PRELIMINARY Product Bulletin OPR2100L August 1996 Six Element SMD LED Array Type OPR2100L Features Absolute Maximum Ratings (Each channel, TA = 25o C unless otherwise noted) • Surface mountable • High temperature operation • Closely matched emissions • Matched to OPR2100 Photodiode Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 V Continous Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Peak Forward Current (1 µA pulse width, 300 pps) . . . . . . . . . . . . . . . . . . . . . . . 1.0 A Storage and Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . -55o C to +125o C Power Dissipation (derate @ 1.00 mW/o C above 25o C) . . . . . . . . . . . . . . . . 100 mW Array Description Enclosed in a compact polyimide chip carrier, this six element LED has been specifically designed to be used as an illuminating source for the OPR2100. The light is spectrally matched to the responsivity for maximum efficency. The six chips are bonded with common cathodes and individual anodes to allow channel matching. The package can withstand multiple exposures to the most demanding solder conditions. The wrap around solder pads are gold plated for exceptional storage and wetting characteristics. PIN OUT: PIN#1 ANODE A 2 3 ANODE F ANODE E 4 COMMON CATHODE 5 ANODE D 6 ANODE C 7 ANODE B 8 COMMON CATHODE Electrical Characteristics (TA = 25o C unless otherwise noted) SYMBOL PARAMETERS MIN TYP MAX UNITS TEST CONDITIONS µW IF = 20 mA 1.8 V IF = 20 mA 100 µA VR = 2 V 910 nm IF = 20 mA Rise Time 600 ns IP = 100 mA Fall Time 350 ns IP = 100 mA PO Total Optical Power VF Forward Voltage Drop IR Reverse Leakage Current λ Peak Wavelength tr tf Optek Technology, Inc. 1215 W. Crosby Road 350 870 Carrollton, Texas 75006 9-18 (972) 323-2200 Fax (972) 323-2396