LIGITEK LSE2041-TRF-X

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
LSE2041/TRF-X
DATA SHEET
DOC. NO :
QW0905- LSE2041/TRF-X
REV.
:
A
DATE
:
14 - Jun. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE2041/TRF-X
Page 1/6
Package Dimensions
ΔH
P2
H2
H1 H
W2
L W0
W1 W3
P1 F
D
-
+
P
T
LSE2041
3.0
4.0
4.2
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LSE2041/TRF-X
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SE
Forward Current
IF
20
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
80
mA
Power Dissipation
PD
80
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR
PART NO
MATERIAL
Emitted
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @ 20mA(V)
λPnm
Min. Max. Min. Typ.
Lens
LSE2041/TRF-X GaAsP/GaP Orange Orange Transparent
Luminous Viewing
intensity
angle
@10mA(mcd) 2θ 1/2
(deg)
610
45
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
12
30
30
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE2041/TRF-X
Page 3/6
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Maximum
Minimum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
4.8
0.19
5.8
0.23
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
Height Of Seating Plane
-------
H
15.5
0.61
16.5
0.65
TRF-1
17.5
0.69
19.5
0.77
TRF-2
19.0
0.75
21.0
0.83
TRF-3
22.5
0.89
24.5
0.96
TRF-4
25.5
1.0
26.5
1.04
TRF-5
21.5
0.85
22.5
0.89
20.2
0.8
21.2
0.83
TRF-7
17.125
0.67
21.125
0.83
TRF-8
20.0
0.79
22.5
0.89
TRF-9
26.0
1.02
28.0
1.1
TRF-11
24.0
0.94
26.0
1.02
TRF-12
21.0
0.83
23.0
0.91
-------
36
1.42
11.0
0.43
Feed Hole To Bottom Of Component
TRF-6
Feed Hole To Overall Component Height
H1
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
3.15
0.12
4.55
0.18
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
-------
W0
REMARK:TRF=Tape And Reel Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Reel Diameter
D
78.2
3.08
380
14.96
Core Diameter
D1
34.9
1.37
102
4.02
Hub Recess Inside Diameter
D2
28.6
1.13
88.0
3.46
Arbor Hole Diameter
D3
13.8
0.54
38.1
1.5
Overall Reel Thickness
T
---
---
57.2
2.25
Iside Reel Flange Thickness
T1
30.0
1.18
50.0
1.97
LSE2041/TRF-X
2000PCS
MARKING
D3
D2
D1
D
T1 T2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE2041/TRF-X
Page 4/6
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
4.8
0.19
5.8
0.23
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
Height Of Seating Plane
-------
H
15.5
0.61
16.5
0.65
TRF-13
19.0
0.75
20.0
0.79
TRF-14
21.7
0.85
23.7
0.93
TRF-15
22.5
0.89
23.5
0.93
TRF-16
17.5
0.69
18.0
TRF-17
18.5
0.73
19.5
0.77
20.5
0.81
21.5
0.85
TRF-19
25.5
1.0
27.5
1.08
TRF-20
20.5
0.81
22.5
0.89
TRF-21
25.0
0.98
27.0
1.06
TRF-22
22.0
0.87
23.0
0.91
-------
36
1.42
11.0
0.43
Feed Hole To Bottom Of Component
TRF-18
Feed Hole To Overall Component Height
H1
0.71
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
3.15
0.12
4.55
0.18
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
-------
W0
REMARK:TRF=Tape And Reel Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Reel Diameter
D
78.2
3.08
380
14.96
Core Diameter
D1
34.9
1.37
102
4.02
Hub Recess Inside Diameter
D2
28.6
1.13
88.0
3.46
Arbor Hole Diameter
D3
13.8
0.54
38.1
1.5
Overall Reel Thickness
T
---
---
57.2
2.25
Iside Reel Flange Thickness
T1
30.0
1.18
50.0
1.97
LSE2041/TRF-X
2000PCS
MARKING
D3
D2
D1
D
T1 T2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSE2041/TRF-X
Page5/6
Typical Electro-Optical Characteristics Curve
SE CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
5.0
1.0
10
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize @25℃
1.2
Forward Voltage@20mA
Normalize @25℃
100
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
2.5
2.0
1.5
1.0
0.5
0.0
100
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
Relative Intensity@20mA
1.0
0°
-30°
0.5
30°
-60°
60°
0.0
550
600
650
Wavelength (nm)
700
750
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/6
PART NO. LSE2041/TRF-X
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11