E2E0012-27-Y3 ¡ Semiconductor MSM6353/6353L-xx ¡ Semiconductor This version: Jan. 1998 Previous version: Mar. 1996 MSM6353/6353L-xx Built-in 8 or 5 bit Serial Port 4-Bit Microcontroller GENERAL DESCRIPTION The MSM6353/6353L is a low-power 4-bit microcontroller manufactured in CMOS process technology. It is best suited for the control of battery-driven equipment. The built-in 8-bit or 5-bit serial port provides a data communication capability with external apparatus. FEATURES • Low power consumption • Large capacity memory • ROM : 4096 words ¥ 15 bits • RAM : 1024 words ¥ 4 bits • I/O port Input-output port : 5 ports ¥ 4 bits (input or output can be specified for each port) • 1.5 V single-power-supply operation (MSM6353) Can be changed to 3.0 V specification by mask option (MSM6353L). • Built-in watchdog timer • Built-in serial port of 8 bits or 5 bits (asynchronous) • 32.768 kHz built-in crystal oscillator circuit • Package options: 42-pin shrink DIP (SDIP42-P-600-1.78) (Product name: MSM6353-xxSS, MSM6353L-xxSS) 44-pin plastic QFP (QFP44-P-910-0.80-K) (Product name:MSM6353-xxGS-K, MSM6353L-xxGS-K) (QFP44-P-910-0.80-2K) (Product name: MSM6353-xxGS-2K,MSM6353L-xxGS-2K) xx indicates the code number. 1/9 PORT3 PORT4 P4.0 P4.1 P4.2 P4.3 XT TEST1 TEST2 TEST3 SYSTEM CLOCK GENERATOR INSTRUCTION DECODER INSTRUCTION REGISTER IRQEX IRQRT IEXM0 IEXM1 IEXM2 PROGRAM COUNTER RESET WDOG 0 XT WDOG 1 TMOUT 4096 ¥ 15 bits SCND D-BUS SCNT INTERRUPT CONTROL EIRT SBFFl SBFF u PROGRAM ROM P1 ¥ C P00C ADDER FRMT TIME BASE COUNTER P2.0-2.3 P2 ¥ C P3 ¥ C WATCHDOG TIMER P01C P02C FLAG ALU ACC PAGE OSC PORT2 P3.0 P3.1 P3.2 P3.3 P4 ¥ C P03C SERIAL I/O SOUT SCLK BANK XTOUT PORT1 P2.0 P2.1 P2.2 P2.3 PORT0 P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 SIN VCP VCM VOLTAGE CONVERTER REGURATOR 1024 ¥ 4 bits DATA RAM VEE VSS1 VSS2 VDD ¡ Semiconductor MSM6353/6353L-xx BLOCK DIAGRAM WORK STACK 2/9 ¡ Semiconductor MSM6353/6353L-xx PIN CONFIGURATION (TOP VIEW) VDD 1 42 XT VSS2 2 41 XT VSS1 3 40 XTOUT VEE 4 39 P1.0 NC 5 38 P1.1 VCP 6 37 P1.2 VCM 7 36 P1.3 NC 8 35 NC SOUT 9 34 TEST3 SIN 10 SCLK 11 33 32 TEST2 TEST1 NC 12 31 RESET P0.0 13 30 P4.3 P0.1 14 29 P4.2 P0.2 15 28 P4.1 P0.3 16 27 P4.0 NC 17 P2.0 18 26 25 NC P3.3 P2.1 19 24 P3.2 P2.2 20 23 P3.1 P2.3 21 22 P3.0 NC : No-connection pin 42-Pin Shrink DIP 3/9 ¡ Semiconductor MSM6353/6353L-xx 34 P1.0 35 XTOUT 36 XT 37 XT 38 VDD 39 VDD 40 VSS2 41 VSS1 42 VEE 43 NC 44 NC PIN CONFIGURATION (TOP VIEW) (Continued) NC 1 33 P1.1 VCP 2 32 P1.2 VCM 3 31 P1.3 NC 4 30 TEST3 SOUT 5 29 TEST2 NC 22 23 P4.0 P3.3 21 24 P4.1 P0.3 11 P3.2 20 P0.2 10 P3.1 19 25 P4.2 P3.0 18 26 P4.3 9 P2.3 17 8 P0.1 P2.3 16 P0.0 P2.2 15 27 RESET P2.1 14 28 TEST1 7 P2.0 13 6 NC 12 SIN SCLK NC : No-connection pin 44-Pin Plastic QFP 4/9 ¡ Semiconductor MSM6353/6353L-xx ABSOLUTE MAXIMUM RATINGS (MSM6353, 1.5 V) VDD=0 V (VSS1=VSS2=battery voltage) Parameter Symbol VSS1 Condition Input Voltage VIN Ta=25°C Output Voltage VOUT Storage Temperature TSTG Power Supply Voltage Rating Unit –6.0 to +0.3 VSS–0.3 to VSS+0.3 V VSS–0.3 to VSS+0.3 — –55 to +125 °C RECOMMENDED OPERATING CONDITIONS (MSM6353, 1.5 V) VDD=0 V (VSS1=VSS2=battery voltage) Symbol Vop Condition Range BUF=Fixed to "0" –1.25 to –1.75 V Operating Temperature Top — –20 to +70 °C Operating Frequency fOSC — 32.768 kHz Parameter Operating Voltage Unit ELECTRICAL CHARACTERISTICS (MSM6353, 1.5 V) DC Characteristics (VDD=0 V, VSS1=VSS2=–1.5 V (battery voltage), fOSC=32,768 Hz, CX=35 pF, Ta=25°C) Parameter Current Consumption Oscillation Start Voltage Output Current 1 Output Current 2 Input Current 1 Input Leakage Current Input Current 3 Input Voltage Condition Symbol Min. Typ. Max. Unit Applied Pin *1 *2 — 3.0 — mA –VOSC Within 2 sec. — — 1.4 V –IOH1 VO=–0.5 V 150 — — IOL1 VO=–1.0 V 150 — — –IOH2 VO=–0.5 V 7 — — IOL2 VO=–1.0 V 20 — — 75 150 300 IDD –IIH1 | IIL2 | –IIL3 VI=0 V, input state, with pull-down resistor VI=0V, –1.5 V, input state, without pull-down resistor VI=0 V, with pull-down resistor mA — — PORT0 to PORT4*3 SOUT, SCLK, XTOUT mA BD mA PORT0 to PORT4 — — 1 mA — 4 — –VIH — — — 0.3 –VIL — 1.2 — — PORT0 to PORT4 SCLK, SIN, SOUT mA RESET V All input pins *1 This value depends on program. *2 Backup flag (BUF)=fixed to "0". *3 PORT0=P0.0-P0.3, PORT1=P1.0-P1.3, PORT2=P2.0-P2.3, PORT3=P3.0-P3.3, PORT4=P4.0P4.3. 5/9 ¡ Semiconductor MSM6353/6353L-xx ABSOLUTE MAXIMUM RATINGS (MSM6353L, 3.0 V) VDD=0 V (VSS1=VSS2=battery voltage) Parameter Power Supply Voltage Symbol VSS1 Condition Ta=25°C Input Voltage VIN Output Voltage VOUT Storage Temperature TSTG Rating Unit –6.0 to +0.3 VSS–0.3 to VSS+0.3 V VSS–0.3 to VSS+0.3 — –55 to +125 °C RECOMMENDED OPERATING CONDITIONS (MSM6353L, 3.0 V) VDD=0 V (VSS1=VSS2=battery voltage) Symbol Vop Condition Range BUF=Fixed to "1" –2.2 to –3.5 V Operating Temperature Top — –20 to +70 °C Operating Frequency fOSC — 32.768 kHz Parameter Operating Voltage Unit ELECTRICAL CHARACTERISTICS (MSM6353L, 3.0 V) DC Characteristics (VDD=0 V, VSS1=VSS2=–3.0 V (battery voltage), fOSC=32,768 Hz, CX=35 pF, Ta=25°C) Parameter Current Consumption Oscillation Start Voltage Output Current 1 Output Current 2 Input Current 1 Input Leakage Current Input Current 3 Input Voltage Symbol Condition Min. Typ. Max. Unit Applied Pin *1 *2 — 3.0 — mA –VOSC Within 2 sec. — — 2.4 V –IOH1 VO=–0.5 V 500 — — IOL1 VO=–2.5 V 500 — — –IOH2 VO=–0.5 V 7 — — IOL2 VO=–2.5 V 20 — — 150 300 600 IDD –IIH1 | IIL2 | –IIL3 VI=0 V, input state, with pull-down resistor VI=0 V, –3 V, input state, without pull-down resistor VI=0 V, with pull-down resistor mA — — PORT0 to PORT4*3 SOUT, SCLK, XTOUT mA BD mA PORT0 to PORT4 — — 1 mA — 25 — –VIH — — — 0.5 –VIL — 2.5 — — PORT0 to PORT4 SCLK, SIN, SOUT mA RESET V All input pins *1 This value depends on program. *2 Backup flag (BUF)=fixed to "1". *3 PORT0=P0.0-P0.3, PORT1=P1.0-P1.3, PORT2=P2.0-P2.3, PORT3=P3.0-P3.3, PORT4=P4.0P4.3. 6/9 ¡ Semiconductor MSM6353/6353L-xx PACKAGE DIMENSIONS (Unit : mm) SDIP42-P-600-1.78 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 4.52 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 7/9 ¡ Semiconductor MSM6353/6353L-xx (Unit : mm) QFP44-P-910-0.80-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.35 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 8/9 ¡ Semiconductor MSM6353/6353L-xx (Unit : mm) QFP44-P-910-0.80-2K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Epoxy resin 42 alloy Solder plating 5 mm or more Package weight (g) 0.41 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 9/9