EPCOS B82442H1273K000

SMT inductors
SIMID series, SIMID 2220-H
Series/Type:
B82442H
Date:
March 2008
Data Sheet
 EPCOS AG 2008. Reproduction, publication and dissemination of this publication, enclosures
hereto and the information contained therein without EPCOS’ prior express consent is prohibited.
SMT inductors, SIMID series
B82442H
SIMID 2220-H
Size 2220 (EIA) or 5650 (IEC)
Rated inductance 1 µH to 10000 µH
Rated current 35 mA to 2500 mA
Construction
■ Upright ferrite drum core
■ Laser-welded winding
■ Flame-retardant molding
Features
■
■
■
■
■
Temperature range up to 150 °C
Current handling capability up to 2.5 A
High L values
Qualified to AEC-Q200
Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020C
■ RoHS-compatible
Applications
■
■
■
■
■
■
Filtering of supply voltages, coupling, decoupling
DC/DC converters
Automotive electronics
Telecommunications
Consumer electronics
Industrial electronics
Terminals
■ Base material CuSn6
■ Layer composition Cu, Ag, Sn (lead-free)1)
■ Electro-plated
Marking
■ Marking on component:
Manufacturer, L value (in nH),
tolerance of L value (coded), date of manufacture (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value, quantity, date of packing
Delivery mode and packing unit
■ 12-mm blister tape, wound on 330-mm ∅ reel
■ Packing unit: 1500 pcs./reel
1) Ni-barrier-plated terminals on request (B82442H*50).
Please read Cautions and warnings and
Important notes at the end of this document.
2
03/08
SMT inductors, SIMID series
B82442H
SIMID 2220-H
Dimensional drawing and layout recommendation
3.5±0.11)
A
0.7±0.2 1)
B
C
D
B
0.7 min.1)
5+0.3
0.15 max.
IND0053-6
5.6+0.3
A
B
C
D
4.5
2.0
4.0
8.0
5+0.3
Marking
1) Soldering area
Dimensions in mm
IND0088-3-E
Taping and packing
Reel
12±0.3
2±0.05
_0
12.4 +1.5
<_ 6.0
1.6±0.1
8±0.1
62±1.5
IND0350-S
Direction of unreeling
IND0564-H-E
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
13±0.2
_2
330 +0
1.5+0.1
<_ 7.2
Component
18.4 max.
5.5±0.1
4±0.1
1.75±0.1
Blister tape
3
03/08
SMT inductors, SIMID series
B82442H
SIMID 2220-H
Technical data and measuring conditions
Rated inductance LR
Measured with impedance analyzer Agilent 4294A
at frequency fL, 0.1 V, 20 °C
Q factor Qmin
Measured with impedance analyzer Agilent 4294A
at frequency fQ, 20 °C
Rated temperature TR
85 °C
Rated current IR
Maximum permissible DC with inductance decrease
L/L0 ≤ 10% and temperature increase
of ≤ 40 K at rated temperature
Self-resonance frequency fres,min
Measured with network analyzer Agilent 8753D, 20 °C
DC resistance Rmax
Measured at 20 °C
Solderability (lead-free)
Sn95.5Ag3.8Cu0.7: (245 ±5) °C, (5 ±0.3) s
Wetting of soldering area ≥ 90%
(based on IEC 60068-2-58)
Resistance to soldering heat
260 °C, 40 s (as referenced in JEDEC J-STD 020C)
Climatic category
55/150/56 (to IEC 60068-1)
Storage conditions
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, ≤ 75% RH
Weight
Approx. 0.4 g
Please read Cautions and warnings and
Important notes at the end of this document.
4
03/08
SMT inductors, SIMID series
B82442H
SIMID 2220-H
Characteristics and ordering codes
LR
Ordering code1)2)
f L; f Q
IR
Rmax
fres,min
MHz
mA
Ω
MHz
10
7.96
2500
0.024
95
B82442H1102K000
1.2
10
7.96
2350
0.028
70
B82442H1122K000
1.5
10
7.96
2200
0.032
55
B82442H1152K000
1.8
10
7.96
2000
0.040
47
B82442H1182K000
2.2
10
7.96
1800
0.048
42
B82442H1222K000
2.7
10
7.96
1700
0.056
37
B82442H1272K000
3.3
10
7.96
1550
0.064
34
B82442H1332K000
3.9
10
7.96
1450
0.072
32
B82442H1392K000
4.7
10
7.96
1350
0.088
29
B82442H1472K000
5.6
10
7.96
1250
0.104
26
B82442H1562K000
6.8
10
7.96
1130
0.120
24
B82442H1682K000
8.2
10
7.96
1050
0.144
22
B82442H1822K000
10
10
2.52
1000
0.168
19
B82442H1103K000
12
10
2.52
880
0.20
17
B82442H1123K000
15
10
2.52
810
0.24
16
B82442H1153K000
18
10
2.52
740
0.29
14
B82442H1183K000
22
10
2.52
670
0.35
13
B82442H1223K000
27
10
2.52
620
0.42
11.5
B82442H1273K000
10
2.52
560
0.50
10.5
B82442H1333+000
10
2.52
520
0.58
9.5
B82442H1393+000
47
10
2.52
480
0.68
8.5
B82442H1473+000
56
10
2.52
430
0.80
7.8
B82442H1563+000
68
10
2.52
400
0.96
7.0
B82442H1683+000
82
10
2.52
380
1.12
6.4
B82442H1823+000
100
20
0.796
350
1.28
6.0
B82442H1104+000
120
20
0.796
320
1.52
5.4
B82442H1124+000
150
20
0.796
290
1.76
4.8
B82442H1154+000
Tolerance
Qmin
µH
1.0
±10%
33
±5%
39
±10%
^
^
K
J
^
K
Closer tolerances on request.
Higher currents possible at temperatures <TR on request.
Sample kit available. Ordering code: B82442X001
For more information refer to chapter “Sample kits”.
1) Replace the + by the code letter for the required inductance tolerance.
2) For Ni-barrier-plated terminals replace the last two digits “00” by “50”.
Please read Cautions and warnings and
Important notes at the end of this document.
5
03/08
SMT inductors, SIMID series
B82442H
SIMID 2220-H
Characteristics and ordering code
LR
Ordering code1)2)
f L; f Q
IR
Rmax
fres,min
MHz
mA
Ω
MHz
20
0.796
270
2.24
4.4
B82442H1184+000
20
0.796
240
2.72
3.9
B82442H1224+000
270
20
0.796
220
3.36
3.6
B82442H1274+000
330
20
0.796
200
3.92
3.2
B82442H1334+000
390
20
0.796
180
4.64
2.9
B82442H1394+000
470
20
0.796
170
5.60
2.6
B82442H1474+000
560
20
0.796
150
6.80
2.4
B82442H1564+000
680
20
0.796
140
8.00
2.2
B82442H1684+000
820
20
0.796
130
10.4
2.0
B82442H1824+000
1000
30
0.252
120
12.0
1.8
B82442H1105+000
1200
30
0.252
105
13.6
1.5
B82442H1125+000
1500
30
0.252
100
16.0
1.4
B82442H1155+000
1800
30
0.252
85
24.0
1.3
B82442H1185+000
2200
30
0.252
75
28.0
1.2
B82442H1225+000
2700
30
0.252
65
44.0
1.1
B82442H1275+000
3300
30
0.252
55
48.0
1.0
B82442H1335+000
3900
30
0.252
53
56.0
1.0
B82442H1395+000
4700
30
0.252
50
62.4
0.9
B82442H1475+000
5600
30
0.252
46
68.0
0.8
B82442H1565+000
6800
30
0.252
42
88.0
0.7
B82442H1685+000
8200
30
0.252
39
100
0.6
B82442H1825+000
10000
30
0.0796
35
120
0.5
B82442H1106+000
Tolerance
Qmin
µH
180
±5%
220
±10%
^
J
^
K
Closer tolerances on request.
Higher currents possible at temperatures <TR on request.
Sample kit available. Ordering code: B82442X001
For more information refer to chapter “Sample kits”.
1) Replace the + by the code letter for the required inductance tolerance.
2) For Ni-barrier-plated terminals replace the last two digits “00” by “50”.
Please read Cautions and warnings and
Important notes at the end of this document.
6
03/08
SMT inductors, SIMID series
B82442H
SIMID 2220-H
Impedance |Z| versus frequency f
measured with impedance analyzer Agilent
4191A/A4194A, typical values at 20 °C
Inductance L versus DC load current IDC
measured with LCR meter Agilent 4275A,
typical values at 20 °C
IND0094-8
10 6
Ω
B82442H
L
| Z | 10 5
10 3
10 3
10 2
10 2
10 1
1 µH
10 µH
100 µH
1000 µH
10000 µH
10 0 5
10
10
6
10
7
10
B82442H
10000 µH
10 4
10 4
10 1
IND0095-W
10 5
µH
1000 µH
100 µH
10 µH
1 µH
10 0
8
Hz 10
f
10
9
10
_2
10
_1
10 0
A 10 1
I DC
Current derating Iop/IR
versus ambient temperature TA
(rated temperature TR = 85 °C)
Q factor versus frequency f
measured with impedance analyzer
Agilent 4191A, typical values at 20 °C
IND0096-9
80
_1
IND0097-H-E
1.2
B82442H
Iop
IR
Q
B82442H
1.0
60
0.8
40
0.6
0.4
20
0
10 4
1 µH
10 µH
100 µH
1000 µH
10000 µH
10 5
0.2
10 6
10 7
0
Hz 10 8
f
7
0
03/08
20
40
60
80 100 120
C 160
TA
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
8
03/08
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with
them than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very
high level of operational safety and especially in customer applications in which the malfunction
or failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of
the customer application or other action taken by the customer (e.g. installation of protective
circuitry or redundancy) that no injury or damage is sustained by third parties in the event of
malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue,
MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are
trademarks registered or pending in Europe and in other countries. Further information will be
found on the Internet at www.epcos.com/trademarks.
9
03/09