 100% 75% 50% 450 500 550 Wavelength (nm) 600 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page 7/10 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 10 1 2.5 2.0 1.5 1.0 0.5 01 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 1000 Forward Current(mA) Forward Voltage(V) -40 100 80 3.0 2.5 2.0 1.5 1.0 100 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directive Radiation Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 0° -30° 1.0 30 ° -60 ° 60 ° 0.5 100% 75% 50% 0.0 400 450 500 Wavelength (nm) 550 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page 8/10 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150 ℃ 120 ~ 180 sec 3. LEAD Reflow Solder Temp. (℃) 240 Rising +5 ℃/sec Cooling -5℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 4. PB-Free Reflow Solder 1~5°C/sec Preheat 180~200 °C 1~5° C/sec 260° C MaX. 10sec.Max Above 220 °C 60 sec.Max. 120 sec.Max. Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page 9/10 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LRGB9553/S2/TR1 Page 10/10 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=65 ℃±5℃ 3.RH=90 %~95% 4.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling Solderability Test 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5℃ & -40 ℃±5℃ (10min) (10min) 3.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Immersion rate 25 ±2.5mm/sec 4.Immersion rate 25 ±2.5mm/sec 5.Coverage ≧95% of the dipped surface MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 1.105 ℃ ~ 25℃ ~ 55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Ramp-up rate(183 ℃ to Peak) +3 ℃ second max Temp. maintain at 125( ±25) ℃ 120 seconds max Temp. maintain above 183 ℃ 60-150 seconds Peak temperature range 235 ℃+5-0 ℃ Time within 5 ℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 ℃/second max MIL-STD-750D:2031.2 J-STD-020