ROHM RUE003N02_11

1.8V Drive Nch MOSFET
RUE003N02
Dimensions (Unit : mm)
Structure
Silicon N-channel
MOSFET
EMT3
Features
1) Low on-resistance.
2) Fast switching speed.
3) Low voltage drive (1.8V) makes this device ideal for
portable equipment.
4) Drive circuits can be simple.
5) Parallel use is easy.
(1)Source
(2)Gate
Abbreviated symbol : QT
(3)Drain
Applications
Switching
Packaging specifications
Package
Type
Equivalent circuit
Taping
Drain
TL
Code
Basic ordering unit
(pieces)
3000
RUE003N02
Gate
∗2
∗1
Source
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
Absolute maximum ratings (Ta=25C)
Parameter
Symbol
Limits
Unit
Drain-source voltage
VDSS
20
V
Gate-source voltage
VGSS
±8
V
ID
±300
mA
IDP∗1
±600
mA
Total power dissipation
PD∗2
150
mW
Channel temperature
Tch
150
°C
Range of storage temperature
Tstg
−55 to +150
°C
Continuous
Drain current
Pulsed
∗1 Pw≤10μs, Duty cycle≤1%
∗2 Each terminal mounted on a recommended land
Thermal resistance
Parameter
Channel to ambient
Symbol
Limits
Unit
Rth(ch-a) ∗
833
°C / W
∗ Each terminal mounted on a recommended land
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1/3
2011.05 - Rev.B
RUE003N02
Data Sheet
Electrical characteristics (Ta=25C)
Symbol
Parameter
Min.
Typ.
Max.
Unit
Conditions
IGSS
−
−
10
μA
VGS=±8V, VDS=0V
Drain-source breakdown voltage
V(BR)DSS
20
−
−
V
ID=1mA, VGS=0V
Zero gate voltage drain current
IDSS
−
−
1.0
μA
VDS=20V, VGS=0V
Gate threshold voltage
VGS(th)
0.3
−
1.0
V
VDS=10V, ID=1mA
Static drain-source on-state
resistance
−
0.7
1.0
RDS(on)∗
Ω
ID=300mA, VGS=4.0V
Gate-source leakage
−
0.8
1.2
Ω
ID=300mA, VGS=2.5V
−
1.0
1.4
Ω
ID=300mA, VGS=1.8V
Forward transfer admittance
|Yfs| ∗
400
−
−
ms
ID=300mA, VDS=10V
Input capacitance
Ciss
−
25
−
pF
VDS=10V
Output capacitance
Coss
−
10
−
pF
VGS=0V
Reverse transfer capacitance
Crss
−
10
−
pF
f=1MHz
Turn-on delay time
td(on) ∗
−
5
−
ns
ID=150mA, VDD
tr ∗
−
10
−
ns
VGS=4.0V
td(off) ∗
tf ∗
−
15
−
ns
RL=67Ω
−
10
−
ns
RG=10Ω
Rise time
Turn-off delay time
Fall time
10V
∗ Pulsed
Body diode characteristics (Source-drain) (Ta=25C)
Parameter
Symbol
VSD ∗
Forward voltage
Min.
Typ.
Max.
−
−
1.2
Unit
V
Conditions
IS= 100mA, VGS=0V
∗ Pulsed
Electrical characteristic curves
10
0.1
0.01
Ta=125°C
75°C
25°C
−25°C
0.0001
0.00001
0.0
0.5
1.0
Ta=125°C
75°C
25°C
−25°C
1
0.1
0.01
1.5
GATE-SOURCE VOLTAGE : VGS (V)
1
SOURCE CURRENT : IS (A)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS(on) (Ω)
Ta=125°C
75°C
25°C
−25°C
1
0.1
0.01
0.1
1
0.1
0.01
1
1
DRAIN CURRENT : ID (A)
Fig.4 Static drain-source on-state
resistance vs. drain current (ΙΙΙ)
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Ta=125°C
75°C
25°C
−25°C
0.01
0.0
0.5
1
SOURCE-DRAIN VOLTAGE : VSD (V)
Fig.5 Source current vs.
source-drain voltage
2/3
1
Fig.3 Static drain-source on-state
resistance vs. drain current (ΙΙ)
100
VGS=0V
Pulsed
0.1
0.1
DRAIN CURRENT : ID (A)
Fig.2 Static drain-source on-state
resistance vs. drain current (Ι)
VGS=1.8V
Pulsed
VGS=2.5V
Pulsed
Ta=125°C
75°C
25°C
−25°C
DRAIN CURRENT : ID (A)
Fig.1 Typical transfer characteristics
10
0.1
CAPACITANCE : C (pF)
0.001
10
VGS=4V
Pulsed
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS(on) (Ω)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : RDS(on) (Ω)
DRAIN CURRENT : ID (A)
1 VDS=10V
Pulsed
1.5
Ta=25°C
f=1MHZ
VGS=0V
Ciss
10
Crss
1
0.01
0.1
1
Coss
10
100
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.6 Typical capacitance vs.
drain-source voltage
2011.05 - Rev.B
RUE003N02
Data Sheet
SWITHING TIME : t (ns)
1000
Ta=25°C
VDD=10V
VGS=4V
RG=10Ω
Pulsed
100
td(off)
tf
td(on)
10
tr
1
0.01
0.1
1
DRAIN CURRENT : ID (A)
Fig.7 Switching characteristics
Switching characteristics measurement circuit
Pulse width
VGS
RG
ID
VDS
D.U.T.
VGS
90%
50%
10%
50%
RL
10%
VDS
10%
VDD
90%
90%
td (on)
tr
td (off)
toff
ton
Fig.8 Switching time measurement circuit
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c 2011 ROHM Co., Ltd. All rights reserved.
○
tf
Fig.9 Switching time waveforms
3/3
2011.05 - Rev.B
Notice
Notes
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R1120A