March 2000 Optical Communication Devices 10Gb/s Optical Receiver Module TOPD371-RX APPLICATIONS • Optical receiver for 10 Gb/s (STM-64/OC-192) FEATURES -21 dBm (typ. at BER = 1 x 10 , PRBS 2 -1 ) • Sensitivity: Overload: 0 dBm (typ. at BER = 1 x 10 , PRBS 2 -1 ) • Transimpedance: • InGaAs PIN-PD 700 Ω (typ.) • GaAs HEMT • Wavelength: 1.3/1.55 µm • Size: 12.7(W) x 16.0(D) x 7.0(H) mm • –10 –10 31 31 TOPD371-RX BLOCK DIAGRAM Optical Input InGaAs PIN-PD SMF Vpd = +5.0 V Data Output GaAs–HEMT Vg (optimized) Vcc = +5.0 V ABSOLUTE MAXIMUM RATINGS (Ta=25˚C) Item Symbol Rating Storage temperature Tstg -40 to +85 ˚C Operating temperature Topr 0 to +70 ˚C PD forward current If 3 mA PD reverse current Ir 1 mA PD reverse voltage Vpd 0 to +15 V Supply voltage Vcc 0 to +6 V Supply current Icc 100 mA Gate voltage Vg -3 to 0 V Tsol 260/5 ˚C/s Soldering temperature Unit ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=0 to +70˚C, λ=1.55 µm, Vcc=+5 V, Vpd=+5 V, Note 1) Item Symbol Conditions Min Typ. Max Unit Icc Vg=0V — 50 100 mA Responsivity R1.55 -10dBm 0.6 0.75 — A/W Dark current Id — — 10 nA Supply current Cutoff frequency F3dB 3dB down from 10MHz 8.0 9.0 — GHz Amplitude deviation DG 10MHz to F3dB — — 3 dB Transimpedance ZT 500 700 — Ω Sensitivity Ps Note 2 — -21 -19 dBm Overload Po Note 2 0 — — dBm Optical return loss Ro 27 — — dB Note 1): An operating condition for Vg is optimized (the data will be provided). 2): 9.95328Gb/s, NRZ, PRBS231-1, BER=1x10-10 DIMENSIONAL OUTLINES AND PIN ASSIGNMENT 5 1 (unit: mm) 4.5 3.4 6 0.35 3.9 12.7 23 19 30 2-0.8 4-R1.15 8 2.54×4=10.16 0.5 15.2 ST Connector 13 16.03 9 18.13 0.9 3.1 5.8 1 2 7 0.2 3.0 min 1200 Pin Assignment Pin 1 2 3 4 5 Function N/C Vpd(+5 V) N/C N/C Vcc Pin 6 7 8 9 10 Function GND Signal output GND Vs monitor N/C Pin 11 12 13 Function GND Vg(optimised) N/C PRECAUTIONS EYE DIAGRAM (a) Transient voltage may cause the photodiode and amplifier to exceed the absolute maximum ratings. A surge-free power supply and a slow starter circuit should be used. (b) Electro static discharge protection must be applied when transporting, handling and testing this product. (c) The product should be surrounded with a complete ground for optimum performance. (d) Recommended power up/down sequence; when putting power up; 1)Connect all pins listed as ground (GND) to ground plane 2)Provide + 5.0 V(Vcc) to pin 5 3)Provide + 5.0 V(Vpd) to pin 2 4)Provide bias voltage(Vg) to pin 12(optimized Vg value will be supplied) when putting power down; 1)Turn off the Vg 2)Turn off the Vpd 3)Turn off the Vcc 4)Disconnect all pins (X : 20 ps/div, Y : 20 mV/div) (CONDITION : 9.95328 Gbit/s,NRZ,PRBS 231-1,Pr=-10 dBm) 000121 (X) Toshiba America Electronic Components, Inc. Toshiba Electronics Europe GmbH Toshiba Electronics Asia, Ltd. Düsseldorf Head Office Hong Kong Head Office Headquarters-Irvine, CA 9775 Toledo Way, Irvine, CA 92618, U.S.A. Tel: (949)455-2000 Fax: (949)859-3963 Hansaallee 181, D-40549 Düsseldorf Germany Tel: (0211)5296-0 Fax: (0211)5296-400 Deerfield, IL(Chicago) Toshiba Electronics Italiana S.R.L. Level 11, Top Glory Insurance Building, Grand Century Place, No.193, Prince Edward Road West, Mong Kok, Kowloon, Hong Kong Tel: 2375-6111 Fax: 2375-0969 One Pkwy., North, Suite 500, Deerfield, IL 60015-2547, U.S.A. Tel: (847)945-1500 Fax: (847)945-1044 Centro Direzionale Colleoni Palazzo Perseo Ingr. 2-Piano 6, Via Paracelso n.12, 1-20041 Agrate Brianza Milan, Italy Tel: (039)68701 Fax:(039)6870205 Edison, NJ 2035 Lincoln Hwy. Ste. #3000, Edison NJ 08817, U.S.A. Tel: (732)248-8070 Fax: (732)248-8030 Richardson, TX(Dallas) 777 East Campbell Rd., Suite 650, Richardson, TX 75081, U.S.A. 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No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a TOSHIBA product could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent products specifications. Also, please keep in mind the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability Handbook. Electronic Devices Sales & Marketing Group 1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan Tel: (03)3457-3405 Fax: (03)5444-9431 The products described in this document are subject to the foreign exchange and foreign trade laws. Website: http://doc.semicon.toshiba.co.jp/indexus.htm ©2000 TOSHIBA CORPORATION Printed in Japan