Order this document by MBRB2545CT/D SEMICONDUCTOR TECHNICAL DATA D2PAK Surface Mount Power Package Motorola Preferred Device The D2PAK Power Rectifier employs the Schottky Barrier principle with a platinum barrier metal. These state–of–the–art devices have the following features: • • • • • • • • SCHOTTKY BARRIER RECTIFIER 30 AMPERES 45 VOLTS Center–Tap Configuration Guardring for Stress Protection Low Forward Voltage 150°C Operating Junction Temperature Epoxy Meets UL94, VO at 1/8″ Guaranteed Reverse Avalanche Short Heat Sink Tab Manufactured — Not Sheared! Similar in Size to the Industry Standard TO–220 Package 4 1 Mechanical Characteristics • Case: Epoxy, Molded • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4” suffix to the part number • Marking: B2545T 4 1 3 3 CASE 418B–02 D2PAK MAXIMUM RATINGS (PER LEG) Rating Symbol Value Unit VRRM VRWM VR 45 Volts IF(AV) 15 30 Amps Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 130°C IFRM 30 Amps Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 1.0 Amp Tstg – 65 to +175 °C Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR) TC = 130°C Total Device Storage Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR) TJ – 65 to +150 °C dv/dt 10000 V/µs RθJC RθJA 1.5 50 °C/W THERMAL CHARACTERISTICS (PER LEG) Thermal Resistance — Junction to Case — Junction to Ambient (1) (1) When mounted using minimum recommended pad size on FR–4 board. Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Designer’s and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev 2 Device Rectifier Motorola, Inc. 1996 Data 1 MBRB2545CT ELECTRICAL CHARACTERISTICS (PER LEG) Rating Symbol Value Unit Maximum Instantaneous Forward Voltage (2) (iF = 30 Amps, TJ = 125°C) (iF = 30 Amps, TJ = 25°C) vF 0.73 0.82 Volts Maximum Instantaneous Reverse Current (2) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) iR 40 0.2 mA I R , REVERSE LEAKAGE CURRENT (mA) 100 70 50 TJ = 125°C 30 20 100°C 25°C 10 7 5 3 2 1 0 0.2 0.4 0.6 0.8 1.0 24 20 (CAPACITIVE LOADS) DC 5 10 IPK = 20 IAV 4 0 0 4 8 12 16 20 24 28 32 IF, AVERAGE FORWARD CURRENT (AMPS) 36 Figure 3. Typical Forward Power Dissipation 2 75°C 25°C 0 10 20 30 40 Figure 2. Typical Reverse Current, Per Leg IPK =π (RESISTIVE LOAD) IAV 8 100°C Figure 1. Typical Forward Voltage, Per Leg TJ = 125°C 12 125°C VR, REVERSE VOLTAGE (VOLTS) SQUARE WAVE 16 0.04 0.02 0.01 0.004 0.002 TJ = 150°C vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 32 28 200 100 40 20 10 4 2 1 0.4 0.2 0.1 IF(AV), AVERAGE FORWARD CURRENT (AMPS) PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%. 40 50 32 28 DC 24 20 SQUARE WAVE 16 12 8 RATED VOLTAGE APPLIED RθJC = 1.5°C/W 4 0 110 120 130 140 TC, CASE TEMPERATURE (°C) 150 Figure 4. Current Derating, Case Rectifier Device Data MBRB2545CT INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.74 18.79 0.065 1.651 0.420 10.66 0.07 1.78 0.330 8.38 0.14 3.56 inches mm D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.5 watts. PD = 150°C – 25°C = 2.5 watts 50°C/W The 50°C/W for the D2PAK package assumes the recommended drain pad area of 158K mil2 on FR–4 glass epoxy printed circuit board to achieve a power dissipation of 2.5 watts using the footprint shown. Another alternative is to use a ceramic substrate or an aluminum core board such as Thermal Clad. By using an aluminum core board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. GENERAL SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 5 seconds. Rectifier Device Data • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * Due to shadowing and the inability to set the wave height to incorporate other surface mount components, the D2PAK is not recommended for wave soldering. 3 MBRB2545CT RECOMMENDED PROFILE FOR REFLOW SOLDERING the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 –189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 5 shows a typical heating profile for use when soldering the D2PAK to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on STEP 1 PREHEAT ZONE 1 “RAMP” STEP 2 STEP 3 VENT HEATING “SOAK” ZONES 2 & 5 “RAMP” STEP 4 HEATING ZONES 3 & 6 “SOAK” 200°C DESIRED CURVE FOR HIGH MASS ASSEMBLIES STEP 5 HEATING ZONES 4 & 7 “SPIKE” STEP 6 VENT STEP 7 COOLING 205° TO 219°C PEAK AT SOLDER JOINT 170°C 160°C 150°C 150°C 140°C 100°C 100°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 5. Typical Solder Heating Profile for D2PAK 4 Rectifier Device Data MBRB2545CT PACKAGE DIMENSIONS C E V B 4 A 1 2 3 S –T– SEATING PLANE K J G D 3 PL 0.13 (0.005) H M T CASE 418B–02 ISSUE B Rectifier Device Data NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E G H J K S V INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 14.60 15.88 1.14 1.40 ANODE CATHODE ANODE CATHODE 5 MBRB2545CT Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 6 ◊ CODELINE TO BE PLACED HERE Rectifier Device Data MBRB2545CT/D