MELEXIS MLX80001

MLX80001
4-channel Master LIN Transceiver
Features
‰
Compliant to LIN Specification Version 1.3, 2.x and J2602
‰
4 channel independent enhanced master transceiver function
‰
Slew rate selection for 10.4kbps (J2602) and 20kbps (LIN 2.x) for optimized radiated
emission behavior
‰
Disable of slew rate control for fast programming or test modes
‰
High EMC immunity
‰
Fully integrated receiver filter
‰
LIN terminals proof against short-circuits and transients in the automotive environment
‰
High impedance LIN in case of loss of ground , loss of battery and under voltage condition
‰
LIN short to ground protection
‰
Control output for voltage regulator
‰
Only 25µA typical power consumption in sleep mode
‰
Remote wake up via LIN traffic
‰
Integrated master termination resistors (1kOhm) and decoupling diodes
‰
Thermal overload protection
‰
5V and 3.3V compatible digital inputs
‰
20-pin thermally enhanced QFN 5x5 package
‰
±4kV ESD protection pin LIN
Ordering Information
Part No.
Temperature Range
Package
MLX80001 KLQD
K (-40 to 125 °C)
LQD (MLPQ 5x5 20pins)
General Description
The MLX80001 is a 4 channel physical layer device for applications of low speed vehicle serial data network
communication using the Local Interconnect Network (LIN) protocol. The device is designed in accordance
to the physical layer definition of the LIN Protocol Specification Package 2.x and the SAE J2602 standard.
The IC furthermore can be used in ISO9141 systems.
Because of the very low current consumption of the MLX80001 in the recessive state it’s suitable for ECU
applications with hard standby current requirements. An advanced sleep mode capability allows a shutdown
of a complete master node. The included wake-up function detects incoming dominant LIN messages and
enables the voltage regulator.
MLX80001 – Datasheet
3901080001
Page 1 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Contents
1.
Functional Diagram ....................................................................................................4
2.
Electrical Specification ..............................................................................................5
2.1
2.2
2.3
2.4
2.5
2.6
3.
Operating Conditions.............................................................................................5
Absolute Maximum Ratings ...................................................................................6
Static Characteristics.............................................................................................7
Dynamic Characteristics........................................................................................9
Timing Diagrams .................................................................................................10
Test Circuits for Dynamic and Static Characteristics ...........................................12
Functional Description.............................................................................................13
3.1
TxDx Input pin - Logic command to transmit on LINx bus as follows:..................13
3.2
RxDx Output pin - Logic data as sensed on the LINx bus ...................................13
3.3
Mode 0 and Mode 1 pins respectively are used to select transceiver operating
modes: ...........................................................................................................................14
3.4
Power on procedure , INH Pin – INHIBIT ............................................................15
3.5
Pin LIN.................................................................................................................16
4.
Fail-save Features ....................................................................................................17
5.
Application Hints ......................................................................................................19
5.1
5.2
5.3
Bus loading requirements....................................................................................19
Duty Cycle Calculation ........................................................................................20
Application Circuitry.............................................................................................22
6.
Pin Description .........................................................................................................23
7.
Mechanical Specification MLPQ5x5 20...................................................................24
8.
ESD/EMC Remarks ...................................................................................................25
9.
Revision History .......................................................................................................26
10.
Assembly Information ..........................................................................................27
11.
Disclaimer..............................................................................................................28
MLX80001 – Datasheet
3901080001
Page 2 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
List of Figures
Figure 1 - Block diagram.......................................................................................................................... 4
Figure 3 – Receiver debouncing and propagation delay....................................................................... 10
Figure 4 - Sleep mode and wake up procedure .................................................................................... 11
Figure 5 - Test circuit for dynamic characteristics ................................................................................. 12
Figure 6 - Test circuit for automotive transients .................................................................................... 12
Figure 7 - State diagram MLX80001 ..................................................................................................... 15
Figure 8 - Duty cycle calculation in accordance to LIN 2.x.................................................................... 20
Figure 9 - Duty cycle measurement in accordance to LIN 2.x for baud rates of 10.4Kbps................... 21
Figure 10 - Typical application circuitry of the MLX80001..................................................................... 22
Figure 11 - Pin description MLPQ 20 package...................................................................................... 23
MLX80001 – Datasheet
3901080001
Page 3 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
1. Functional Diagram
VS
INH
Aux.
Supply
Vs
VBG
Bandgap
TSHD
Temp.
Protection
Mode
Control
MODE0
Vs
monitor/
POR
Wake-up
Control
Sleep timer
Charge
pump
RCO
RxDx time out
MODE1
UV/POR
fuse
P0
fuse
P1
Adjustment
fuse
P2
4
Bias
fuse
P3
Slew rate
Active
decoupling
diode
Master
Pull up
WakeFilter
VS
Rec-Filter
RxD1
Receiver
1K
200K
TSHD
Filter
TxD1
MR
VCC
RxD2
Driver
control
LIN1
channel1
channel2
LIN2
channel3
LIN3
channel4
LIN4
TxD2
RxD3
TxD3
RxD4
TxD4
Figure 1 - Block diagram
MLX80001 – Datasheet
3901080001
Page 4 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2. Electrical Specification
All voltages are referenced to ground (GND). Positive currents flow into the IC.
The absolute maximum ratings (in accordance with IEC 60 134) given in the table below are limiting values
that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long
term exposure to limiting values may effect the reliability of the device.
2.1 Operating Conditions
Parameter
Symbol
Min
Max
Unit
VS
7
18
V
Short time battery supply voltage
VS_S
18
26.5
V
Low battery supply voltage
Vs_L
5
7
V
Operating ambient temperature
Tamb
-40
+125
°C
Battery supply voltage [1]
[1]
Vs is the IC supply voltage including voltage drop of reverse battery protection diode, VDROP = 0.4 to 1V, VBAT_ECU voltage range
is 6 to 26.5V
MLX80001 – Datasheet
3901080001
Page 5 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.2 Absolute Maximum Ratings
Parameter
Symbol
Condition
Min
Max
Unit
-0.3
30
45
V
VVS.tr1
VVS.tr2
VLINx..tr1
VLINx..tr2
t < 1 min
ISO 7637/2 pulse 5, t < 400ms
ISO 7637/2 pulse 1[1]
ISO 7637/3 pulse 2[1]
ISO 7637/3 pulses 1[2]
ISO 7637/3 pulses 2[2]
VHV..tr3
ISO 7637/2 pulses 3A, 3B [3]
-200
DC voltage LIN
VLIN_DC
t < 500ms , Vs = 18V
Vs = 0V
DC voltage logic I/O’s
Vlogic_DC
-22
-40
-0.3
ESD capability any pins
VESDHB
Battery Supply Voltage
Transients at
Transients at
Transients at
Transients at
Transients at
pins
VS
battery supply voltage
battery supply voltage
high voltage signal pins
high voltage signal pins
high voltage signal and power supply
ESD capability LINx
Maximum latch – up free current at any Pin
VESDHB_HV
ILATCH
Maximum power dissipation [4]
Ptot
Thermal impedance
ΘJA
Tstg
Tvj
Storage temperature
Junction temperature
[1]
[2]
[3]
[4]
Human body model,
equivalent to discharge
100pF with 1.5kΩ,
Human body model,
equivalent to discharge
100pF with 1.5kΩ,
-100
+30
V
V
V
V
+200
V
+40
V
+7
V
-2
+2
kV
-4
+4
kV
-500
+500
0.75
1.3
1.6
mA
34
K/W
+150
+150
°C
°C
+50
-30
Tamb = +125 °C
Tamb = +105 °C
Tamb = + 95 °C
in free air
-55
-40
W
ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor.
ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF.
ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a
reverse polarity diode and >10uF blocking capacitor
Simulated values for low conductance board (JEDEC)
MLX80001 – Datasheet
3901080001
Page 6 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.3 Static Characteristics
Unless otherwise specified all values in the following tables are valid for VS = 5 to 26.5V and TAMB= -40 to
125°C. All voltages are referenced to ground (GND), positive currents are flow into the IC.
Parameter
Symbol
Condition
Min
Typ
Max
Unit
4.5
V
PIN VS
Undervoltage lockout
VS_UV
MODE0/1=1, TxDx=0
2
Supply current single channel, dominant
ISd_single
VS = 26.5V, TxDx=0
no load current
30
2
mA
Supply current four channel, dominant
ISd_four
VS = 26.5V, TxDx=0
No load current
120
4
mA
Supply current, recessive
ISr
VS = 18V, TxDx=H
950
1500
µA
Supply current, sleep mode
ISsl
MODE0/1=0
VS = 12V, Tamb= 25°
25
Supply current, sleep mode
ISsl
MODE0/1=0
µA
50
µA
200
mA
1100
Ω
PIN LINx – Transmitter
Short circuit LIN current
I_LIN_LIM
VLIN = VS, TxD=0
Pull up resistor LIN
R_LIN_PU
VLIN =0, TxD open
Pull up current LIN , sleep mode
I_LIN_PU_SLEEP VLIN=0, VS=12V, sleep mode
120
900
-100
µA
-75
LIN reverse current, recessive
I_LIN_rec
VLIN> VS, 5V < VLIN < 26.5V ,
5V < VS < 26.5V, TxD open
20
µA
LIN reverse current loss of battery
I_LIN_LOB
VS=0V, 0V < VLIN < 26.5V
20
µA
I_LIN_LOG
VS=12V, 0V < VLIN < 26.5V
100
µA
VolLIN_3
VS=18V, network load =500Ω,
TxDx = 0
2
V
LIN current during loss of
Ground[2]
Transmitter dominant voltage
Transmitter driving capability low battery
I_LIN_dom_min
VS=7V, VLIN=1.5V, TxDx = 0
Recessive output voltage
VohLIN
TxDx open
LIN input capacitance [1]
CLIN
Pulse response via 1KΩ,
VPULSE = 12V, VS open
-150
40
mA
0.8*Vs
25
Vs
V
35
pF
PIN LINx – Receiver
Receiver dominant voltage
VilLIN
Receiver recessive voltage
VihLIN
0.4 *VS
V
0.6 *VS
Center point of receiver threshold
ViLIN_cnt
VLIN_cnt = ( VilLIN_ + VihLIN )/2
Receiver hysteresis
ViLIN_hys
VLIN_cnt = ( VihLIN -VilLIN )
V
0.475 *VS 0.5 *VS 0.525 *VS
V
0.175 *VS
V
PIN TXD_x, MODE 0/1
High level input voltage
Vih
Low level input voltage
Vil
TxD pull up current
MODE pull down resistor
MLX80001 – Datasheet
3901080001
-IIL_TXD
2.0
TxD_x =L, MODE0&1=H
RMODE_pd
Page 7 of 28
V
0.65
V
10
50
µA
10
50
kΩ
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Parameter
Symbol
Condition
Min
Typ
Max
Unit
PIN RXD_x
Low level output voltage
High level output leakage
Vol_rxd
IRxD = 2mA
Iih_rxd
VRxD = 5.5V
-10
0.9
V
+10
µA
PIN INH
High level output voltage
Voh_INH
IINH = -180µA
Leakage current INH
IINH_lk
EN = L ,VINH = 0V
VS -0.8V VS -0.5V
V
-10
10
µA
Thermal Protection
Thermal shutdown [1]
Tsd
160
190
°C
Thermal recovery [1]
Thys
126
150
°C
[1]
[2]
No production test, guaranteed by design and qualification
The current is determined by the master pull up, to prevent discharge battery the master pull up path will be disconnected under
LOG conditions
MLX80001 – Datasheet
3901080001
Page 8 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.4 Dynamic Characteristics
Unless otherwise specified all values in the following table are valid for VS = 5 to 26.5V and
TAMB= -40 to 125oC.
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Propagation delay receiver
[1]
trec_pdf
CRxD =25pF falling edge
6
µs
Propagation delay receiver
[1]
trec_pdr
CRxD =25pF rising edge
6
µs
trec_sym
Calculate ttrans_pdf ttrans_pdr
-2
2
µs
trec_deb
LIN rising & falling edge
0.5
4
µs
Propagation delay receiver symmetry
Receiver debounce time [2]
[2]
LIN duty cycle 1 [3] [4]
D1
20kbps operation ,
normal mode
LIN duty cycle 2 [3] [4]
D2
20kbps operation ,
normal mode
LIN duty cycle 3 [3] [4]
D3
10.4kbs operation ,
low speed mode
LIN duty cycle 4 [3] [4]
D4
10.4kbs operation ,
low speed mode
0.590
trec(max) – tdom(min)
∆t3
10.4kbs operation ,
low speed mode
15.9
µs
trec(min) – tdom(max)
∆t4
10.4kbs operation ,
low speed mode
17.28
µs
Rise time in high speed mode
tr_hs
Network τ < 1µs
2
µs
Fall time in high speed mode
tf_hs
Network τ < 1µs
2
µs
Wake-up filter time
twu
Sleep mode
LIN_x rising & falling edge
15
150
µs
0.396
0.581
0.417
Delay from Standby to Sleep Mode
tdsleep
MODE0/1 = L
100
500
ms
RxD time out
tRxD_to
Active modes, RxD_x = L
25
50
ms
tMODE_deb
Active <--> standby mode
transitions
2
20
µs
MODE0/1 – debounce time
[1]
[2]
[3]
[4]
5
This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling
edges is 50V/us
See figure 4 - receiver debounce and propagation delay
See figure 5 and 6 – duty cycle measurement & calculation,
Standard loads for duty cycle measurements are 1KΩ/1nF , 660Ω/6.8nF, 500Ω/10nF,internal termination disabled
MLX80001 – Datasheet
3901080001
Page 9 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.5 Timing Diagrams
t < trec_deb
t < trec_deb
VBUS
t
tREC_PDF
tREC_PDR
VRxD
50%
t
Figure 2 – Receiver debouncing and propagation delay
MLX80001 – Datasheet
3901080001
Page 10 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
VLINx
t
t > twu
VINH
twu
t
VCC_ECU
t
VM0/1
t
VRxDx
wake-up interrupt
t
Figure 3 - Sleep mode and wake up procedure
MLX80001 – Datasheet
3901080001
Page 11 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
2.6 Test Circuits for Dynamic and Static Characteristics
Figure 4 - Test circuit for dynamic characteristics
Figure 5 - Test circuit for automotive transients
MLX80001 – Datasheet
3901080001
Page 12 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
3. Functional Description
3.1 TxDx Input pin - Logic command to transmit on LINx bus as follows:
TxD Polarity
•
•
TxD = logic 1 (or floating) on this pin applies a recessive bus state (high bus voltage)
TxD = logic 0 on this pin applies a bus dominant state depending on the transceiver mode state (low
bus voltage)
If the TxD pin is driven to a logic low state while the Mode 0,1 pins are in the 0,0 state or open, the
transceiver does not drive the LIN pin to the dominant state.
The pin contains an internal pull up to guarantee a recessive LIN behaviour in case of an open TxD pin. For
5V ECU supply systems an external pull up resistor is recommended.
TxD input thresholds are standard CMOS logic levels for 3.3V and 5V supply voltages.
3.2 RxDx Output pin - Logic data as sensed on the LINx bus
RxD polarity
•
•
RxD = logic 1 on this pin indicates a bus recessive state (high bus voltage)
RxD = logic 0 on this pin indicates a bus dominant state (low bus voltage)
The RxDx output is a low side open drain output. An external pull up resistor is required to realize the level
shift of an logic 1 level (high impedance output) to the Vcc_ECU voltage level.
Wake up source recognition
RxDx do not pass signals to the micro processor while in sleep mode until a valid wake up bus voltage level
is received or the Mode 0,1 pins are not 0,0 respectively. When the valid wake up bus signal awakens the
transceiver, the RxDx pin signalized an active low interrupt. This interrupt is active as long as no MODE pin
is switched to logic 1. After the MLX80001 enters an active mode, all valid bus signals will be sent out to the
RxD output.
The micro can detect the source of the wake up event and start the transmission only to the network caused
the wake up.
RxD time out feature
A dominant RxDx level longer than the specified time indicates a faulty blocked bus caused by a LIN node
itself or a short circuit to ground. The master pull up resistor of the LIN channel affected by the short will be
disconnected from the network in order to prevent thermal overload conditions or failure currents from the
battery without any intervention from the micro. The RxD timeout will be disabled with the next L->H
transition.
RxD Typical Load
Resistance: 2.7 kΩ
Capacitance: < 25 pF
MLX80001 – Datasheet
3901080001
(recommended pull up resistor)
(parasitic board capacitance)
Page 13 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
3.3 Mode 0 and Mode 1 pins respectively are used to select transceiver operating
modes:
The MLX80001 provides a weak internal pull down current on each of these pins. In case of open pins or
during the micro I/O initialisation procedure after power on or ECU wake up a stable passive behaviour of the
MLX80001 is given.
The MODE0/1 input thresholds are standard CMOS logic level for 3.3V and 5V supply voltages.
M0
M1
Mode
L
L
Sleep Mode
H
L
High Speed Mode (slew rate control disabled)
L
H
Low speed mode
H
H
Normal Mode
Mode 0 = 0, Mode 1 = 0 - Sleep mode.
Transceiver is in low power state, waiting for remote wake up via LIN or by mode changes to any state other
than 0,0. In this mode, the LINx pin is not in the dominant state regardless of the voltage at the TxDx pin.
As long as the MODE0/1 pin are logic 0, the transceiver returns to sleep mode after power on or remote
wake up after the specified time.
Mode 0 = 1, Mode 1 = 0. High Speed mode
This mode allows high speed data download up to 100Kbit/s. The slew rate control is disabled in this mode
all the six transmission channels. The falling edge is the active driven edge, the rising edge additional is
determined by the network time constant.
Mode 0 = 0, Mode 1 = 1. Transmit with reduced slew rate for low speed applications with
10.4kbps or below
This mode is the recommended operating mode for J2602 applications. The slew rate control of any channel
is optimized for minimum radiated noise, especially in the AM band.
Mode 0 = 1, Mode 1 = 1. Normal speed mode
Transmission bit rate in normal mode is up to 20kbps. The slew rate control of any channel is optimized for
maximum allowed bit rate in the LIN specification package 2.x.
MLX80001 – Datasheet
3901080001
Page 14 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
LINx termination
1kOhm
Low Slew Mode
M0
M1
RxDx
INH
low
high
LINxdata
VS
High Speed Mode
Thermal
shutdown
M0
High resistive LINx
termination
RxDx = low
high
No TxDx -> LINx
transmission possible
M0&1=>Low
M1
RxDx
INH
low
LINxdata
VS
VS on
Normal Slew Mode
M0
M1
RxDx
INH
high high
LINxdata
VS
RxD L->H > 150us
M0&1
RxDx
time out
=>High
Standby
RxD=L > 10ms
M0/1 INH RxDx
M0&1=>Low
low
Only faulty blocked
channels switched to high
resistive LIN termination
wake up
request
from LINx
Sleep Mode
M0&1
low
RxDx
high/
VCCECU
low[1]
High resistive LINx
termination
M0/1 =>High
(if VCC_ECU on)
after 200ms
-> no mode change
-> no valid wake up
VS
INH
floating
High resistive LINx
termination
[1]
active low interrupt, indicates source of wake up
after power on all channel RxDx are active low
Figure 6 - State diagram MLX80001
3.4 Power on procedure , INH Pin – INHIBIT
After power on the MLX80001 automatically enters an intermediate standby mode, the INH output becomes
HIGH (VBAT) and therefore the external voltage regulator will provide the Vcc supply voltage for the ECU . If
there is no mode change within the time stated (typically 350ms), the IC re-enters the sleep mode and the
INH output is going to become floating (logic 0).
When the device detects a valid wake up condition (bus traffic on any of the four LIN networks exceeds the
wake up filter time delay) the INH output becomes HIGH (VBAT) again and the same procedure starts as
described after power on. In case of a mode change to any active mode the sleep timer is stopped and INH
keeps HIGH(VBAT). If the transceiver enters the sleep mode (M0/1=0) , INH goes to logic 0 (floating) after
typically 350 ms when no valid wake up is detected.
MLX80001 – Datasheet
3901080001
Page 15 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
3.5 Pin LIN
The LINx pins are the four physical interfaces to the automotive environment. The related circuitry consists of
three parts:
•
Transmitter with slew rate control
The slew rate of the transmitter is configurable by the MODE0/1 pins and depends from the application.
•
Receiver
The receiver guarantees the specified input threshold levels and a very high robustness to external
disturbances.
•
Termination
This circuitry contains the master pull up resistor and decoupling diodes. The integrated solution allows a
very comfortable control of failure situations, see description below. To guarantee the specified value of +/10% and to minimize the power dissipation, this circuitry is adjustable on wafer level. In order to allow a
battery current limitation in failure situations, a high resistive termination is placed in parallel to the master
pull up resistor.
MLX80001 – Datasheet
3901080001
Page 16 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
4. Fail-save Features
Loss of battery
If the ECU is disconnected from the battery, the LIN pin is in high impedance state. There is no impact to the
LIN bus traffic and to the ECU self, no damage can occur.
Loss of Ground
In case of an interrupted ECU ground connection the LIN pin is in high impedance state. There is no impact
to the LIN bus traffic and to the ECU self, no damage can occur.
Short circuit to battery
The transmitter output current is limited to the specified value in case of short circuit to battery in order to
protect the MLX80001 itself against high current densities. Otherwise the micro of the master ECU or the
slave nodes will not detect any bus traffic until the failure disappears and will switch into sleep mode.
Ground shift and short circuit to ground
If the LIN wire is shorted to negative shifted ground levels, there is no current flow from the ECU ground to
the LIN bus and no distortion of the LIN bus traffic.
A permanent failure current from battery via LIN short to ground can be reduced dramatically by
disconnection of the master pull up resistor. The following different situations may occur:
• The master node is in sleep mode, there is no bus traffic at any channel. If a short circuit to ground is
applied to a LIN network, the H ->L transition will awakens the shorted LIN network and the master
node. Due to the wake up source recognition the master is able to detect the wake up channel and
will not awaken the other LIN networks too. If there is no bus traffic possible with the shorted
network, the connected nodes will go to sleep mode again and the failure current to ground is
limited. If the failure disappears, the high resistive termination is able to drive a recessive voltage
level and the master node and the network will wake up due to the L->H transition.
• The master node is busy and there is bus traffic on one or more connected LIN networks. If a short
circuit to ground is applied to a LIN network, the integrated RxD timeout circuit will disconnect the
master pull up resistor from the shorted LIN network (high resistive termination present now). The
failure current to ground is limited and the thermal overload condition of the MLX80001 is removed
without any intervention of the micro. If the failure disappears, the RxD L->H transition will reset the
RxD timer circuit and the master termination will be reconnected to the LIN network.
Thermal overload
The MLX80001 is protected against thermal overloads.
Independent from the source of a LIN bus transmission (master channel1...4 or any slave node), the most
significant part of the power dissipation will be produced in the master pull up resistor(s) during normal
operation. Assuming a duty cycle of 50% and all channels are busy by bus traffic, the chip only can exceed
the specified trip off temperature if the ambient temperature is higher than the specified maximum of125°C.
Due to failure situations such as short of a LIN channel vs. battery voltage or ground, the power dissipation
can become higher than expected in the operating temperature range.
In these situations any transmit path will be interrupted and any master pull up resistor will be disconnected
from the LIN interfaces until thermal recovery, independent from the operating mode of the MLX80001 and
without any intervention of the micro. The thermal shutdown can be detected by the micro due to the active
low interrupt applied to any RxD output.
Usually the short to ground situation is covered by the sleep mode behaviour or the RxD timeout feature for
each channel. Thereby very high system availability is guaranteed.
MLX80001 – Datasheet
3901080001
Page 17 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Undervoltage Vs
If the supply voltage is missing or will be decreased under the specified value, the transmitter is switched off
to prevent undefined LIN bus traffic. If the supply voltage is in the range of Vs = 5V…7V (low battery
operation), the transmitter operates in the mode as indicated by the MODE0/1 pins. Communication can not
be guaranteed under all worst case conditions (plug & play specification of LIN2.x and SAE J2602 standard
is defined from 7V…18V IC battery supply voltage).
Overvoltage Vs
If the supply voltage is in the range of Vs = 18V…26.5, the transmitter operates in the mode as indicated by
the MODE0/1 pins. In case of multi channel bus traffic the power consumption can exceed the expected
maximum value for the normal operation voltage range up to Vs = 18V and the thermal overload protection
will operate as described above. Communication can not be guaranteed under all worst case conditions (
plug & play specification of LIN2.x and SAE J2602 standard is defined from 7V..18V IC battery supply
voltage).
MLX80001 – Datasheet
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Page 18 of 28
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Rev 001
MLX80001
4-channel Master LIN Transceiver
5. Application Hints
5.1 Bus loading requirements
Parameter
Symbol
Min
Max
Unit
VBAT
8
18
V
Voltage drop of reverse protection diode
VDrop_rev
0.4
0.7
1
V
Voltage drop at the serial diode in pull up path
VSerDiode
0.4
0.7
1
V
Battery shift voltage
VShift_BAT
0
0.1
VBAT
Ground shift voltage
VShift_GND
0
0.1
VBAT
Master termination resistor
Rmaster
900
1000
1100
Ω
Slave termination resistor
Rslave
20
30
60
kΩ
Number of system nodes
N
2
Operating voltage range
Total length of bus line
Typ
16
LENBUS
40
m
150
pF/m
Line capacitance
CLINE
100
Capacitance of master node
CMaster
220
Capacitance of slave node
CSlave
195
220
300
pF
Total capacitance of the bus including slave and master
capacitance
CBUS
0.47
4
10
nF
RNetwork
500
862
Ω
τ
1
5
µs
Network Total Resistance
Time constant of overall system
pF
Table 1 - Bus loading requirements
MLX80001 – Datasheet
3901080001
Page 19 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
5.2 Duty Cycle Calculation
tBit
tBit
TxD
tdom(max)
VSUP
trec(min)
100%
74.4%
tdom(min)
58.1%
BUS
58.1%
42.2%
28.4%
VSS
trec(max)
28.4%
0%
RxD
Figure 7 - Duty cycle calculation in accordance to LIN 2.x
With the timing parameters shown in Figure 7 two duty cycles , based on trec(min) and trec(max) can be
calculated as follows :
D1 = trec(min) / (2 * tBit)
D2 = trec(max) / (2 * tBit)
For proper operation at 20KBit/s ( tBit = 50µs) the LIN driver has to fulfill the duty cycles specified in chapter
2.4 for supply voltages of 7 to 18V and the defined standard loads .
Due to this simplified definition there is no need to measure slew rates, slope times, transmitter delays and
dominant voltage levels as specified in the LIN physical layer specification 1.3.
The device within the D1/D2 duty cycle range operates also in applications with reduced bus speed of
10.4KBit/s or below.
In order to minimize EME, the slew rates of the transmitter can be reduced (approximately by 2 times). Such
devices have to fulfill the duty cycle definition D3/D4 in the LIN physical layer specification 2.x. Devices
within this duty cycle range cannot operate in 20KBit/s applications.
MLX80001 – Datasheet
3901080001
Page 20 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
Figure 8 - Duty cycle measurement in accordance to LIN 2.x for baud rates of 10.4Kbps
With the timing parameters shown in the above diagram two duty cycles , based on trec(min) and trec(max)
can be calculated as follows : tBit =96µs
D3 = trec(min) / (2 x tBit)
D4 = trec(max) / (2 x tBit)
MLX80001 – Datasheet
3901080001
Page 21 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
5.3 Application Circuitry
LINx network
Car Battery Cl30
1N4001
10uF
VBAT_ECU
Voltage regulator
Master
ECU
100nF
VBAT
INH
+5V
4 times
100nF
47nF
2.7K
VS
4 times
Rx/Tx LIN
10Ohm
LINx
MLX80001
10K
INH
TxDx
180pF
µP
MODE0
Control
LIN
MODE1
GNDx
ESD
protection
Control
CAN
SWCAN
TH8056
or
HSCAN
Rx/Tx
CAN
GND
ECU connector to
Single Wire LIN
Bus
RxDx
INH
CAN
1N4001
2.2uF
VBAT
Voltage regulator
100nF
VBAT
Slave
ECU
INH
+5V
47nF
47nF
100nF
µP
INH
VCC
VS
TH8082BUS
10Ohm
RxD
180pF
TxD
EN
GND
GND
ESD
protection
ECU connector to
Single Wire LIN
Bus
2.7K
Figure 9 - Typical application circuitry of the MLX80001
MLX80001 – Datasheet
3901080001
Page 22 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
16
17
18
15
1
MLX80001
2
3
MLPQ5x 5
4
14
13
12
11
10
9
INH
RxD3
TxD3
GNDA
TxD2
LIN2
RxD2
8
RxD1
LIN1
GNDL
7
5
6
TxD4
MODE0
MODE1
GNDD
TxD1
19
20
RxD4
LIN4
GNDL
LIN3
Vs
6. Pin Description
Figure 10 - Pin description MLPQ 20 package
Pin
Name
IO-Typ
1
TxD4
I
Transmit data to LIN4
2
MODE0
I
Mode control pin
3
MODE1
I
Mode control pin
4
GNDD
P
Ground for digital core
5
TxD1
I
Transmit data to LIN1
6
RxD1
O
Receive data from LIN1
7
LIN1
I/O
Interface to LIN bus ,channel 1
8
GNDL
P
9
LIN2
I/O
Interface to LIN bus ,channel 1
10
RxD2
O
Receive data from LIN2
11
TxD2
I
Transmit data to LIN2
12
GNDA
P
Ground for analogue core
13
TxD3
I
Transmit data to LIN3
14
RxD3
O
Receive data from LIN3
15
INH
O
Control output for voltage regulator
16
Vs
P
Battery supply voltage
17
LIN3
I/O
18
GNDL
P
19
LIN4
I/O
Interface to LIN bus ,channel 4
20
RxD4
O
Receive data from LIN4
MLX80001 – Datasheet
3901080001
Description
Power ground for LIN1&2
Interface to LIN bus ,channel 3
Power ground for LIN3&4
Page 23 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
7. Mechanical Specification MLPQ5x5 20
A
A1
A3
b[1]
D
D2
E
E2
e
L
N [6][3]
ND [5]
NE [5]
0.25
0.30
0.35
5.00
3.00
3.15
3.25
5.00
3.00
3.15
3.25
0.65
0.45
0.55
0.65
20
5
5
All Dimension in mm, coplanarity < 0.1 mm
Min
nom
max
[1]
[2]
[3]
[4]
[5]
[6]
0.8
0.90
1.00
0
0.02
0.05
0.20
Dimensions and tolerances conform to ASME Y14.5M-1994
All dimensions are in Millimeters. All angels are in degrees
N is the total number of terminals
Dimension b applies to metallized terminal and is measured between 0.25 and 0.30mm from terminal tip
ND and NE refer to the number of terminals on each D and E side respectively
Depopulation is possible in a symmetrical fashion
MLX80001 – Datasheet
3901080001
Page 24 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
8. ESD/EMC Remarks
•
The MLX80001 is designed for automotive environments. Typical ESD - and EMC events the device
can withstand are defined in chapter 2.2 ‘Absolute maximum ratings ‘.
•
The application circuit board should be designed related to the board layout requirements in the SAE
J2602 chapter 7.6.2. .
•
The MLX80001 is an ESD sensitive device and should be handled according to guideline EN100015/
part1 (“ The protection of ESD sensitive devices “)
MLX80001 – Datasheet
3901080001
Page 25 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
9. Revision History
Version
Changes
001
MLX80001 – Datasheet
3901080001
Remark
1st Release
Page 26 of 28
Date
March 2007
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
10. Assembly Information
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
MLX80001 – Datasheet
3901080001
Page 27 of 28
March 2007
Rev 001
MLX80001
4-channel Master LIN Transceiver
11. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2005 Melexis NV. All rights reserved.
.
For the latest version of this document. Go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan:
Phone: +32 1367 0495
E-mail: [email protected]
All other locations:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS16949 and ISO14001 Certified
MLX80001 – Datasheet
3901080001
Page 28 of 28
March 2007
Rev 001