MAXIM MAX3353E

19-2845; Rev 1; 10/03
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
Features
♦ Ideal for Enabling USB Dual-Role Components for
USB OTG Protocol
The MAX3353E integrates a regulated charge pump,
switchable pullup/pulldown resistors, and an I2C-compatible 2-wire serial interface. The device provides a
detector to monitor ID status and operates with logic
supply voltages (VL) between +1.65V and VCC and
charge-pump supply voltages (V CC ) from +2.6V to
+5.5V. The charge pump supplies an OTG-compatible
output on VBUS while sourcing 8mA output current.
The MAX3353E enables USB OTG communication
between digital logic parts that cannot supply or tolerate
the +5V VBUS levels that USB OTG requires. By controlling and measuring VBUS using internal comparators,
this device supports USB OTG session request protocol
(SRP) and host negotiation protocol (HNP).
The MAX3353E has built-in ±15kV ESD protection circuitry
to guard VBUS, ID_IN, D+, and D-. The MAX3353E is
available in a 5 x 4 chip-scale package (UCSP™) and
16-pin TSSOP package.
♦ Charge Pump for VBUS Signaling and Operation
Down to +2.6V
♦ Level Translators Allow Low-Voltage System
Interface
♦ Internal VBUS Comparators and ID Detector
♦ Internal Switchable Pullup and Pulldown
Resistors for Host/Peripheral Functionality
♦ I2C-Compatible Bus Interface with Command and
Status Registers
♦ Interrupt Features
♦ ±15kV ESD Protection on ID_IN, VBUS, D+, and D♦ Supports SRP and HNP
♦ Available in 5 x 4 UCSP and 16-Pin TSSOP
Ordering Information
PART
PINPACKAGE
PKG
CODE
-40°C to +85°C 16 TSSOP
-40°C to +85°C 5 x 4 UCSP
B20-4
TEMP RANGE
MAX3353EEUE
MAX3353EEBP-T
Applications
Functional Diagram
Mobile Phones
PDAs
—
C+
C-
VCC
Digital Cameras
VBUS
COMPARATORS
MP3 Players
Photo Printers
CHARGE
PUMP
CURRENT
GENERATOR
200kΩ
VBUS
ID_OUT
ID_IN
Pin Configurations appear at end of data sheet.
VL
Typical Applications Circuit appears at end of data sheet.
SCL
UCSP is a trademark of Maxim Integrated Products, Inc.
Purchase of I2C components from Maxim Integrated Products,
Inc., or one of its sublicensed Associated Companies, conveys
a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms
to the I2C Standard Specification as defined by Philips.
SDA
INT
ADD
I2C INTERFACE AND CONTROL LOGIC
ID DETECTOR
±15kV
ESD
PROTECTION
D+
DSE0
DRIVER
PULLUP/DOWN
RESISTORS
VTRM
110kΩ
MAX3353E
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX3353E
General Description
The MAX3353E I 2 C™-compatible USB On-The-Go
(OTG) regulated charge pump with switchable
pullup/pulldown resistors allows peripherals and mobile
devices such as PDAs, cellular phones, and digital
cameras to be interconnected without a host PC.
The MAX3353E enables a system with an integrated
USB dual-role transceiver to function as a USB OTG
dual-role device. The charge pump in the MAX3353E
supplies VBUS power and signaling that is required by
the transceiver as defined in On-The-Go Supplement:
USB 2.0, Revision 1.0. The MAX3353E provides the
switchable pullup and pulldown resistors on D+ and Drequired for a dual-role device.
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC, VL, VTRM ..........................................................-0.3V to +6V
D+, D-, ID_IN (Note 1)..............................................-0.3V to +6V
VBUS (Notes 1, 2) .....................................................-0.3V to +6V
C+..................................................................(VCC - 0.3V) to +6V
C-................................................................-0.3V to (VCC + 0.3V)
INT, ID_OUT ..................................................-0.3V to (VL + 0.3V)
SDA, SCL, ADD .......................................................-0.3V to +6V
VBUS Output Short Circuit to Ground ....................... Continuous
Output Current (all other pins) .........................................±15mA
Continuous Power Dissipation (TA = +70°C)
16-Pin TSSOP (derate 9.4mW/°C above +70°C) .........755mW
5 x 4 UCSP (derate 7.8mW/°C above +70°C) .............625mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering 10s) .................................+300°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+200°C
Vapor Phase (20s) .......................................................+215°C
Note 1: 15kV ESD protected.
Note 2: VBUS can be backdriven to +6V.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, VTRM = +3V to +3.6V, CFLYING = 0.1µF, VCC decoupled with 1µF capacitor to ground;
VTRM and VL decoupled with 0.1µF capacitor to ground; CVBUS = 1µF (min), TA = TMIN to TMAX, unless otherwise noted. Typical
values are at VCC = +4V, VL = +1.8V, VTRM = +3.3V, and TA = +25°C.) (Notes 3, 4)
PARAMETER
MAX
UNITS
VCC
2.6
5.5
V
Logic Supply Voltage
VL
1.65
VCC
V
VTRM Supply Voltage
VTRM
3.0
3.6
V
Supply Voltage
VCC Operating Supply Current
VCC Shutdown Supply Current
VTRM Supply Current
VL Input Current
SYMBOL
ICC
CONDITION
73
100
µA
VBUS_DRV = 1, VBUS_CHG1= 0,
VBUS_CHG2 = 0, IVBUS = 8mA
18
25
mA
0.4
2
µA
DP_PULLDWN = 1, DP_PULLUP = 0,
DM_PULLDWN = 1, DM_PULLUP = 0
no activity on USB serial bus
1
µA
No activity on I2C serial bus
1
µA
ICC(SHDN) No activity on I2C serial bus
IVTRM
IVL
VOH
INT configured to push/pull; source current
ILOAD = +1mA
SDA, INT, ID_OUT Output
Voltage Low
VOL
Sink current ILOAD = -1mA
SDA, SCL, ADD Input Voltage
High
VIH
SDA, SCL, ADD Input Voltage
Low
VIL
2
TYP
ID_IN floating, VBUS_CHG1 = 0,
VBUS_CHG2 = 0, VBUS_DRV = 0,
BDISC_ACONN = 0
ID_OUT, INT Output Voltage High
Input/Three-State Output Leakage
Current (SDA, SCL, INT)
MIN
VL - 0.4
V
0.4
0.67 x VL
INT configured to open drain
_______________________________________________________________________________________
V
V
0.4
V
±1
µA
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, VTRM = +3V to +3.6V, CFLYING = 0.1µF, VCC decoupled with 1µF capacitor to ground;
VTRM and VL decoupled with 0.1µF capacitor to ground; CVBUS = 1µF (min), TA = TMIN to TMAX, unless otherwise noted. Typical
values are at VCC = +4V, VL = +1.8V, VTRM = +3.3V, and TA = +25°C.) (Notes 3, 4)
PARAMETER
SYMBOL
CONDITION
MIN
ADD Pulldown Resistor
TYP
MAX
110
UNITS
kΩ
ESD PROTECTION (VBUS, ID_IN, D+, D-)
ESD Protection
Human Body Model
±15
IEC1000-4-2 Air-Gap Discharge
±11
IEC1000-4-2 Contact Discharge
±6
kV
VBU S/CHARGE-PUMP SPECIFICATIONS
(VBUS_DRV = 1, VBUS_DISCHG = 0, VBUS_CHG1 = 0, VBUS_CHG2 = 0, unless otherwise noted.)
VBUS Output Voltage
VBUS
VBUS Output Current
IVBUS
IVBUS = 0 to 8mA, CVBUS = 1µF
4.63
5.25
8
mA
VBUS Short-Circuit Current
VBUS shorted to GND
140
Output Ripple
IVBUS = 8mA, CVBUS = 1µF
100
Efficiency
VCC = 2.6V, IVBUS = 8mA
Switching Frequency
f
VBUS Voltage in Three-State
Mode
VBUS_DRV = 0, VBUS_DISCHG = 1
3.2
VBUS Input Impedance
VBUS_DRV = 0
40
250
mA
mV
80
%
600
kHz
VBUS_DRV = 0
VBUS Pulldown Resistance
V
5.1
0.2
V
6.5
kΩ
100
kΩ
VBUS AND CURRENT SOURCE SPECIFICATIONS (VBUS_CHG1 = 1, VBUS_CHG2 = 0, VBUS_DRV = 0, VBUS_DISCHG = 0)
VBUS Output Voltage
VBUS
CLOAD = 15µF
2.1
CLOAD = 95µF
1.9
V
VBUS Current Source
(Note 5)
450
600
850
µA
VBUS Current Gate Time
VBUS_CHG1 = 1, VBUS_CHG2 = 0 (Note 5)
56
105
155
ms
4.40
4.55
4.63
V
COMPARATOR SPECIFICATIONS
VBUS_VALID Comparator
Threshold
VBUS_VALID Comparator
Hysteresis
SESSION_VALID Comparator
Threshold
20
1.0
SESSION_VALID Comparator
Hysteresis
B_SESSION_END Comparator
Threshold
1.4
mV
1.8
20
0.4
B_SESSION_END Comparator
Hysteresis
0.5
V
mV
0.6
35
V
mV
SINGLE-ENDED RECEIVERS AND SE0 SPECIFICATIONS (D+, D-)
Low-Level Input Threshold
High-Level Input Threshold
0.8
2.0
V
V
_______________________________________________________________________________________
3
MAX3353E
ELECTRICAL CHARACTERISTICS (continued)
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, VTRM = +3V to +3.6V, CFLYING = 0.1µF, VCC decoupled with 1µF capacitor to ground;
VTRM and VL decoupled with 0.1µF capacitor to ground; CVBUS = 1µF (min), TA = TMIN to TMAX, unless otherwise noted. Typical
values are at VCC = +4V, VL = +1.8V, VTRM = +3.3V, and TA = +25°C.) (Notes 3, 4)
PARAMETER
Hysteresis Voltage
SYMBOL
CONDITION
MIN
VHYST
Output Voltage Low
(D+ and D- in SE0 state)
TYP
MAX
0.2
UNITS
V
ISINK = -2.4mA
0.3
V
PULLUP/PULLDOWN RESISTOR SPECIFICATIONS (D+, D-, ID_IN)
Pulldown Resistor on D+
DP_PULLDWN = 1, DP_PULLUP = 0,
BDISC_ACONN = 0
14.25
15.75
kΩ
Pulldown Resistor on D-
DM_PULLDWN = 1, DM_PULLUP = 0,
BDISC_ACONN = 0
14.25
15.75
kΩ
Pullup Resistor on D+
DP_PULLDWN = 0, DP_PULLUP = 1,
BDISC_ACONN = 0
1.425
1.575
kΩ
Pullup Resistor on D-
DM_PULLDWN = 0, DM_PULLUP = 1,
DP_PULLUP = 0, BDISC_ACONN = 0
1.425
1.575
kΩ
D- Leakage Current
DM_PULLDWN = 0, DM_PULLUP = 0,
BDISC_ACONN = 0
±1
µA
D+ Leakage Current
DP_PULLDWN = 0, DP_PULLUP = 0,
BDISC_ACONN = 0
±1
µA
Input Impedance on D+/D-
DP_PULLUP = 0, DP_PULLDWN = 0,
DM_PULLUP = 0, DM_PULLDWN = 0,
BDISC_ACONN = 0
ID_IN Pullup Resistor
300
140
kΩ
200
ID_IN Input Voltage Low
270
0.33 x VCC
ID_IN Input Voltage High
0.67 x VCC
kΩ
V
V
TIMING CHARACTERISTICS
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, VTRM = +3V to +3.6V, CFLYING = 0.1µF, VCC decoupled with 1µF capacitor to ground.
VTRM and VL decoupled with 0.1µF capacitor to ground. CVBUS = 1µF (min), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C, VCC = +4V, VL = +1.8V, VTRM = +3.3V.) (Notes 3, 4)
PARAMETER
SYMBOL
CONDITION
Time to Assert D+ Pullup
BDISC_ACONN = 1, ID_IN = GND
(A Device)
Time to Assert SE0
BDISC_ACONN = 1,
ID_IN = floating (B Device)
Interrupt Propagation Delay
(Note 6)
VBUS Rise Time
From 0 to 4.4V; CLOAD = 1µF; IVBUS = 8mA;
VBUS_DRV = 1
INT Out Rise Time
INT out push/pull configured,
CLOAD = 50pF
4
MIN
0.025
TYP
0.061
20
_______________________________________________________________________________________
MAX
UNITS
1
ms
1
ms
1
µs
100
ms
ns
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, VTRM = +3V to +3.6V, CFLYING = 0.1µF, VCC decoupled with 1µF capacitor to ground.
VTRM and VL decoupled with 0.1µF capacitor to ground. CVBUS = 1µF (min), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C, VCC = +4V, VL = +1.8V, VTRM = +3.3V.) (Notes 3, 4)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
INT Out Fall Time
CLOAD = 50pF
20
ns
ID_OUT Rise Time
CLOAD = 50pF
30
ns
ID_OUT Fall Time
CLOAD = 50pF
10
ns
Time to Exit Shutdown
500
µs
Time to Enter Shutdown
1000
µs
I2C/SMBUS-COMPATIBLE TIMING SPECIFICATIONS
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, VTRM = +3V to +3.6V, CFLYING = 0.1µF, VCC decoupled with 1µF capacitor to ground.
VTRM and VL decoupled with 0.1µF capacitor to ground. CVBUS = 1µF (min). TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +4V, VL = +1.8V, VTRM = +3.3V, and TA = +25°C.) (Notes 3, 4)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
400
kHz
Serial Clock Frequency
fSCL
DC
Bus Free Time Between Stop and
Start Conditions
tBUF
1.3
µs
Start Condition Hold Time
tHD:STA
0.6
µs
Stop Condition Setup Time
tSU:STO
0.6
µs
Clock Low Period
tLOW
1.3
µs
Clock High Period
tHIGH
0.6
µs
Data Setup Time
tSU:DAT
Data Hold Time
tHD:DAT
(Note 7)
Maximum Receive SCL/SDA Rise
Time
tR
(Note 8)
300
ns
Minimum Receive SCL/SDA Rise
Time
tR
(Note 8)
20 + 0.1CB
ns
Maximum Receive SCL/SDA Fall
Time
tF
(Note 8)
300
ns
Minimum Receive SCL/SDA Fall
Time
tF
(Note 8)
20 + 0.1CB
ns
Transmit SDA Fall Time (Note 4)
Pulse Width of Suppressed Spike
100
ns
0
0.9
tF
CB = 400pF, ISDA = 3mA, VL ≥ 2.5V
20 + 0.1CB
250
tF
CB = 50pF, ISDA = 3mA, VL < 2.5
20 + 0.1CB
250
tSP
(Note 9)
50
µs
ns
ns
Note 3: All currents into the device are negative; currents out of the device are positive. All voltages are referenced to device
ground unless otherwise specified.
Note 4: Parameters are 100% production tested at +25°C, limits over temperature are guaranteed by design.
Note 5: The VBUS current source and current gate time vary together with process and temperature such that the resulting VBUS
pulse is guaranteed to drive a <13µF load to a voltage >2.0V, and to drive a >96µF load to a volatge <2.2V. See the SRP
VBUS Pulsing section for an explanation of this self-timed pulse.
Note 6: Guaranteed by design, not production tested.
Note 7: A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s falling
edge.
Note 8: CB is total capacitance of one bus line in pF. Tested with CB = 400pF.
Note 9: Input filters on SDA, SCL, and ADD suppress noise spikes less than 50ns.
_______________________________________________________________________________________
5
MAX3353E
TIMING CHARACTERISTICS (continued)
Typical Operating Characteristics
(VCC = +3V, VL = +2.5V, CFLYING = 0.1µF, CVBUS = 1µF (ESRCVBUS = 0.1Ω), TA = +25°C.)
VBUS OUTPUT VOLTAGE
vs. VBUS OUTPUT CURRENT
80
60
40
MAX3353 toc02
VCC = 4.2V
VCC = 3.3V
5.00
4.90
VBUS OUTPUT VOLTAGE (V)
VBUS OUTPUT VOLTAGE (V)
VCC = 2.6V
VCC = 3.3V
VCC = 4.2V
100
5.25
MAX3353 toc01
120
VBUS OUTPUT VOLTAGE
vs. INPUT VOLTAGE
4.75
VCC = 2.6V
4.50
4.25
20
0
4.00
0
10
20
30
40
50
MAX3353 toc03
INPUT CURRENT
vs. OUTPUT CURRENT
INPUT CURRENT (mA)
4.85
IVBUS = 8mA
4.80
IVBUS = 0
4.75
4.70
10
0
OUTPUT CURRENT (mA)
20
30
40
50
2.5
3.0
OUTPUT CURRENT (mA)
TIME TO ENTER SHUTDOWN
4.0
3.5
4.5
5.0
5.5
INPUT VOLTAGE (V)
TIME TO EXIT SHUTDOWN
MAX3353 toc04
VBUS WITH CAPACITIVE LOAD
MAX3353 toc05
MAX3353 toc06
ICC
10mA/div
CL = 10µF
VBUS
1V/div
ICC
5mA/div
SCL
5V/div
SCL
5V/div
200µs/div
40ms/div
SUPPLY CURRENT
vs. TEMPERATURE
IVBUS = 8mA
SUPPLY CURRENT (mA)
67.5
67.0
66.5
66.0
19
VCC = 2.6V
18
VCC = 3.3V
17
VCC = 4.2V
65.5
65.0
MAX3353 toc08
20
MAX3353 toc07
68.0
16
-40
-15
10
35
TEMPERATURE (°C)
6
CL = 96µF
100µs/div
VBUS INPUT IMPEDANCE
vs. TEMPERATURE
VBUS INPUT IMPEDANCE (kΩ)
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
VBUS
1V/div
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
PIN
NAME
FUNCTION
C5
VCC
Power-Supply Input. VCC input range is +2.6V to +5.5V. Bypass VCC to GND with a 1µF capacitor.
2
D5
VL
3
D4
SDA
Serial Data Input/Output. I2C bus serial data input/open-drain output can be driven above VL.
4
C3
ADD
Address Select Input. Address selection for the I2C-compatible interface. ADD has an internal
110kΩ pulldown resistor (see the 2-Wire I2C Compatible Serial Interface section for details).
5
D3
SCL
Serial Clock Input. I2C bus serial clock input. Can be driven above VL.
6
D2
INT
Interrupt Output. INT is an active-low output and can be set either open-drain or push/pull output
through control register 1 (default = open drain).
7
D1
ID_OUT
8
C1
VTRM
TSSOP
UCSP
1
Logic Supply. VL sets the logic output high voltage and logic input high threshold for SDA, SCL,
INT, and ID_OUT. VL can range from +1.65V to VCC. Bypass VL to GND with a 0.1µF capacitor.
Device ID Output. Output of ID_IN level translated to VL.
Termination Supply Input. Connect +3V to +3.6V supply voltage for internal USB pullup resistors.
Bypass VTRM to GND with a 0.1µF capacitor.
9
B1
D-
USB D- (±15kV ESD Protected)
10
A1
D+
USB D+ (±15kV ESD Protected)
11
A2
ID_IN
Device ID Input. Internally pulled up to VCC. ID_IN logic state is VL level translated to ID_OUT and
can be read through the I2C interface (±15kV ESD protected).
12
—
N.C.
No Connection. Not internally connected.
13
A3
GND
14
A4
C-
Charge-Pump Capacitor Negative Connection
15
A5
C+
Charge-Pump Capacitor Positive Connection
16
B5
VBUS
Ground
OTG Bus Supply. Provides power to the bus. VBUS can be back-driven to +6V. Bypass VBUS to
GND with a 1µF capacitor.
Detailed Description
The MAX3353E integrates a regulated charge pump,
switchable pullup/pulldown resistors, and an I 2 Ccompatible 2-wire serial interface. The internal level
shifter allows the device to operate with logic supply voltages (VL) between +1.65V and VCC. The MAX3353E’s
OTG-compliant charge pump operates with input supply
voltages (VCC) from +2.6V to +5.5V and supplies an
OTG-compatible output on VBUS while sourcing 8mA
output current.
The MAX3353E level-detector comparators monitor important VBUS voltages needed to support SRP and HNP and
provides an interrupt output signal for OTG events that
require action. The VBUS power-control block performs the
various switching functions required by an OTG dual-role
device and is programmable by system logic.
For OTG operation, D+ and D- are connected to switchable pulldown resistors (host) and switchable pullup
resistors (peripheral) controlled by internal registers.
Charge Pump
The MAX3353E’s OTG-compliant charge-pump operates
with input supply voltages (VCC) from +2.6V to +5.5V
and supplies an OTG-compatible output on VBUS with
the capability of sourcing 8mA (min) output current.
When VBUS is not providing power, an input impedance
of no more than 100kΩ and no less than 40kΩ to GND is
present on VBUS. When VBUS provides power, the rise
time on VBUS from 0 to 4.4V is no longer than 100ms
when driving a constant current load of 8mA and an
external load capacitance of 13µF.
During a continuous short circuit on VBUS, the chargepump output is current limited to 140mA (typ). Thermalshutdown circuitry turns off the charge pump if the die
temperature exceeds +150°C and restarts when the die
cools to 140°C.
Level Shifters
Internal level shifters allow the system-side interface to
run at logic supply voltages as low as 1.65V. Interface
logic signals are referenced to the voltage applied to VL.
_______________________________________________________________________________________
7
MAX3353E
Pin Description
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
VBUS Level-Detection Comparators
VBUS
Comparators drive status register bits 0, 1, and 2 to
indicate these important USB OTG VBUS voltage levels:
• VBUS is valid (VBUS > 4.6V)
• A USB session is valid (VBUS > 1.4V)
• A USB session is ended (VBUS < 0.5V)
The 4.6V comparator sets bit 0 in status register
VBUS_VALID to 1 if VBUS > 4.6V. The A Device uses the
VBUS valid status bit (VBUS_VALID) to determine if the B
Device is sinking too much current (i.e., is not supported).
The interrupt can be associated to either a positive or a
negative transition. The 1.4V comparator sets bit 1 of status register SESSION_VALID to 1 if VBUS > 1.4V. This status bit indicates that a data transfer session is valid and
the interrupt can be associated to either a positive or a
negative transition. The session-end comparator sets bit
2 in the status register SESSION_END to a 1 when VBUS
< 0.5V, and generates an interrupt when VBUS falls below
0.5V. Figure 1 shows the level-detector comparators.
VBUS_VALID
4.6V
SESSION_VALID
1.4V
SESSION_END
0.5V
Figure 1. Comparator Network Diagram
VCC
CURRENT SOURCE
Interrupt Logic
When OTG events require action, the MAX3353E provides an interrupt output signal on INT. An interrupt is
triggered (INT goes low) when one of the conditions
specified by the interrupt-mask register and interruptedge register is verified. INT stays active until the interrupt is cleared by reading the interrupt latch register.
CHARGE
PUMP
VBUS
ON/OFF
67kΩ
Shutdown
In shutdown mode, the MAX3353E’s quiescent current
is reduced to less than 2µA. Bit 0 in control register 2
controls the shutdown feature. Setting bit 0 = 1 places
the device in shutdown mode (Figure 2, Table 5). When
in shutdown, the MAX3353E’s charge-pump current
generator and VBUS detection comparators are turned
off. During shutdown, the I2C serial interface is fully
functional and registers can be read from or written to.
ID_IN and ID_OUT are both functional in shutdown.
VBUS Power Control
VBUS is a dual-function I/O that can supply USB OTGcompliant voltage to the USB. The VBUS power-control
block performs the various switching functions required
by an OTG dual-role device. This action is programmed
by the system logic using internal register control bits in
control register 2.
• Discharge VBUS through a resistor to ensure a session is not in progress.
• Charge VBUS through an internal current generator
to initiate SRP (session request protocol).
• Connect the charge pump to VBUS to provide power
on VBUS.
8
CURRENT
GATE
TIMER
7
0
6
0
5
0
4
0
3
0
2
0
DEFAULT
(POWER-ON)
VALUES
1
0
5kΩ
0
1
CONTROL REGISTER 2
0 = OPERATING MODE
1 = SHUTDOWN MODE
NOTE: SWITCHES ARE SHOWN IN THEIR DEFAULT
(POWER-ON) POSITIONS. A "1" CLOSES A SWITCH.
Figure 2. Power-Control Block Diagram
Bit 0 (SDWN) in control register 2 is used to place the
MAX3353E in normal operation or shutdown mode.
Setting bit 1 (VBUS_CHG1) issues a timed pulse on VBUS
suitable for implementing the session request protocol
(see the SRP VBUS Pulsing section). The pulse is created
by turning a current source – supplied by VCC and connected to VBUS – on and off. Setting control register bit
2 (VBUS_CHG2) to 1 charges VBUS through the current
source continuously. Setting VBUS_CHG2 to zero disconnects the current source. Bit 3 (VBUS_DRV) turns the
_______________________________________________________________________________________
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
Autoconnect and Autoresponse
USB OTG defines the HNP, where the default host (A
Device) can pass the host responsibilities off to the
default peripheral (B Device). This protocol can be handled entirely by the firmware and controlling logic that drives the OTG transceiver. The MAX3353E has the option
to automatically perform some of the required signaling
for some of the timing-critical events in the HNP process.
The automatic signaling used by the A Device, when it
transfers host control to the B Device, is defined by the
OTG transceiver supplement and is known as autoconnect. Autoconnect allows the transceiver to automatically
connect the A Device’s D+ pullup resistor during HNP.
Autoconnect is enabled when the MAX3353E is configured as an A Device (ID_IN = 0) and the BDISC_ACONN
control bit is set.
The MAX3353E also has the capability to automate the
signaling used by the B Device when it assumes host
control from the A Device. This autoresponse is not specified by the OTG-transceiver supplement. Autoresponse
causes the B Device to automatically assert a bus reset
by driving a single-ended zero (SE0: both D+ and D- driven low) onto USB in response to the A Device connecting its D+ pullup resistor. Autoresponse is enabled when
the MAX3353E is configured as a B Device and the
BDISC_ACONN control bit is set.
Note: In a system, D+ and D- are also driven by a transceiver in an ASIC or other device. The autoresponse
mode should not be used unless the system designer
can ensure that there is no bus conflict between the
transceiver and the MAX3353E driving USB to SE0.
Autoconnect Details
When the MAX3353E is configured as an A Device
(ID_IN = GND), it can enable autodetect by setting
BDISC_ACONN to one. This should be done after the
USB is in the suspend state (>3ms with no traffic). The
MAX3353E monitors D+/D- for an SE0. The presence of
the SE0 indicates that the B Device has disconnected
its pullup resistor, the first step in HNP. When SE0 is
detected, the MAX3353E automatically turns on its
internal pullup resistor to the D+ line within 3ms. There
are two ways for firmware to ascertain that the
MAX3353E has automatically turned on its D+ pullup
during HNP:
1) The A_HNP status bit goes high when the D+ pullup
is automatically connected during HNP
2) The A_HNP_EN control bit is set, and an interrupt is
issued as the D+ pullup is connected (see also the
Interrupt Logic section).
By clearing BDISC_ACONN bit, the D+ pullup is disconnected. After a successful autoconnect operation, the
firmware should set the DP_PULLUP control bit before
clearing the BDISC_ACONN bit; this ensures that the
D+ pullup remains connected.
Note: The autoconnect works only if MAX3353E is not
in shutdown.
Autoresponse Details
When the MAX3353E is configured as a B Device
(ID_IN = open), setting the BDISC_ACONN control bit
enables the autoresponse feature. Using this feature,
the MAX3353E automatically issues a USB bus reset
when the A Device becomes a peripheral. Firmware
can take advantage of the autoresponse feature of the
MAX3353E by doing the following:
• Ensure that the system transceiver is in USB-suspend mode. Wait until the USB-suspend conditions
are met (no USB activity for >3ms). Enable autoresponse. Set the BDISC_ACONN control bit. Signal
a USB disconnect. Firmware clears the DP_PULLUP
control bit, which disconnects the D+ pullup resistor. At this point, the MAX3353E waits at least 25µs
before enabling its internal USB line monitor to
detect if the A Device has attached its D+ pullup;
this ensures that the D+ line is not high due to the
residual effect of the B Device pullup. When the A
Device has connected its D+ pullup, the MAX3353E
issues a bus reset (SE0) and the B_HNP status bit
goes high.
• Wait for B_HNP to go high; output SE0 from the
ASIC or other device on D+/D-. Disable autoresponse. By clearing BDISC_ACONN bit, the SE0
generator is turned off. The SE0 is maintained by the
system USB transceiver.
Note: The autoresponse works only if the MAX3353E is
not in shutdown.
SRP VBUS Pulsing
Session request protocol (SRP) is designed to allow
the A Device (default host) to conserve power by turning off VBUS when there is no USB traffic. The B Device
(default peripheral) can request the A Device to turn
VBUS on and initiate a new session through SRP.
The B Device must initiate SRP in two ways: data-line
and VBUS pulsing. Firmware is responsible for turning
on and off the pullup resistor on D+ to implement
data-line pulsing. Firmware can also be used to turn on
and off a current source to implement VBUS pulsing.
_______________________________________________________________________________________
9
MAX3353E
charge pump on and off to power VBUS. Bit 4 in control
register 2 (VBUS_DISCHG) is used to discharge VBUS
through a 5kΩ resistor. Figure 2 and Table 2 show
power control.
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
The MAX3353E also has a special feature that allows it
to control the timing of the VBUS pulse.
Since an OTG device could be plugged into a PC, the
VBUS pulse must be particularly well controlled to prevent
damage to a PC host. For this reason, VBUS pulsing is
done by turning on and off a current source. The VBUS
pulse must be timed so it drives a 13µF load (when it is
connected to the A Device) to a voltage greater than
2.1V, and it drives a >96µF load (when it is connected to
a standard PC) to a voltage less than 2.0V.
Firmware can control the current source and the timing
of the VBUS pulse through the VBUS_CHG2 control bit.
The MAX3353E also has the capability to time the pulse
VTRM
BIT 4 BIT 5 SW1
SW2
0
0
OPEN
OPEN
0
1
OPEN CLOSED
1
0
CLOSED OPEN
1
1
CLOSED OPEN
1.5kΩ
SW2
SW1
D+
D15kΩ
15kΩ
SW4
itself. Firmware initiates the self-timed VBUS pulse by
setting the VBUS_CHG1 control bit to 1.
The internal timer and current generator guarantee that
the VBUS voltage goes above 2.1V if CVBUS < 13µF
within 90ms and stands below 2.0V if CVBUS > 96µF.
Once the time has elapsed, if another VBUS pulse is
required, it is necessary to clear the VBUS_CHG1 bit and
then set it again.
Note: SRP VBUS pulsing and its associated current generator work only if the MAX3353E is not in shutdown.
Data-Line Pullup and Pulldown Resistance
For OTG operation, D+ and D- are connected to switchable pulldown resistors (host) and switchable pullup
resistors (peripheral). Data-line pullup/pulldown resistors
are individually controlled through data bits 4 through 7 in
control register 1. Two 15kΩ pulldown resistors allow the
device to be set as a host and are asserted by bits 6 and
7. The 1.5kΩ pullup resistor is applied to the data lines
through SW1 and SW2, which are controlled by bits 4 and
5. D+ pullup has higher priority to avoid direct connection
of D+ and D-. Each of the control bits controls a designated switch; therefore, pullup and pulldown switches can
be asserted at the same time. A simplified schematic of
the switching network is shown in Figure 3.
The bidirectional D+ and D- lines are ESD protected to
±15kV, reducing external components in many applications.
Applications Information
SW3
2-Wire I2C-Compatible Serial Interface
A register file that interfaces to the control logic uses a
simple 2-wire interface operating up to 400kHz to control the various switches and modes.
GND
7
0
DEFAULT
(POWER ON)
VALUES
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Serial Addressing
The MAX3353E operates as a slave that sends and
receives control and status signals through an I 2Ccompatible 2-wire interface. The interface uses a serial
data line (SDA) and a serial clock line (SCL) to achieve
CONTROL REGISTER 1
NOTE: SWITCHES ARE SHOWN IN THEIR DEFAULT
(POWER-ON) POSITIONS. A "1" CLOSES A SWITCH.
Figure 3. Pullup and Pulldown Resistors Network
SCL
tF
tHD:STA
tR
tLOW
tHIGH
tSU:DAT
tHD:DAT
tSU:STO
SDA
tBUF
Figure 4. 2-Wire Serial Interface Timing Details
10
______________________________________________________________________________________
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
SDA
Slave Address
SCL
S
P
START
CONDITION
STOP
CONDITION
Figure 5. Start and Stop Conditions
bidirectional communication between master(s) and
slave(s). A master (typically a microcontroller) initiates
all data transfers to and from the MAX3353E and generates the SCL clock that synchronizes the data transfer (Figure 4).
The MAX3353E SDA line operates as both an input and
an open-drain output. A pullup resistor (4.7kΩ typ) is
required on SDA. The MAX3353E SCL line operates
only as an input. A pullup resistor (4.7kΩ typ) is
required on SCL if there are multiple masters on the 2wire interface, or if the master in a single-master system
has an open-drain SCL output.
Each transmission consists of a START condition
(Figure 5) sent by a master, followed by the MAX3353E
7-bit slave address plus R/W bit (Figure 6), a register
address byte, one or more data bytes, and finally a
STOP condition (Figure 5).
Start and Stop Conditions
Both SCL and SDA remain high when the interface is
not busy. A master signals the beginning of a transmission with a START (S) condition by transitioning SDA
from high to low while SCL is high. When the master
has finished communicating with the slave, it issues a
STOP (P) condition by transitioning the SDA from low to
high while SCL is high. The bus is then free for another
transmission (Figure 5).
Bit Transfer
One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable while SCL
is high (Figure 7).
Acknowledge
The acknowledge bit is the clocked ninth bit that the
recipient uses to handshake receipt of each byte of
data (Figure 8). Thus, each byte transferred effectively
requires 9 bits. The master generates the 9th clock
pulse, and the recipient pulls down SDA during the
acknowledge clock pulse, such that the SDA line is stable low during the high period of the clock pulse. When
The MAX3353E has a 7-bit-long slave address. The
eighth bit following the 7-bit slave address is the R/W
bit. It is low for a write command, high for a read command. The first 6 bits (MSBs) of the MAX3353E slave
address are always 010110. Select slave address bit
A0 by connecting the address input ADD to VL, GND,
or leave floating (ADD is internally pulled to GND
through a 110kΩ resistor). The MAX3353E has two possible slave addresses (Table 1). As a result, only two
MAX3353E devices can share the same interface.
Write Byte Format
A write to the MAX3353E comprises the transmission of
the MAX3353E’s slave address with the R/W bit set to
zero, followed by 2 bytes of information. The first byte
of information is the command byte that determines
which register of the MAX3353E is to be written by the
second byte. The second byte is the data that goes into
the register that is set by the first byte. Figure 9 shows
the typical write byte format.
Read Byte Format
A read from the MAX3353E comprises the transmission
of the MAX3353E’s slave address (from the master)
with the R/W bit set to zero, followed by one byte containing the address of the register, from which the master is going to read data, and then followed by
MAX3353E’s slave address again with the R/W bit set
to one. After that one byte of data is being read by the
master. Figure 10 shows the read byte format that must
be used. To read many contiguous registers, multiple
accesses are required.
Registers
Control Registers (10h, 11h)
There are two read/write control registers. Control register 1 is used to set D+, D- pullup or pulldown, and to
set interrupt output to open-drain or push-pull. Control
register 2 is the bus control register used to control the
bus operation and put the device into shutdown mode.
(Tables 3, 4, and 5.)
Status Register (13h)
The status register is a read-only register for determining
valid bus and session comparator thresholds, ID_IN status, and HNP success. Tables 6 and 7 show status register address map, bit configuration, and description.
______________________________________________________________________________________
11
MAX3353E
the master is transmitting to the MAX3353E, the
MAX3353E generates the acknowledge bit because it
is the recipient. When the MAX3353E is transmitting to
the master, the master generates the acknowledge bit
because the master is the recipient.
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
1
0
SDA
START
1
1
0
0
R/W
A0
MSB
ACK
LSB
SCL
Figure 6. Slave Address
START
CONDITION
SDA
CLOCK PULSE FOR ACKNOWLEDGMENT
SCL
1
2
8
9
SDA BY
TRANSMITTER
SCL
DATA LINES STABLE, CHANGE OF
DATA VALID
DATA ALLOWED
SDA BY
RECEIVER
Figure 8. Acknowledge
Figure 7. Bit Transfer
S
PART ADDRESS
A6
A5
A4
A3
A2
R/W
A1
A0
A5
A4
A3
REGISTER ADDRESS
W
DATA
A6
ACK
8 bits
ACK
A2
A1
ACK
0
7 bits
A7
S
P
A0
8 bits
Where:
Slave address: Part address
Register address: Selecting which register to write to
Data: Data byte being read by the master
R/W: Read/Write (R/W = 1: Read; R/W = 0: Write)
S: Start condition
P: Stop condition
ACK: Acknowledge bit from the slave
NACK: Not acknowledged bit from the master
Blank: Master transmission
Shaded: Slave transmisstion
Figure 9. Write Byte Format
S
PART ADDRESS
A6
A5
A4
A3
A2
A1
A0
R/W
ACK
0
0
REGISTER ADDRESS
7 bits
RS
A5
A4
A3
0
8 bits
PART ADDRESS
A6
A2
A1
A0
R/W
ACK
1
0
7 bits
Where:
Slave address: Part address
Register address: Selecting which register to write to
Data: Data byte being read by the master
R/W: Read/Write (R/W = 1: Read; R/W = 0: Write)
S: Start condition
DATA
NACK
1
8 bits
P: Stop condition
ACK: Acknowledge bit from the slave
NACK: Not acknowledged bit from the master
Blank: Master transmission
Shaded: Slave transmisstion
Figure 10. Read Byte Format
12
ACK
______________________________________________________________________________________
P
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
ADD PIN
ADDRESS BITS
A6
A5
A4
A3
A2
A1
A0
Float or
GND
0
1
0
1
1
0
0
VL
0
1
0
1
1
0
1
Interrupt Registers (14h, 15h, 16h)
There are three interrupt registers. Interrupt mask register is a read/write register used to enable interrupts and
read status of interrupts. Interrupt edge register is a
read/write register for setting and determining interrupts for positive and negative edges. Interrupt latch
register is a read only register to check and validate
interrupt requests. Table 8 shows the interrupt mask,
Table 2. Register Address Map
NAME
ADD
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Manufacturer
Register 0
00h
0
1
1
0
1
0
1
0
Manufacturer
Register 1
01h
0
0
0
0
1
0
1
1
Manufacturer
Register 2
02h
0
1
0
1
0
0
1
1
Manufacturer
Register 3
03h
0
0
1
1
0
0
1
1
Product ID
Register 0
04h
0
1
0
0
1
0
0
0
Product ID
Register 1
05h
0
1
0
1
1
0
1
0
Product ID
Register 2
06h
0
1
0
0
0
0
1
0
Product ID
Register 3
07h
0
0
0
0
0
0
0
1
Reserved
—
—
—
—
—
BDISC_
ACONN
IRQ_MODE
—
08h-0Fh
—
—
—
—
Control
Register 1
10h
DM_
PULLDWN
DP_
PULLDWN
DM_
PULLUP
DP_
PULLUP
Control
Register 2
11h
—
—
—
Reserved
12h
—
—
—
—
—
—
—
—
Status
Register
13h
—
B_HNP
A_HNP
ID_FLOAT
ID_GND
SESSION_
END
SESSION_
VALID
VBUS_VALID
Interrupt Mask
14h
—
—
A_HNP_EN
ID_
FLOAT_EN
ID_
GND_EN
SESSION_
END_EN
SESSION_
VALID_EN
VALID_EN
—
—
—
SESSION_
VALID_ED
VALID_ED
Interrupt Edge
VBUS_
DISCHG
15h
Interrupt
Latch
16h
Reserved
17h -Ffh
—
A_HNP_RQ
—
—
—
VBUS_DRV
VBUS_CHG2 VBUS_CHG1
VBUS_
SDWN
VBUS_
VBUS_
ID_
FLOAT_RQ
ID_
GND_RQ
SESSION_
END_RQ
SESSION_
VALID_RN
VALID_RN
SESSION_
VALID_RP
VALID_RP
—
—
—
—
—
—
—
VBUS_
______________________________________________________________________________________
13
MAX3353E
Table 1. MAX3353E Address Map
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
interrupt edge, and interrupt latch address maps. Bit
configuration is shown in Tables 9, 10, and 11.
Manufacturer and ID Register Address Map
The manufacturer and ID registers are read-only registers (Table 12).
External Capacitors
Five external capacitors are recommended for proper
operation. Bypass VL and VTRM to GND with a 0.1µF
ceramic capacitor. Bypass VBUS and VCC to GND with a
1µF low-ESR ceramic capacitor. For the internal charge
pump, use a 0.1µF ceramic capacitor between C+ and C-.
Table 3. Control Register Address Map
REGISTER
ADDRESS
Control 1
Control 2
POWER-UP REGISTER STATUS
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
10h
0
0
0
0
0
0
0
0
11h
0
0
0
0
0
0
0
1
Table 5. Control Register 2 (11h)
Table 4. Control Register 1 (10h)
BIT
NUMBER
SYMBOL
0
—
OPERATION
SYMBOL
0
SDWN
Not used
Interrupt pin open-drain/push-pull:
0 = open drain
1 = push/pull
1
IRQ_MODE
2
BDISC_
ACONN
3
—
4
DP_PULLUP
D+ pullup (high priority)
0 = D+ pullup unconnected
1 = D+ pullup connected
DM_PULLUP
D- pullup:
0 = D- pullup unconnected
1 = D- pullup connected
5
BIT
NUMBER
0 = disable
1 = enable
1
6
DP_
PULLDWN
D+ pulldown:
0 = D+ pulldown unconnected
1 = D+ pulldown connected
7
DM_
PULLDWN
D- pulldown:
0 = D- pulldown unconnected
1 = D- pulldown connected
3
4
Puts part in shutdown mode:
0 = operating
1 = shutdown mode
VBUS_CHG1
Charge VBUS through a current
generator for 105ms:
0 = current generator OFF
1 = current generator ON
(automatically turned off after
105ms)
VBUS_CHG2
Charge VBUS through a current
generator:
0 = current generator OFF
1 = current generator ON
Not used
2
OPERATION
VBUS_DRV
Drive VBUS through charge pump
0 = VBUS not driven
1 = VBUS connected to the charge
pump
Discharge VBUS through a resistor:
VBUS_DISCHG 0 = Resistor disconnected
1 = Resistor connected
5
—
Not used
6
—
Not used
7
—
Not used
Table 6. Status Register Address Map
REGISTER
ADDRESS
Status
13h
POWER-UP REGISTER STATUS
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
0
0
0
—
—
—
—
—
(—) = don’t know
14
______________________________________________________________________________________
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
MAX3353E
Table 7. Status Register (13h)
BIT
NUMBER
SYMBOL
0
VBUS_VALID
Device A VBUS valid comparator, threshold = 4.55V:
0 = VBUS lower than threshold
1 = VBUS higher than threshold
1
SESSION_
VALID
Session-valid comparator, threshold = 1.4V:
0 = VBUS lower than threshold
1 = VBUS higher than threshold
2
SESSION_END
3
ID_GND
4
ID_FLOAT
5
A_HNP
Set when Device A is configured, BDISC_ACONN is enabled and has attached pullup during HNP;
cleared by resetting BDISC_ACONN bit in control register 1.
6
B_HNP
Set when Device B is configured, BDISC_ACONN is enabled and has asserted an SE0 during HNP;
cleared by resetting BDISC_ACONN bit in control register 1.
7
—
CONTENTS
VBUS session-end comparator, threshold = 0.5V:
0 = VBUS higher than threshold
1 = VBUS lower than threshold
ID_IN grounded:
0 = not grounded
1 = grounded
ID_IN floating:
0 = not floating
1 = floating
Not used
Table 8. Interrupt Register Address Map
REGISTER
ADDRESS
Interrupt Mask
Interrupt Edge
Interrupt Latch
POWER-UP REGISTER STATUS
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
14h
0
0
0
0
0
0
0
0
15h
0
0
0
0
0
0
0
0
16h
0
0
0
0
0
0
0
0
Table 9. Interrupt Mask Register (14h)
BIT
NUMBER
SYMBOL
OPERATION
0
VBUS_VALID_EN
Enables VBUS_VALID interrupt
1
SESSION_
VALID_EN
Enables SESSION_VALID
interrupt
2
SESSION_
END_EN
Enables SESSION_END
interrupt
3
ID_GND_EN
4
ID_FLOAT_EN
5
A_HNP_EN
6
—
Not used
7
—
Not used
Enables ID_GND interrupt
Enables ID_FLOAT interrupt
Enables A_HNP interrupt
______________________________________________________________________________________
15
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
Table 10. Interrupt Edge Register (15h)
BIT
NUMBER
0
SYMBOL
VBUS_
VALID_ED
Table 11. Interrupt Latch Register (16h)
BIT
NUMBER
OPERATION
VBUS_VALID interrupt on
positive/negative edge:
0 = detected on negative edge
1 = detected on positive edge
SESSION_VALID interrupt on
positive/negative edge:
0 = detected on negative edge
1 = detected on positive edge
1
SESSION_
VALID_ED
2
—
Not used
3
—
Not used
4
—
Not used
5
—
Not used
6
—
Not used
7
—
Not used
SYMBOL
OPERATION
VBUS_VALID positive edge
interrupt request:
0 = not asserted
1 = asserted
0
VBUS_VALID_RP
1
SESSION_
VALID _RP
2
VBUS_ VALID
_RN
3
SESSION_
VALID _RN
SESSION_ VALID negative edge
interrupt request:
0 = not asserted
1 = asserted
4
SESSION_END_
RQ
SESSION_END interrupt request:
0 = not asserted
1 = asserted
5
ID_GND_RQ
6
ID_FLOAT_RQ
7
A_HNP_RQ
SESSION_ VALID positive edge
interrupt request:
0 = not asserted
1 = asserted
VBUS_VALID negative edge
interrupt request:
0 = not asserted
1 = asserted
ID_GND interrupt request:
0 = not asserted
1 = asserted
ID_FLOAT interrupt request:
0 = not asserted
1 = asserted
DP_SRP interrupt request:
0 = not asserted
1 = asserted
Table 12. Manufacturer and ID Register Address Map
REGISTER
ADD
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
hex
Manufacturer Register 0
00h
0
1
1
0
1
0
1
0
6A
Manufacturer Register 1
01h
0
0
0
0
1
0
1
1
0B
Manufacturer Register 2
02h
0
1
0
1
0
0
1
1
53
Manufacturer Register 3
03h
0
0
1
1
0
0
1
1
33
Product ID Register 0
04h
0
1
0
0
1
0
0
0
48
Product ID Register 1
05h
0
1
0
1
1
0
1
0
5A
Product ID Register 2
06h
0
1
0
0
0
0
1
0
42
Product ID Register 3
07h
0
0
0
0
0
0
0
1
01
16
______________________________________________________________________________________
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
±15kV ESD Protection
To protect the MAX3353E against ESD, D+, D-, ID_IN,
and VBUS, have extra protection against static electricity
to protect the device up to ±15kV. The ESD structures
withstand high ESD in all states—normal operation,
shutdown, and powered down. In order for the 15kV
ESD structures to work correctly, a 1µF or greater
capacitor must be connected from VBUS to GND. ESD
protection can be tested in various ways; D+, D-, ID_IN,
and VBUS are characterized for protection to the following limits:
1) ±15kV using the Human Body Model
2) ±6kV using the IEC 1000-4-2 Contact Discharge
method
3) ±11kV using the IEC 1000-4-2 Air-Gap Discharge
method
ESD Test Conditions: ESD performance depends on
a variety of conditions. Contact Maxim for a reliability
report that documents test setup, test methodology,
and test results.
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing. The Machine Model is less relevant to
I/O ports after PC board assembly.
Layout Considerations
The MAX3353E high oscillator frequency makes proper
layout important to ensure stability and maintain the
output voltage under all loads. For best performance,
minimize the distance between the capacitors and the
MAX3353E.
UCSP Reliability
For the latest application details on UCSP construction,
dimensions, tape-carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, refer to Maxim Application Note:
UCSP – A Wafer-Level Chip Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
Human Body Model
Figure 11 shows the Human Body Model and Figure 12
shows the current waveform it generates when discharged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device
through a 1.5kΩ resistor.
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifically refer to integrated circuits. The major difference
between tests done using the Human Body Model and
IEC 1000-4-2 is a higher peak current in IEC 1000-4-2,
because series resistance is lower in the IEC 1000-4-2
model. Hence, the ESD withstand voltage measured to
IEC 1000-4-2 is generally lower than that measured
using the Human Body Model. Figure 13 shows the IEC
1000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The
Contact Discharge method connects the probe to the
device before the probe is energized. Figure 14 shows
the IEC 1000-4-2 current waveform.
______________________________________________________________________________________
17
MAX3353E
Connect all capacitors as close to the device as possible.
VBUS and VCC bypass capacitors should have trace
lengths as short as possible
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
RC
1MΩ
CHARGE-CURRENTLIMIT RESISTOR
RD
1.5kΩ
IP 100%
90%
DISCHARGE
RESISTANCE
Ir
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
AMPERES
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
STORAGE
CAPACITOR
DEVICE
UNDER
TEST
36.8%
10%
0
0
Figure 11. Human Body ESD Test Models
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
150pF
Figure 12. Human Body Model Current Waveform
RD
330Ω
I
100%
90%
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Figure 13. IEC 1000-4-2 ESD Test Model
DEVICE
UNDER
TEST
IPEAK
RC
50Ω to 100Ω
TIME
tDL
CURRENT WAVEFORM
tRL
10%
t
tr = 0.7ns TO 1ns
30ns
60ns
Figure 14. IEC 1000-4-2 Current Waveform
18
______________________________________________________________________________________
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
Typical Applications Circuit
TOP VIEW
VL
VL 2
15 C+
SDA 3
14 C-
ADD 4
13 GND
0.1µF
MAX3353EEUE
SCL 5
12 N.C.
INT 6
11 ID_IN
ID_OUT 7
4.7kΩ
9
D+
ID_IN
GND
D-
C
VTRM
D
VTRM
VCC
C1+
SCL
C1-
CFLYING
0.1µF
CVBUS
1µF
MAX3353E
INT
C-
0.1µF
SDA
µP
C+
D-
B
0.1µF
VBUS
D-
TSSOP
A
VTRM
4.7kΩ
VL
10 D+
VTRM 8
VCC
PULLUP
RESISTORS
16 VBUS
VCC 1
D+
ID_IN
ID_OUT
D+
ADD
D-
VBUS
ID
D+
DGND
OTG CONNECTOR
GND
VBUS
MAX3353EEBP
VCC
ADD
ID_OUT
INT
SCL
SDA
VL
1
2
3
4
5
Chip Information
TRANSISTOR COUNT: 9394
PROCESS: BiCMOS
UCSP
______________________________________________________________________________________
19
MAX3353E
Pin Configurations
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
5x4 UCSP.EPS
MAX3353E
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
PACKAGE OUTLINE, 5x4 UCSP
21-0095
20
______________________________________________________________________________________
I
1
1
USB On-the-Go Charge Pump with Switchable
Pullup/Pulldown Resistors
TSSOP4.40mm.EPS
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX3353E
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)