LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (0.39Inch) Pb Lead-Free Parts LSD355/6SBKS-XX/S3 DATA SHEET DOC. NO : QW0905- LSD355/6SBKS-XX/S3 REV. : A DATE : 03 - Jun.-2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 1/8 Package Dimensions LSD355/6SBKS-XX/S3 LIGITEK PIN NO.1 7.0(0.275") 9.85(0.39") 7.62 12.9 (0.506") 10.0 (0.394") ψ1.2 11.0±0.5 3.38±0.5 0.45 TYP. 7.62 (0.3") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54X4= 10.16 (0.4") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 2/8 Internal Circuit Diagram LSD355SBKS-XX/S3 3,8 A B 10 9 C D 7 5 E F 4 2 G DP 1 6 LSD356SBKS-XX/S3 3,8 A B 10 9 C D 7 5 E F 4 2 G DP 1 6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LSD355/6SBKS-XX/S3 Electrical Connection PIN NO.1 LSD355SBKS-XX/S3 PIN NO.1 LSD356SBKS-XX/S3 1 Anode G 1 Cathode G 2 Anode F 2 Cathode F 3 Common Cathode 3 Common Anode 4 Anode E 4 Cathode E 5 Anode D 5 Cathode D 6 Anode DP 6 Cathode DP 7 Anode C 7 Cathode C 8 Common Cathode 8 Common Anode 9 Anode B 9 Cathode B 10 Anode A 10 Cathode A LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT SBKS Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 120 mW Ir 50 μA Electrostatic Discharge( * ) ESD 500 V Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO △λ Vf(v) (nm) Iv(mcd) Typ. Max. 3.5 4.2 IV-M Min. Typ. Common Cathode LSD355SBKS-XX/S3 475 InGaN/SiC Bule LSD356SBKS-XX/S3 Electrical λD (nm) 26 Common Anode Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 7.2 12.8 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Dominant Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 6/8 Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.2 Relative Intensity vs. Forward Current 30 1.5 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 1 2 3 4 1.25 1.0 0.75 0.5 0.25 0 5 0 5 Relative Intensity@20mA Forward Current@20mA 40 30 20 10 0 50 75 Ambient Temperature( ℃) 20 25 30 Fig.4 Relative Intensity vs. Wavelength Fig.3 Forward Current vs. Temperature 25 15 Forward Current(mA) Forward Voltage(V) 0 10 100 1.0 0.5 0 380 430 480 530 580 Wavelength (nm) 630 680 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD355/6SBKS-XX/S3 Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11