05130 SFC05-5 Only One Name Means ProTek’Tion™ FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ Personnal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns ✔ 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line-Gnd) & Level 3(Line-Line) PENTA FEATURES ✔ ESD Protection > 25 kilovolts ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Protects up to Five(5) Unidirectional & Four (4) Bidirectional Lines MECHANICAL CHARACTERISTICS ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION 05130.R6 8/03 6 5 4 1 2 BOTTOM VIEW 3 1 www.protekdevices.com SFC05-5 DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 250 Watts Operating Temperature TJ -55°C to 150°C °C TSTG -55°C to 150°C °C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER SFC05-5 RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 5A VC VOLTS 5.0 6.0 9.5 MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE @8/20µs VC @ IPP @VWM ID µA @0V, 1 MHz Cj pF 11.0V @ 24A 10 150 FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 250W, 8/20µs Waveform 100 10 0.01 05130.R6 8/03 FIGURE 2 PULSE WAVE FORM 120 tf 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 2 0 5 10 15 t - Time - µs 20 25 30 www.protekdevices.com SFC05-5 GRAPHS 100 Peak Pulse Power 8/20µs 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE FIGURE 3 POWER DERATING CURVE 225°C 5-10 sec 60 200°C Instantaneous to 200°C 40 1-2 Minutes to 150°C 20 1-2 Minutes to 25°C 100°C Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 Pre-Heat Time Soldering Time Cool Down Time Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR SFC05-5 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SFC05-5 VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05130.R6 8/03 3 www.protekdevices.com SFC05-5 PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS PACKAGE OUTLINE A C SIDE B MILLIMETERS INCHES A 0.510 0.020 B 0.510 0.020 C 0.99 ± 0.0254 0.039 ± 0.001 E 0.15 NOM 0.006 NOM F 1.5 ± 0.0254 0.059 ± 0.001 G 0.15 NOM 0.006 NOM H See Note 3 See Note 3 G TOP DIM I 0.003 MIN 0.419 NOM 0.0165 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. “H” Dimensions for the SFC05-5 device are 0.10mm Max and 0.004” Max. E F 0.076 MIN H I END PAD DIMENSIONS MOUNTING PAD LAYOUT - Option 1 A MILLIMETERS INCHES A B C D E F G 0.305 0.457 0.203 0.254 0.510 0.990 0.510 0.012 0.018 0.008 0.010 0.020 0.039 0.020 C DIE SOLDER BUMPS DIM NOTE: B F E 1. Preferred: Using 0.1mm (0.004”) stencil. D G SOLDER PADS SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK Outline & Dimensions: Rev 1 - 1/03, 06038 05130.R6 8/03 4 www.protekdevices.com SFC05-5 PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS MOUNTING PAD LAYOUT - Option 2 DIM A COPPER CONTACTS 0.009” [0.23] DIA. D C DIE SOLDER BUMPS MILLIMETERS INCHES A 1.5 NOM 0.059 B 0.152 NOM 0.006 NOM C 0.510 0.020 D 0.990 0.039 E 0.510 0.020 NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. Outline & Dimensions: Rev 0 - 10/02, 06039 TAPE & REEL ORIENTATION B E SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK 1 6 2 5 3 4 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., SFC05-5-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., SFC05-5-T75-2). COPYRIGHT © ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05130.R6 8/03 5 www.protekdevices.com