ADVANCED INFORMATION SMAJ530 AND SMAJ550 SURFACE MOUNT TRANSZORB™ TRANSIENT VOLTAGE SUPPRESSOR Steady State Power - 1Watt Reverse Voltage - 530, 550 Volts FEATURES DO-214AC 0.065 (1.65) 0.110 (2.79) 0.100 (2.54) 0.049 (1.25) ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Protects TOPSwitch ♦ Glass Passivated Junction ♦ High temperature soldering guaranteed: 250°C/10 seconds at terminals ♦ Exellent Clamping capability ♦ Available in unidirectional only 0.177 (4.50) 0.157 (3.99) 0.012 (0.305) 0.006 (0.152) 0.090 (2.29) 0.078 (1.98) 0.060 (1.52) 0.008 (0.203) MAX. 0.030 (0.76) 0.208 (5.28) 0.194 (4.93) MECHANICAL DATA Case: JEDEC DO-214AC molded plastic body over passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: The color band denotes the cathode, which is positive with respect to the anode under normal TVS operation Mounting Position: Any Weight: 0.002 ounces, 0.064 gram Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS Device marking code SMAJ530 SMAJ550 HD SB UNITS Steady state power dissipation (NOTE 3) PM(AV) 1.0 Watts Peak pulse power dissipation (NOTE 1,2,5, FIG.1) PPPM Minimum 300 Watts Minimum breakdown voltage at 100µA V(BR) Maximum clamping voltage at 300mA, 10/1000 µs-waveform Stand-off voltage 530 Vc VWM 550 660 477 Volts Volts 495 Volts ID 5.0 µA Typical thermal resistance RΘJL 27 °C/W Typical thermal resistance RΘJA 75 °C/W 650 mV°C CJ 75 45 pF TJ, TSTG -55 to +150 °C Maximum DC reverse leakage current at VWM Typical temperature coefficient of V(BR) Typical capacitance (NOTE 4) at 0V at 200V Operating junction and storage temperature range NOTES: (1) Non-repetitive current pulse, per Fig.3 and derated above 25°C per - Fig. 2 (2) Mounted on 5.0mm2 copper pads to each terminal (3) Lead temperature at 75°C=TL per Fig. 5 (4) Measured at 1MHz (5) Peak pulse power waveform is 10/100µS 1/4/99 MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMAJ530 AND SMAJ550 FIG. 1 - PEAK PULSE POWER RATING CURVE PPPM, PEAK PULSE POWER, kW NON-REPETITIVE PULSE WAVEFORM SHOWN in FIG. 3 TA=25°C 10 1.0 0.1 0.1µs 100µs 10µs 1.0µs 1.0ms 10ms td, PULSE WIDTH, sec. FIG. 3 - PULSE WAVEFORM PEAK PULSE POWER (Ppp) or CURRENT (IPPM) DERATING IN PERCENTAGE, % FIG. 2 - PULSE DERATING CURVE 100 100 75 50 25 0 0 25 IPPM, PEAK PULSE CURRENT, % 150 75 100 125 150 175 TA, AMBIENT TEMPERATURE, °C PULSE WIDTH (td) is DEFINED as the POINT WHERE the PEAK CURRENT DECAYS to 50% of IPPM tr=10µsec. 50 PEAK VALUE IPPM 100 10,000 HALF VALUE - IPPM 2 50 10/1000µsec. WAVEFORM as DEFINED by R.E.A. 1,000 td 0 2.0 1.0 0 3.0 4.0 t, TIME, ms APPLICATION NOTES RECOMMENDED PAD LAYOUT The pad dimensions should be 0.010” (2.5mm) longer than the contact size in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods. MODIFIED J-BEND 0.060 MIN (1.52 MIN) 0.094 MAX (2.38 MAX) • Respect Thermal Resistance (PCB Layout) - as the temperature coefficient also contributes to the clamping voltage. • Select minimum breakdown voltage, so you get acceptable power dissipation and PCB tie point temperature. Devices with higher breakdown voltage will have a shorter conduction time and will dissipate less power. • Clamping voltage is influenced by internal resistance - design approximation is 7V per 100mA slope. • Keep temperature of TVS lower than TOPSwitch as a recommendation. • Maximum current is determined by the maximum TJ and can be higher than 300mA. Contact supplier for different clamping voltage / current arrangements. 0.050 MIN (1.27 MIN) 0.220 REF (5.58) Dimensions in inches and (millimeters) • Minimum breakdown voltage can be customized for other applications. Contact supplier.