MICROCHIP TC647_13

TC647
PWM Fan Speed Controller with FanSense™ Technology
Features
• Temperature Proportional Fan Speed for Acoustic
Control and Longer Fan Life
• Efficient PWM Fan Drive
• 3.0V to 5.5V Supply Range:
- Fan Voltage Independent of TC647
Supply Voltage
- Supports any Fan Voltage
• FanSense™ Technology Fault Detection Circuits
Protect Against Fan Failure and Aid System
Testing
• Shutdown Mode for "Green" Systems
• Supports Low Cost NTC/PTC Thermistors
• Space Saving 8-Pin MSOP Package
Applications
•
•
•
•
•
•
Power Supplies
Personal Computers
File Servers
Telecom Equipment
UPSs, Power Amps
General Purpose Fan Speed Control
Available Tools
• Fan Controller Demonstration Board (TC642DEMO)
• Fan Controller Evaluation Kit (TC642EV)
Package Types
SOIC/PDIP/MSOP
VIN
1
CF
2
VMIN
GND
8
VDD
7
VOUT
3
6
FAULT
4
5
SENSE
TC647
General Description
The TC647 is a switch mode, fan speed controller for
use with brushless DC fans. Temperature proportional
speed control is accomplished using pulse width modulation (PWM). A thermistor (or other voltage output
temperature sensor) connected to VIN furnishes the
required control voltage of 1.25V to 2.65V (typical) for
0% to 100% PWM duty cycle. Minimum fan speed is
set by a simple resistor divider on the VMIN input. An
integrated Start-up Timer ensures reliable motor startup at turn-on, coming out of shutdown mode or
following a transient fault. A logic low applied to VMIN
(Pin 3) causes fan shutdown.
The TC647 also features Microchip Technology's proprietary FanSense™ technology for increasing system
reliability. In normal fan operation, a pulse train is present at SENSE (Pin 5). A missing pulse detector monitors this pin during fan operation. A stalled, open or
unconnected fan causes the TC647 to trigger its Startup Timer once. If the fault persists, the FAULT output
goes low and the device is latched in its shutdown
mode.
The TC647 is available in the 8-pin plastic DIP, SOIC
and MSOP packages and is available in the industrial
and extended commercial temperature ranges.
 2001-2012 Microchip Technology Inc.
DS21447D-page 1
TC647
Functional Block Diagram
VIN
–
VDD
+
SHDN
–
+
Control
Logic
VOUT
CF
3 x TPWM
Timer
Clock
Generator
VMIN
Start-up
Timer
+
VSHDN
–
FAULT
Missing
Pulse
Detect.
TC647
+
–
GND
10kΩ
SENSE
70mV (typ.)
DS21447D-page 2
 2001-2012 Microchip Technology Inc.
TC647
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the
operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ......................................................... 6V
Input Voltage, Any Pin.... (GND – 0.3V) to (VDD +0.3V)
Package Thermal Resistance:
PDIP (RJA)............................................. 125°C/W
SOIC (RJA) ............................................ 155°C/W
MSOP (RJA) .......................................... 200°C/W
Specified Temperature Range............ -40°C to +125°C
Storage Temperature Range.............. -65°C to +150°C
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise specified, TMIN < TA < TMAX, VDD = 3.0V to 5.5V.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VDD
Supply Voltage
3.0
—
5.5
V
IDD
Supply Current, Operating
—
0.5
1
mA
Pins 6, 7 Open,
CF = 1 µF, VIN = VC(MAX)
IDD(SHDN)
Supply Current,
Shutdown Mode
—
25
—
µA
Pins 6, 7 Open,
CF = 1 µF, VMIN = 0.35V
IIN
VIN, VMIN Input Leakage
– 1.0
—
+1.0
µA
Note 1
VOUT Output
tR
VOUT Rise Time
—
—
50
µsec
IOH = 5 mA, Note 1
tF
VOUT Fall Time
—
—
50
µsec
IOL = 1 mA, Note 1
tSHDN
Pulse Width (On VMIN) to Clear
Fault Mode
30
—
—
µsec
VSHDN, VHYST
Specifications, Note 1
IOL
Sink Current at VOUT Output
1.0
—
—
mA
VOL = 10% of VDD
IOH
Source Current at VOUT Output
5.0
—
—
mA
VOH = 80% of VDD
VC(MAX)
Input Voltage at VIN or VMIN for
100% PWM Duty Cycle
2.5
2.65
2.8
V
VC(SPAN)
VC(MAX) - VC(MIN)
1.3
1.4
1.5
V
VSHDN
Voltage Applied to VMIN to
Ensure Shutdown Mode
—
—
VDD x 0.13
V
VREL
Voltage Applied to VMIN to
Release Shutdown Mode
VDD x 0.19
—
—
V
PWM Frequency
26
30
34
Hz
CF = 1.0 µF
SENSE Input Threshold
Voltage with Respect to GND
50
70
90
mV
Note 1
VOL
Output Low Voltage
—
—
0.3
V
Sec
VIN, VMIN Inputs
VDD = 5V
Pulse Width Modulator
FPWM
SENSE Input
VTH(SENSE)
FAULT Output
tMP
Missing Pulse Detector Timer
—
32/F
—
tSTARTUP
Start-up Timer
—
32/F
—
Sec
tDIAG
Diagnostic Timer
—
3/F
—
Sec
IOL = 2.5 mA
Note 1: Ensured by design, not tested.
 2001-2012 Microchip Technology Inc.
DS21447D-page 3
TC647
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
PIN FUNCTION TABLE
Symbol
Description
1
VIN
Analog Input
2
CF
Analog Output
2.3
Analog Input (VMIN)
An external resistor divider connected to the VMIN input
sets the minimum fan speed by fixing the minimum
PWM duty cycle (1.25V to 2.65V = 0% to 100%, typical). The TC647 enters shutdown mode when VMIN 
VSHDN. During shutdown, the FAULT output is inactive
and supply current falls to 25 µA (typical). The TC647
exits shutdown mode when VMIN  VREL. See
Section 5.0, “Typical Applications”, for more details.
3
VMIN
Analog Input
4
GND
Ground Terminal
2.4
5
SENSE
Analog Input
GND denotes the ground terminal.
6
FAULT
Digital (Open Collector) Output
7
VOUT
Digital Output
2.5
8
VDD
Power Supply Input
Pulses are detected at the SENSE pin as fan rotation
chops the current through a sense resistor. The
absence of pulses indicates a fault.
2.1
Analog Input (VIN)
The thermistor network (or other temperature sensor)
connects to the VIN input. A voltage range of 1.25V to
2.65V (typical) on this pin drives an active duty cycle of
0% to 100% on the VOUT pin.
2.2
Analog Output (CF)
CF is the positive terminal for the PWM ramp generator
timing capacitor. The recommended CF is 1 µF for
30 Hz PWM operation.
2.6
Ground (GND)
Analog Input (SENSE)
Digital Output (FAULT)
The FAULT line goes low to indicate a fault condition.
When FAULT goes low due to a fan fault condition, the
device is latched in shutdown mode until deliberately
cleared or until power is cycled. FAULT may be connected to VMIN if a hard shutdown is desired.
2.7
Digital Output (VOUT)
VOUT is an active high complimentary output that drives
the base of an external NPN transistor (via an appropriate base resistor) or the gate of an N-channel MOSFET. This output has asymmetrical drive (see
Section 1.0, “Electrical Characteristics”).
2.8
Power Supply Input (VDD)
VDD may be independent of the fan’s power supply
(see Section 1.0, “Electrical Characteristics”).
DS21447D-page 4
 2001-2012 Microchip Technology Inc.
TC647
3.0
DETAILED DESCRIPTION
3.1
PWM
The PWM circuit consists of a ramp generator and
threshold detector. The frequency of the PWM is determined by the value of the capacitor connected to the CF
input. A frequency of 30 Hz is recommended
(CF = 1 µF). The PWM is also the time base for the
Start-up Timer (see Section 3.3, “Start-Up Timer”). The
PWM voltage control range is 1.25V to 2.65V (typical)
for 0% to 100% output duty cycle.
3.2
VOUT Output
The VOUT pin is designed to drive a low cost transistor
or MOSFET as the low side power switching element in
the system. Various examples of driver circuits will be
shown throughout this data sheet. This output has an
asymmetric complimentary drive and is optimized for
driving NPN transistors or N-channel MOSFETs. Since
the system relies on PWM rather than linear control,
the power dissipation in the power switch is kept to a
minimum. Generally, very small devices (TO-92 or SOT
packages) will suffice.
3.3
Start-Up Timer
To ensure reliable fan start-up, the Start-up Timer turns
the VOUT output on for 32 cycles of the PWM whenever
the fan is started from the off state. This occurs at
power up and when coming out of shutdown mode. If
the PWM frequency is 30 Hz (CF = 1 µF), the resulting
start-up time will be approximately one second. If a
fault is detected, the Diagnostic Timer is triggered
once, followed by the Start-up Timer. If the fault
persists, the device is shut down (see Section 3.6,
“FAULT Output”).
3.4
Shutdown Control (Optional)
If VMIN (Pin 3) is pulled below VSHDN, the TC647 will go
into shutdown mode. This can be accomplished by
driving VMIN with an open-drain logic signal or using an
external transistor, as shown in Figure 3-1. All functions
are suspended until the voltage on VMIN becomes
higher than VREL (0.85V @ VDD = 5.0V). Pulling VMIN
below VSHDN will always result in complete device
shutdown and reset. The FAULT output is
unconditionally inactive in shutdown mode.
A small amount of hysteresis, typically one percent of
VDD (50 mV at VDD = 5.0V), is designed into the VSHDN/
VREL threshold. The levels specified for VSHDN and
VREL in Section 1.0, “Electrical Characteristics”,
include this hysteresis plus adequate margin to
account for normal variations in the absolute value of
the threshold and hysteresis.
 2001-2012 Microchip Technology Inc.
CAUTION: Shutdown mode is unconditional. That is,
the fan will not be activated regardless of the voltage
at VIN. The fan should not be shut down until all heat
producing activity in the system is at a negligible
level.
3.5
SENSE Input
(FanSense™ Technology)
The SENSE input (Pin 5) is connected to a low value
current sensing resistor in the ground return leg of the
fan circuit. During normal fan operation, commutation
occurs as each pole of the fan is energized. This
causes brief interruptions in the fan current, seen as
pulses across the sense resistor. If the device is not in
shutdown mode, and pulses are not appearing at the
SENSE input, a fault exists.
The short, rapid change in fan current (high dI/dt)
causes a corresponding dV/dt across the sense
resistor, RSENSE. The waveform on RSENSE is
differentiated and converted to a logic-level, pulse-train
by CSENSE and the internal signal processing circuitry.
The presence and frequency of this pulse-train is a
direct indication of fan operation. See Section 5.0,
“Typical Applications”, for more details.
3.6
FAULT Output
Pulses appearing at SENSE due to the PWM turning
on are blanked with the remaining pulses being filtered
by a missing pulse detector. If consecutive pulses are
not detected for 32 PWM cycles (1 Sec if CF = 1 µF),
the Diagnostic Timer is activated and VOUT is driven
high continuously for three PWM cycles (100 msec if
CF = 1 µF). If a pulse is not detected within this window,
the Start-up Timer is triggered (see Section 3.3, “StartUp Timer”). This should clear a transient fault condition.
If the missing pulse detector times out again, the PWM
is stopped and FAULT goes low. When FAULT is
activated due to this condition, the device is latched in
shutdown mode and will remain off indefinitely.
Note:
At this point, action must be taken to restart
the fan by momentarily pulling VMIN below
VSHDN, or cycling system power. In either
case, the fan cannot remain disabled due
to a fault condition as severe system damage could result. If the fan cannot be
restarted, the system should be shut down.
The TC647 may be configured to continuously attempt
fan restarts, if so desired.
DS21447D-page 5
TC647
Continuous restart mode is enabled by connecting the
FAULT output to VMIN through a 0.1 µF capacitor, as
shown in Figure 3-1. When so connected, the TC647
automatically attempts to restart the fan whenever a
fault condition occurs. When the FAULT output is
driven low, the VMIN input is momentarily pulled below
VSHDN, initiating a reset and clearing the fault
condition. Normal fan start-up is then attempted as previously described. The FAULT output may be
connected to external logic (or the interrupt input of a
microcontroller) to shut the TC647 down if multiple fault
pulses are detected at approximately one second
intervals.
+5V
10 kΩ
C1
+5V
0.01µF
+12V
1 kΩ
TC647
CB
1µF
From
Temp
Sensor
RESET
8
1
VIN
Fan
VDD
FAULT
6
1
0
Q1
Fault
Detected
+5V
TC647
R3
VOUT
RBASE
7
3 V
MIN
CB
From
System
Shutdown
Controller
R1
Q2
(Optional)
0.01 µF 2
R4
CF
1 µF
SENSE
5
CSENSE
CF
GND
4
RSENSE
Note: The parallel combination of R3 and R4 must be >10 kΩ.
FIGURE 3-1:
DS21447D-page 6
Fan Fault Output Circuit.
 2001-2012 Microchip Technology Inc.
TC647
4.0
SYSTEM BEHAVIOR
The flowcharts describing the TC647’s behavioral
algorithm are shown in Figure 4-1. They can be
summarized as follows:
4.1
Power-Up
(1) Assuming the device is not being held in shutdown
mode (VMIN > VREL)…
(2) Turn VOUT output on for 32 cycles of the PWM
clock. This ensures that the fan will start from a
dead stop.
4.3
Fan Fault
Fan Fault is an infinite loop wherein the TC647 is
latched in shutdown mode. This mode can only be
released by a reset (i.e., VMIN being brought below
VSHDN, then above VREL, or by power cycling).
(1) While in this state, FAULT is latched on (low) and
the VOUT output is disabled.
(2) A reset sequence applied to the VMIN pin will exit
the loop to Power-up.
(3) End.
(3) During this Start-up Timer, if a fan pulse is
detected, branch to Normal Operation; if none are
received…
(4) Activate the 32-cycle Start-up Timer one more time
and look for fan pulse; if a fan pulse is detected,
proceed to Normal Operation; if none are
received…
(5) Proceed to Fan Fault.
(6) End.
4.2
Normal Operation
Normal Operation is an endless loop which may only
be exited by entering shutdown mode or Fan Fault. The
loop can be thought of as executing at the frequency of
the oscillator and PWM.
(1) Reset the missing pulse detector.
(2) Is TC647 in shutdown? If so…
a. VOUT duty cycle goes to zero.
b. FAULT is disabled.
c. Exit the loop and wait for VMIN > VREL to resume
operation (indistinguishable from Power-up).
(3) Drive VOUT to a duty cycle proportional to greater
of VIN and VMIN on a cycle by cycle basis.
(4) If a fan pulse is detected, branch back to the start
of the loop (1).
(5) If the missing pulse detector times out …
(6) Activate the 3-cycle Diagnostic Timer and look for
pulses; if a fan pulse is detected, branch back to
the start of the loop (1); if none are received…
(7) Activate the 32-cycle Start-up Timer and look for
pulses; if a fan pulse is detected, branch back to
the start of the loop (1); if none are received…
(8) Quit Normal Operation and go to Fan Fault.
(9) End.
 2001-2012 Microchip Technology Inc.
DS21447D-page 7
TC647
Normal
Operaton
Power-Up
Clear
Missing Pulse
Detector
Power-on
Reset
FAULT = 1
Yes
Shutdown
VOUT = 0
VMIN < VSHDN
Yes
Shutdown
VOUT = 0
VMIN < VSHDN?
No
No
VMIN > VREL?
No
VMIN > VREL
No
Yes
Yes
Fire Start-up
Timer
(1 SEC)
Fan Fault
Detected?
Power-up
Yes
Yes
No
Normal
Operation
Fire Start-up
Timer
YES
(1 SEC)
Fan Pulse
Detected?
VOUT
Proportional to Greater
of VIN or VMIN
No
Fan Fault
Yes
Fan Pulse
Detected?
Fan Fault
No
No
M.P.D.
Expired?
Yes
Fire Diagnostic
Timer
(100msec)
FAULT = 0,
VOUT = 0
No
No
VMIN < VSHDN?
Yes
No
Fan Pulse
Detected?
Cycling
Power?
Yes
Yes
Yes
VMIN > VREL?
Fire Start-up
Timer
(1 SEC)
No
Fan Pulse
Detected?
No
Fan Fault
Yes
Power-up
FIGURE 4-1:
DS21447D-page 8
TC647 Behavioral Algorithm Flowchart.
 2001-2012 Microchip Technology Inc.
TC647
5.0
TYPICAL APPLICATIONS
The TC642 demonstration and prototyping board
(TC642DEMO) and the TC642 Evaluation Kit
(TC642EV) provide working examples of TC647 circuits and prototyping aids. The TC642DEMO is a
printed circuit board optimized for small size and ease
of inclusion into system prototypes. The TC642EV is a
larger board intended for benchtop development and
analysis. At the very least, anyone contemplating a
design using the TC647 should consult the documentation for both TC642EV and (DS21403) and
TC642DEMO (DS21401). Figure 5-1 shows the base
schematic for the TC642DEMO.
Designing with the TC647 involves the following:
(1) The temp sensor network must be configured to
deliver 1.25V to 2.65V on VIN for 0% to 100% of
the temperature range to be regulated.
(2) The minimum fan speed (VMIN) must be set.
(3) The output drive transistor and associated circuitry
must be selected.
(4) The SENSE network, RSENSE and CSENSE, must
be designed for maximum efficiency while
delivering adequate signal amplitude.
(5) If shutdown capability is desired, the drive requirements of the external signal or circuit must be
considered.
+5V*
+12V
CB
1 µF
NTC
R1
8
1
VIN
Fan
VDD
CB
0.01 µF
R2
6
FAULT
Fan Fault
Shutdown
Q1
RBASE
TC647
VOUT
R3
3
CB
0.01 µF
Shutdown
R4
(Optional)
7
VMIN
5
SENSE
2
CSENSE
CF
CF
1 µF
GND
RSENSE
4
Note: *See cautions regarding latch-up considerations in Section 5.0, "Typical Applications".
FIGURE 5-1:
Typical Application Circuit.
 2001-2012 Microchip Technology Inc.
DS21447D-page 9
TC647
5.1
Temperature Sensor Design
EQUATION
VDD x R2
The temperature signal connected to VIN must output a
voltage in the range of 1.25V to 2.65V (typical) for 0%
to 100% of the temperature range of interest. The
circuit in Figure 5-2 illustrates a convenient way to
provide this signal.
VDD
R1 = 100 kΩ
VIN
R2 = 23.2 kΩ
FIGURE 5-2:
Circuit.
Temperature Sensing
Figure 5-2 illustrates a simple temperature dependent
voltage divider circuit. RT1 is a conventional 100 k @
25°C NTC thermistor, while R1 and R2 are standard
resistors. The supply voltage, VDD, is divided between
R2 and the parallel combination of RT1 and R1 (for convenience, the parallel combination of RT1 and R1 will
be referred to as RTEMP). The resistance of the thermistor at various temperatures is obtained from the manufacturer’s specifications. Thermistors are often
referred to in terms of their resistance at 25°C. Generally, the thermistor shown in Figure 5-2 is a non-linear
device with a negative temperature coefficient (also
called an NTC thermistor). In Figure 5-2, R1 is used to
linearize the thermistor temperature response and R2
is used to produce a positive temperature coefficient at
the VIN node. As an added benefit, this configuration
produces an output voltage delta of 1.4V, which is well
within the range of the VC(SPAN) specification of the
TC647. A 100 k NTC thermistor is selected for this
application in order to keep IDIV at a minimum.
For the voltage range at VIN to be equal to 1.25V to
2.65V, the temperature range of this configuration is
0°C to 50°C. If a different temperature range is required
from this circuit, R1 should be chosen to equal the
resistance value of the thermistor at the center of this
new temperature range. It is suggested that a maximum temperature range of 50°C be used with this circuit due to thermistor linearity limitations. With this
change, R2 is adjusted according to the following
equations:
DS21447D-page 10
VDD x R2
RTEMP (T2) + R2
= V(T2)
Where T1 and T2 are the chosen temperatures and
RTEMP is the parallel combination of the thermistor
and R1.
IDIV
RT1
NTC
Thermistor
100 kΩ @ 25ºC
= V(T1)
RTEMP (T1) + R2
These two equations facilitate solving for the two
unknown variables, R1 and R2. More information about
Thermistors may be obtained from AN679, “Temperature Sensing Technologies”, and AN685, “Thermistors
in Single Supply Temperature Sensing Circuits”, which
can be downloaded from Microchip’s website at
www.microchip.com.
5.2
Minimum Fan Speed
A voltage divider on VMIN sets the minimum PWM duty
cycle and, thus, the minimum fan speed. As with the
VIN input, 1.25V to 2.65V corresponds to 0% to 100%
duty cycle. Assuming that fan speed is linearly related
to duty cycle, the minimum speed voltage is given by
the equation:
EQUATION
Minimum Speed
VMIN =
x (1.4V) + 1.25V
Full Speed
For example, if 2500 RPM equates to 100% fan speed,
and a minimum speed of 1000 RPM is desired, then
the VMIN voltage is:
EQUATION
VMIN =
1000
2500
x (1.4V) + 1.25V = 1.81V
The VMIN voltage may be set using a simple resistor
divider as shown in Figure 5-3. Per Section 1.0,
“Electrical Characteristics”, the leakage current at the
VMIN pin is no more than 1 µA. It would be very
conservative to design for a divider current, IDIV, of
100 µA. If VDD = 5.0V then;
EQUATION
IDIV = 1e–4A =
R1 + R2 =
5.0V
R1 + R2
5.0V
1e–4A
, therefore
= 50,000  = 50 k
 2001-2012 Microchip Technology Inc.
TC647
VOUT output is “off” most of the time. The fan may be
rotating normally, but the commutation events are
occurring during the PWM’s off-time.
VDD
R1
IDIV
IIN
VMIN
R2
GND
FIGURE 5-3:
VMIN Circuit.
We can further specify R1 and R2 by the condition that
the divider voltage is equal to our desired VMIN. This
yields the following equation:
EQUATION
VMIN =
VDD x R2
R1 + R2
Solving for the relationship between R1 and R2 results
in the following equation:
EQUATION
R1 = R2 x
VDD - VMIN
VMIN
In this example, R1 = (1.762) R2. Substituting this relationship back into the previous equation yields the
resistor values:
The phase relationship between the fan’s commutation
and the PWM edges tends to “walk around” as the
system operates. At certain points, the TC647 may fail
to capture a pulse within the 32-cycle missing pulse
detector window. When this happens, the 3-cycle
Diagnostic Timer will be activated, the VOUT output will
be active continuously for three cycles and, if the fan is
operating normally, a pulse will be detected. If all is
well, the system will return to normal operation. There
is no harm in this behavior, but it may be audible to the
user as the fan will accelerate briefly when the
Diagnostic Timer fires. For this reason, it is
recommended that VMIN be set no lower than 1.8V.
5.4
FanSense™ Network
(RSENSE and CSENSE)
The FanSense network, comprised of RSENSE and
CSENSE, allows the TC647 to detect commutation of
the fan motor (FanSense™ technology). This network
can be thought of as a differentiator and threshold
detector. The function of RSENSE is to convert the fan
current into a voltage. CSENSE serves to AC-couple this
voltage signal and provide a ground referenced input to
the SENSE pin. Designing a proper SENSE network is
simply a matter of scaling RSENSE to provide the
necessary amount of gain (i.e., the current-to-voltage
conversion ratio). A 0.1 µF ceramic capacitor is recommended for CSENSE. Smaller values require larger
sense resistors, and higher value capacitors are bulkier
and more expensive. Using a 0.1 µF results in
reasonable values for RSENSE. Figure 5-4 illustrates a
typical SENSE network. Figure 5-5 shows the
waveforms observed using a typical SENSE network.
VDD
R2 = 18.1 k
R1 = 31.9 k
In this case, the standard values of 31.6 k and
18.2 k are very close to the calculated values and
would be more than adequate.
5.3
FAN
Operations at Low Duty Cycle
RBASE
VOUT
One boundary condition which may impact the selection of the minimum fan speed is the irregular activation
of the Diagnostic Timer due to the TC647 “missing” fan
commutation pulses at low speeds. This is a natural
consequence of low PWM duty cycles (typically 25% or
less). Recall that the SENSE function detects commutation of the fan as disturbances in the current through
RSENSE. These can only occur when the fan is energized (i.e., VOUT is “on”). At very low duty cycles, the
SENSE
CSENSE
(0.1 µF Typ.)
RSENSE
GND
FIGURE 5-4:
 2001-2012 Microchip Technology Inc.
Q1
SENSE Network.
DS21447D-page 11
TC647
5.5
Tek Run: 10.0kS/s Sample
[
T
]
Waveform @ Sense Resistor
GND
1
Waveform @ Sense Pin
90mV
50mV
GND
T
2
Ch1 100mV
Ch2
FIGURE 5-5:
100mV
M5.00ms
142mV
Ch1
SENSE Waveforms.
Table 5-1 lists the recommended values of RSENSE
based on the nominal operating current of the fan. Note
that the current draw specified by the fan manufacturer
may be a worst-case rating for near-stall conditions and
not the fan’s nominal operating current. The values in
Table 5-1 refer to actual average operating current. If
the fan current falls between two of the values listed,
use the higher resistor value. The end result of employing Table 5-1 is that the signal developed across the
sense resistor is approximately 450 mV in amplitude.
RSENSE VS. FAN CURRENT
TABLE 5-1:
Nominal Fan Current (mA)
RSENSE ()
50
9.1
100
4.7
150
3.0
200
2.4
250
2.0
300
1.8
350
1.5
400
1.3
450
1.2
500
1.0
DS21447D-page 12
Output Drive Transistor Selection
The TC647 is designed to drive an external transistor
or MOSFET for modulating power to the fan. This is
shown as Q1 in Figures 3-1, 5-1, 5-4, 5-6, 5-7, 5-8
and 5-9. The VOUT pin has a minimum source current
of 5 mA and a minimum sink current of 1 mA. Bipolar
transistors or MOSFETs may be used as the power
switching element, as shown in Figure 5-7. When high
current gain is needed to drive larger fans, two transistors may be used in a Darlington configuration. These
circuit topologies are shown in Figure 5-7: (a) shows a
single NPN transistor used as the switching element;
(b) illustrates the Darlington pair; and (c) shows an Nchannel MOSFET.
One major advantage of the TC647’s PWM control
scheme versus linear speed control is that the power
dissipation in the pass element is kept very low. Generally, low cost devices in very small packages, such as
TO-92 or SOT, can be used effectively. For fans with
nominal operating currents of no more than 200 mA, a
single transistor usually suffices. Above 200 mA, the
Darlington or MOSFET solution is recommended. For
the fan sensing function to work correctly, it is imperative that the pass transistor be fully saturated when
“on”.
Table 5-2 gives examples of some commonly available
transistors and MOSFETs. This table should be used
as a guide only since there are many transistors and
MOSFETs which will work just as well as those listed.
The critical issues when choosing a device to use as
Q1 are: (1) the breakdown voltage (V(BR)CEO or
VDS(MOSFET)) must be large enough to withstand the
highest voltage applied to the fan (Note: This will occur
when the fan is off); (2) 5 mA of base drive current must
be enough to saturate the transistor when conducting
the full fan current (transistor must have sufficient
gain); (3) the VOUT voltage must be high enough to sufficiently drive the gate of the MOSFET to minimize the
RDS(on) of the device; (4) rated fan current draw must
be within the transistor's/MOSFET's current handling
capability; and (5) power dissipation must be kept
within the limits of the chosen device.
A base-current limiting resistor is required with bipolar
transistors. This is shown in Figure 5-6.
 2001-2012 Microchip Technology Inc.
TC647
The correct value for this resistor can be determined as
follows:
VDD
Fan
Q1
–
+ VR
BASE
+ VBE
= VRSENSE + VBE(SAT) + VRBASE
VRSENSE
= IFAN x RSENSE
VRBASE
= RBASE x IBASE
IBASE
= IFAN / hFE
VOH is specified as 80% of VDD in Section 1.0,
“Electrical Characteristics”; VBE(SAT) is given in the chosen transistor data sheet. It is now possible to solve for
RBASE.
RBASE
VOH = 80% VDD
VOH
–
(SAT)
EQUATION
+
VR
SENSE
RSENSE
RBASE =
–
TABLE 5-2:
Device
MMBT2222A
MPS2222A
MPS6602
IBASE
Some applications require the fan to be powered from the
negative 12V supply to keep motor noise out of the
positive voltage power supplies. As shown in Figure 5-8,
zener diode D1 offsets the -12V power supply voltage,
holding transistor Q1 off when VOUT is low. When VOUT is
high, the voltage at the anode of D1 increases by VOUT
causing Q1 to turn on. Operation is otherwise the same as
the case of fan operation from +12V.
GND
FIGURE 5-6:
RBASE.
VOH - VBE(SAT) - VRSENSE
Circuit For Determining
TRANSISTORS AND MOSFETS FOR Q1 (VDD = 5V)
Package
Max. VBE(sat)/VGS
(V)
Min. HFE
VCEO/VDS
(V)
Fan Current
(mA)
Suggested
RBASE ()
SOT-23
1.2
50
40
150
800
TO-92
1.2
50
40
150
800
TO-92
1.2
50
40
500
301
SI2302
SOT-23
2.5
NA
20
500
Note 1
MGSF1N02E
SOT-23
2.5
NA
20
500
Note 1
SI4410
SO-8
4.5
NA
30
1000
Note 1
SI2308
SOT-23
4.5
NA
60
500
Note 1
Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times.
 2001-2012 Microchip Technology Inc.
DS21447D-page 13
TC647
VDD
VDD
VDD
Fan
Fan
Fan
RBASE
RBASE
VOUT
VOUT
Q1
Q1
Q1
VOUT
Q2
RSENSE
RSENSE
RSENSE
GND
a) Single Bipolar Transistor
FIGURE 5-7:
b) Darlington Transistor Pair
C) N-Channel MOSFET
Output Drive Transistor Circuit Topologies.
ing points can result in enough parasitic capacitance
and/or inductance in the power supply connections to
delay one power supply “routing” versus another.
+5V
VDD
R2 *
2.2 kΩ
VOUT
TC647
5.7
Fan
D1
12.0V
Zener
Q1 *
GND
R4 *
10 kΩ
R3 *
2.2 Ω
-12V
*Note: Value depends on the specific application and is shown for example only.
FIGURE 5-8:
-12V Supply.
5.6
GND
GND
Powering the Fan from a
Latch-Up Considerations
As with any CMOS IC, the potential exists for latch-up
if signals are applied to the device which are outside
the power supply range. This is of particular concern
during power-up if the external circuitry (such as the
sensor network, VMIN divider or shutdown circuit) is
powered by a supply different from that of the TC647.
Care should be taken to ensure that the TC647’s VDD
supply powers up first. If possible, the networks
attached to VIN and VMIN should connect to the VDD
supply at the same physical location as the IC itself.
Even if the IC and any external networks are powered
by the same supply, physical separation of the connect-
DS21447D-page 14
Power Supply Routing and
Bypassing
Noise present on the VIN and VMIN inputs may cause
erroneous operation of the FAULT output. As a result,
these inputs should be bypassed with a 0.01 µF capacitor mounted as close to the package as possible. This
is particularly true of VIN, which is usually driven from a
high impedance source (such as a thermistor). In addition, the VDD input should be bypassed with a 1 µF
capacitor. Ground should be kept as short as possible.
To keep fan noise off the TC647 ground pin, individual
ground returns for the TC647 and the low side of the
fan current sense resistor should be used.
Design Example
Step 1. Calculate R1 and R2 based on using an NTC
having a resistance of 10 k at TMIN (25°C)
and 4.65 k at TMAX (45°C) (see Figure 5-9).
R1 = 20.5 k
R2 = 3.83 k
Step 2. Set minimum fan speed VMIN = 1.8V.
Limit the divider current to 100 µA from which
R5 = 33 k and R6 = 18 k
Step 3. Design the output circuit.
Maximum fan motor current = 250 mA.
Q1 beta is chosen at 50 from which
R7 = 800
 2001-2012 Microchip Technology Inc.
TC647
+5V
+5V
R1
20.5 kΩ
R2
3.83 kΩ
NTC
CB +
10 kΩ 1 µF
@ 25°C
1
VIN
CB
0.01 µF
+12V
8
VDD
Fan
4
GND
6
FAULT
System
Fault
+5V
TC647
R5
33 kΩ
Fan Shutdown
Q2
R8
10 kΩ
R6
18 kΩ
3
CB
0.01 µF
2
(Optional)
FIGURE 5-9:
5.8
Q1
R7
800 Ω
VOUT
7
VMIN
SENSE
CF
C1
1 µF
5
CSENSE
0.1 µF
RSENSE
2.2 Ω
Design Example.
TC647 as a Microcontroller
Peripheral
In a system containing a microcontroller or other host
intelligence, the TC647 can be effectively managed as
a CPU peripheral. Routine fan control functions can be
performed by the TC647 without controller intervention.
The microcontroller receives temperature data from one
or more points throughout the system. It calculates a fan
operating speed based on an algorithm specifically
designed for the application at hand. The processor
controls fan speed using complimentary port bits I/O1
through I/O3. Resistors R1 through R6 (5% tolerance)
form a crude 3-bit DAC that translates the 3-bit code
from the controller or processor's outputs into a 1.6V DC
control signal. A monolithic DAC or digital pot may be
used instead of the circuit shown in Figure 5-10.
With VMIN set to 1.8V, the TC647 has a minimum
operating speed of approximately 40% of full rated
speed when the processor's output code is 000[B].
Output codes 001[B] to 111[B] operate the fan from
roughly 40% to 100% of full speed. An open-drain
output from the processor I/O can be used to reset the
TC647 following detection of a fault condition. The
FAULT output can be connected to the processor's
interrupt input, or to an I/O pin, for polled operation (see
Figure 5-10).
 2001-2012 Microchip Technology Inc.
DS21447D-page 15
TC647
+12V
+5V
Open-drain
(RESET) (Optional)
Outputs I/O0
I/O1
Analog or Digital
Temperature
Data from one or
more Sensors
CMOS
Outputs
1
R2
240 kΩ
I/O2
CB
.01 μF
R3
360 kΩ
I/O3
CMOS
Microcontroller
+5V
R1
(MSB) 110 kΩ
(LSB)
R5
1.5 kΩ
+5V
R6
1 kΩ
R7
33 kΩ
+5V
R8
18 kΩ
VDD
2
CF
+
R4
18 kΩ
VIN
1 μF
3
CB
.01 μF
4
VOUT
CB +
1 μF
R9
800Ω
7
TC647
VMIN
FAULT
GND
SENSE
Fan
8
6
5
2N2222A
+5V
R10
10 kΩ
0.1 μF
R11
2.2Ω
GND
FIGURE 5-10:
DS21447D-page 16
INT
TC647 as a Microcontroller Peripheral.
 2001-2012 Microchip Technology Inc.
TC647
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
NNN
YYWW
TC647VPA
025
0215
8-Lead SOIC (150 mil)
XXXXXXXX
YYWW
NNN
8-Lead MSOP
XXXXXX
YWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
Example:
TC647VOA
0215
025
Example:
TC647E
215025
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2001-2012 Microchip Technology Inc.
DS21447D-page 17
TC647
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1

E
A2
A
L
c
A1

B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB


MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21447D-page 18
 2001-2012 Microchip Technology Inc.
TC647
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1

h
45×
c
A2
A
f

L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
f
c
B


MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2001-2012 Microchip Technology Inc.
DS21447D-page 19
TC647
6.2
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
2
B
n
1

A2
A
c

A1
(F)
L

INCHES
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
MILLIMETERS*
NOM
MIN
MAX
MIN
NOM
8
.026
0.65
.044
A
1.18
.038
0.76
0.86
.006
0.05
0.97
.193
.200
4.67
4.90
.5.08
.114
.118
.114
.118
.122
2.90
3.00
3.10
.122
2.90
3.00
L
.016
3.10
.022
.028
0.40
0.55
.035
Foot Angle
F

0.70
.037
.039
0.90
0.95
1.00
Lead Thickness
c
6
0
.004
.006
.008
0.10
0.15
0.20
Lead Width
Mold Draft Angle Top
B

.010
.012
.016
0.25
0.30
0.40
Mold Draft Angle Bottom

Molded Package Thickness
A2
.030
Standoff
A1
.002
E
.184
Molded Package Width
E1
Overall Length
D
Foot Length
Footprint (Reference)
§
Overall Width
MAX
8
.034
0
0.15
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed. 010" (0.254mm) per side.
Drawing No. C04-111
DS21447D-page 20
 2001-2012 Microchip Technology Inc.
TC647
6.3
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
 2001-2012 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
DS21447D-page 21
TC647
7.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
DS21447D-page 22
 2001-2012 Microchip Technology Inc.
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2001-2012 Microchip Technology Inc.
DS21447D-page 23
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
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RE:
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Application (optional):
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Y
N
Device:
Literature Number: DS21447D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21447D-page 24
 2001-2012 Microchip Technology Inc.
TC647
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Examples:
a)
TC647VOA: PWM Fan Speed Controller w/
Fault Detection, SOIC package.
b)
TC647VUA: PWM Fan Speed Controller w/
c)
TC647VPA: PWM Fan Speed Controller w/
d)
TC647EOATR: PWM Fan Speed Controller
Fault Detection, MSOP package.
Device:
TC647:
Temperature Range:
V
E
PWM Fan Speed Controller w/Fault Detection
Fault Detection, PDIP package.
Package:
= 0C to +85C
= -40C to +85C
w/Fault Detection, SOIC package, Tape and
Reel.
PA = Plastic DIP (300 mil Body), 8-lead *
OA = Plastic SOIC, (150 mil Body), 8-lead
UA = Plastic Micro Small Outline (MSOP), 8-lead
* PDIP package is only offered in the V temp range
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2001-2012 Microchip Technology Inc.
DS21447D-page25
TC647
NOTES:
DS21447D-page 26
 2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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hold harmless Microchip from any and all damages, claims,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768280
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2001-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21447D-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21447D-page 28
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
 2001-2012 Microchip Technology Inc.