ANAREN RFP-250250-6Z50-2

16 Watts, 50 Ω
General Specifications
Resistive Element:
Substrate:
Terminals:
Thick film
Beryllium oxide ceramic
Thick film silver
Surface Mount Terminations
Model RFP-250250-6Z50-2
Surface Mount Terminations
Electrical Specifications
Resistance Value:
Frequency Range:
Power:
V.S.W.R.:
Features
• DC - 3.0 GHz
• 16 Watts
50 ohms, ±2%
DC - 3.0 GHz
16 Watts
1.25:1
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +125°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches.
Specifications subject to change without notice.
• BeO Ceramic
• Non-Nichrome Resistive
Element
• Low VSWR
• 100% Tested
Outline Drawing
BOTTOM VIEW
SIDE VIEW
.060
TOP VIEW
.250
GND
RF PAD
RFP
Z
50
.250
.070
.030
.070
.120
.037
.175
HATCHED AREA INDICATES LOCATION
OF PROTECTIVE COATING
VER. 12/5/01
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
1
Surface Mount Terminations
Model RFP-250250-6Z50-2
Typical Performance
Suggested Mounting Procedures
Power Derating
SCREW
(2 PLS.)
% OF RATED POWER
100
SOLDER
PASTE
75
SOLDER
FILLED VIA
50
PC BOARD
HEATSINK
25
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
0
25
50
75
100
P.C.B. SOLDER INTERFACE TEMPERATURE
125
°C
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
Available on Tape and Reel for Pick and Place Manufacturing.
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369