ETC 74HC1G126GW/T1

INTEGRATED CIRCUITS
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
Product specification
File under Integrated Circuits, IC06
1997 Nov 24
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
FEATURES
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 6.0 ns
• Wide operating voltage :
2.0 to 6.0 V
TYPICAL
• Symmetrical output impedance
SYMBOL
• High noise immunity
• Low power dissipation
• Balanced propagation delays
• Very small 5 pins package
tPHL/ tPLH
input
capacitance
CPD
power
dissipation
capacitance
The bus driver output currents are
equal compared to the
74HC/HCT126.
FUNCTION TABLE
INPUTS
UNIT
HC1G
HCT1G
9
10
ns
1.5
1.5
pF
30
27
pF
notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
∑ (CL × VCC2 × fo) = sum of outputs.
2. For HC1G the condition is VI = GND to VCC.
For HCT1G the condition is VI = GND to VCC − 1.5 V.
PIN DESCRIPTION
OUTPUT
OE
inA
outY
H
L
L
H
H
H
L
X
Z
PIN NO.
SYMBOL
NAME AND FUNCTION
1, 2
OE, inA
output enable input, data input
3
GND
ground (0 V)
4
outY
data output
5
VCC
positive supply voltage
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance OFF state
1997 Nov 24
CONDITIONS
CL = 15 pF
VCC = 5 V
inA to outY
DESCRIPTION
The 74HC1G/HCT1G126 provides
one non-inverting buffer/line driver
with 3-state output. The 3-state output
is controlled by the output enable
input (OE). A LOW at OE causes the
output as assume a high impedance
OFF-state.
propagation
delay
CI
• Output capability : bus driver
The 74HC1G/HCT1G126 is a
highspeed Si-gate CMOS device.
PARAMETER
2
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
ORDERING AND PACKAGE INFORMATION
PACKAGES
OUTSIDE
NORTH
AMERICA
NORTH
AMERICA
TEMPERATURE
RANGE
74HC1G126GW
−40 °C to +125 °C
74HCT1G126GW
OE 1
inA 2
PACKAGE MATERIAL
plastic
SOT353
HN
5
SC88A
plastic
SOT353
TN
4 outY
Pin configuration.
2
inA
1
OE
outY
Fig.2
outY
4
OE
Fig.3
1997 Nov 24
OE
IEC logic symbol.
Fig.4
3
4
Logic symbol.
inA
1
MARKING
SC88A
126
2
CODE
5
5 VCC
GND 3
Fig.1
PINS
Logic diagram.
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
RECOMMENDED OPERATING CONDITIONS
74HC1G
SYMBOL
74HCT1G
PARAMETER
UNIT
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
2.0
5.0
6.0
4.5
5.0
5.5
V
VCC
DC supply voltage
VI
input voltage
0
−
VCC
0
−
VCC
V
VO
output voltage
0
−
VCC
0
−
VCC
V
Tamb
operating ambient
temperature range
−40
25
+125
−40
25
+125
°C
−
−
1000
−
−
−
−
−
500
−
−
500
−
−
400
−
−
−
tr,tf
input rise and fall times
except for
Schmitt-trigger inputs
CONDIITIONS
see DC and AC
characteristics per
device
VCC = 2.0 V
ns
VCC = 4.5 V
VCC = 6.0 V
ABSOLUTE MAXIMUM RATINGS
Limiting values is accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0 V)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
VCC
DC supply voltage
−0.5
+7.0
±IIK
DC input diode current
VI < - 0.5 or VI > VCC + 0.5 V
−
20
mA
±IOK
DCoutput diode current
VO < - 0.5 or VO > VCC + 0.5 V
−
20
mA
±IO
DC output source or sink
current bus driver outputs
− 0.5V < VO < VCC + 0.5 V
−
35.0
mA
±ICC
DC VCC or GND current for
types with bus driver outputs
−
70
mA
Tstg
storage temperature range
−65
+150
°C
−
200
mW
PD
power dissipation per package for temperature range: − 40 to + 125 °C
5 pins plastic SC88A
above +55 °C derate linearly with 2.5 mW/K
Notes
1. Stresses beyond those listed may cause permanent damage to the device. These are stress rating only and
functional operation of the device at these or any other conditions beyond those under ‘recommended operating
conditions’ is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1997 Nov 24
4
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
DC CHARACTERISTICS FOR THE 74HC1G
Over recommended operating conditions.
Voltage are referenced to GND (ground = 0 V)
Tamb (°C)
SYMBOL
VIH
VIL
VOH
VOH
−40 to +85
PARAMETER
HIGH level input voltage
LOW level input voltage
HIGH level output
voltage; all outputs
HIGH level output
voltage; Bus driver
outputs
TEST CONDITIONS
−40 to +125
MIN.
TYP.(1)
MAX.
MIN.
MAX.
UNIT
VCC (V)
OTHER
1.5
1.2
−
1.5
−
3.15
2.4
−
3.15
−
4.2
3.2
−
4.2
−
−
0.8
0.5
−
0.5
−
2.1
1.35
−
1.35
−
2.8
1.8
−
1.8
1.9
2.0
−
1.9
−
4.4
4.5
−
4.4
−
5.9
6.0
−
5.9
−
6.0
3.84
4.32
−
3.7
−
4.5
VI = VIH or VIL,
−IO = 6.0 mA
VI = VIH or VIL,
−IO = 7.8 mA
2.0
V
4.5
6.0
2.0
V
4.5
6.0
2.0
V
4.5
V
VI = VIH or VIL,
−IO = 20 µA
5.34
5.81
−
5.2
−
6.0
−
0
0.1
−
0.1
2.0
−
0
0.1
−
0.1
−
0
0.1
−
0.1
6.0
LOW level output
voltage; Bus driver
outputs
−
0.15
0.33
−
0.4
4.5
VI = VIH or VIL,
IO = 6.0 mA
−
0.16
0.33
−
0.4
6.0
VI = VIH or VIL,
IO = 7.8 mA
input leakage current
−
−
1.0
−
1.0
µA
6.0
VI = VCC or GND
IOZ
3-state output
OFF-state current
−
−
5
−
10
µA
6.0
VI = VIH or VIL,
VO = VCC or GND
ICC
Quiescent supply
current
−
−
10
−
20
µA
6.0
VI = VCC or GND,
IO = 0
VOL
VOL
II
LOW level output
voltage; all outputs
4.5
V
Note
1. All typical values are measured at Tamb = 25 °C.
1997 Nov 24
V
5
VI = VIH or VIL,
IO = 20 µA
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
DC CHARACTERISTICS FOR THE 74HCT1G
Over recommended operating conditions.
Voltage are referenced to GND (ground = 0 V.)
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
TEST CONDITIONS
−40 to +125
MIN.
TYP.(1)
MAX.
MIN.
MAX.
UNIT
VCC (V)
OTHER
VIH
HIGH level input
voltage
2.0
1.6
−
2.0
−
V
4.5 to 5.5
VIL
LOW level input
voltage
−
1.2
0.8
−
0.8
V
4.5 to 5.5
VOH
HIGH level output
voltage; all outputs
4.4
4.5
−
4.4
−
V
4.5
VI = VIH or VIL,
−IO = 20 µA
VOH
HIGH level output
voltage; Bus driver
outputs
3.84
4.32
−
3.7
−
V
4.5
VI = VIH or VIL,
−IO = 6.0 mA
VOL
LOW level output
voltage; all outputs
−
0
0.1
−
0.1
V
4.5
VI = VIH or VIL,
IO = 20 µA
VOL
LOW level output
voltage; Bus driver
outputs
−
0.16
0.33
−
0.4
V
4.5
VI = VIH or VIL,
IO = 6.0 mA
input leakage current
−
−
1.0
−
1.0
µA
5.5
VI = VCC or GND
IOZ
3-state output
OFF-state current
−
−
5
−
10
µA
5.5
VI = VIH or VIL,
VO = VCC or GND
ICC
Quiescent supply
current
−
−
10
−
20
µA
5.5
VI = VCC or GND,
IO = 0
∆ICC
Additional supply
current per input
−
−
500
−
850
µA
4.5 to 5.5
II
Note
1. All typical values are measured at Tamb = 25 °C.
1997 Nov 24
6
VI = VCC − 2.1,
IO = 0
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
AC CHARACTERISTICS FOR 74HC1G126
GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
MIN. TYP.(1)
tPHL/tPLH
tPZH/tPZL
tPHZ/tPLZ
propagation delay
inA to outY
3-state output
enable time
OE to outY
3-state output
disable time
OE to outY
TEST CONDITIONS
−40 to +125
MAX.
MIN.
MAX.
−
24
125
−
150
−
10
25
−
30
−
9
21
−
26
−
24
155
−
190
−
10
31
−
38
−
8
26
−
32
−
16
155
−
190
−
12
31
−
38
−
11
26
−
32
UNIT
VCC (V)
WAVEFORMS
2.0
ns
4.5
see Fig.5 and Fig.7
6.0
2.0
ns
4.5
see Fig.6 and Fig.7
6.0
2.0
ns
4.5
see Fig.6 and Fig.7
6.0
Note
1. All typical values are measured at Tamb = 25 °C.
AC CHARACTERISTICS FOR 74HCT1G126
GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF
Tamb (°C)
SYMBOL
−40 to +85
PARAMETER
TEST CONDITIONS
−40 to +125
MIN.
TYP.(1)
MAX.
MIN.
MAX.
UNIT
VCC(V)
WAVEFORMS
tPHL/tPLH
propagation delay
inA to outY
−
11
30
−
36
ns
4.5
see Fig.5 and Fig.7
tPZH/tPZL
3-state output
enable time
OE to outY
−
10
35
−
42
ns
4.5
see Fig.6 and Fig.7
tPHZ/tPLZ
3-state output
disable time
OE to outY
−
12
31
−
38
ns
4.5
see Fig.6 and Fig.7
Note
1. All typical values are measured at Tamb = 25 °C.
1997 Nov 24
7
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
AC WAVEFORMS
VI
inA INPUT
GND
VM(1)
tPLZ
tPZL
VCC
GND
tPHL
outY OUTPUT
VM(1)
OE INPUT
VI
OUTPUT
LOW-to-OFF
OFF-to-LOW
tPLH
VM(1)
10%
tPZH
tPHZ
VM(1)
90%
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
VM(1)
GND
output
disabled
output
enabled
(1) HC1G VM = 50 %; VI = GND to VCC
HCT1G VM = 1.3 V; VI = GND to 3.0 V
Fig.5
(1) HC1G VM = 50 %; VI = GND to VCC
HCT1G VM = 1.3 V; VI = GND to 3.0 V
The input (inA) to output (outY) propagation
delays.
Fig.6
The 3-state enable and disable times.
VCC
PULSE
GENERATOR
VI
RL = 1 kΩ
VO
D.U.T.
CL
RT
Test
CL = Load capacitance including jig and probe capacitance
(See AC Characteristics for values).
RL = Load resistance.(See AC Characteristics for values).
RT = Termination resistance should be equal to the output
impedance Zo of the pulse generator.
1997 Nov 24
Load circuitry for switching times.
8
S1
VCC
Open
50 pF
Definitions for test circuit ;
Fig.7
output
enabled
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
Open
VCC
GND
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
PACKAGE OUTLINES
1997 Nov 24
9
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1997 Nov 24
10
Philips Semiconductors
Product specification
74HC1G126
74HCT1G126
Bus buffer/line driver; 3-state
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Nov 24
11
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SCA55
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Printed in The Netherlands
budgetnum/printrun/ed/pp12
Date of release: 1997 Nov 24
Document order number:
9397 nnn nnnnn