19-2492; Rev 1; 8/03 5GHz Low-Noise Amplifier with Shutdown Features ♦ 4.9GHz to 5.9GHz Wideband Operation This device operates over a +2.7V to +3.6V supply range and features low overall current consumption (12.5mA). The MAX2649 also includes a shutdown mode to save power when the receiver is inactive. The LNA is designed on a low-noise, advanced SiGe process optimized for high-frequency applications. The device is available in a tiny 2 × 3 chip-scale package (UCSP™) (1mm × 1.5mm). ♦ Shutdown Mode ♦ Low-Noise Figure: 2.1dB ♦ High Gain: 17dB ♦ High IIP3: 0dBm ♦ +2.7V to +3.6V Single-Supply Operation ♦ 1mm × 1.5mm UCSP Applications Ordering Information IEEE802.11a Wireless LAN PART ETSI HiperLAN2 WLAN MAX2649EBT-T 5GHz ISM Radios TEMP RANGE o o -40 C to +85 C PIN-PACKAGE 2 x 3 UCSP* *Requires special solder temperature profile described in the Absolute Maximum Ratings section. 5GHz Cordless Phones UCSP is a trademark of Maxim Integrated Products, Inc. Pin Configuration appears at end of data sheet. Functional Diagram/Typical Operating Circuit SHUTDOWN CONTROL TRANSMISSION LINE RF INPUT RFIN GND A1 A3 A2 BIAS MAX2649 B1 VCC VCC B2 GND B3 RFOUT RF OUTPUT FOR LAYOUT AND DESIGN DETAILS, PLEASE REFER TO THE MAX2649 EV KIT. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX2649 General Description The MAX2649 high-linearity, silicon-germanium (SiGe) low-noise amplifier (LNA) is designed for 5GHz wireless LAN systems based on IEEE802.11a and HiperLAN2 standards. The MAX2649 achieves a 2.1dB noise figure, 17dB gain, and 0dBm IIP3, making it ideal as a firststage LNA in 5GHz OFDM WLAN radio systems. MAX2649 5GHz Low-Noise Amplifier with Shutdown ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +4.2V SHDN to GND.............................................-0.3V to (VCC + 0.3V) RFIN to GND..........................................................-0.3V to +0.9V RFOUT to GND...........................................-0.3V to (VCC + 0.3V) RF Input Power (50Ω Source) ..........................................+5dBm Continuous Power Dissipation (TA = +70°C) 2 x 3 UCSP (derate 24mW/°C above +70°C) ...............500mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Bump Temperature (soldering) (Note 1) Infrared (15s) ...............................................................+220°C Vapor Phase (60s) .......................................................+215°C Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not recommended. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION! ESD SENSITIVE DEVICE DC ELECTRICAL CHARACTERISTICS (VCC = +2.7V to +3.6V, no RF signal applied, VIH = +2.0V, VIL = +0.4V, RFIN and RFOUT terminated to 50Ω through DC-blocking caps, TA = -40°C to +85°C. Typical values are at +3.0V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL Supply Voltage VCC Active Supply Current ICC Shutdown Supply Current ICC Digital Input Logic High VIH Digital Input Logic Low VIL CONDITIONS MIN TYP MAX UNITS 3.6 V 12.5 20 mA 0.3 10 µA 2.7 SHDN = VIL 2 V Digital Input Current 0.4 V 5 µA AC ELECTRICAL CHARACTERISTICS (MAX2649 EV kit, VCC = +3.0V, PIN = -30dBm, RFIN and RFOUT terminated to 50Ω through DC-blocking caps, VIH = +2.0V, VIL = +0.4V, TA = +25°C. Typical values are at fRF = 5250MHz, unless otherwise noted.) (Note 3) PARAMETER RF Frequency Range Power Gain SYMBOL fRF S21 CONDITIONS (Note 4) fRF = 5150MHz to 5350MHz (Note 5) MIN Input Third-Order Intercept Point NF fRF = 5150MHz to 5350MHz (Note 6) IIP3 Two tones at 5250MHz and 5251MHz, -30dBm per tone (Note 6) MAX UNITS 5900 MHz 0.2 1.5 dB 2.1 2.5 dB 4900 15 Gain Variation Over Temperature Noise Figure TYP -3.5 17 dB 0 dBm Input Return Loss S11 -12 dB Output Return Loss S22 -16 dB Reverse Isolation S12 -30 Turn-On Time tON 0.3 0.8 µs Turn-Off Time tOFF 0.5 1.2 µs 2 _______________________________________________________________________________________ dB 5GHz Low-Noise Amplifier with Shutdown (MAX2649 EV kit, VCC = +3.0V, PIN = -30dBm, RFIN and RFOUT terminated to 50Ω through DC-blocking caps, VIH = +2.0V, VIL = +0.4V, TA = +25°C. Typical values are at fRF = 5250MHz, unless otherwise noted.) (Note 3) Note 2: DC characteristics are production tested at TA = +85°C. DC specifications over temperature are guaranteed by design and characterization. Note 3: Specifications are guaranteed by design and characterization. Note 4: Recommended band of operation. Note 5: Specifications are corrected for board losses on the MAX2649 EV kit (0.5dB at input, 0.5dB at output). Note 6: Specifications are corrected for board losses on the MAX2649 EV kit (0.5dB at input). Typical Operating Characteristics (Data taken on board optimized for fRF = 5150MHz to 5350MHz.) (VCC = +3.0V, fRF = 5250MHz, PIN = -30dBm, and TA = +25°C, unless otherwise noted.) SUPPLY CURRENT vs. SUPPLY VOLTAGE 13 12 11 TA = +25°C 18 18 17 17 16 15 15 14 14 13 13 10 TA = -40°C 8 7 -40 SUPPLY VOLTAGE (V) 10 35 60 MAX2649 toc03 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 85 SUPPLY VOLTAGE (V) IIP3 vs. SUPPLY VOLTAGE 1.0 MAX2649 toc04 -9.55 -15 TEMPERATURE (°C) P(1dB) vs. SUPPLY VOLTAGE -9.50 0.8 0.6 -9.60 |S11|, |S12|, |S22| vs. FREQUENCY -9.70 -9.75 0.2 0 -0.2 -0.4 -9.80 -9.90 |S11| -15 |S22| -20 -25 -30 -0.6 -9.85 -5 MAGNITUDE (dB) -9.65 0 -10 0.4 IIP3 (dBm) OUTPUT 1dB COMPRESSION POINT (dBm) 12 12 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 MAX2649 toc05 9 16 MAX2649 toc06 TA = +85°C 19 GAIN (dB) 14 19 GAIN (dB) SUPPLY CURRENT (mA) 15 20 MAX2649 toc02 16 GAIN vs. SUPPLY VOLTAGE GAIN vs. TEMPERATURE 20 MAX2649 toc01 17 -0.8 -35 -1.0 -40 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) |S12| 4900 5100 5300 5500 5700 5900 FREQUENCY (MHz) _______________________________________________________________________________________ 3 MAX2649 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (Data taken on board optimized for fRF = 5150MHz to 5350MHz.) (VCC = +3.0V, fRF = 5250MHz, PIN = -30dBm, and TA = +25°C, unless otherwise noted.) NOISE FIGURE vs. FREQUENCY NF (dB) 17 16 15 14 13 12 11 4900 5100 5300 5500 5700 5900 NF (dB) 18 4900 5100 OPERATING FREQUENCY (MHz) 5300 5500 5700 5900 -40 -15 10 TURN-OFF TIME -10 OUTPUT POWER (dBm) -20 -30 -40 -50 -60 MAX2649 toc11 0 MAX2649 toc10 -10 -20 -30 -40 -50 -60 -70 -70 0 200 400 600 TIME (ns) 800 1000 0 35 TEMPERATURE (°C) TURN-ON TIME OUTPUT POWER (dBm) 3.9 3.7 3.5 3.3 3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 1.3 1.1 0.9 OPERATING FREQUENCY (MHz) 0 4 NOISE FIGURE vs. TEMPERATURE MAX2649 toc08 MAX2649 toc07 19 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 MAX2649 toc09 |S21| vs. FREQUENCY 20 |S21| (dB) MAX2649 5GHz Low-Noise Amplifier with Shutdown 200 400 600 800 1000 TIME (ns) _______________________________________________________________________________________ 60 85 5GHz Low-Noise Amplifier with Shutdown PIN NAME FUNCTION A1 RFIN LNA Input. Requires shunt capacitor and transmission line for input matching. (See the Typical Operating Circuit and refer to the MAX2649 EV kit data sheet for details.) A2, B2 GND Ground. For optimum performance, provide a low-inductance connection to the ground plane. A3 SHDN Shutdown. Apply logic signal through 100Ω resistor with a 20pF shunt capacitor to ground. Set SHDN high for active operation. Set SHDN low to place the part in shutdown mode. B1 VCC B3 RFOUT +2.7V to +3.6V Supply Pin. Bypass with 100pF capacitor. (See the Typical Operating Circuit and refer to the MAX2649 EV kit data sheet for details.) LNA Output. Requires external matching network for optimal performance. (See the Typical Operating Circuit and refer to the MAX2649 EV kit data sheet for details.) Detailed Description The MAX2649 LNA operates with RF frequencies of 4.9GHz to 5.9GHz. This device is ideal for IEEE802.11a and HiperLAN2 applications. This device is available in a 6-bump UCSP package and contains internal bias circuitry and shutdown circuitry to minimize the number of required external components. Applications Information Optimal gain and noise-figure performance require input- and output-matching circuits tuned for the band of interest. All electrical specifications and typical operating characteristics are measured on the MAX2649 evaluation kit (EV kit), which is tuned for operation in the 5.15GHz to 5.35GHz band. Referencing the application circuit, PC board layout, and components specified in the MAX2649 EV kit data sheet reduces evaluation and design time for five system designs. For applications in other bands, refer to the MAX2649 S-parameters, noise parameters, and the following comments to aid design. The S-parameters and noise parameters are available at www.maxim-ic.com. Input Matching The input stage is internally biased, so no external bias circuitry is required at RFIN. Be sure to AC-couple to the input. Because the noise figure of the LNA design is severely degraded by low-Q matching components, always design with high-Q wire-wound inductors and low-loss capacitors. Remember that package parasitics must be taken into consideration; always use components with self-resonant frequencies higher than the intended frequency of operation. Output Matching The output of the MAX2649 is an open-collector transistor; the DC bias and RF matching network are off-chip, as illustrated in the Typical Operating Circuit. Bias the output stage with VCC through an RF choke. The collector is in series with a small inductor and then AC-coupled to the RF output. If necessary, place a shunt capacitor to ground at the far end of the inductor to provide better matching. S-parameters and noise parameters can be found at www.maxim-ic.com. Power-Supply Bypassing Proper power-supply bypassing is essential for highfrequency circuit stability. Place a small-value capacitor as close to the IC as possible to decouple high-frequency noise. Place a larger-value capacitor near the supply to decouple low-frequency noise. Whenever possible, place the ground-connected side of bypass capacitors within a few millimeters of the IC’s ground connections. _______________________________________________________________________________________ 5 MAX2649 Pin Description MAX2649 5GHz Low-Noise Amplifier with Shutdown Layout information A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, EMI, and stray inductance. Use multiple, separate low-inductance-plated vias to the ground plane for each ground bump. The chip-scale package (UCSP) has a bump pitch of 0.5mm (19.7mil) and a bump diameter of 0.3mm (12mil). Therefore, lay out the solder pad spacing on 0.5mm (19.7mil) centers, and use a pad size of 0.25mm (10mil), and a solder mask opening of 0.33mm (13mil). Round or square pads are permissible. Refer to the Maxim application note, Wafer Level Chip-Scale Packaging, for additional detailed information on UCSP layout and handling. UCSP Reliability The chip-scale package (UCSP) represents a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. Operating life test and moisture resistance remains uncompromised, as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must be considered because the package is attached through direct solder contact to the user’s PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environmental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website, www.maxim-ic.com/ 1st_pages/UCSP.htm. Chip Information Pin Configuration TRANSISTOR COUNT: 471 TOP VIEW 6 B1 A1 VCC RFIN B2 A2 GND GND B3 A3 RFOUT SHDN _______________________________________________________________________________________ 5GHz Low-Noise Amplifier with Shutdown 6L, UCSP.EPS PACKAGE OUTLINE, 3x2 UCSP 21-0097 G 1 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 7 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX2649 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)