AD AD9779A

Circuit Note
CN-0019
Circuit Designs Using Analog Devices Products
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Devices Connected/Referenced
AD9779A
Dual 16-Bit, 1 GSPS DAC
ADL5373
2300 MHz to 3000 MHz I/Q Modulator
Interfacing the ADL5373 I/Q Modulator to the AD9779A
Dual-Channel, 1 GSPS High Speed DAC
CIRCUIT FUNCTION AND BENEFITS
CIRCUIT DESCRIPTION
This circuit provides a simple, elegant interface between the
ADL5373 I/Q modulator and the AD9779A high speed DAC.
The ADL5373 and the AD9779A are well-matched devices
because they have the same bias levels and similarly high
signal-to-noise ratios (SNR). The matched bias levels of 500 mV
allow for a “glueless” interface—there is no requirement for a
level shifting network that would add noise and insertion loss
along with extra components. The addition of the swinglimiting resistors (RSLI, RSLQ) allows the DAC swing to be
scaled appropriately without loss of resolution or of the 0.5 V
bias level. The high SNR of each device preserves a high SNR
through the circuit.
The ADL5373 is designed to interface with minimal
components to members of Analog Devices family of
TxDAC® converters (AD97xx). The baseband inputs of the
ADL5373 require a dc common-mode bias voltage of 500 mV.
With each AD9779A output swinging from 0 mA to 20 mA, a
single 50 Ω resistor to ground from each of the DAC outputs
provides the desired 500 mV dc bias. With just the four 50 Ω
resistors in place, the voltage swing on each pin is 1 V p-p.
This results in a differential voltage swing of 2 V p-p on each
input pair.
By adding resistors RSLI and RSLQ to the interface, the output
swing of the DAC can be reduced without any loss of DAC
resolution. The resistor is placed as a shunt between each side of
AD9779A
ADL5373
93
19
OUT1_P
92
RBIN
50Ω
RSLI
100Ω
20
OUT1_N
84
23
OUT2_N
OUT2_P
RBQN
50Ω
RBQP
50Ω
83
IBBP
IBBN
QBBN
RSLQ
100Ω
24
QBBP
08222-001
RBIP
50Ω
Figure 1. Interface Between the AD9779A and ADL5373 with 50 Ω Resistors to Ground to Establish the
500 mV DC Bias for the ADL5373 Baseband Inputs (Simplified Schematic)
Rev. A
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CN-0019
Circuit Note
A simulated filter example is shown in Figure 3 with a thirdorder elliptical filter with a 3 dB frequency of 10 MHz.
Matching input and output impedances makes the filter design
easier, so the shunt resistor chosen is 100 Ω, producing an ac
swing of 1 V p-p differential for a 0 mA to 20 mA DAC fullscale output current. The simulated frequency response of this
filter is shown in Figure 4. In a practical application, the use of
standard value components along with the input impedance of
the I/Q modulator (2900 kΩ in parallel with a few picofarads of
input capacitance), will slightly change the frequency response.
2.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
All the power supply pins of the ADL5373 must be connected to
the same 5 V source. Adjacent pins of the same name can be
tied together and decoupled to a large area ground plane with a
0.1 μF capacitor. These capacitors should be located as close as
possible to the device. The power supply can range between
4.75 V and 5.25 V.
100
1k
10k
RL (Ω)
Figure 2. Relationship Between the AC Swing-Limiting Resistor and the
Peak-to-Peak Voltage Swing with 50 Ω Bias-Setting Resistors
the differential pair, as shown in Figure 1. It has the effect of
reducing the ac swing without changing the dc bias already
established by the 50 Ω resistors and the DAC output current.
The value of this ac swing-limiting resistor is chosen based on
the desired ac voltage swing. Figure 2 shows the relationship
between the swing-limiting resistor and the peak-to-peak ac
swing that it produces when 50 Ω bias-setting resistors are used.
Note that all Analog Devices I/Q modulators present a relatively
high input impedance on their baseband inputs (typically >1 kΩ).
As a result, the input impedance of the I/Q modulator will have
no effect on the scaling of the DAC output signal.
It is generally necessary to low-pass filter the DAC outputs to
remove image frequencies when driving a modulator. The
above interface lends itself well to the introduction of such a
filter. The filter can be inserted between the dc bias setting
resistors and the ac swing-limiting resistor. Doing so establishes
the input and output impedances for the filter.
The COM1 pin, COM2 pin, COM3 pin, and COM4 pin should
be tied to the same ground plane through low impedance paths.
The exposed paddle on the underside of the package should
also be soldered to a low thermal and electrical impedance
ground plane. If the ground plane spans multiple layers on the
circuit board, they should be stitched together with nine vias
under the exposed paddle. The AN-772 application note
discusses the thermal and electrical grounding of the
LFCSP_VQ in greater detail.
COMMON VARIATIONS
The interface described here can be used to interface
any TxDAC converter with ground referenced 0 mA to 20 mA
output currents to any I/Q modulator with a 0.5 V input bias
level. For zero-IF applications, the AD9783 dual DAC provides
an LVDS interface, while the CMOS-driven AD9788 dual DAC
can generate a fine resolution complex IF input to the I/Q
modulator. The ADL5370/ADL5371/ADL5372/ADL5373/
0
19
OUT1_P
RBIP
50Ω
RBIN
92 50Ω
53.62nF
C1I
350.1pF
C2I
RSLI
100Ω
20
OUT1_N
LNI
771.1nH
LNQ
771.1nH
84
23
OUT2_N
RBQN
50Ω
RBQP
83 50Ω
53.62nF
C1Q
350.1pF
C2Q
LPQ
771.1nH
IBBN
30
–20
24
GROUP DELAY
–30
18
–40
12
–50
6
QBBN
RSLQ
100Ω
24
OUT2_P
MAGNITUDE
–10
IBBP
MAGNITUDE (dB)
93
36
ADL5373
LPI
771.1nH
QBBP
08222-003
AD9779A
GROUP DELAY (ns)
0
10
08222-002
0.2
–60
1
10
FREQUENCY (MHz)
Figure 3. DAC Modulator Interface with 3 MHz Third-Order, Low-Pass Filter
(Calculated Component Values)
0
100
08222-004
DIFFERENTIAL SWING (V p-p)
1.8
Figure 4. Simulated Frequency Response for DAC Modulator Interface with
10 MHz Third-Order Bessel Filter
Rev. A | Page 2 of 3
Circuit Note
CN-0019
ADL5374 family of I/Q modulators provides narrow-band
operation with high output 1 dB compression point and OIP3,
whereas the ADL5375 provides broadband high performance
operation from 400 MHz to 6 GHz. The ADL5385 I/Q modulator uses a 2 × LO and operates from 50 MHz to 2.2 GHz.
LEARN MORE
AN-772 Application Note, A Design and Manufacturing Guide
for the Lead Frame Chip Scale Package (LFCSP). Analog
Devices.
MT-016 Tutorial, Basic DAC Architectures III: Segmented DACs.
Analog Devices.
MT-017 Tutorial, Oversampling Interpolating DACs. Analog
Devices.
MT-031 Tutorial, Grounding Data Converters and Solving the
Mystery of 'AGND' and 'DGND'. Analog Devices.
MT-080 Tutorial, Mixers and Modulators. Analog Devices.
MT-101 Tutorial, Decoupling Techniques. Analog Devices.
Zumbahlen, Hank. 2006. Basic Linear Design. Analog Devices.
ISBN 0915550281. Chapters 4 and 11. Also available as
Linear Circuit Design Handbook. Elsevier-Newnes, 2008,
ISBN 0750687037, Chapters 4 and 11.
Data Sheets
AD9779A Data Sheet.
ADL5373 Data Sheet.
REVISION HISTORY
5/09—Rev. 0 to Rev. A
Updated Format.................................................................. Universal
10/08—Revision 0: Initial Version
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CN08222-0-5/09(A)
Rev. A | Page 3 of 3