ATMEL AT6002-4JI

Features
• High-performance
•
•
•
•
•
•
•
•
•
– System Speeds > 100 MHz
– Flip-flop Toggle Rates > 250 MHz
– 1.2 ns/1.5 ns Input Delay
– 3.0 ns/6.0 ns Output Delay
Up to 204 User I/Os
Thousands of Registers
Cache Logic® Design
– Complete/Partial In-System Reconfiguration
– No Loss of Data or Machine State
– Adaptive Hardware
Low Voltage and Standard Voltage Operation
– 5.0 (VCC = 4.75V to 5.25V)
– 3.3 (VCC = 3.0V to 3.6V)
Automatic Component Generators
– Reusable Custom Hard Macro Functions
Very Low-power Consumption
– Standby Current of 500 µA/ 200 µA
– Typical Operating Current of 15 to 170 mA
Programmable Clock Options
– Independently Controlled Column Clocks
– Independently Controlled Column Resets
– Clock Skew Less Than 1 ns Across Chip
Independently Configurable I/O (PCI Compatible)
– TTL/CMOS Input Thresholds
– Open Collector/Tristate Outputs
– Programmable Slew-rate Control
– I/O Drive of 16 mA (combinable to 64 mA)
Easy Migration to Atmel Gate Arrays for High Volume Production
Coprocessor
Field
Programmable
Gate Arrays
AT6000(LV)
Series
Description
AT6000 Series SRAM-based Field Programmable Gate Arrays (FPGAs) are ideal for
use as reconfigurable coprocessors and implementing compute-intensive logic.
Supporting system speeds greater than 100 MHz and using a typical operating current
of 15 to 170 mA, AT6000 Series devices are ideal for high-speed, compute-intensive
designs. These FPGAs are designed to implement Cache Logic®, which provides the
user with the ability to implement adaptive hardware and perform hardware
acceleration.
The patented AT6000 Series architecture employs a symmetrical grid of small yet
powerful cells connected to a flexible busing network. Independently controlled clocks
and resets govern every column of cells. The array is surrounded by programmable
I/O.
(continued)
AT6000 Series Field Programmable Gate Arrays
Device
AT6002
AT6003
AT6005
AT6010
Usable Gates
6,000
9,000
15,000
30,000
Cells
1,024
1,600
3,136
6,400
Registers (maximum)
1,024
1,600
3,136
6,400
96
120
108
204
Typ. Operating Current (mA)
15 - 30
25 - 45
40 - 80
85 - 170
Cell Rows x Columns
32 x 32
40 x 40
56 x 56
80 x 80
I/O (maximum)
Rev. 0264F–10/99
1
Devices range in size from 4,000 to 30,000 usable gates,
and 1024 to 6400 registers. Pin locations are consistent
throughout the AT6000 Series for easy design migration.
High-I/O versions are available for the lower gate count
devices.
AT6000 Series FPGAs utilize a reliable 0.6 µm single-poly,
double-metal CMOS process and are 100% factory-tested.
Atmel's PC- and workstation-based Integrated Development System is used to create AT6000 Series designs.
Multiple design entry methods are supported.
The Atmel architecture was developed to provide the highest levels of performance, functional density and design
flexibility in an FPGA. The cells in the Atmel array are
small, very efficient and contain the most important and
most commonly used logic and wiring functions. The cell’s
small size leads to arrays with large numbers of cells,
greatly multiplying the functionality in each cell. A simple,
high-speed busing network provides fast, efficient communication over medium and long distances.
Figure 1. Symmetrical Array Surrounded by I/O
2
AT6000(LV) Series
The Symmetrical Array
At the heart of the Atmel architecture is a symmetrical array
of identical cells (Figure 1). The array is continuous and
completely uninterrupted from one edge to the other,
except for bus repeaters spaced every eight cells
(Figure 2).
In addition to logic and storage, cells can also be used as
wires to connect functions together over short distances
and are useful for routing in tight spaces.
The Busing Network
There are two kinds of buses: local and express (see
Figures 2 and 3).
Local buses are the link between the array of cells and the
busing network. There are two local buses – North-South 1
and 2 (NS1 and NS2) – for every column of cells, and two
local buses – East-West 1 and 2 (EW1 and EW2) – for
every row of cells. In a sector (an 8 x 8 array of cells
enclosed by repeaters) each local bus is connected to
every cell in its column or row, thus providing every cell in
the array with read/write access to two North-South and
two East-West buses.
AT6000(LV) Series
Figure 2. Busing Network (one sector)
CELL
REPEATER
Figure 3. Cell-to-cell and Bus-to-bus Connections
3
Each cell, in addition, provides the ability to route a signal
on a 90° turn between the NS1 bus and EW1 bus and
between the NS2 bus and EW2 bus.
Express buses are not connected directly to cells, and thus
provide higher speeds. They are the fastest way to cover
long, straight-line distances within the array.
Each express bus is paired with a local bus, so there are
two express buses for every column and two express
buses for every row of cells.
Connective units, called repeaters, spaced every eight
cells, divide each bus, both local and express, into
segments spanning eight cells. Repeaters are aligned in
rows and columns thereby partitioning the array into 8 x 8
sectors of cells. Each repeater is associated with a
local/express pair, and on each side of the repeater are
connections to a local-bus segment and an express-bus
segment. The repeater can be programmed to provide any
one of twenty-one connecting functions. These functions
are symmetric with respect to both the two repeater sides
and the two types of buses.
Among the functions provided are the ability to:
• Isolate bus segments from one another
• Connect two local-bus segments
• Connect two express-bus segments
• Implement a local/express transfer
Figure 4. Cell Structure
4
AT6000(LV) Series
In all of these cases, each connection provides signal
regeneration and is thus unidirectional. For bidirectional
connections, the basic repeater function for the NS2 and
EW2 repeaters is augmented with a special programmable
connection allowing bidirectional communication between
local-bus segments. This option is primarily used to implement long, tristate buses.
The Cell Structure
The Atmel cell (Figure 4) is simple and small and yet
can be programmed to perform all the logic and wiring
functions needed to implement any digital circuit. Its four
sides are functionally identical, so each cell is completely
symmetrical.
Read/write access to the four local buses – NS1, EW1,
NS2 and EW2 – is controlled, in part, by four bidirectional
pass gates connected directly to the buses. To read a local
bus, the pass gate for that bus is turned on and the threeinput multiplexer is set accordingly. To write to a local bus,
the pass gate for that bus and the pass gate for the associated tristate driver are both turned on. The two-input
multiplexer supplying the control signal to the drivers permits either: (1) active drive, or (2) dynamic tristating
controlled by the B input. Turning between LNS1 and LEW1 or
between LNS2 and LEW2 is accomplished by turning on the
two associated pass gates. The operations of reading, writing and turning are subject to the restriction that each bus
can be involved in no more than a single operation.
AT6000(LV) Series
In addition to the four local-bus connections, a cell receives
two inputs and provides two outputs to each of its
North (N), South (S), East (E) and West (W) neighbors.
These inputs and outputs are divided into two classes: “A”
and “B”. There is an A input and a B input from each neighboring cell and an A output and a B output driving all four
neighbors. Between cells, an A output is always connected
to an A input and a B output to a B input.
• In State 3 – corresponding to the “3” inputs of the
multiplexers – the XOR function of State 2 is provided to
the D input of a D-type flip-flop, the Q output of which is
connected to the cell’s A output. Clock and
asynchronous reset signals are supplied externally as
described later. The AND of the outputs from the two
upstream AND gates is provided to the cell's B output.
Within the cell, the four A inputs and the four B inputs enter
two separate, independently configurable multiplexers. Cell
flexibility is enhanced by allowing each multiplexer to select
also the logical constant “1”. The two multiplexer outputs
enter the two upstream AND gates.
Logic States
Downstream from these two AND gates are an ExclusiveOR (XOR) gate, a register, an AND gate, an inverter and
two four-input multiplexers producing the A and B outputs.
These multiplexers are controlled in tandem (unlike the
A and B input multiplexers) and determine the function of
the cell.
• In State 0 – corresponding to the “0” inputs of the
multiplexers – the output of the left-hand upstream AND
gate is connected to the cell’s A output, and the output of
the right-hand upstream AND gate is connected to the
cell’s B output.
• In State 1 – corresponding to the “1” inputs of the
multiplexers – the output of the left-hand upstream AND
gate is connected to the cell’s B output, the output of the
right-hand upstream AND gate is connected to the cell’s
A output.
The Atmel cell implements a rich and powerful set of logic
functions, stemming from 44 logical cell states which permutate into 72 physical states. Some states use both A and
B inputs. Other states are created by selecting the “1” input
on either or both of the input multiplexers.
There are 28 combinatorial primitives created from the
cell’s tristate capabilities and the 20 physical states represented in Figure 5. Five logical primitives are derived from
the physical constants shown in Figure 7. More complex
functions are created by using cells in combination.
A two-input AND feeding an XOR (Figure 8) is produced
using a single cell (Figure 9). A two-to-one multiplexer
selects the logical constant “0” and feeds it to the righthand AND gate. The AND gate acts as a feed-through, letting the B input pass through to the XOR. The three-to-one
multiplexer on the right side selects the local-bus input,
LNS1, and passes it to the left-hand AND gate. The A and
LNS1 signals are the inputs to the AND gate. The output of
the AND gate feeds into the XOR, producing the logic state
(AlL) XOR B.
• In State 2 – corresponding to the “2” inputs of the
multiplexers – the XOR of the outputs from the two
upstream AND gates is provided to the cell’s A output,
while the NAND of these two outputs is provided to the
cell’s B output.
5
Figure 5. Combinatorial Physical States
Li
A
Li
A, L o
B
A, L o
B
A Li
B
A Li
B
A, L o
B
Li B
A, L o
"0"
A, L o
B
"0"
A, L o
"1"
"1"
"0"
B
A, L o
B
B
A, L o
B
Figure 8. Two-input AND Feeding XOR
B
A
Li B
A Li
A, L o
A, L o
Li
B
B
A Li B
A, L o B
B
A
"0"
A Li
A, L o
Li B
A, L o
B
A Li
B
B
A Li B
B A, L o
A Li
A, L o
A, L o
A, L o
A, L o
Figure 7. Physical Constants
B
Li
A
B
Li
B
A Li
B
A Li
B
1 0
A, L o
A, L o B
A, L o B
A, L o B
A, L o B
Figure 9. Cell Configuration (AlL) XOR B
Figure 6. Register States
A
A
D
Q
"0"
A, L o
B
D
Q
A, L o
A Li
D
Q
A, L o
A
B
Li
D
Q
B
D
Q
A, L o
Li B
A Li
D
Q
D
Q
A, L o
A, L o
B
A, L o
B
B
Li
B
A Li
B
A Li B
1 0
D
Q
A, L o B
D
Q
A, L o B
D
Q
D
Q
A, L o
A, L o B
6
B
AT6000(LV) Series
"1"
A, L o
"1"
B
AT6000(LV) Series
Clock Distribution
Asynchronous Reset
Along the top edge of the array is logic for distributing clock
signals to the D flip-flop in each logic cell (Figure 10). The
distribution network is organized by column and permits
columns of cells to be independently clocked. At the head
of each column is a user-configurable multiplexer providing
the clock signal for that column. It has four inputs:
• Global clock supplied through the CLOCK pin
Along the bottom edge of the array is logic for asynchronou sl y r es etti ng the D fl ip -fl op s in the lo gic cel ls
(Figure 10). Like the clock network, the asynchronous reset
network is organized by column and permits columns to be
independently reset. At the bottom of each column is a
user-configurable multiplexer providing the reset signal for
that column. It has four inputs:
• Global asynchronous reset supplied through the
RESET pin
• Express bus adjacent to the distribution logic
• “A” output of the cell at the head of the column
• Logical constant “1” to conserve power (no clock)
Through the global clock, the network provides low-skew
distribution of an externally supplied clock to any or all of
the columns of the array. The global clock pin is also connected directly to the array via the A input of the upper left
and right corner cells (AW on the left, and AN on the right).
The express bus is useful in distributing a secondary clock
to multiple columns when the global clock line is used as a
primary clock. The A output of a cell is useful in providing a
clock signal to a single column. The constant “1” is used to
reduce power dissipation in columns using no registers.
Figure 10. Column Clock and Column Reset
GLOBAL
CLOCK
GLOBAL
CLOCK
"1"
• Express bus adjacent to the distribution logic
• “A” output of the cell at the foot of the column
• Logical constant “1” to conserve power
The asynchronous reset logic uses these four inputs in the
same way that the clock distribution logic does. Through
the global asynchronous reset, any or all columns can be
reset by an externally supplied signal. The global asynchronous reset pin is also connected directly to the array via the
A input of the lower left and right corner cells (AS on the
left, and AE on the right). The express bus can be used to
distribute a secondary reset to multiple columns when the
global reset line is used as a primary reset, the A output of
a cell can also provide an asynchronous reset signal to a
single column, and the constant “1” is used by columns
with registers requiring no reset. All registers are reset during power-up.
A
Input/Output
D
Q
CELL
EXPRESS
BUS
EXPRESS
BUS
D
Q
Two adjacent cells – an “exit” and an “entrance” cell – on
the perimeter of the logic array are associated with each
I/O pin.
CELL
D
E
D
I
C
A
T
E
D
B
U
R
I
E
D
R
O
U
T
I
N
G
There are two types of I/Os: A-type (Figure 11) and B-type
(Figure 12). For A-type I/Os, the edge-facing A output of an
exit cell is connected to an output driver, and the edgefacing A input of the adjacent entrance cell is connected to
an input buffer. The output of the output driver and the input
of the input buffer are connected to a common pin.
CELL
D
Q
EXPRESS
BUS
The Atmel architecture provides a flexible interface
between the logic array, the configuration control logic and
the I/O pins.
EXPRESS
BUS
CELL
D
Q
A
B-type I/Os are the same as A-type I/Os, but use the B
inputs and outputs of their respective entrance and exit
cells. A- and B-type I/Os alternate around the array Control
of the I/O logic is provided by user-configurable memory
bits.
"1"
GLOBAL
RESET
GLOBAL
RESET
7
Figure 11. A-type I/O Logic
Slew Rate Control
A user-configurable bit controls the slew rate – fast or slow
– of the output buffer. A slow slew rate, which reduces
noise and ground bounce, is recommended for outputs that
are not speed-critical. Fast and slow slew rates have the
same DC-current sinking capabilities, but the rate at which
each allows the output devices to reach full drive differs.
Pull-up
A user-configurable bit controls the pull-up transistor in the
I/O pin. It’s primary function is to provide a logical “1” to
unused input pins. When on, it is approximately equivalent
to a 25K resistor to VCC.
Enable Select
Figure 12. B-type I/O Logic
User-configurable bits determine the output-enable for the
output driver. The output driver can be static – always on or
always off – or dynamically controlled by a signal generated in the array. Four options are available from the array:
(1) the control is low and always driving; (2) the control is
high and never driving; (3) the control is connected to a vertical local bus associated with the output cell; or (4) the
control is connected to a horizontal local bus associated
with the output cell. On power-up, the user I/Os are configured as inputs with pull-up resistors.
In addition to the functionality provided by the I/O logic, the
entrance and exit cells provide the ability to register both
inputs and outputs. Also, these perimeter cells (unlike interior cells) are connected directly to express buses: the
edge-facing A and B outputs of the entrance cell are connected to express buses, as are the edge-facing A and B
inputs of the exit cell. These buses are perpendicular to the
edge, and provide a rapid means of bringing I/O signals to
and from the array interior and the opposite edge of the
chip.
Chip Configuration
TTL/CMOS Inputs
A user-configurable bit determines the threshold level –
TTL or CMOS – of the input buffer.
Open Collector/Tristate Outputs
A user-configurable bit which enables or disables the active
pull-up of the output device.
8
AT6000(LV) Series
The Integrated Development System generates the SRAM
bit pattern required to configure a AT6000 Series device. A
PC parallel port, microprocessor, EPROM or serial configuration memory can be used to download configuration
patterns.
Users select from several configuration modes. Many factors, including board area, configuration speed and the
number of designs implemented in parallel can influence
the user’s final choice.
Configuration is controlled by dedicated configuration pins
and dual-function pins that double as I/O pins when the
device is in operation. The number of dual-function pins
required for each mode varies.
AT6000(LV) Series
The devices can be partially reconfigured while in operation. Portions of the device not being modified remain
operational during reconfiguration. Simultaneous configuration of more than one device is also possible. Full
configuration takes as little as a millisecond, partial configuration is even faster.
Refer to the Pin Function Description section following for a
brief summary of the pins used in configuration. For more
information about configuration, refer to the AT6000 Series
Configuration data sheet.
Pin Function Description
This section provides abbreviated descriptions of the various AT6000 Series pins. For more complete descriptions,
refer to the AT6000 Series Configuration data sheet.
M0, M1, M2
Configuration mode pins are used to determine the configuration mode. All three are TTL input pins.
CCLK
Configuration clock pin. CCLK is a TTL input or a CMOS
output depending on the mode of operation. In modes 1, 2,
3, and 6 it is an input. In modes 4 and 5 it is an output with
a typical frequency of 1 MHz. In all modes, the rising edge
of the CCLK signal is used to sample inputs and change
outputs.
CLOCK
Pinout tables for the AT6000 series of devices follow.
External logic source used to drive the internal global clock
line. Registers toggle on the rising edge of CLOCK. The
CLOCK signal is neither used nor affected by the configuration modes. It is always a TTL input.
Power Pins
RESET
VCC, VDD, GND, VSS
VCC and GND are the I/O supply pins, VDD and VSS are the
internal logic supply pins. VCC and VDD should be tied to the
same trace on the printed circuit board. GND and V SS
should be tied to the same trace on the printed circuit
board.
Input/Output Pins
All I/O pins can be used in the same way (refer to the I/O
section of the architecture description). Some I/O pins are
dual-function pins used during configuration of the array.
When not being used for configuration, dual-function I/Os
are fully functional as normal I/O pins. On initial power-up,
all I/Os are configured as TTL inputs with a pull-up.
Dedicated Timing and Control Pins
CON
Configuration-in-process pin. After power-up, CON staysLow until power-up initialization is complete, at which time
CON is then released. CON is an open collector signal.
After power-up initialization, forcing CON low begins the
configuration process.
CS
Configuration enable pin. All configuration pins are ignored
if CS is high. CS must be held low throughout the configuration process. CS is a TTL input pin.
Array register asynchronous reset. RESET drives the internal global reset. The RESET signal is neither used nor
affected by the configuration modes. It is always a TTL
input.
Dual-function Pins
When CON is high, dual-function I/O pins act as device
I/Os; when CON is low, dual-function pins are used as configuration control or data signals as determined by the
configuration modes. Care must be taken when using
these pins to ensure that configuration activity does not
interfere with other circuitry connected to these pins in the
application.
D0 or I/O
Serial configuration modes use D0 as the serial data input
pin. Parallel configuration modes use D0 as the least-signi fic an t bi t. Inpu t d ata mus t mee t s etu p a nd hol d
requirements with respect to the rising edge of CCLK. D0 is
a TTL input during configuration.
D1 to D7 or I/O
Parallel configuration modes use these pins as inputs.
Serial configuration modes do not use them. Data must
meet setup and hold requirements with respect to the rising
edge of CCLK. D1 - D7 are TTL inputs during configuration.
A0 to A16 or I/O
During configuration in modes 1, 2 and 5, these pins are
CMOS outputs and act as the address pins for a parallel
EPROM. A0 - A16 eliminates the need for an external
address counter when using an external parallel nonvolatile
9
memory to configure the FPGA. Addresses change after
the rising edge of the CCLK signal.
CSOUT or I/O
When cascading devices, CSOUT is an output used to
enable other devices. CSOUT should be connected to the
CS input of the downstream device. The CSOUT function is
optional and can be disabled during initial programming
when cascading is not used. When cascading devices,
CSOUT should be dedicated to configuration and not used
as a configurable I/O.
CHECK or I/O
During configuration, CHECK is a TTL input that can be
used to enable the data check function at the beginning of
a configuration cycle. No data is written to the device while
CHECK is low. Instead, the configuration file being applied
to D0 (or D0 - D7, in parallel mode) is compared with the
current contents of the internal configuration RAM. If a mismatch is detected between the data being loaded and the
data already in the RAM, the ERR pin goes low. The
CHECK function is optional and can be disabled during initial programming.
ERR or I/O
During configuration, ERR is an output. When the CHECK
function is activated and a mismatch is detected between
the current configuration data stream and the data already
loaded in the configuration RAM, ERR goes low. The ERR
ouput is a registered signal. Once a mismatch is found, the
signal is set and is only reset after the configuration cycle is
restarted. ERR is also asserted for configuration file errors.
The ERR function is optional and can be disabled during
initial programming.
Device Pinout Selection (Max. Number of User I/O)
AT6002
AT6003
AT6005
AT6010
84 PLCC
64 I/O
64 I/O
64 I/O
-
100 VQFP
80 I/O
80 I/O
80 I/O
-
132 PQFP
96 I/O
108 I/O
108 I/O
108 I/O
144 TQFP
95 I/O
120 I/O
108 I/O
120 I/O
208 PQFP
-
-
-
172 I/O
240 PQFP
-
-
-
204 I/O
Bit-stream Sizes
Mode(s)
10
Type
Beginning Sequence
AT6002
AT6003
AT6005
AT6010
1
Parallel
Preamble
2677
4153
8077
16393
2
Parallel
Preamble
2677
4153
8077
16393
3
Serial
Null Byte/Preamble
2678
4154
8078
16394
4
Serial
Null Byte/Preamble
2678
4154
8078
16394
5
Parallel
Preamble
2677
4153
8077
16393
6
Parallel
Preamble/Preamble
2678
4154
8078
16394
AT6000(LV) Series
AT6000(LV) Series
Pinout Assignment
Left Side (Top to Bottom)
AT6002
AT6003
AT6005
AT6010
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
-
-
-
I/O51(A)
-
-
-
-
B1
1
1
I/O24(A) or A7
I/O30(A) or A7
I/O27(A) or A7
I/O50(A) or A7
12
1
18
1
C1
2
2
-
I/O29(B)
-
I/O49(A)
-
-
-
2
D1
3
3
-
-
-
I/O48(B)
-
-
-
-
-
-
4
4
5
5
6
6
7
-
-
-
VCC
-
-
-
-
PWR
-
-
-
I/O47(A)
-
-
-
-
E1
(1)
(2)
-
-
-
GND
-
-
-
-
GND
-
I/O28(A)
I/O26(A)
I/O46(A)
-
-
19
3
G1
7
8
I/O23(A) or A6
I/O27(A) or A6
I/O25(A) or A6
I/O45(A) or A6
13
2
20
4
H1
8
9
-
-
-
I/O44(B)
-
-
-
-
-
-
10
-
-
-
I/O43(A)
-
-
-
-
C2
9
11
I/O22(B)
I/O26(A)
I/O24(A)
I/O42(A)
-
-
21
5
D2
10
12
I/O21(A) or A5
I/O25(A) or A5
I/O23(A) or A5
I/O41(A) or A5
14
3
22
6
E2
11
13
-
-
-
I/O40(B)
-
-
-
-
-
-
14
-
-
-
I/O39(A)
-
-
-
-
F2
12
15
I/O20(B)
I/O24(B)
I/O22(A)
I/O38(A)
-
4
23
7
G2
13
16
I/O19(A) or A4
I/O23(A) or A4
I/O21(A) or A4
I/O37(A) or A4
15
5
24
8
H2
14
17
-
-
-
I/O36(B)
-
-
-
-
-
-
18
I/O18(B)
I/O22(B)
I/O20(A)
I/O35(A)
-
-
25
9
D3
15
19
I/O17(A) or A3
I/O21(A) or A3
I/O19(A) or A3
I/O34(A) or A3
16
6
26
10
E3
16
20
I/O16(B)
I/O20(B)
I/O18(A)
I/O33(A)
-
7
27
11
F3
17
21
-
-
-
I/O32(B)
-
-
-
-
-
18
22
I/O15(A) or A2
I/O19(A) or A2
I/O17(A) or A2
I/O31(A) or A2
17
8
28
12
G3
19
23
-
I/O18(B)
I/O16(A)
I/O30(A)
-
-
29
13
H3
GND
GND
GND
GND
18
9
30
14
20
24
GND
(2)
21
25
(2)
22
26
VSS
VSS
VSS
VSS
19
10
31
15
GND
I/O14(A) or A1
I/O17(A) or A1
I/O15(A) or A1
I/O29(A) or A1
20
11
32
16
F4
23
27
-
-
-
I/O28(B)
-
-
-
-
-
24
28
-
I/O16(B)
-
I/O27(A)
-
-
-
17
G4
25
29
I/O13(A) or A0
I/O15(A) or A0
I/O14(A) or A0
I/O26(A) or A0
21
12
33
18
H4
26
30
I/O12(B) or D7
I/O14(A) or D7
I/O13(A) or D7
I/O25(B) or D7
22
13
34
19
H5
27
31
-
-
-
I/O24(B)
-
-
-
-
-
28
32
I/O11(A) or D6
I/O13(A) or D6
I/O12(A) or D6
I/O23(A) or D6
23
14
35
20
J4
29
33
I/O10(A) or D5
I/O12(A) or D5
I/O11(A) or D5
I/O22(A) or D5
24
15
36
21
K4
VDD
VCC
VDD
VCC
VDD
VCC
VDD
VCC
25
26
16
17
37
38
22
23
30
34
PWR
(1)
31
35
PWR
(1)
32
36
11
Pinout Assignment (Continued)
Left Side (Top to Bottom)
AT6002
AT6003
AT6005
AT6010
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
I/O9(B)
I/O11(B)
I/O10(A)
I/O21(A)
-
-
39
24
J3
33
37
-
-
-
I/O20(B)
-
-
-
-
-
34
38
I/O8(A) or D4
I/O10(A) or D4
I/O9(A) or D4
I/O19(A) or D4
27
18
40
25
K3
35
39
I/O7(B)
I/O9(B)
I/O8(A)
I/O18(A)
-
19
41
26
L3
36
40
-
-
-
I/O17(A)
-
-
-
-
M3
37
41
-
-
-
I/O16(B)
-
-
-
-
-
-
42
I/O6(A) or D3
I/O8(A) or D3
I/O7(A) or D3
I/O15(A) or D3
28
20
42
27
N3
38
43
-
I/O7(B)
I/O6(A)
I/O14(A)
-
-
43
28
J2
39
44
-
-
-
I/O13(A)
-
-
-
-
K2
GND
GND
GND
GND
-
-
44
29
40
45
GND
(2)
41
46
GND
(2)
42
47
-
-
-
VSS
-
-
-
-
-
-
-
I/O12(B)
-
-
-
-
-
-
48
I/O5(A) or D2
I/O6(A) or D2
I/O5(A) or D2
I/O11(A) or D2
29
21
45
30
M2
43
49
I/O4(B)
I/O5(B)
I/O4(A)
I/O10(A)
-
22
46
31
N2
44
50
-
-
-
I/O9(A)
-
-
-
-
P2
45
51
-
-
-
I/O8(B)
-
-
-
-
-
-
52
I/O3(A) or D1
I/O4(A) or D1
I/O3(A) or D1
I/O7(A) or D1
30
23
47
32
J1
46
53
I/O2(B)
I/O3(A)
I/O2(A)
I/O6(A)
-
-
48
33
K1
47
54
-
-
-
I/O5(A)
-
-
-
-
L1
48
55
-
-
-
I/O4(B)
-
-
-
-
-
-
56
-
I/O2(B)
-
I/O3(A)
-
-
-
34
M1
49
57
I/O1(A) or D0
I/O1(A) or D0
I/O1(A) or D0
I/O2(A) or D0
31
24
49
35
N1
50
58
-
-
-
I/O1(A)
-
-
-
-
P1
51
59
CCLK
CCLK
CCLK
32
25
50
36
R1
52
60
CCLK
Notes:
12
1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12.
2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6.
AT6000(LV) Series
AT6000(LV) Series
Pinout Assignment
Bottom Side (Left to Right)
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
33
26
51
37
M5
53
61
I/O204(A)
-
-
-
-
M6
54
62
I/O108(A)
I/O203(A)
34
27
52
38
M7
55
63
I/O119(B)
-
I/O202(A)
-
-
-
39
R2
56
64
-
-
I/O201(B)
-
-
-
-
-
-
65
57
66
58
67
59
68
AT6002
AT6003
AT6005
AT6010
CON
CON
CON
CON
-
-
-
I/O96(A)
I/O120(A)
-
-
-
VCC
-
-
-
-
PWR
-
-
-
I/O200(A)
-
-
-
-
R3
GND
(1)
(2)
-
-
-
GND
-
-
-
-
-
I/O118(A)
I/O107(A)
I/O199(A)
-
-
53
40
R5
60
69
I/O95(A) or
CSOUT
I/O117(A) or
CSOUT
I/O106(A) or
CSOUT
I/O198(A) or
CSOUT
35
28
54
41
R6
61
70
-
-
-
I/O197(B)
-
-
-
-
-
-
71
-
-
-
I/O196(A)
-
-
-
-
R7
62
72
I/O94(B)
I/O116(A)
I/O105(A)
I/O195(A)
-
-
55
42
P3
63
73
I/O93(A)
I/O115(A)
I/O104(A)
I/O194(A)
36
29
56
43
P4
64
74
-
-
-
I/O193(B)
-
-
-
-
-
-
75
-
-
-
I/O192(A)
-
-
-
-
P5
65
76
I/O92(B)
I/O114(B)
I/O103(A)
I/O191(A)
-
30
57
44
P6
66
77
I/O91(A) or
CHECK
I/O113(A) or
CHECK
I/O102(A) or
CHECK
I/O190(A) or
CHECK
37
31
58
45
P7
67
78
-
-
-
I/O189(B)
-
-
-
-
-
-
79
I/O90(B)
I/O112(B)
I/O101(A)
I/O188(A)
-
-
59
46
N4
68
80
I/O89(A) or
ERR
I/O111(A) or
ERR
I/O100(A) or
ERR
I/O187(A) or
ERR
38
32
60
47
N5
69
81
I/O88(B)
I/O110(B)
I/O99(A)
I/O186(A)
-
33
61
48
N6
70
82
-
-
-
I/O185(B)
-
-
-
-
-
71
83
I/O87(A)
I/O109(A)
I/O98(A)
I/O184(A)
39
34
62
49
N7
72
84
-
I/O108(B)
I/O97(A)
I/O183(A)
-
-
63
50
M8
73
85
GND
GND
GND
GND
40
35
64
51
GND(2)
74
86
I/O86(A)
I/O107(A)
I/O96(A)
I/O182(A)
41
36
65
52
M9
75
87
-
-
-
I/O181(B)
-
-
-
-
-
76
88
-
I/O106(B)
-
I/O180(A)
-
-
-
53
M10
77
89
I/O85(A)
I/O105(A)
I/O95(A)
I/O179(A)
42
37
66
54
M11
78
90
CS
CS
CS
CS
43
38
67
55
L8
79
91
I/O84(B)
I/O104(A)
I/O94(A)
I/O178(A)
44
39
68
56
M12
80
92
-
-
-
I/O177(B)
-
-
-
-
-
81
93
I/O83(A)
I/O103(A)
I/O93(A)
I/O176(A)
45
40
69
57
N8
82
94
13
Pinout Assignment (Continued)
Bottom Side (Left to Right)
AT6002
AT6003
AT6005
AT6010
-
-
-
VDD
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
-
-
-
-
PWR(1)
83
95
(1)
84
96
VCC
VCC
VCC
VCC
46
41
70
58
PWR
I/O82(A)
I/O102(A)
I/O92(A)
I/O175(A)
47
42
71
59
N11
85
97
I/O81(B)
I/O101(B)
I/O91(A)
I/O174(A)
-
-
72
60
N12
86
98
-
-
-
I/O173(B)
-
-
-
-
-
87
99
I/O80(A)
I/O100(A)
I/O90(A)
I/O172(A)
48
43
73
61
N13
88
100
I/O79(B)
I/O99(B)
I/O89(A)
I/O171(A)
-
44
74
62
P8
89
101
-
-
-
I/O170(A)
-
-
-
-
P9
90
102
-
-
-
I/O169(B)
-
-
-
-
-
-
103
I/O78(A)
I/O98(A)
I/O88(A)
I/O168(A)
49
45
75
63
P10
91
104
-
I/O97(B)
I/O87(A)
I/O167(A)
-
-
76
64
P11
92
105
-
-
-
I/O166(A)
-
-
-
-
P12
93
106
94
107
GND
GND
GND
GND
-
-
77
65
-
-
-
I/O165(B)
-
-
-
-
-
-
108
I/O77(A)
I/O96(A)
I/O86(A)
I/O164(A)
50
46
78
66
P13
95
109
I/O76(B)
I/O95(B)
I/O85(A)
I/O163(A)
-
47
79
67
P14
96
110
-
-
-
I/O162(A)
-
-
-
-
P8
97
111
-
-
-
I/O161(B)
-
-
-
-
-
-
112
I/O75(A)
I/O94(A)
I/O84(A)
I/O160(A)
51
48
80
68
R9
98
113
I/O74(B)
I/O93(A)
I/O83(A)
I/O159(A)
-
-
81
69
R10
99
114
-
-
-
I/O158(A)
-
-
-
-
R11
100
115
-
-
-
I/O157(B)
-
-
-
-
-
-
116
-
I/O92(B)
-
I/O156(A)
-
-
-
70
R12
101
117
I/O73(A)
I/O91(A)
I/O82(A)
I/O155(A)
52
49
82
71
R13
102
118
-
-
-
I/O154(A)
-
-
-
-
R14
103
119
RESET
RESET
RESET
53
50
83
72
R15
104
120
RESET
Notes:
14
1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12.
2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6.
AT6000(LV) Series
GND
(2)
AT6000(LV) Series
Pinout Assignment
Right Side (Bottom to Top)
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
I/O153(A)
-
-
-
-
P15
105
121
I/O152(A)
54
51
84
73
N15
106
122
74
M15
107
123
-
-
-
124
108
125
109
126
110
127
AT6002
AT6003
AT6005
AT6010
-
-
-
I/O72(A)
I/O90(A)
I/O81(A)
(3)
-
I/O89(B)
I/O80(A)
I/O151(A)
-
-
85
-
-
-
I/O150(B)
-
-
-
(1)
-
-
-
VCC
-
-
-
-
PWR
-
-
-
I/O149(A)
-
-
-
-
L15
-
-
-
GND
-
-
(4)
-
GND
(2)
75
J15
111
128
86
76
H15
112
129
-
-
-
-
-
130
-
-
-
-
N14
113
131
I/O144(A)
-
-
87
77
M14
114
132
I/O77(A)
I/O143(A)
56
53
88
78
L14
115
133
-
-
I/O142(B)
-
-
-
-
-
-
134
-
-
-
I/O141(A)
-
-
-
-
K14
116
135
I/O68(B)
I/O84(B)
I/O76(A)
I/O140(A)
-
54
89
79
J14
117
136
I/O67(A)
I/O83(A)
I/O75(A)
I/O139(A)
57
55
90
80
H14
118
137
-
-
-
I/O138B
-
-
-
-
-
-
138
I/O66(B)
I/O82(B)
I/O74(A)
I/O137(A)
-
-
91
81
M13
119
139
I/O65(A)
I/O81(A)
I/O73(A)
I/O136(A)
58
56
92
82
L13
120
140
I/O64(B)
I/O80(B)
I/O72(A)
I/O135(A)
-
57
93
83
K13
121
141
-
-
-
I/O134(B)
-
-
-
-
-
122
142
I/O63(A)
I/O79(A)
I/O71(A
I/O133(A)
59
58
94
84
J13
123
143
-
I/O78(B)
I/O70(A)
I/O132(A)
-
-
95
85
H13
-
I/O88(A)
-
I/O148(A)
-
-
I/O71(A)
I/O87(A)
I/O79(A)
I/O147(A)
55
52
-
-
-
I/O146(B)
-
-
-
-
I/O145(A)
I/O70(B)
I/O86(A)
I/O78(A)
I/O69(A)
I/O85(A)
-
GND
GND
GND
GND
60
59
85
96
86
124
144
GND
(2)
125
145
(2)
126
146
VSS
VSS
VSS
VSS
61
60
97
87
GND
I/O62(A)
I/O77(A)
I/O69(A)
I/O131(A)
62
61
98
88
K12
127
147
-
-
-
I/O130(B)
-
-
-
-
-
128
148
-
I/O76(B)
-
I/O129(A)
-
-
-
89
J12
129
149
I/O61(A)
I/O75(A)
I/O68(A)
I/O128(A)
63
62
99
90
H12
130
150
I/O60(B)
I/O74(A)
I/O67(A)
I/O127(A)
64
63
100
91
H11
131
151
-
-
-
I/O126(B)
-
-
-
-
-
132
152
I/O59(A)
I/O73(A)
I/O66(A)
I/O125(A)
65
64
101
92
G12
133
153
I/O58(A)
I/O72(A)
I/O65(A)
I/O124(A)
66
65
102
93
F12
VDD
VCC
VDD
VCC
VDD
VCC
VDD
VCC
67
68
66
67
103
104
94
95
134
154
PWR
(1)
135
155
PWR
(1)
136
156
15
Pinout Assignment (Continued)
Right Side (Bottom to Top)
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
I/O123(A)
-
-
105
96
G13
137
157
-
I/O122(B)
-
-
-
-
-
138
158
I/O70(A)
I/O63(A)
I/O121(A)
69
68
106
97
F13
139
159
I/O55(B)
I/O69(B)
I/O62(A)
I/O120(A)
-
69
107
98
E13
140
160
-
-
-
I/O119(A)
-
-
-
-
D13
141
161
-
-
-
I/O118(B)
-
-
-
-
-
-
162
I/O54(A)
I/O68(A)
I/O61(A)
I/O117(A)
70
70
108
99
C13
142
163
-
I/O67(B)
I/O60(A)
I/O116(A)
-
-
109
100
G14
143
164
-
-
-
I/O115(A)
-
-
-
-
F14
AT6002
AT6003
AT6005
AT6010
I/O57(B)
I/O71(B)
I/O64(A)
-
-
I/O56(A)
GND
GND
GND
GND
-
-
110
101
144
165
GND
(2)
145
166
GND
(2)
146
167
-
-
-
VSS
-
-
-
-
-
-
-
I/O114(B)
-
-
-
-
-
-
168
I/O53(A)
I/O66(A)
I/O59(A)
I/O113(A)
71
71
111
102
D14
147
169
I/O52(B)
I/O65(B)
I/O58(A)
I/O112(A)
-
72
112
103
C14
148
170
-
-
-
I/O111(A)
-
-
-
-
B14
149
171
-
-
-
I/O110(B)
-
-
-
-
-
-
172
I/O51(A)
I/O64(A)
I/O57(A)
I/O109(A)
72
73
113
104
G15
150
173
I/O50(B)
I/O63(A)
I/O56(A)
I/O108(A)
-
-
114
105
F15
151
174
-
-
-
I/O107(A)
-
-
-
-
E15
152
175
-
-
-
I/O106(B)
-
-
-
-
-
-
176
-
I/O62(B)
-
I/O105(A)
-
-
-
106
D15
153
177
I/O49(A)
I/O61(A)
I/O55(A)
I/O104(A)
73
74
115
107
C15
154
178‘
-
-
-
I/O103(A)
-
-
-
-
B15
155
179
M2
M2
M2
74
75
116
108
A15
156
180
M2
Notes:
16
1.
2.
3.
4.
PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12.
GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6.
85 = Pin 85 on AT6005.
85 = Pin 85 on AT6003 and AT6010.
AT6000(LV) Series
AT6000(LV) Series
Pinout Assignment
Top Side (Right to Left)
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
75
76
117
109
D11
157
181
I/O102(A)
-
-
-
-
D10
158
182
I/O54(A)
I/O101(A)
76
77
118
110
D9
159
183
I/O59(B)
-
I/O100(A)
-
-
-
111
A14
160
184
-
-
I/O99(B)
-
-
-
-
-
-
185
161
186
162
187
163
188
AT6002
AT6003
AT6005
AT6010
M1
M1
M1
M1
-
-
-
I/O48(A)
I/O60(A)
-
(1)
-
-
-
VCC
-
-
-
-
PWR
-
-
-
I/O98(A)
-
-
-
-
A13
GND
(2)
-
-
-
GND
-
-
-
-
-
I/O58(A)
I/O53(A)
I/O97(A)
-
-
119
112
A11
164
189
I/O47(A)
I/O57(A)
I/O52(A)
I/O96(A)
77
78
120
113
A10
165
190
-
-
-
I/O95(B)
-
-
-
-
-
-
191
-
-
-
I/O94(A)
-
-
-
-
A9
166
192
I/O46(B)
I/O56(A)
I/O51(A)
I/O93(A)
-
-
121
114
B13
167
193
I/O45(A)
I/O55(A)
I/O50(A)
I/O92(A)
78
79
122
115
B12
168
194
-
-
-
I/O91(B)
-
-
-
-
-
-
195
-
-
-
I/O90(A)
-
-
-
-
B11
169
196
I/O44(B)
I/O54(B)
I/O49(A)
I/O89(A)
-
80
123
116
B10
170
197
I/O43(A)
I/O53(A)
I/O48(A)
I/O88(A)
79
81
124
117
B9
171
198
-
-
-
I/O87(B)
-
-
-
-
-
-
199
I/O42(B)
I/O52(B)
I/O47(A)
I/O86(A)
-
-
125
118
C12
172
200
I/O41(A)
I/O51(A)
I/O46(A)
I/O85(A)
80
82
126
119
C11
173
201
I/O40(B)
I/O50(B)
I/O45(A)
I/O84(A)
-
83
127
120
C10
174
202
-
-
-
I/O83(B)
-
-
-
-
-
175
203
I/O39(A)
I/O49(A)
I/O44(A)
I/O82(A)
81
84
128
121
C9
176
204
-
I/O48(B)
I/O43(A)
I/O81(A)
-
-
129
122
D8
177
205
178
206
(2)
GND
GND
GND
GND
82
85
130
123
GND
I/O38(A)
I/O47(A)
I/O42(A)
I/O80(A)
83
86
131
124
D7
179
207
-
-
-
I/O79(B)
-
-
-
-
-
180
208
-
I/O46(B)
-
I/O78(A)
-
-
-
125
D6
181
209
I/O37(A) or A16
I/O45(A) or A16
I/O41(A) or A16
I/O77(A) or A16
84
87
132
126
D5
182
210
CLOCK
CLOCK
CLOCK
CLOCK
1
88
1
127
E8
183
211
I/O36(B) or A15
I/O44(B) or A15
I/O40(A) or A15
I/O76(A) or A15
2
89
2
128
D4
184
212
-
-
-
I/O75(B)
-
-
-
-
-
185
213
I/O35(A) or A14
I/O43(A) or A14
I/O39(A) or A14
I/O74(A) or A14
3
90
3
129
C8
VCC
VCC
VCC
VDD
VCC
4
91
4
130
186
214
PWR
(1)
187
215
PWR
(1)
188
216
17
Pinout Assignment (Continued)
Top Side (Right to Left)
84
PLCC
100
VQFP
132
PQFP
144
TQFP
180
CPGA
208
PQFP
240
PQFP
I/O73(A) or A13
5
92
5
131
C5
189
217
I/O37(A)
I/O72(A)
-
-
6
132
C4
190
218
-
-
I/O71(B)
-
-
-
-
-
191
219
I/O32(A) or A12
I/O40(A) or A12
I/O36(A) or A12
I/O70(A) or A12
6
93
7
133
C3
192
220
I/O31(B)
I/O39(B)
I/O35(A)
I/O69(A)
-
94
8
134
B8
193
221
-
-
-
I/O68(A)
-
-
-
-
B7
194
222
-
-
-
I/O67(B)
-
-
-
-
-
-
223
I/O30(A) or A11
I/O38(A) or A11
I/O34(A) or A11
I/O66(A) or A11
7
95
9
135
B6
195
224
-
I/O37(B)
I/O33(A)
I/O65(A)
-
-
10
136
B5
196
225
-
-
-
I/O64(A)
-
-
-
-
B4
197
226
198
227
AT6002
AT6003
AT6005
AT6010
I/O34(A) or A13
I/O42(A) or A13
I/O38(A) or A13
I/O33(B)
I/O41(B)
-
GND
GND
GND
GND
-
-
11
137
-
-
-
I/O63(B)
-
-
-
-
-
-
228
I/O29(A) or A10
I/O36(A) or A10
I/O32(A) or A10
I/O62(A) or A10
8
96
12
138
B3
199
229
I/O28(B)
I/O35(B)
I/O31(A)
I/O61(A)
-
97
13
139
B2
200
230
-
-
-
I/O60(A)
-
-
-
-
A8
201
231
-
-
-
I/O59(B)
-
-
-
-
-
-
232
I/O27(A) or A9
I/O34(A) or A9
I/O30(A) or A9
I/O58(A) or A9
9
98
14
140
A7
202
233
I/O26(B)
I/O33(A)
I/O29(A)
I/O57(A)
-
-
15
141
A6
203
234
-
-
-
I/O56(A)
-
-
-
-
A5
204
235
-
-
-
I/O55(B)
-
-
-
-
-
-
236
-
I/O32(B)
-
I/O54(A)
-
-
-
142
A4
205
237
I/O25(A) or A8
I/O31(A) or A8
I/O28(A) or A8
I/O53(A) or A8
10
99
16
143
A3
206
238
-
-
-
I/O52(A)
-
-
-
-
A2
-207
239
M0
M0
M0
11
100
17
144
A1
208
240
M0
Notes:
18
1. PWR = Pins connected to power plane = F1, E4/E5, L2, R4, K15, L12, E14, A12.
2. GND = Pins connected to ground plane = L4, M4, N9, N10, E12, D12, C7, C6.
AT6000(LV) Series
GND
(2)
AT6000(LV) Series
AC Timing Characteristics – 5V Operation
Delays are based on fixed load. Loads for each type of device are described in the notes. Delays are in nanoseconds.
Worst case: VCC = 4.75V to 5.25V. Temperature = 0°C to 70°C.
Cell Function
Parameter
From
To
Load
Definition(7)
-1
-2
-4
Units
Wire(4)
tPD (max)(4)
A, B, L
A, B
1
0.8
1.2
1.8
ns
NAND
tPD (max)
A, B, L
B
1
1.6
2.2
3.2
ns
XOR
tPD (max)
A, B, L
A
1
1.8
2.4
4.0
ns
AND
tPD (max)
A, B, L
B
1
1.7
2.2
3.2
ns
A, B
A
1
1.7
2.3
4.0
ns
MUX
tPD (max)
L
A
1
2.1
3.0
4.9
ns
(5)
tsetup (min)
A, B, L
CLK
-
1.5
2.0
3.0
ns
(5)
D-Flip-flop
thold (min)
CLK
A, B, L
-
0
0
0
ns
D-Flip-flop
tPD (max)
CLK
A
1
1.5
2.0
3.0
ns
Bus Driver
tPD (max)
A
L
2
2.0
2.6
4.0
ns
L, E
E
3
1.3
1.6
2.3
ns
Repeater
tPD (max)
L, E
L
2
1.7
2.1
3.0
ns
D-Flip-flop
Column Clock
tPD (max)
GCLK, A, ES
CLK
3
1.8
2.4
3.0
ns
Column Reset
tPD (max)
GRES, A, EN
RES
3
1.8
2.4
3.0
ns
(5)
tPD (max)
CLOCK PIN
GCLK
-
1.6
2.0
2.9
ns
(5)
tPD (max)
RESET PIN
GRES
-
1.5
1.9
2.8
ns
tPD (max)
I/O
A
3
1.0
1.2
1.5
ns
tPD (max)
I/O
A
3
1.3
1.4
2.3
ns
tPD (max)
A
I/O PIN
4
3.3
3.5
6.0
ns
tPD (max)
A
I/O PIN
4
7.5
8.0
12.0
ns
tPXZ (max)
L
I/O PIN
4
3.1
3.3
5.5
ns
tPXZ (max)
L
I/O PIN
4
3.8
4.0
6.5
ns
tPXZ (max)
L
I/O PIN
4
8.2
8.5
12.5
ns
Clock Buffer
Reset Buffer
TTL Input(1)
(2)
CMOS Input
Fast Output
(3)
Slow Output
(3)
Output Disable(5)
(3)(5)
Fast Enable
Slow Enable
(3)(5)
Device
Cell Types
Cell(6)
Wire, XWire, Half-adder, Flip-flop
Bus
(6)
Wire, XWire, Half-adder, Flip-flop, Repeater
Column Clock
Notes:
1.
2.
3.
4.
5.
6.
7.
(6)
Column Clock Driver
Outputs
ICC (max)
A, B
4.5 µA/MHz
L
2.5 µA/MHz
CLK
40 µA/MHz
TTL buffer delays are measured from a VIH of 1.5V at the pad to the internal VIH at A. The input buffer load is constant.
CMOS buffer delays are measured from a VIH of 1/2 VCC at the apd to the internal VIH at A. The input buffer load is constant.
Buffer delay is to a pad voltage of 1.5V with one output switching.
Max specifications are the average of mas tPDLH and tPDHL.
Parameter based on characterization and simulation; not tested in production
Exact power calculation is available in an Atmel application note.
Load Definition: 1 = Load of one A or B input; 2 = Load of one L input; 3 = Constant Load; 4 = Tester Load of 50 pF.
= Preliminary Information
19
AC Timing Characteristics – 3.3V Operation
Delays are based on fixed load. Loads for each type of device are described in the notes. Delays are in nanoseconds.
Worst case: VCC = 3.0V to 3.6V. Temperature = 0°C to 70°C.
Cell Function
Parameter
To
Load
Definition(7)
-4
Units
A, B, L
A, B
1
1.8
ns
(4)
tPD (max)
NAND
tPD (max)
A, B, L
B
1
3.2
ns
XOR
tPD (max)
A, B, L
A
1
4.0
ns
AND
tPD (max)
A, B, L
B
1
3.2
ns
A, B
A
1
4.0
ns
MUX
tPD (max)
L
A
1
4.9
ns
tsetup (min)
A, B, L
CLK
-
3.0
ns
D-Flip-flop
thold (min)
CLK
A, B, L
-
0
ns
D-Flip-flop
tPD (max)
CLK
A
1
3.0
ns
Bus Driver
tPD (max)
A
L
2
4.0
ns
L, E
E
3
2.3
ns
Repeater
tPD (max)
L, E
L
2
3.0
ns
Wire
D-Flip-flop(5)
(5)
(4)
From
Column Clock
tPD (max)
GCLK, A, ES
CLK
3
3.0
ns
Column Reset
tPD (max)
GRES, A, EN
RES
3
3.0
ns
Clock Buffer(5)
tPD (max)
CLOCK PIN
GCLK
4
2.9
ns
Reset Buffer(5)
tPD (max)
RESET PIN
GRES
5
2.8
ns
tPD (max)
I/O
A
3
1.5
ns
CMOS Input
tPD (max)
I/O
A
3
2.3
ns
Fast Output(3)
tPD (max)
A
I/O PIN
6
6.0
ns
tPD (max)
A
I/O PIN
6
12.0
ns
tPXZ (max)
L
I/O PIN
6
5.5
ns
Fast Enable
tPXZ (max)
L
I/O PIN
6
6.5
ns
Slow Enable(3)(5)
tPXZ (max)
L
I/O PIN
6
12.5
ns
TTL Input
(1)
(2)
Slow Output
(3)
Output Disable
(5)
(3)(5)
Device
Cell Types
Cell
(6)
Wire, XWire, Half-adder, Flip-flop
Bus
(6)
Wire, XWire, Half-adder, Flip-flop, Repeater
Column Clock(6)
Notes:
20
1.
2.
3.
4.
5.
6.
7.
Column Clock Driver
Outputs
ICC (max)
A, B
2.3 µA/MHz
L
1.3 µA/MHz
CLK
20 µA/MHz
TTL buffer delays are measured from a VIH of 1.5V at the pad to the internal VIH at A. The input buffer load is constant.
CMOS buffer delays are measured from a VIH of 1/2 VCC at the apd to the internal VIH at A. The input buffer load is constant.
Buffer delay is to a pad voltage of 1.5V with one output switching.
Max specifications are the average of mas tPDLH and tPDHL.
Parameter based on characterization and simulation; not tested in production
Exact power calculation is available in an Atmel application note.
Load Definition: 1 = Load of one A or B input; 2 = Load of one L input; 3 = Constant Load; 4 = Load of 28 Clock Columns; 5
= Load of 28 Reset Columns; 6 = Tester Load of 50 pF.
AT6000(LV) Series
AT6000(LV) Series
Absolute Maximum Ratings*
*NOTICE:
Supply Voltage (VCC) ........................................-0.5V to + 7.0V
DC Input Voltage (VIN) ...............................-0.5V to VCC + 0.5V
DC Output Voltage (VON) ...........................-0.5V to VCC + 0.5V
Storage Temperature Range
(TSTG)........................................................... -65°C to +150°C
Power Dissipation (PD)............................................. 1500 mW
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. These are stress rating only
and functional operation of the device at these or
any other conditions beyond those listed under
operating conditions is not implied. Exposure to
Absolute Maximum Rating conditions for
extended periods of time may affect device reliability.
Lead Temperature (TL)
(Soldering, 10 sec.) ........................................................260°C
ESD (RZAP = 1.5K, CZAP = 100 pF)................................. 2000V
DC and AC Operating Rage – 5V Operation
Operating Temperature (Case)
VCC Power Supply
AT6002-2/4
AT6003-2/4
AT6005-2/4
AT6010-2/4
Commercial
AT6002-2/4
AT6003-2/4
AT6005-2/4
AT6010-2/4
Industrial
AT6002-2/4
AT6003-2/4
AT6005-2/4
AT6010-2/4
Military
0°C - 70°C
-40°C - 85°C
-55°C - 125°C
5V ± 5%
5V ± 10%
5V ± 10%
Input Voltage Level
(TTL)
High (VIHT)
2.0V - VCC
2.0V - VCC
2.0V - VCC
Low (VILT)
0V - 0.8V
0V - 0.8V
0V - 0.8V
Input Voltage Level
(CMOS)
High (VIHC)
70% - 100% VCC
70% - 100% VCC
70% - 100% VCC
Low (VILC)
0 - 30% VCC
0 - 30% VCC
0 - 30% VCC
50 ns (max)
50 ns (max)
50 ns (max)
Input Signal Transition Time (TIN)
DC and AC Operating Rage – 3.3V Operation
AT6002-2/4, AT6003-2/4
AT6005-2/4, AT6010-2/4
Commercial
Operating Temperature (Case)
0°C - 70°C
VCC Power Supply
3.3V ± 5%
Input Voltage Level
(TTL)
High (VIHT)
2.0V - VCC
Low (VILT)
0V - 0.8V
Input Voltage Level
(CMOS)
High (VIHC)
70% - 100% VCC
Low (VILC)
0 - 30% VCC
Input Signal Transition Time (TIN)
50 ns (max)
21
DC Characteristics – 5V Operation
Symbol
Parameter
Conditions
VIH
High-level Input Voltage
Commercial
VIL
Low-level Input Voltage
VOH
High-level Output Voltage
VOL
Low-level Output Voltage
Min
Max
Units
70% VCC
VCC
V
2.0
VCC
V
CMOS
0
30% VCC
V
TTL
0
0.8
V
CMOS
TTL
Commercial
Commercial
Commercial
IOH = -4 mA, VCC min
3.9
V
IOH = -16 mA, VCC min
3.0
V
IOL = 4 mA, VCC min
0.4
V
IOL = 16 mA, VCC min
0.5
V
10
µA
High-level Tristate
IOZH
Output Leakage Current
VO = VCC (max)
High-level Tristate
Without Pull-up, VO = VSS
-10
µA
Output Leakage Current
With Pull-up, VO = VSS
-500
µA
IIH
High-level Input Current
VIN = VCC (max)
IIL
Low-level Input Current
ICC
Power Consumption
Without Internal Oscillator (Standby)
500
µA
CIN
Input Capacitance
All Pins
10
pF
IOZL
22
10
µA
Without Pull-up, VIN = VSS
-10
µA
With Pull-up, VIN = VSS
-500
µA
AT6000(LV) Series
AT6000(LV) Series
DC Characteristics – 3.3V Operation
Symbol
Parameter
Conditions
VIH
High-level Input Voltage
Commercial
VIL
Low-level Input Voltage
VOH
High-level Output Voltage
VOL
Low-level Output Voltage
Min
Max
Units
70% VCC
VCC
V
2.0
VCC
V
CMOS
0
30% VCC
V
TTL
0
0.8
V
CMOS
TTL
Commercial
Commercial
Commercial
IOH = -2 mA, VCC min
2.4
V
IOH = -6 mA, VCC min
2.0
V
IOL = +2 mA, VCC min
0.4
V
IOL = +6 mA, VCC min
0.5
V
10
µA
High-level Tristate
IOZH
Output Leakage Current
VO = VCC (max)
High-level Tristate
Without Pull-up, VO = VSS
-10
µA
Output Leakage Current
With Pull-up, VO = VSS
-500
µA
IIH
High-level Input Current
VIN = VCC (max)
IIL
Low-level Input Current
ICC
Power Consumption
IOZL
CIN(1)
Note:
10
µA
Without Pull-up, VIN = VSS
-10
µA
With Pull-up, VIN = VSS
-500
µA
Without Internal Oscillator (Standby)
Input Capacitance
All Pins
1. Parameter based on characterization and simulation; it is not tested in production.
200
µA
10
pF
Device Timing: During Operation
23
Ordering Information – AT6002
Usable
Gates
Speed
Grade (ns)
6,000
2
6,000
4
Ordering Code
Package
AT6002-2AC
AT6002A-2AC
AT6002-2JC
AT6002-2QC
100A
144A
84J
132Q
5V Commercial
(0°C to 70°C)
AT6002-2AI
AT6002A-2AI
AT6002-2JI
AT6002-2QI
100A
144A
84J
132Q
5V Industrial
(-40°C to 85°C)
AT6002-4AC
AT6002A-4AC
AT6002-4JC
AT6002-4QC
100A
144A
84J
132Q
5V Commercial
(0°C to 70°C)
AT6002LV-4AC
AT6002ALV-4AC
AT6002LV-4JC
AT6002LV-4QC
100A
144A
84J
132Q
3.3V Commercial
(0°C to 70°C)
AT6002-4AI
AT6002A-4AI
AT6002-4JI
AT6002-4QI
100A
144A
84J
132Q
5V Industrial
(-40°C to 85°C)
Package Type
84J
84-lead, Plastic J-leaded Chip Carrier (PLCC)
100A
100-lead, Very Thin (1.0 mm) Plastic Gull-Wing Quad Flat Package (VQFP)
132Q
132-lead, Bumpered Plastic Gull-Wing Quad Flat Package (BQFP)
144A
144-lead, Thin (1.4 mm) Plastic Gull-Wing Quad Flat Package (TQFP)
208Q
208-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
240Q
240-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
24
AT6000(LV) Series
Operation Range
AT6000(LV) Series
Ordering Information – AT6003
Usable
Gates
Speed
Grade (ns)
9,000
2
9,000
4
Ordering Code
Package
Operation Range
AT6003-2AC
AT6003A-2AC
AT6003-2JC
AT6003-2QC
100A
144A
84J
132Q
5V Commercial
(0°C to 70°C)
AT6003-2AI
AT6003A-2AI
AT6003-2JI
AT6003-2QI
100A
144A
84J
132Q
Industrial
(-40°C to 85°C)
AT6003-4AC
AT6003A-4AC
AT6003-4JC
AT6003-4QC
100A
144A
84J
132Q
5V Commercial
(0°C to 70°C)
AT6003LV-4AC
AT6003ALV-4AC
AT6003LV-4JC
AT6003LV-4QC
100A
144A
84J
132Q
3.3V Commercial
(0°C to 70°C)
AT6003-4AI
AT6003A-4AI
AT6003-4JI
AT6003-4QI
100A
144A
84J
132Q
5V Industrial
(-40°C to 85°C)
Package Type
84J
84-lead, Plastic J-leaded Chip Carrier (PLCC)
100A
100-lead, Very Thin (1.0 mm) Plastic Gull-Wing Quad Flat Package (VQFP)
132Q
132-lead, Bumpered Plastic Gull-Wing Quad Flat Package (BQFP)
144A
144-lead, Thin (1.4 mm) Plastic Gull-Wing Quad Flat Package (TQFP)
208Q
208-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
240Q
240-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
25
Ordering Information – AT6005
Usable
Gates
Speed
Grade (ns)
15,000
2
15,000
4
Ordering Code
Package
AT6005-2AC
AT6005A-2AC
AT6005-2JC
AT6005-2QC
AT6005A-2QC
100A
144A
84J
132Q
208Q
5V Commercial
(0°C to 70°C)
AT6005-2AI
AT6005A-2AI
AT6005-2JI
AT6005-2QI
AT6005A-2QI
100A
144A
84J
132Q
208Q
Industrial
(-40°C to 85°C)
AT6005-4AC
AT6005A-4AC
AT6005-4JC
AT6005-4QC
AT6005A-4QC
100A
144A
84J
132Q
208Q
5V Commercial
(0°C to 70°C)
AT6005LV-4AC
AT6005ALV-4AC
AT6005LV-4JC
AT6005LV-4QC
AT6005ALV-4QC
100A
144A
84J
132Q
208Q
3.3V Commercial
(0°C to 70°C)
AT6005-4AI
AT6005A-4AI
AT6005-4JI
AT6005-4QI
AT6005A-4QI
100A
144A
84J
132Q
208Q
5V Commercial
(-40°C to 85°C)
Package Type
84J
84-lead, Plastic J-leaded Chip Carrier (PLCC)
100A
100-lead, Very Thin (1.0 mm) Plastic Gull-Wing Quad Flat Package (VQFP)
132Q
132-lead, Bumpered Plastic Gull-Wing Quad Flat Package (BQFP)
144A
144-lead, Thin (1.4 mm) Plastic Gull-Wing Quad Flat Package (TQFP)
208Q
208-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
240Q
240-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
26
AT6000(LV) Series
Operation Range
AT6000(LV) Series
Ordering Information – AT6010
Usable
Gates
Speed
Grade (ns)
30,000
2
30,000
4
Ordering Code
Package
Operation Range
AT6010-2JC
AT6010A-2AC
AT6010-2QC
AT6010A-2QC
AT6010H-2QC
84J
144A
132Q
208Q
240Q
5V Commercial
(0°C to 70°C)
AT6010-2JI
AT6010A-2AI
AT6010-2QI
AT6010A-2QI
AT6010H-2QI
84J
144A
132Q
208Q
240Q
Industrial
(-40°C to 85°C)
AT6010A-4AC
AT6010-4QC
AT6010-4JC
AT6010A-4QC
AT6010H-4QC
144A
132Q
84J
208Q
240Q
5V Commercial
(0°C to 70°C)
AT6010ALV-4AC
AT6010LV-4QC
AT6010LV-4JC
AT6010ALV-4QC
AT6010HLV-4QC
144A
132Q
84J
208Q
240Q
3.3V Commercial
(0°C to 70°C)
AT6010A-4AI
AT6010-4QI
AT6010-4JI
AT6010A-4QI
AT6010H-4QI
144A
132Q
84J
208Q
240Q
5V Industrial
(-40°C to 85°C)
Package Type
84J
84-lead, Plastic J-leaded Chip Carrier (PLCC)
100A
100-lead, Very Thin (1.0 mm) Plastic Gull-Wing Quad Flat Package (VQFP)
132Q
132-lead, Bumpered Plastic Gull-Wing Quad Flat Package (BQFP)
144A
144-lead, Thin (1.4 mm) Plastic Gull-Wing Quad Flat Package (TQFP)
208Q
208-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
240Q
240-lead, Plastic Gull-Wing Quad Flat Package (PQFP)
27
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© Atmel Corporation 1999.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
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are registered trademarks and trademarks of Atmel Corporation.
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0264F–10/99/xM