BOURNS MF-SD013_12

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IA
NT
CO
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Features
Applications
■ Tip & ring line protection with two devices
Used as a secondary overcurrent protection
device in:
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Subscriber Line Interface Cards (SLIC)
■
■
■
■
in one surface mount package
High voltage surge capabilities
Assists in meeting ITU-T K.20/K.21/K.45
specifications as well as Telcordia GR-1089
intra-building
RoHS compliant*
Agency recognition:
MF-SD/250 Series - Telecom PTC Resettable Fuses
Electrical Characteristics
Model
MF-SD013/250
Max.
Interrupt
Ratings
Max.
Operating
Voltage
Volts
Volts
(V)
Amps
(A)
60
250
3.0
Ihold
Itrip
Initial
Resistance
Amperes
at 23 °C
Hold
Trip
Ohms
at 23 °C
Min.
Max.
0.13
2.0
0.26
7.0
1 Hour (R1)
Post-Trip
Resistance*
Ohms
at 23 °C
Max.
10.0
Nominal Time
to Trip
Amps
at 23 °C
Seconds
at 23 °C
1
2.5
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.5
* R1 value is measured 24 hours post reflow.
Resistance matched in housing: 1.0 ohm measured 24 hours after reflow installation.
Environmental Characteristics
Operating Temperature.................................... -45 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ............................................ 125 °C
Passive Aging .................................................. +85 °C, 1000 hours................................................±15 % typical resistance change
..................................................................... +60 °C, 1000 hours................................................±15 % typical resistance change
Humidity Aging................................................. +85 °C, 85 % R.H. 1000 hours ..............................±15 % typical resistance change
Thermal Shock ................................................ MIL-STD-202F, Method 107G,...............................±10 % typical resistance change
+125 °C to -55 °C,10 times
±15 % typical resistance change
Solvent Resistance .......................................... MIL-STD-202, Method 215B ..................................No change
Lead Solderability ............................................ ANSI/J-STD-002
Flammability .................................................... IEC 695-2-2 ...........................................................No Flame for 60 secs.
Vibration .......................................................... MIL-STD-883C, Method 2007.1, Condition A ........No change
Test Procedures And Requirements For Model MF-SD/250 Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. .................................................... Verify dimensions and materials .......................Per MF physical description
Resistance ....................................................... In still air @ 23 °C .............................................Rmin ≤ R ≤ Rmax
Time to Trip ...................................................... At specified current, Vmax, 23 °C .....................T ≤ max. time to trip (seconds)
Hold Current .................................................... 30 min. at Ihold .................................................No trip
Primary
Test
Test Conditions
Protection
Mains Power Contact - ITU-T K.20, K.21 ........ 230 V rms, 10 ohms, t = 15 min........................None
Power Induction - ITU-T K.20, K.21................. 600V rms, 600 ohms, t = 0.2 seconds ..............None
Power Induction - ITU-T K.20, K.21................. 600 V rms, 600 ohms, t = 1 second. .................GDT
Lightning Surge - ITU-T K.20, K.21 ................. 1.5 KV, 10/700 μs .............................................None
Lightning Surge ............................................... 4.0 KV, 10/700 μs .............................................GDT
UL File Number ........................................... E 174545S
Thermal Derating Chart -Ihold (Amps)
Model
MF-SD013/250
Ambient Operating Temperature
-40 °C
-20 °C
0 °C
23 °C
40 °C
50 °C
60 °C
70 °C
85 °C
0.21
0.18
0.16
0.13
0.10
0.09
0.08
0.07
0.05
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SD/250 Series - Telecom PTC Resettable Fuses
Product Dimensions
Recommended Pad Layout
8.90
(.350) MAX.
7.2
(.283)
MAX.
1
10.2
(402)
MAX.
DIMENSIONS:
MAX.
8.90
(.350)
MM
(INCHES)
2
3
6.3
(.248)
3.9
(.154)
4
2.4
(.094)
0.5
(.020)
2 PLCS.
3.9
(.154)
7.2
MAX.
(.283)
8.2
(.323)
2.4
(.094)
3.2
(.126)
2.0
(.079)
Packaging: TAPE & REEL = 400 pcs. per reel
Typical Time to Trip at 23 ˚C
Schematic
1000
1
2
3
4
Time to Trip (Seconds)
100
10
Typical Part Marking
1
MANUFACTURER'S
TRADEMARK
0.1
PART
IDENTIFICATION
S D013
0.01
0
0.5
1
1.5
2
2.5
3
How to Order
Fault Current (Amps)
MF - SD 013/250 - 2
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
Temperature (°C)
250
200
150
100
50
0
160–220
10–20
Time (seconds)
120
Solder reflow:
• Recommended reflow methods: IR,
vapor phase oven, hot air oven.
• Devices are not designed to be
wave soldered to the bottom side
of the board.
• Gluing the devices is not
recommended.
• Recommended maximum paste
thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using
standard industry methods and
solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Rework:
• A device should not be reworked.
Multifuse® Product
Designator
Series
SD = Surface Mount
Dual Package
Hold Current, Ihold
013 (0.13 Amps)
Max. Interrupt Voltage, V
250 = 250 Volts
Packaging
- 2 = Tape and Reel*
*Packaged per EIA481-2
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SD/250 Series - Telecom PTC Resettable Fuses
Storage Recommendations
The recommended long term storage conditions for Multifuse® Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices
should remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage
recommendations are exceeded. Devices stored in this manner have an indefinite shelf life.
Packaging Dimensions
MF-SD/250 Series
per EIA 481-2
24.0 ± 0.5
(0.945 ± 0.020)
4.0
(0.157)
16.0
(0.630)
2.0
(0.079)
7.5 ± 0.2
(0.295 ± 0.008)
9.0 ± 0.2
(0.354 ± 0.008)
1.5
(0.059)
11.5
(0.453)
1.75
(0.069)
0.5 ± 0.15
(0.020 ± 0.006)
10.0 ± 0.2
(0.394 ± 0.008)
390
(15.35)
160
(6.30)
Tape Dimensions
W
P0
P
P2
A0
B0
D
F
E
t
K0
Leader min.
Trailer min.
D
P2
E
P0
T
-0.4
(-.016)
330 -2/+0
(12.99 -.079/+0)
DIA.
F
W
B0
P
A0
K0
DIMENSIONS:
MF-SD/250, REV. D 08/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MM
(INCHES)
24.4
(.961)
MIN.
30.4
(1.197)
MAX.
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.