STMICROELECTRONICS M34C02

M34C02
2 Kbit Serial I²C Bus EEPROM
For DIMM Serial Presence Detect
■
Two Wire I2C Serial Interface
Supports 400 kHz Protocol
■
Single Supply Voltage:
– 2.5V to 5.5V for M34C02-W
8
– 2.2V to 5.5V for M34C02-L
■
Software Data Protection for lower 128 bytes
■
BYTE and PAGE WRITE (up to 16 bytes)
■
RANDOM and SEQUENTIAL READ Modes
■
Self-Timed Programming Cycle
■
Automatic Address Incrementing
■
Enhanced ESD/Latch-Up Protection
■
1 Million Erase/Write Cycles (minimum)
■
40 Year Data Retention (minimum)
DESCRIPTION
The M34C02 is a 2 Kbit serial EEPROM memory
able to lock permanently the data in its first half
(from location 00h to 7Fh). This facility has been
designed specifically for use in DRAM DIMMs
(dual interline memory modules) with Serial
Presence Detect. All the information concerning
the DRAM module configuration (such as its
access speed, its size, its organization) can be
kept write protected in the first half of the memory.
This bottom half of the memory area can be writeprotected using a specially designed software
write protection mechanism. By sending the
device a specific sequence, the first 128 bytes of
1
PSDIP8 (BN)
0.25 mm frame
8
8
1
1
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
Figure 1. Logic Diagram
VCC
3
Table 1. Signal Names
E0, E1, E2
Chip Enable Inputs
SDA
Serial Data/Address Input/
Output
E0-E2
SCL
SCL
Serial Clock
WC
Write Control
VCC
Supply Voltage
VSS
Ground
December 1999
SDA
M34C02
WC
VSS
AI01931
1/19
M34C02
Figure 2B. SO and TSSOP Connections
Figure 2A. DIP Connections
M34C02
E0
E1
E2
VSS
1
2
3
4
8
7
6
5
M34C02
VCC
WC
SCL
SDA
E0
E1
E2
VSS
AI01932
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI01933
the memory become permanently write protected.
Care must be taken when using this sequence as
its effect cannot be reversed. In addition, the
device allows the entire memory area to be write
protected, using the WC input (for example by
tieing this input to V CC).
The M34C02 is a 2 Kbit electrically erasable programmable memory (EEPROM), organized as
256x8 bits, fabricated with STMicroelectronics’
High Endurance, Advanced, CMOS technology.
This guarantees an endurance typically well
above one million Erase/Write cycles, with a data
retention of 40 years. These memory devices
operate with a power supply down to 2.2 V for the
M34C02-L.
The M34C02 is available in Plastic Dual In-line,
Plastic Small Outline and Thin Shrink Small
Outline packages.
These memory devices are compatible with the
I2C memory standard. This is a two wire serial
interface that uses a bi-directional data bus and
serial clock. The memory carries a built-in 4-bit
Device Type Identifier code (1010) in accordance
with the I2C bus definition to access the memory
area and a second Device Type Identifier Code
(0110) to access the Protection Register. These
codes are used together with three chip enable
inputs (E2, E1, E0) so that up to eight 2 Kbit
devices may be attached to the I²C bus and
selected individually.
The memory behaves as a slave device in the I2C
protocol, with all memory operations synchronized
by the serial clock. Read and Write operations are
initiated by a START condition, generated by the
bus master. The START condition is followed by a
Device Select Code and RW bit (as described in
Table 3), terminated by an acknowledge bit.
When writing data to the memory, the memory
inserts an acknowledge bit during the 9th bit time,
following the bus master’s 8-bit transmission.
Table 2. Absolute Maximum Ratings 1
Symbol
Value
Unit
Ambient Operating Temperature
-40 to 85
°C
TSTG
Storage Temperature
-65 to 150
°C
TLEAD
Lead Temperature during Soldering
260
215
215
°C
TA
Parameter
PSDIP8: 10 sec
SO8: 40 sec
TSSOP8: 40 sec
VIO
Input or Output range
-0.6 to 6.5
V
VCC
Supply Voltage
-0.3 to 6.5
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
4000
V
Note: 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the ST SURE Program and other relevant quality documents.
2. MIL-STD-883C, 3015.7 (100 pF, 1500 Ω)
2/19
M34C02
When data is read by the bus master, the bus
master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a STOP condition after an Ack for WRITE, and
after a NoAck for READ.
Power On Reset: V CC Lock-Out Write Protect
In order to prevent data corruption and inadvertent
write operations during power up, a Power On
Reset (POR) circuit is included. The internal reset
is held active until the V CC voltage has reached
the POR threshold value, and all operations are
disabled – the device will not respond to any
command. In the same way, when V CC drops from
the operating voltage, below the POR threshold
value, all operations are disabled and the device
will not respond to any command. A stable and
valid VCC must be applied before applying any
logic signal.
SIGNAL DESCRIPTION
Serial Clock (SCL)
The SCL input pin is used to strobe all data in and
out of the memory. In applications where this line
is used by slaves to synchronize the bus to a
slower clock, the master must have an open drain
output, and a pull-up resistor must be connected
from the SCL line to VCC. (Figure 3 indicates how
the value of the pull-up resistor can be calculated).
In most applications, though, this method of
synchronization is not employed, and so the pullup resistor is not necessary, provided that the
master has a push-pull (rather than open drain)
output.
Serial Data (SDA)
The SDA pin is bi-directional, and is used to
transfer data in or out of the memory. It is an open
drain output that may be wire-OR’ed with other
open drain or open collector signals on the bus. A
pull up resistor must be connected from the SDA
bus to V CC. (Figure 3 indicates how the value of
the pull-up resistor can be calculated).
Chip Enable (E2, E1, E0)
These chip enable inputs are used to set the value
that is to be looked for on the three least significant
bits (b3, b2, b1) of the 7-bit device select code.
These inputs may be driven dynamically or tied to
VCC or VSS to establish the device select code.
Write Control (WC)
A hardware Write Control (WC, pin 7) is provided
for protecting the contents of the whole memory
from erroneous erase/write cycles. The Write
Control signal is used to enable (WC=V IL) or
disable (WC=VIH) write instructions to the entire
memory area or to the Protection Register.
When WC is tied to V SS or left unconnected, the
write protection of the first half of the memory is
determined by the status of the Protection
Register.
DEVICE OPERATION
The memory device supports the I2C protocol.
This is summarized in Figure 4. Any device that
sends data on to the bus is defined to be a
transmitter, and any device that reads the data to
be a receiver. The device that controls the data
transfer is known as the master, and the other as
the slave. A data transfer can only be initiated by
the master, which will also provide the serial clock
for synchronization. The memory device is always
a slave device in all communication.
Figure 3. Maximum R L Value versus Bus Capacitance (CBUS) for an I2C Bus
VCC
Maximum RP value (kΩ)
20
16
RL
12
RL
SDA
MASTER
8
fc = 100kHz
4
fc = 400kHz
CBUS
SCL
CBUS
0
10
100
1000
CBUS (pF)
AI01665
3/19
M34C02
Figure 4. I2C Bus Protocol
SCL
SDA
START
CONDITION
SCL
1
SDA
MSB
SDA
INPUT
2
SDA
CHANGE
STOP
CONDITION
3
7
8
9
ACK
START
CONDITION
SCL
1
SDA
MSB
2
3
7
8
9
ACK
STOP
CONDITION
AI00792
Stop Condition
STOP is identified by a low to high transition of the
SDA line while the clock SCL is stable in the high
state.
A
STOP
condition
terminates
communication between the memory device and
the bus master. A STOP condition at the end of a
Read command, provided that it is followed by a
NoAck, forces the memory device into its standby
state. A STOP condition at the end of a Write
Start Condition
START is identified by a high to low transition of
the SDA line while the clock, SCL, is stable in the
high state. A START condition must precede any
data transfer command. The memory device
continuously
monitors
(except
during
a
programming cycle) the SDA and SCL lines for a
START condition, and will not respond unless one
is given.
Table 3. Device Select Code 1
Device Type Identifier
Chip Enable
RW
b7
b6
b5
b4
b3
b2
b1
b0
Memory Area Select Code (two arrays)
1
0
1
0
E2
E1
E0
RW
Protection Register Select Code
0
1
1
0
E2
E1
E0
RW
Note: 1. The most significant bit (b7) is sent first.
4/19
M34C02
Table 4. Operating Modes
Mode
Current Address Read
RW bit
WC 1
Bytes
1
X
1
0
X
Random Address Read
Initial Sequence
START, Device Select, RW = ‘1’
START, Device Select, RW = ‘0’, Address
1
1
X
reSTART, Device Select, RW = ‘1’
Sequential Read
1
X
≥1
Byte Write
0
VIL
1
START, Device Select, RW = ‘0’
Page Write
0
VIL
≤ 16
START, Device Select, RW = ‘0’
Similar to Current or Random Address Read
Note: 1. X = VIH or VIL.
command triggers the internal EEPROM write
cycle.
Acknowledge Bit (ACK)
An acknowledge signal is used to indicate a
successful byte transfer. The bus transmitter,
whether it be master or slave, releases the SDA
bus after sending eight bits of data. During the 9th
clock pulse period, the receiver pulls the SDA bus
low to acknowledge the receipt of the eight data
bits.
Data Input
During data input, the memory device samples the
SDA bus signal on the rising edge of the clock,
SCL. For correct device operation, the SDA signal
must be stable during the clock low-to-high
transition, and the data must change only when
the SCL line is low.
Memory Addressing
To start communication between the bus master
and the slave memory, the master must initiate a
START condition. Following this, the master sends
the 8-bit byte, shown in Table 3, on the SDA bus
line (most significant bit first). This consists of the
7-bit Device Select Code, and the 1-bit Read/Write
Designator (RW). The Device Select Code is
further subdivided into: a 4-bit Device Type
Identifier, and a 3-bit Chip Enable “Address” (E2,
E1, E0).
To address the memory array, the 4-bit Device
Type Identifier is 1010b. To address the Protection
Register, it is 0110b.
If all three chip enable inputs are connected, up to
eight memory devices can be connected on a
single I 2C bus. Each one is given a unique 3-bit
code on its Chip Enable inputs. When the Device
Select Code is received on the SDA bus, the
memory only responds if the Chip Select Code is
the same as the pattern applied to its Chip Enable
pins.
The 8th bit is the read or write bit (RW). This bit is
set to ‘1’ for read and ‘0’ for write operations. If a
match occurs on the Device Select Code, the
corresponding memory gives an acknowledgment
on the SDA bus during the 9 th bit time. If the
memory does not match the Device Select code, it
will deselect itself from the bus, and go into standby mode.
Write Operations
Following a START condition the master sends a
Device Select Code with the RW bit set to ’0’, as
shown in Table 4. The memory acknowledges this,
and waits for an address byte. The memory
responds to the address byte with an acknowledge
bit, and then waits for the data byte.
Writing to the memory may be inhibited if the WC
input pin is taken high.
Byte Write
In the Byte Write mode, after the Device Select
Code and the address byte, the master sends one
data byte. If the addressed location is in a write
protected area, the memory replies with a NoAck,
and the location is not modified. If, instead, the
addressed location is not in a write protected area,
the memory replies with an Ack. The master
terminates the transfer by generating a STOP
condition.
Page Write
The Page Write mode allows up to 16 bytes to be
written in a single write cycle, provided that they
are all located in the same ’row’ in the memory:
that is the most significant memory address bits
(b7-b4) are the same. If more bytes are sent than
will fit up to the end of the row, a condition known
as ‘roll-over’ occurs. Data starts to become
overwritten (in a way not formally specified in this
data sheet).
The master sends from one up to 16 bytes of data,
each of which is acknowledged by the memory if
the WC pin is low. If the WC pin is high, the
contents of the addressed memory location are
not modified. After each byte is transferred, the
internal byte address counter (the 4 least
5/19
M34C02
Figure 5. How to Set the Write Protection
FFh
FFh
Standard
Array
Memory
Area
Standard
Array
80h
7Fh
Write
Protected
Array
Standard
Array
00h
80h
7Fh
00h
State of the EEPROM memory
area after write access
to the Protect Register
Default EEPROM memory area
state before write access
to the Protect Register
AI01936C
Figure 6. Write Mode Sequences in the Non Write-Protected Area
ACK
BYTE ADDR
DATA IN
R/W
ACK
ACK
DEV SEL
START
PAGE WRITE
ACK
STOP
DEV SEL
START
BYTE WRITE
ACK
BYTE ADDR
ACK
DATA IN 1
DATA IN 2
R/W
ACK
ACK
STOP
DATA IN N
AI01941
significant bits only) is incremented. The transfer is
terminated by the master generating a STOP
condition.
When the master generates a STOP condition
immediately after the Ack bit (in the “10 th bit” time
slot), either at the end of a byte write or a page
write, the internal memory write cycle is triggered.
A STOP condition at any other time does not
trigger the internal write cycle.
During the internal write cycle, the SDA input is
disabled internally, and the device does not
respond to any requests.
6/19
Minimizing System Delays by Polling On ACK
During the internal write cycle, the memory
disconnects itself from the bus, and copies the
data from its internal latches to the memory cells.
The maximum write time (tw) is shown in Table 9,
but the typical time is shorter. To make use of this,
an Ack polling sequence can be used by the
master.
M34C02
Figure 7. Write Cycle Polling Flowchart using ACK
WRITE Cycle
in Progress
START Condition
DEVICE SELECT
with RW = 0
NO
First byte of instruction
with RW = 0 already
decoded by M34C02
ACK
Returned
YES
NO
Next
Operation is
Addressing the
Memory
YES
Send
Byte Address
ReSTART
STOP
Proceed
WRITE Operation
Proceed
Random Address
READ Operation
AI01934
CONTROL
BYTE
WORD
ADDRESS
STOP
BUS ACTIVITY
MASTER
START
Figure 8. Setting the Write Protection Register (WC = 0)
DATA
SDA LINE
BUS ACTIVITY
ACK
ACK
VALUE
DON'T CARE
ACK
VALUE
DON'T CARE
AI01935
7/19
M34C02
The sequence, as shown in Figure 7, is:
– Initial condition: a Write is in progress.
– Step 1: the master issues a START condition
followed by a Device Select Code (the first byte
of the new instruction).
– Step 2: if the memory is busy with the internal
write cycle, no Ack will be returned and the
master goes back to Step 1. If the memory has
terminated the internal write cycle, it responds
with an Ack, indicating that the memory is ready
to receive the second part of the next instruction
(the first byte of this instruction having been sent
during Step 1).
Setting the Protection, Using the Protection
Register
The M34C02 has a software write-protection
function, using the Protecton Register, that allows
the bottom half of the memory area (addresses
00h to 7Fh) to be permanently write protected. The
write protection feature is activated by writing once
to the Protection Register (with the WC input held
at VSS).
The Protection Register is accessed with the
device select code set to 0110b (as shown in
Table 3), and the E2-E1-E0 bits set according to
the states being applied to the E2-E1-E0 pins. As
Figure 9. Read Mode Sequences
ACK
DATA OUT
STOP
START
DEV SEL
NO ACK
R/W
ACK
START
DEV SEL *
ACK
BYTE ADDR
R/W
ACK
START
DEV SEL
DATA OUT
R/W
ACK
ACK
DATA OUT 1
NO ACK
DATA OUT N
R/W
ACK
START
DEV SEL *
ACK
BYTE ADDR
R/W
ACK
ACK
DEV SEL *
START
SEQUENTIAL
RANDOM
READ
DEV SEL *
NO ACK
STOP
SEQUENTIAL
CURRENT
READ
ACK
START
RANDOM
ADDRESS
READ
STOP
CURRENT
ADDRESS
READ
ACK
DATA OUT 1
R/W
NO ACK
STOP
DATA OUT N
AI01942
Note: 1. The seven most significant bits of the Device Select Code of a Random Read (in the 1 st and 3rd bytes) must be identical.
8/19
M34C02
for any other write command, the WC input needs
to be held at V SS. Address and data bytes must be
sent with this command, but their values are all
ignored, and are treated as Don’t Care. Once the
Protection Register has been written, the write
protection of the first 128 bytes of the memory is
enabled, and it is not possible to unprotect these
128 bytes, even if the device is powered off and
on, and regardless the state of the WC input.
When the Protection Register has been written,
the M34C02 no longer responds to the device type
identifier 0110b in either read or write mode.
Read Operations
Read operations are performed independently of
the state of the WC pin.
Random Address Read
A dummy write is performed to load the address
into the address counter, as shown in Figure 9.
Then, without sending a STOP condition, the
master sends another START condition, and
repeats the Device Select Code, with the RW bit
set to ‘1’. The memory acknowledges this, and
outputs the contents of the addressed byte. The
master must not acknowledge the byte output, and
terminates the transfer with a STOP condition.
Current Address Read
The device has an internal address counter which
is incremented each time a byte is read. For the
Current Address Read mode, following a START
condition, the master sends a Device Select Code
with the RW bit set to ‘1’. The memory
acknowledges this, and outputs the byte
addressed by the internal address counter. The
counter is then incremented. The master
terminates the transfer with a STOP condition, as
shown in Figure 9, without acknowledging the byte
output.
Table 5. 168 Pin DRAM DIMM Connections
DIMM Position
E2
(pin 167)
E1
(pin 166)
E0
(pin 165)
0
VSS
VSS
VSS
1
VSS
VSS
VCC
2
VSS
VCC
VSS
3
VSS
VCC
VCC
4
VCC
VSS
VSS
5
VCC
VSS
VCC
6
VCC
VCC
VSS
7
VCC
VCC
VCC
Sequential Read
This mode can be initiated with either a Current
Address Read or a Random Address Read. The
master does acknowledge the data byte output in
this case, and the memory continues to output the
next byte in sequence. To terminate the stream of
bytes, the master must not acknowledge the last
byte output, and must generate a STOP condition.
The output data comes from consecutive
addresses, with the internal address counter
automatically incremented after each byte output.
After the last memory address, the address
counter ‘rolls-over’ and the memory continues to
output data from address 00h (at the start of the
memory block).
Acknowledge in Read Mode
In all read modes, the memory waits, after each
byte read, for an acknowledgment during the 9th
bit time. If the master does not pull the SDA line
low during this time, the memory terminates the
data transfer and switches to its standby state.
USE WITHIN A DRAM DIMM
In the application, the M34C02 is soldered directly
in the printed circuit module. The 3 Chip Enable
inputs (pins 1, 2 and 3) are connected to pins 165,
166 and 167, respectively, of the 168-pin DRAM
DIMM module. They are wired at VCC or VSS
through the DIMM socket (see Table 5). The SCL
and SDA lines (pins 6 and 5) are connected
respectively to pins 83 and 82 of the memory
module. The pull-up resistors needed for normal
behavior of the I2C bus are connected on the I2C
bus of the mother-board (as shown in Figure 10).
The Write Control input of the M34C02 (WC on pin
7) can be left unconnected. However, connecting
it to V SS is recommended, to maintain full read and
write access to the top half of the memory.
Programming the M34C02
When the M34C02 is delivered, full read and write
access is given to the whole memory array. It is
recommended that the first step is to use the test
equipment to write the module information (such
as its access speed, its size, its organization) to
the first half of the memory, starting from the first
memory location. When the data has been
validated, the test equipment can send a Write
command to the Protection Register, using the
device select code ’01100000b’ followed by an
address and data byte (made up of Don’t Care
values) as shown in Figure 8. The first 128 bytes
of the memory area are then write-protected, and
the M34C02 will no longer respond to the specific
device select code ’0110000xb’. It is not possible
to reverse this sequence.
9/19
M34C02
Figure 10. Serial Presence Detect Block Diagram
R = 4.7kΩ
DIMM Position 7
E2
E1
E0
SCL SDA
E0
SCL SDA
VCC
DIMM Position 6
E2
E1
VCC
VSS
DIMM Position 5
E2
E1
E0
SCL SDA
VCC VSS VCC
DIMM Position 4
E2
E1
VCC
E0
SCL SDA
VSS
DIMM Position 3
E2
E1
VSS
E0
SCL SDA
VCC
DIMM Position 2
E2
E1
E0
SCL SDA
VSS VCC VSS
DIMM Position 1
E2
E1
VSS
E0
SCL SDA
VCC
DIMM Position 0
E2
E1
E0
SCL SDA
VSS
SCL line
AI01937
SDA line
From the motherboard
I2C master controller
Note: 1. E0, E1 and E2 are wired at each DIMM socket in a binary sequence for a maximum of 8 devices.
2. Common clock and common data are shared across all the devices.
3. Pull-up resistors are required on all SDA and SCL bus lines (typically 4.7 kΩ) because these lines are open drain when used as
outputs.
10/19
M34C02
Table 6. DC Characteristics
(TA = –40 to 85 °C; VCC = 2.5 to 5.5 V, 2.2 to 5.5 V)
Symbol
Parameter
Test Condition
Max.
Unit
0 V ≤ VIN ≤ VCC
±2
µA
0 V ≤ VOUT ≤ VCC, SDA in Hi-Z
±2
µA
VCC =5V, fc=400kHz (rise/fall time < 30ns)
2
mA
-W series VCC =2.5V, fc=400kHz (rise/fall time < 30ns)
1
mA
-L series VCC =2.2V, fc=400kHz (rise/fall time < 30ns)
1
mA
VIN = VSS or VCC , VCC = 5 V
1
µA
-W series
VIN = VSS or VCC , VCC = 2.5 V
0.5
µA
-L series
VIN = VSS or VCC , VCC = 2.2 V
0.5
µA
ILI
Input Leakage
Current
ILO
Output Leakage Current
SCL, SDA
-W or -L series
ICC
Supply Current
-W or -L series
Supply Current
(Stand-by)
ICC1
Input Low
Voltage
VIL
Input High
Voltage
VIH
SCL, SDA
– 0.3
0.3VCC
V
E0, E1, E2
– 0.3
0.3VCC
V
WC
– 0.3
0.5
V
SCL, SDA
0.7VCC
VCC+1
V
E0, E1, E2
0.7VCC
VCC+1
V
WC
0.7VCC
VCC+1
V
IOL = 3 mA, VCC = 5 V
0.4
V
-W series
IOL = 2.1 mA, VCC = 2.5 V
0.4
V
-L series
IOL = 2.1 mA, VCC = 2.2 V
0.4
V
-W or -L series
Output Low
Voltage
VOL
Min.
Table 7. AC Measurement Conditions
Figure 11. AC Testing Input Output Waveforms
≤ 50 ns
Input Rise and Fall Times
0.8VCC
Input Pulse Voltages
0.2VCC to 0.8VCC
Input and Output Timing
Reference Voltages
0.3VCC to 0.7VCC
0.7VCC
0.3VCC
0.2VCC
AI00825
Table 8. Input Parameters 1(T A = 25 °C, f = 400 kHz)
Symbol
Parameter
Test Condition
Min.
Max.
Unit
CIN
Input Capacitance (SDA)
8
pF
CIN
Input Capacitance (other pins)
6
pF
20
kΩ
ZWCL
WC Input Impedance
VIN < 0.5 V
5
ZWCH
WC Input Impedance
VIN > 0.7VCC
500
tNS
Low Pass Filter Input Time
Constant (SCL and SDA)
100
kΩ
500
ns
Note: 1. Sampled only, not 100% tested.
11/19
M34C02
Table 9. AC Characteristics
Symbol
Alt.
Parameter
M34C02-W
M34C02-L
VCC=2.5 to 5.5V
TA = –40 to 85°C
VCC=2.2 to 5.5V
TA = –40 to 85°C
Min
Max
Min
Unit
Max
tCH1CH2
tR
Clock Rise Time
300
300
ns
tCL1CL2
tF
Clock Fall Time
300
300
ns
tDH1DH2 2
tR
SDA Rise Time
20
300
20
300
ns
tDL1DL2 2
tF
SDA Fall Time
20
300
20
300
ns
tCHDX 1
tSU:STA
Clock High to Input Transition
600
600
ns
tCHCL
tHIGH
Clock Pulse Width High
600
600
ns
tDLCL
tHD:STA
Input Low to Clock Low (START)
600
600
ns
tCLDX
tHD:DAT
Clock Low to Input Transition
0
0
µs
tCLCH
tLOW
Clock Pulse Width Low
1.3
1.3
µs
tDXCX
tSU:DAT
Input Transition to Clock Transition
100
100
ns
tCHDH
tSU:STO
Clock High to Input High (STOP)
600
600
ns
tDHDL
tBUF
Input High to Input Low (Bus Free)
1.3
1.3
µs
tAA
Clock Low to Data Out Valid
200
tCLQX
tDH
Data Out Hold Time After Clock Low
200
fC
fSCL
Clock Frequency
400
400
kHz
tW
tWR
Write Time
10
10
ms
tCLQV
3
900
200
900
200
ns
ns
Note: 1. For a reSTART condition, or following a write cycle.
2. Sampled only, not 100% tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
12/19
M34C02
Figure 12. AC Waveforms
tCHCL
tCLCH
SCL
tDLCL
tDXCX
tCHDH
SDA IN
tCHDX
START
CONDITION
tCLDX
tDHDL
SDA
INPUT
SDA
CHANGE
STOP &
BUS FREE
SCL
tCLQV
tCLQX
DATA VALID
SDA OUT
DATA OUTPUT
SCL
tW
SDA IN
tCHDH
STOP
CONDITION
tCHDX
WRITE CYCLE
START
CONDITION
AI00795B
13/19
M34C02
Table 10. Ordering Information Scheme
Example:
M34C02
– W
MN
6
T
Operating Voltage
W
2.5 V to 5.5 V
L
2.2 V to 5.5 V
Option
T
Package
BN1
PSDIP8 (0.25 mm
frame)
MN
SO8 (150 mil width)
DW
TSSOP8 (169 mil width)
Tape and Reel Packing
Temperature Range
6
–40 °C to 85 °C
Note: 1. Package-type available only on request.
ORDERING INFORMATION
Devices are shipped from the factory with the
memory content set at all ‘1’s (FFh), and the
Protection Register set at all ‘0’s (00h).
14/19
The notation used for the device number is as
shown in Table 10. For a list of available options
(speed, package, etc.) or for further information on
any aspect of this device, please contact your
nearest ST Sales Office.
M34C02
Table 11. PSDIP8 - 8 pin Plastic Skinny DIP, 0.25mm lead frame
mm
inches
Symb.
Typ.
Min.
Max.
A
3.90
A1
Min.
Max.
5.90
0.154
0.232
0.49
–
0.019
–
A2
3.30
5.30
0.130
0.209
B
0.36
0.56
0.014
0.022
B1
1.15
1.65
0.045
0.065
C
0.20
0.36
0.008
0.014
D
9.20
9.90
0.362
0.390
–
–
–
–
6.00
6.70
0.236
0.264
–
–
–
–
7.80
–
0.307
–
E
7.62
E1
e1
2.54
eA
eB
Typ.
0.300
0.100
10.00
L
3.00
N
8
0.394
3.80
0.118
0.150
8
Figure 13. PSDIP8 (BN)
A2
A1
B
A
L
e1
eA
eB
B1
D
C
N
E1
E
1
PSDIP-a
Note: 1. Drawing is not to scale.
15/19
M34C02
Table 12. SO8 - 8 lead Plastic Small Outline, 150 mils body width
mm
inches
Symb.
Typ.
Min.
Max.
A
1.35
A1
Min.
Max.
1.75
0.053
0.069
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
–
–
–
–
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
0.90
0.016
0.035
α
0°
8°
0°
8°
N
8
e
1.27
Typ.
0.050
8
CP
0.10
0.004
Figure 14. SO8 narrow (MN)
h x 45˚
A
C
B
CP
e
D
N
E
H
1
A1
SO-a
Note: 1. Drawing is not to scale.
16/19
α
L
M34C02
Table 13. TSSOP8 - 8 lead Thin Shrink Small Outline
mm
inches
Symb.
Typ.
Min.
Max.
A
Typ.
Min.
1.10
Max.
0.043
A1
0.05
0.15
0.002
0.006
A2
0.85
0.95
0.033
0.037
B
0.19
0.30
0.007
0.012
C
0.09
0.20
0.004
0.008
D
2.90
3.10
0.114
0.122
E
6.25
6.50
0.246
0.256
E1
4.30
4.50
0.169
0.177
–
–
–
–
L
0.50
0.70
0.020
0.028
α
0°
8°
0°
8°
N
8
e
0.65
0.026
8
CP
0.08
0.003
Figure 15. TSSOP8 (DW)
D
DIE
N
C
E1 E
1
N/2
α
A1
A
CP
A2
B
L
e
TSSOP
Note: 1. Drawing is not to scale.
17/19
M34C02
Table 14. Revision History
Date
27-Dec-1999
18/19
Description of Revision
Adjustments to the formatting. 0 to 70°C temperature range removed from DC and AC tables.
No change to description of device, or parameters
M34C02
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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19/19