ONSEMI MMDL101T1G

MMDL101T1
Schottky Barrier Diode
Schottky barrier diodes are designed primarily for high−efficiency
UHF and VHF detector applications. Readily available to many other
fast switching RF and digital applications.
Features
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• Very Low Capacitance − Less than 1.0 pF @ 0 V
• Low Noise Figure − 6.0 dB Typ @ 1.0 GHz
• Pb−Free Package is Available
1.0 pF SCHOTTKY
BARRIER DIODE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VR
7.0
Vdc
Symbol
Max
Unit
200
1.57
mW
mW/°C
Reverse Voltage
1
CATHODE
2
ANODE
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) @TA = 25°C
Derate above 25°C
2
PD
Thermal Resistance, Junction−to−Ambient
RqJA
635
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
1
PLASTIC
SOD−323
CASE 477
STYLE 1
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may
be affected.
1. FR−5 Minimum Pad
MARKING DIAGRAM
4M M G
G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Reverse Breakdown Voltage
(IR = 10 mA)
Symbol
Min
Typ
Max
7.0
10
−
Unit
V(BR)R
Diode Capacitance
(VR = 0, f = 1.0 MHZ), (Note 2)*
CT
Reverse Leakage
(VR = 3.0 V)
IR
Noise Figure
(f = 1.0 GHz), (Note 3)*
NF
Forward Voltage
(IF = 10 mA)
VF
V
pF
−
0.88
1.0
−
20
250
−
6.0
−
nAdc
dB
ORDERING INFORMATION
Vdc
−
0.5
4M = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
0.6
*Notes on Next Page
Package
Shipping†
MMDL101T1
SOD−323
3000 / Tape & Reel
MMDL101T1G
SOD−323
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 1
1
Publication Order Number:
MMDL101T1/D
MMDL101T1
TYPICAL CHARACTERISTICS
100
IF, FORWARD CURRENT (mA)
IR, REVERSE LEAKAGE (m A)
1.0
0.7
0.5
VR = 3.0 Vdc
0.2
0.1
0.07
0.05
10
TA = 85°C
TA = −40°C
1.0
0.02
TA = 25°C
MMBD110T1
0.01
30
40
50
60
70
80
90 100 110
TA, AMBIENT TEMPERATURE (°C)
120
MMBD110T1
0.1
0.3
130
0.4
Figure 1. Reverse Leakage
0.8
11
LOCAL OSCILLATOR FREQUENCY = 1.0 GHz
(Test Circuit Figure 5)
10
0.9
NF, NOISE FIGURE (dB)
C, CAPACITANCE (pF)
0.7
Figure 2. Forward Voltage
1.0
0.8
0.7
9
8
7
6
5
4
3
2
MMBD110T1
0.6
0.5
0.6
VF, FORWARD VOLTAGE (VOLTS)
0
1.0
2.0
3.0
VR, REVERSE VOLTAGE (VOLTS)
1
0.1
4.0
Figure 3. Capacitance
MMBD110T1
0.2
0.5
1.0
2.0
5.0
PLO, LOCAL OSCILLATOR POWER (mW)
Figure 4. Noise Figure
LOCAL
OSCILLATOR
UHF
NOISE SOURCE
H.P. 349A
DIODE IN
TUNED
MOUNT
NOISE
FIGURE METER
H.P. 342A
IF AMPLIFIER
NF = 1.5 dB
f = 30 MHz
NOTES ON TESTING AND SPECIFICATIONS
2. CC and CT are measured using a capacitance bridge
(Boonton Electronics Model 75A or equivalent).
3. Noise figure measured with diode under test in tuned diode
mount using UHF noise source and local oscillator (LO)
frequency of 1.0 GHz. The LO power is adjusted for
1.0 mW. IF amplifier NF = 1.5 dB, f = 30 MHz, see Figure 5.
Figure 5. Noise Figure Test Circuit
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2
10
MMDL101T1
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
HE
D
b
1
2
E
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1 0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C 0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
HE
2.30
2.50
2.70
A3
A
C
NOTE 3
L
NOTE 5
A1
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN
0.031
0.000
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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MMDL101T1/D