MAXIM DS2782G+

19-4635; 5/09
DS2782
Stand-Alone Fuel Gauge IC
www.maxim-ic.com
GENERAL DESCRIPTION
PIN CONFIGURATIONS
The DS2782 measures voltage, temperature and
current, and estimates available capacity for
rechargeable lithium ion and lithium-ion polymer
batteries. Cell characteristics and application
parameters used in the calculations are stored in onchip EEPROM. The available capacity registers
report a conservative estimate of the amount of
charge that can be removed given the current
temperature, discharge rate, stored charge and
application parameters. Capacity estimation reported
in mAh remaining and percentage of full.
APPLICATIONS
Digital Still Cameras
Sub-Notebook Computers
FEATURES
Handheld PC Data Terminals

3G Multimedia Wireless Handsets


TYPICAL OPERATING CIRCUIT






Precision Voltage, Temperature, and Current
Measurement System
Accurate Stable Internal Time Base
Absolute and Relative Capacity Estimated from
Coulomb Count, Discharge Rate, Temperature
and Battery Cell Characteristics
Accurate Warning of Low Battery Conditions
Automatic Backup of Coulomb Count and Age
Estimation to Nonvolatile (NV) EEPROM
Gain and Tempco Calibration Allows the Use of
Low-Cost Sense Resistors
24-Byte User EEPROM or 16-Byte User
EEPROM and Unique 64-Bit ID
Industry 2-Wire Interface with Programmable
Slave Address
Tiny 8-Pin TSSOP and 10-TDFN Packages
Embed Easily in Thin Prismatic Cell Packs
ORDERING INFORMATION
PART
DS2782E+
DS2782E+T&R
DS2782G+
DS2782G+T&R
PIN-PACKAGE
8 TSSOP
8 TSSOP
10 TDFN-EP*
10 TDFN-EP*
TOP MARK
2782+
2782+
2782+
2782+
Note: To order devices with the unique 64-bit ID option, contact Maxim sales.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T&R = Tape and reel.
*EP = Exposed pad.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.
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DS2782
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to VSS
Voltage Range on VIN Relative to VSS
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
-0.3V to +6.0V
-0.3V to (VDD + 0.3V)
-40°C to +85°C
-55°C to +125°C
Refer to the IPC/JEDEC J-STD-020 Specification.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CHARACTERISTICS
(VDD = 2.5V to 4.5V; TA = -20°C to +70°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
Supply Voltage
SCL, VIN Voltage Range
SYMBOL
VDD
SDA, PIO Voltage Range
CONDITIONS
MIN
TYP
MAX
UNITS
(Note 1)
(Note 1)
+2.5
-0.3
+4.5
+4.5
V
V
(Note 1)
-0.3
+5.5
V
DC ELECTRICAL CHARACTERISTICS
(VDD = 2.5V to 4.5V; TA = -20°C to +70°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
ACTIVE Current
IACTIVE
SLEEP Mode Current
ISLEEP
Input Logic-High:
SDA, SCL, PIO
Input Logic-Low:
SDA, SCL, PIO
Output Logic-Low:
SDA, PIO
Pulldown Current:
SDA, SCL, PIO
VIN Input Resistance
CONDITIONS
MIN
2.5V ≤ VDD ≤ 4.2V
TYP
MAX
65
95
105
2.5V ≤ VDD ≤ 4.2V
1
3
A
A
VIH
(Note 1)
VIL
(Note 1)
0.6
V
VOL
IOL = 4mA (Note 1)
0.4
V
IPD
VSDA, VSCL, VPIO =
0.4V
RIN
1.5
UNITS
V
A
0.2
15
Bus Low to Sleep Time
tSLEEP
SDA, SCL < VIL
(Note 2)
Undervoltage SLEEP
Threshold
VSLEEP
(Note 1)
2.40
M
2.45
2.2
s
2.50
V
ELECTRICAL CHARACTERISTICS: TEMPERATURE, VOLTAGE, CURRENT
(VCC = 2.5V to 4.5V; TA = -20°C to +70°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
Temperature Resolution
TLSB
Temperature Error
TERR
Voltage Resolution
VLSB
Voltage Full-Scale
VFS
Voltage Error
VERR
Current Resolution
ILSB
Current Full-Scale
IFS
CONDITIONS
MIN
TYP
MAX
0.125
°C
±3
4.88
0
°C
mV
4.5
V
±50
mV
V
1.56
±51.2
2 of 28
UNITS
mV
DS2782
PARAMETER
SYMBOL
Current Gain Error
IGERR
Current Offset Error
IOERR
Accumulated Current Offset
qOERR
Time-Base Error
tERR
CONDITIONS
MIN
TYP
MAX
UNITS
±1
% FullScale
-7.82
+12.5
V
-188
+0
Vhr/
day
(Note 3)
0°C ≤ TA ≤ +70°C,
2.5V ≤ VDD ≤ 4.2V
(Note 5)
0°C ≤ TA ≤ +70°C,
2.5V ≤ VDD ≤ 4.2V
VSNS = VSS
(Notes 4, 5)
VDD = 3.8V,
TA = +25°C
0°C ≤ TA ≤ +70°C,
2.5V ≤ VDD ≤ 4.2V
±1
±2
%
±3
ELECTRICAL CHARACTERISTICS: 2-WIRE INTERFACE
(2.5V  VDD  4.5V, TA = -20C to +70C.)
PARAMETER
SYMBOL
SCL Clock Frequency
fSCL
Bus Free Time Between a
STOP and START Condition
Hold Time (Repeated)
START Condition
tBUF
tHD:STA
CONDITIONS
(Note 6)
(Note 7)
MIN
TYP
0
MAX
UNITS
400
kHz
1.3
s
0.6
s
Low Period of SCL Clock
tLOW
1.3
s
High Period of SCL Clock
tHIGH
0.6
s
Setup Time for a Repeated
START Condition
tSU:STA
0.6
s
Data Hold Time
tHD:DAT
(Note 8, 9)
Data Setup Time
tSU:DAT
(Note 8)
0
100
Rise Time of Both SDA and
SCL Signals
Fall Time of Both SDA and
SCL Signals
Setup Time for STOP
Condition
Spike Pulse Widths
Suppressed by Input Filter
Capacitive Load for Each Bus
Line
tF
20 +
0.1CB
20 +
0.1CB
tSU:STO
0.6
SCL, SDA Input Capacitance
CBIN
tR
tSP
(Note 10)
CB
(Note 11)
0.9
s
ns
300
ns
300
ns
s
0
50
ns
400
pF
60
pF
EEPROM RELIABILITY SPECIFICATION
(VCC = 2.5V to 4.5V; TA = -20°C to +70°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
EEPROM Copy Time
tEEC
EEPROM Copy Endurance
NEEC
CONDITIONS
TA = +50°C
3 of 28
MIN
50,000
TYP
MAX
UNITS
10
ms
cycles
DS2782
Note 1: All voltages are referenced to VSS.
Note 2: To properly enter sleep mode the application should hold the bus low for longer than the maximum tSLEEP.
Note 3: Factory calibrated accuracy. Higher accuracy can be achieved by in-system calibration by the user.
Note 4: Accumulation bias register set to 00h.
Note 5: Parameters guaranteed by design.
Note 6: Timing must be fast enough to prevent the DS2782 from entering sleep mode due to bus low for period >
tSLEEP.
Note 7: fSCL must meet the minimum clock low time plus the rise/fall times.
Note 8: The maximum tHD:DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL
signal.
Note 9: This device internally provides a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of
the SCL signal) to bridge the undefined region of the falling edge of SCL.
Note 10: Filters on SDA and SCL suppress noise spikes at the input buffers and delay the sampling instant.
Note 11: CB – total capacitance of one bus line in pF.
Figure 1. I2C Bus Timing Diagram
4 of 28
DS2782
PIN DESCRIPTION
PIN
NAME
FUNCTION
TSSOP
TDFN-EP
1
1
N.C.
2
2, 3
VSS
3
4
VIN
4
5
VDD
5
6
SDA
Serial Data Input/Output. 2-Wire data line. Open-drain output driver.
Connect this pin to the DATA terminal of the battery pack. Pin has an
internal pull-down (IPD) for sensing disconnection.
6
7
SCL
Serial Clock Input. 2-Wire clock line. Input only. Connect this pin to the
CLOCK terminal of the battery pack. Pin has an internal pull-down (IPD) for
sensing disconnection.
—
8
N.C.
No Connection
7
9
SNS
Sense Resistor Connection. Connect to the negative terminal of the
battery pack. Connect the sense resistor between VSS and SNS.
8
10
PIO
Programmable I/O Pin. Can be configured as input or output to monitor or
control user-defined external circuitry. Output driver is open drain. This pin
has a weak internal pulldown (IPD).
—
EP
EP
Exposed Pad. Connect to VSS or leave floating.
Not Connected. Pin not connected internally, float or connect to VSS.
Device Ground. Connect directly to the negative terminal of the battery
cell. Connect the sense resistor between VSS and SNS.
Voltage Sense Input. The voltage of the battery cell is monitored through
this input pin.
Power-Supply Input. Connect to the positive terminal of the battery cell
through a decoupling network.
Figure 2. Block Diagram
VDD
EN
VPOR
BIAS/VREF
Timebase
PIO
VIN
SDA
SCL
2-Wire
Interface
Status
&
Control
Temp
&
Voltage
ADC
EEPROM
SNS
Accumulated
Current
Current ADC
15 bit + sign
5 of 28
Rate,
Temperature
Compensation
VSS
DS2782
DETAILED DESCRIPTION
The DS2782 operates directly from 2.5V to 4.5V and supports single cell Lithium-ion battery packs. As shown in
Figure 3, the DS2782 accommodates multicell applications by adding a voltage regulator for VDD and voltage
divider for VIN. Nonvolatile storage is provided for cell compensation and application parameters. Host side
development of fuel-gauging algorithms is eliminated. On-chip algorithms and convenient status reporting of
operating conditions reduce the serial polling required of the host processor.
Additionally, 16 bytes of EEPROM memory are made available for the exclusive use of the host system and/or
pack manufacturer. The additional EEPROM memory can be used to facilitate battery lot and date tracking and NV
storage of system or battery usage statistics.
Through its 2-Wire interface, the DS2782 gives the host system read/write access to status and control registers,
instrumentation registers, and general-purpose data storage. The 7-bit slave address is field programmable, thus
allowing up to 128 devices to be distinctly addressed by the host system. A unique, factory programmed 64-bit
registration number (8-bit family code + 48-bit serial number + 8-bit CRC) option assures that no two parts are alike
and enables absolute traceability.
Figure 3. Multicell Application Example
Pack+
0.1uF
4.7uF
500
SDA
SCL
150
VDD
SCL
VIN
PIO
NC
Protection
Circuit
(1)
SNS
VSS
Multi-Cell
Li-Ion
Battery
R
150
(1)
Pack-
SDA
(n-1)
*R
0.1uF
RSNS
(1) Components improve IEC1004 Air/Contact ESD compliance
n = number of cells used in the application
R resistors should be selected based on the minimum acceptable resistance (highest acceptable current drain) for the application
6 of 28
DS2782
POWER MODES
The DS2782 has two power modes: ACTIVE and SLEEP. On initial power up, the DS2782 defaults to ACTIVE
mode. While in ACTIVE mode, the DS2782 is fully functional with measurements and capacity estimation
continuously updated. In SLEEP mode, the DS2782 conserves power by disabling measurement and capacity
estimation functions, but preserves register contents. SLEEP mode is entered under two different conditions and
an enable bit for each condition makes entry into SLEEP optional. SLEEP mode can be enabled using the Power
Mode (PMOD) bit or the Under Voltage Enable (UVEN) bit.
The PMOD type SLEEP is entered if the PMOD bit is set AND a bus low condition occurs. A bus low condition,
where both SDA AND SCL low for tSLEEP (2s nominal), is used to detect a pack disconnection or system shutdown
in which the bus pull-up voltage, VPULLUP, is not present. PMOD SLEEP assumes that no charge or discharge
current will flow and therefore coulomb counting is not necessary. A system with PMOD SLEEP enabled must
ensure that a stand-alone or cradle charger includes a pull-up on SDA and/or SCL. The DS2782 transitions from
PMOD SLEEP to ACTIVE mode when either SDA or SCL is pulled high.
The second option for entering SLEEP is an under voltage condition measured on VIN. When the UVEN bit is set,
the DS2782 will transition to SLEEP if the voltage on VIN is less than VSLEEP (2.45V nominal) AND the 2-Wire bus
is in a bus high or a bus low condition for tSLEEP. UVEN SLEEP relieves the battery of the DS2782 load until
communication resumes to prevent over discharging the battery. The DS2782 transitions from UVEN SLEEP to
ACTIVE mode when either SDA or SCL change logic state. The bus master should initiate a transaction after
charging of a depleted battery begins.
Note: PMOD and UVEN SLEEP features must be disabled when a battery is charged on an external charger that
does not connect to SDA and/or SCL. PMOD SLEEP can be used if the charger pulls the bus high. The DS2782
remains in SLEEP and therefore does not measure or accumulate current when a battery is charged on a charger
that fails to properly drive the communication bus.
INITIATING COMMUNICATION IN SLEEP
When beginning communication with a DS2782 in PMOD SLEEP, the bus must be pulled up before a START bit
can be issued by the master. In UVEN SLEEP, the procedure depends on the bus state when UVEN SLEEP was
entered. If the bus was low, it must be pulled up before a START bit can be issued by the master as required with
PMOD SLEEP. If the bus was high when UVEN SLEEP was entered, then the DS2782 is prepared to receive a
START bit from the master. A standard procedure of issuing a START – STOP – START when the host system is
powered up on the charger input properly initiates communication from both PMOD and UVEN SLEEP modes.
VOLTAGE MEASUREMENT
Battery voltage is measured at the VIN input with respect to VSS over a range of 0V to 4.5V, with a resolution of
4.88mV. The result is updated every 440ms and placed in the VOLTAGE register in two’s complement form.
Voltages above the maximum register value are reported at the maximum value; voltages below the minimum
register value are reported at the minimum value. The format of the voltage register is shown in Figure 4.
Figure 4. Voltage Register Format
Read Only
VOLT
MSB—Address 0Ch
S
29
28
27
MSb
26
25
LSB—Address 0Dh
24
23
LSb
22
MSb
21
20
X
X
X
X
X
LSb
Units: 4.88mV
“S”: sign bit(s), “X”: reserved
7 of 28
DS2782
VIN is usually connected to the positive terminal of a single cell Lithium-Ion battery via a 1k resistor. The input
impedance is sufficiently large (15M) to be connected to a high impedance voltage divider in order to support
multiple cell applications. The pack voltage should be divided by the number of series cells to present a single cell
average voltage to the VIN input. In Figure 3, the value of R can be up to 1M without incurring significant error
due to input loading.
TEMPERATURE MEASUREMENT
The DS2782 uses an integrated temperature sensor to measure battery temperature with a resolution of 0.125°C.
Temperature measurements are updated every 440ms and placed in the temperature register in two’s complement
form. The format of the temperature register is shown in Figure 5.
Figure 5. Temperature Register Format
Read Only
TEMP
MSB—Address 0Ah
S
29
28
27
26
25
LSB—Address 0Bh
24
MSb
23
22
LSb
21
20
X
X
X
X
MSb
X
LSb
Units: 0.125C
“S”: sign bit(s), “X”: reserved
CURRENT MEASUREMENT
In the ACTIVE mode of operation, the DS2782 continually measures the current flow into and out of the battery by
measuring the voltage drop across a low-value current-sense resistor, RSNS. The voltage-sense range between
SNS and VSS is ±51.2mV. The input linearly converts peak signal amplitudes up to 102.4mV as long as the
continuous signal level (average over the conversion cycle period) does not exceed ±51.2mV. The ADC samples
the input differentially at 18.6kHz and updates the Current register at the completion of each conversion cycle.
The Current register is updated every 3.515s with the current conversion result in two’s complement form. Charge
currents above the maximum register value are reported at the maximum value (7FFFh = +51.2mV). Discharge
currents below the minimum register value are reported at the minimum value (8000h = -51.2mV).
Figure 6. Current Register Format
Read Only
CURRENT
MSB—Address 0Eh
S
214
213
212
211
210
LSB—Address 0Fh
29
MSb
28
27
LSb
26
25
24
23
22
MSb
Units:
CURRENT RESOLUTION (1 LSB)
1.5625V
RSNS
20m
78.13A
15m
104.2A
8 of 28
20
LSb
“S”: sign bit(s)
VSS VSNS
21
10m
156.3A
5m
312.5A
1.5625V/Rsns
DS2782
AVERAGE CURRENT MEASUREMENT
The Average Current register reports an average current level over the preceding 28 seconds. The register value is
updated every 28s in two’s complement form, and is the average of the 8 preceding Current register updates. The
format of the Average Current register is shown in Figure 7. Charge currents above the maximum register value
are reported at the maximum value (7FFFh = +51.2mV). Discharge currents below the minimum register value are
reported at the minimum value (8000h = -51.2mV).
Figure 7. Average Current Register Format
R/W
IAVG
MSB—Address 08h
S
214
213
212
211
210
MSb
LSB—Address 09h
29
28
27
LSb
26
25
24
23
MSb
“S”: sign bit(s)
22
21
20
LSb
Units:
1.5625V/Rsns
CURRENT OFFSET CORRECTION
Every 1024th conversion, the ADC measures its input offset to facilitate offset correction. Offset correction occurs
approximately once per hour. The resulting correction factor is applied to the subsequent 1023 measurements.
During the offset correction conversion, the ADC does not measure the sense resistor signal. A maximum error of
1/1024 in the accumulated current register (ACR) is possible; however, to reduce the error, the current
measurement made just prior to the offset conversion is displayed in the current register and is substituted for the
dropped current measurement in the current accumulation process. This results in an accumulated current error
due to offset correction of less than 1/1024.
CURRENT MEASUREMENT CALIBRATION
The DS2782’s current measurement gain can be adjusted through the RSGAIN register, which is factory-calibrated
to meet the data sheet specified accuracy. RSGAIN is user accessible and can be reprogrammed after module or
pack manufacture to improve the current measurement accuracy. Adjusting RSGAIN can correct for variation in an
external sense resistor’s nominal value, and allows the use of low-cost, non-precision current sense resistors.
RSGAIN is an 11-bit value stored in 2 bytes of the Parameter EEPROM Memory Block. The RSGAIN value adjusts
the gain from 0 to 1.999 in steps of 0.001 (precisely 2-10). The user must program RSGAIN cautiously to ensure
accurate current measurement. When shipped from the factory, the gain calibration value is stored in two separate
locations in the Parameter EEPROM Block: RSGAIN, which is reprogrammable, and FRSGAIN, which is read only.
RSGAIN determines the gain used in the current measurement. The read-only FRSGAIN is provided to preserve
the factory value only and is not used in the current measurement.
SENSE RESISTOR TEMPERATURE COMPENSATION
The DS2782 is capable of temperature compensating the current sense resistor to correct for variation in a sense
resistor’s value over temperature. The DS2782 is factory programmed with the sense resistor temperature
coefficient, RSTC, set to zero, which turns off the temperature compensation function. RSTC is user accessible
and can be reprogrammed after module or pack manufacture to improve the current accuracy when using a high
temperature coefficient current-sense resistor. RSTC is an 8-bit value stored in the Parameter EEPROM Memory
Block. The RSTC value sets the temperature coefficient from 0 to +7782ppm/ºC in steps of 30.5ppm/ºC. The user
must program RSTC cautiously to ensure accurate current measurement.
Temperature compensation adjustments are made when the Temperature register crosses 0.5oC boundaries. The
temperature compensation is most effective with the resistor placed as close as possible to the VSS terminal to
optimize thermal coupling of the resistor to the on-chip temperature sensor. If the current shunt is constructed with
a copper PCB trace, run the trace under the DS2782 package if possible.
9 of 28
DS2782
CURRENT ACCUMULATION
Current measurements are internally summed, or accumulated, at the completion of each conversion period with
the results displayed in the Accumulated Current Register (ACR). The accuracy of the ACR is dependent on both
the current measurement and the conversion time base. The ACR has a range of 0 to 409.6mVh with an LSb of
6.25Vh. Additional read-only registers (ACRL) hold fractional results of each accumulation to avoid truncation
errors. Accumulation of charge current above the maximum register value is reported at the maximum register
value (7FFFh); conversely, accumulation of discharge current below the minimum register value is reported at the
minimum value (8000h).
Charge currents (positive Current register values) less than 100V are not accumulated in order to mask the effect
of accumulating small positive offset errors over long periods. This limits the minimum charge current, for coulombcounting purposes, to 5mA for RSNS = 0.020 and 20mA for RSNS = 0.005.
Read and write access is allowed to the ACR. The ACR must be written MSByte first then LSByte. Whenever the
ACR is written, the fractional accumulation result bits are cleared. The write must be completed within 3.515s (one
ACR register update period). A write to the ACR forces the ADC to perform an offset correction conversion and
update the internal offset correction factor. Current measurement and accumulation begins with the second
conversion following a write to the ACR. Writing ACR clears the fractional values in ACRL. The Format of the ACR
register is shown in Figure 8, and the format of ACRL is shown in Figure 9.
In order to preserve the ACR value in case of power loss, the ACR value is backed up to EEPROM. The ACR
value is recovered from EEPROM on power-up. See the Memory Map in Table 2 for specific address location and
backup frequency.
Figure 8. Accumulated Current Register Format, ACR
R/W & EE
ACR
MSB—Address 10h
215
MSb
214
213
212
211
210
LSB—Address 11h
29
28
27
LSb
MSb
26
25
24
23
21
20
LSb
Units:
10 of 28
22
6.25Vh/Rsns
DS2782
Figure 9. Fractional/Low Accumulated Current Register Format, ACRL
Read Only
ACRL
MSB—Address 12h
211
210
29
28
27
26
LSB—Address 13h
25
MSb
24
23
LSb
MSb
22
21
20
X
X
X
X
LSb
“X”: reserved
Units:1.526nVHr/RSNS
ACR LSb
RSNS
VSS VSNS
20m
15m
10m
5m
6.25Vh
312.5Ah
416.7Ah
625Ah
1.250mAh
ACR RANGE
RSNS
VSS VSNS
20m
15m
10m
5m
409.6mVh
20.48Ah
27.30Ah
40.96Ah
81.92Ah
ACCUMULATION BIAS
The Accumulation Bias register (AB) allows an arbitrary bias to be introduced into the current-accumulation
process. The AB can be used to account for currents that do not flow through the sense resistor, estimate currents
too small to measure, estimate battery self-discharge or correct for static offset of the individual DS2782 device.
The AB register allows a user programmed constant positive or negative polarity bias to be included in the current
accumulation process. The user-programmed two’s complement value, with bit weighting the same as the current
register, is added to the ACR once per current conversion cycle. The AB value is loaded on power-up from
EEPROM memory. The format of the AB register is shown in Figure 10.
Figure 10. Accumulation Bias Register Formats
EE
AB
Address 61h
S
26
25
24
23
MSb
“S”: sign bit
22
21
20
LSb
Units:
11 of 28
1.5625V/Rsns
DS2782
CAPACITY ESTIMATION ALGORITHM
Remaining capacity estimation uses real-time measured values and stored parameters describing the cell
characteristics and application operating limits. The following diagram describes the algorithm inputs and outputs.
Figure 11. Top-Level Algorithm Diagram
12 of 28
DS2782
MODELING CELL CHARACTERISTICS
In order to achieve reasonable accuracy in estimating remaining capacity, the cell performance characteristics over
temperature, load current, and charge termination point must be considered. Since the behavior of Li-ion cells is
non-linear, even over a limited temperature range of 10°C to 35°C, these characteristics must be included in the
capacity estimation to achieve a reasonable accuracy. Refer to Application Note AN131: Li+ Fuel Gauging with
Dallas Semiconductor Devices for general information on the FuelPack™ method used in the DS2782. To facilitate
efficient implementation in hardware, a modified version of the method outlined in AN131 is used to store cell
characteristics in the DS2782. Full and empty points are retrieved in a lookup process which re-traces a piece-wise
linear model. Three model curves are stored: Full, Active Empty and Standby Empty. Each model curve is
constructed with 4 line segments and spans from 0°C to 40°C. Operation outside the 0°C to 40°C model span is
supported by the model with minimal loss of accuracy. Above 40°C, the 40°C fixed points are extended with zero
slope. This achieves a conservative capacity estimate for temperatures above 40°C. Below 0°C, the model curves
are extended using the slope of each 0°C to 10°C segment. If low temperature operation is expected, the 0°C to
10°C slopes can be selected to optimize the model accuracy. A diagram of example battery cell model curves is
shown if Figure 12.
Figure 12. Cell Model Example Diagram
100%
Derivative
[ppm / °C]
FULL
Cell
Characterization
data points
Active
Empty
Standby
Empty
1
0°C
2
10°C
3
20°C
4
30°C
40°C
Full: The Full curve defines how the full point of a given cell depends on temperature for a given charge
termination. The charge termination method used in the application is used to determine the table values. The
DS2782 reconstructs the Full line from cell characteristic table values to determine the Full capacity of the battery
at each temperature. Reconstruction occurs in one-degree temperature increments.
Active Empty: The Active Empty curve defines the temperature variation in the empty point of the discharge profile
based on a high level load current (one that is sustained during a high power operating mode) and the minimum
voltage required for system operation. This load current is programmed as the Active Empty current (IAE), and
should be a 3.5s average value to correspond to values read from the Current register, and the specified minimum
voltage, or Active Empty voltage (VAE) should be a 220ms average to correspond to values read from the Voltage
register. The DS2782 reconstructs the Active Empty line from cell characteristic table values to determine the
Active Empty capacity of the battery at each temperature. Reconstruction occurs in one-degree temperature
increments.
Standby Empty: The Standby Empty curve defines the temperature variation in the empty point in the discharge
defined by the application standby current and the minimum voltage required for standby operation. In typical PDA
13 of 28
FuelPack is a trademark of Maxim Integrated Products, Inc.
DS2782
applications, Standby Empty represents the point that the battery can no longer support RAM refresh and thus the
standby voltage is set by the RAM voltage supply requirements. In other applications, Standby Empty can
represent the point that the battery can no longer support a subset of the full application operation, such as games
or organizer functions on a wireless handset. The standby load current and voltage are used for determining the
cell characteristics but are not programmed into the DS2782. The DS2782 reconstructs the Standby Empty line
from cell characteristic table values to determine the Standby Empty capacity of the battery at each temperature.
Reconstruction occurs in one-degree temperature increments.
CELL MODEL CONSTRUCTION
The model is constructed with all points normalized to the fully charged state at +40°C. Initial values, the +40°C
Full value in mVh units and the +40°C Active Empty value as a fraction of the +40°C Full are stored in the cell
parameter EEPROM block. Standby Empty at +40°C is by definition zero and therefore no storage is required. The
slopes (derivatives) of the 4 segments for each model curve are also stored in the cell parameter EEPROM block.
Segment endpoints are fixed at 0°C, +10°C, +20°C, +30°C and +40°C. An example of data stored in this manner is
shown in Table 1.
Table 1. Example Cell Characterization Table (Normalized to +40°C)
Manufacturers rated cell capacity: 1000mAh
Charge Voltage: 4.2V
Charge Current: 500mA
Termination Current: 50mA
Active Empty (V, I): 3.0V, 300mA
Standby Empty (V, I): 3.0V, 4mA
Sense Resistor: 0.020
+40C
0°C
+10°C
+20°C
+30°C
+40°C
Nominal
[mAh]
Full
1051
0.927
0.951
0.974
0.991
1.0
Active Empty
0.051
0.040
0.022
0.012
0.008
Standby Empty
0.013
0.0067
0.0038
0.001
0
Figure 13. Lookup Function Diagram
Cell Model
Parameters
15 bytes
(EEPROM)
FULL(T)
Lookup
Function
AE(T)
SE(T)
Temperature
14 of 28
DS2782
APPLICATION PARAMETERS
In addition to cell model characteristics, several application parameters are needed to detect the full and empty
points, as well as calculate results in mAh units.
Sense Resistor Prime (RSNSP): RSNSP stores the value of the sense resistor for use in computing the absolute
capacity results. The value is stored as a 1-byte conductance value with units of mhos. RSNSP supports resistor
values of 1 to 3.922m. RSNSP is located in the Parameter EEPROM block.
Charge Voltage (VCHG): VCHG stores the charge voltage threshold used to detect a fully charged state. The
value is stored as a 1-byte voltage with units of 19.52mV and can range from 0V to 4.978V. VCHG should be set
marginally less than the cell voltage at the end of the charge cycle to ensure reliable charge termination detection.
VCHG is located in the Parameter EEPROM block.
Minimum Charge Current (IMIN): IMIN stores the charge current threshold used to detect a fully charged state.
The value is stored as a 1-byte value with units of 50V and can range from 0 to 12.75mV. Assuming RSNS =
20m, IMIN can be programmed from 0mA to 637.5mA in 2.5mA steps. IMIN should be set marginally greater than
the charge current at the end of the charge cycle to ensure reliable charge termination detection. IMIN is located in
the Parameter EEPROM block.
Active Empty Voltage (VAE): VAE stores the voltage threshold used to detect the Active Empty point. The value
is stored in 1-byte with units of 19.52mV and can range from 0V to 4.978V. VAE is located in the Parameter
EEPROM block. See the Cell Characteristics section for more information.
Active Empty Current (IAE): IAE stores the discharge current threshold used to detect the Active Empty point.
The unsigned value represents the magnitude of the discharge current and is stored in 1-byte with units of 200V
and can range from 0 to 51.2mV. Assuming RSNS = 20m, IAE can be programmed from 0mA to 2550mA in
10mA steps. IAE is located in the Parameter EEPROM block. See the Cell Characteristics section for more
information.
Aging Capacity (AC): AC stores the rated battery capacity used in estimating the decrease in battery capacity that
occurs in normal use. The value is stored in 2-bytes in the same units as the ACR (6.25Vh). Setting AC to the
manufacturer’s rated capacity sets the aging rate to approximately 2.4% per 100 cycles of equivalent full capacity
discharges. Partial discharge cycles are added to form equivalent full capacity discharges. The default estimation
results in 88% capacity after 500 equivalent cycles. The estimated aging rate can be adjusted by setting AC to a
different value than the cell manufacturer’s rating. Setting AC to a lower value, accelerates the estimated aging.
Setting AC to a higher value, retards the estimated aging. AC is located in the Parameter EEPROM block.
Age Scalar (AS): AS adjusts the capacity estimation results downward to compensate for cell aging. AS is a 1-byte
-7
value that represents values between 49.2% and 100%. The lsb is weighted at 0.78% (precisely 2 ). A value of
100% (128 decimal or 80h) represents an un-aged battery. A value of 95% is recommended as the starting AS
value at the time of pack manufacture to allow learning a larger capacity on batteries that have an initial capacity
greater than the nominal capacity programmed in the cell characteristic table. AS is modified by the cycle count
based age estimation introduced above and by the capacity Learn function. The host system has read and write
access to AS, however caution should exercised when writing AS to ensure that the cumulative aging estimate is
not over written with an incorrect value. Usually, writing AS by the host is not necessary because AS is
automatically saved to EEPROM on a periodic basis by the DS2782. (See the Memory section for details.) The
EEPROM stored value of AS is recalled on power-up.
15 of 28
DS2782
CAPACITY ESTIMATION UTILITY FUNCTIONS
Aging Estimation
As discussed above, the AS register value is adjusted occasionally based on cumulative discharge. As the ACR
register decrements during each discharge cycle, an internal counter is incremented until equal to 32 times AC. AS
is then decremented by one, resulting in a decrease in the scaled full battery capacity of 0.78%. Refer to the AC
register description above for recommendations on customizing the age estimation rate.
Learn Function
Since Li+ cells exhibit charge efficiencies near unity, the charge delivered to a Li+ cell from a known empty point to
a known full point is a dependable measure of the cell capacity. A continuous charge from empty to full results in a
“learn cycle”. First, the Active Empty point must be detected. The Learn Flag (LEARNF) is set at this point. Then,
once charging starts, the charge must continue uninterrupted until the battery is charged to full. Upon detecting full,
LEARNF is cleared, the Charge to Full (CHGTF) flag is set and the Age Scalar (AS) is adjusted according to the
learned capacity of the cell.
ACR Housekeeping
The ACR register value is adjusted occasionally to maintain the coulomb count within the model curve boundaries.
When the battery is charged to full (CHGTF set), the ACR is set equal to the age scaled full lookup value at the
present temperature. If a learn cycle is in progress, correction of the ACR value occurs after the age scalar (AS) is
updated.
When an empty condition is detected (AEF or LEARNF set), the ACR adjustment is conditional. If AEF is set and
LEARNF is not, then the Active Empty Point was not detected and the battery is likely below the Active Empty
capacity of the model. The ACR is set to the Active Empty model value only if it is greater than the Active Empty
model value. If LEARNF is set, then the battery is at the Active Empty Point and the ACR is set to the Active Empty
model value.
Full Detect
Full detection occurs when the Voltage (VOLT) readings remain continuously above the VCHG threshold for the
period between two Average Current (IAVG) readings, where both IAVG readings are below IMIN. The two
consecutive IAVG readings must also be positive and non-zero. This ensures that removing the battery from the
charger does not result in a false detection of full. Full Detect sets the Charge to Full (CHGTF) bit in the Status
register.
Active Empty Point Detect
Active Empty Point detection occurs when the Voltage register drops below the VAE threshold and the two
previous Current readings are above IAE. This captures the event of the battery reaching the Active Empty point.
Note that the two previous Current readings must be negative and greater in magnitude than IAE, that is, a larger
discharge current than specified by the IAE threshold. Qualifying the Voltage level with the discharge rate ensures
that the Active Empty point is not detected at loads much lighter than those used to construct the model. Also,
Active Empty must not be detected when a deep discharge at a very light load is followed by a load greater than
IAE. Either case would cause a learn cycle on the following charge to full to include part of the Standby capacity in
the measurement of the Active capacity. Active Empty detection sets the Learn Flag (LEARNF) bit in the Status
register.
16 of 28
DS2782
RESULT REGISTERS
The DS2782 processes measurement and cell characteristics on a 3.5s interval and yields seven result registers.
The result registers are sufficient for direct display to the user in most applications. The host system can produce
customized values for system use, or user display by combining measurement, result and User EEPROM values.
FULL(T) [ ]: The Full capacity of the battery at the present temperature is reported normalized to the 40°C Full
value. This 15-bit value reflects the cell model Full value at the given temperature. FULL(T) reports values between
100% and 50% with a resolution of 61ppm (precisely 2-14). Though the register format permits values greater than
100%, the register value is clamped to a maximum value of 100%.
Active Empty, AE(T) [ ]: The Active Empty capacity of the battery at the present temperature is reported
normalized to the 40°C Full value. This 13-bit value reflects the cell model Active Empty at the given temperature.
AE(T) reports values between 0% and 49.8% with a resolution of 61ppm (precisely 2-14).
Standby Empty, SE(T) [ ]: The Standby Empty capacity of the battery at the present temperature is reported
normalized to the 40°C Full value. This 13-bit value reflects the cell model Standby Empty value at the current
temperature. SE(T) reports values between 0% and 49.8% with a resolution of 61ppm (precisely 2-14).
Remaining Active Absolute Capacity (RAAC) [mAh]: RAAC reports the capacity available under the current
temperature conditions at the Active Empty discharge rate (IAE) to the Active Empty point in absolute units of milliamp-hours. RAAC is 16 bits. See Figure 14.
Figure 14. Remaining Active Absolute Capacity Register Format
Read Only
RAAC
MSB—Address 02h
215
214
213
212
211
210
LSB—Address 03h
29
MSb
28
27
LSb
MSb
26
25
24
23
22
21
20
LSb
Units:1.6mAhr
Remaining Standby Absolute Capacity (RSAC) [mAh]: RSAC reports the capacity available under the current
temperature conditions at the Standby Empty discharge rate (ISE) to the Standby Empty point capacity in absolute
units of milli-amp-hours. RSAC is 16 bits. See Figure 15.
Figure 15. Remaining Standby Absolute Capacity Register Format
Read Only
RSAC
MSB—Address 04h
215
MSb
214
213
212
211
210
LSB—Address 05h
29
28
27
LSb
MSb
26
25
24
23
22
21
20
LSb
Units:1.6mAhr
17 of 28
DS2782
Remaining Active Relative Capacity (RARC) [%]: RARC reports the capacity available under the current
temperature conditions at the Active Empty discharge rate (IAE) to the Active Empty point in relative units of
percent. RARC is 8 bits. See Figure 16.
Figure 16. Remaining Active Relative Capacity Register Format
Read Only
RARC
Address 06h
27
26
25
24
23
22
21
MSb
20
LSb
Units:
1%
Remaining Standby Relative Capacity (RSRC) [%]: RSRC reports the capacity available under the current
temperature conditions at the Standby Empty discharge rate (ISE) to the Standby Empty point capacity in relative
units of percent. RSRC is 8 bits. See Figure 17.
Figure 17. Remaining Standby Relative Capacity Register Format
Read Only
RSRC
Address 07h
27
26
25
24
23
22
21
MSb
20
LSb
Units:
1%
Calculation of Results
RAAC [mAh] = (ACR[mVh] - AE(T) * FULL40[mVh]) * RSNSP [mhos]
RSAC [mAh] = (ACR[mVh] - SE(T) * FULL40[mVh]) * RSNSP [mhos]
RARC [%] = 100% * (ACR[mVh] - AE(T) * FULL40[mVh]) /
{(AS * FULL(T) - AE(T)) * FULL40[mVh]}
RSRC [%] = 100%* (ACR[mVh] - SE(T) * FULL40[mVh]) /
{(AS * FULL(T) - SE(T)) * FULL40[mVh]}
18 of 28
DS2782
STATUS REGISTER
The STATUS register contains bits which report the device status. The bits can be set internally by the DS2782.
The CHGTF, AEF, SEF, LEARNF and VER bits are read only bits which can be cleared by hardware. The UVF and
PORF bits can only be cleared via the 2-Wire interface.
Figure 18. Status Register Format
ADDRESS
FIELD
01h
BIT
FORMAT
CHGTF
7
Read Only
AEF
6
Read Only
SEF
5
Read Only
LEARNF
4
Read Only
Reserved
3
Read Only
BIT DEFINITION
ALLOWABLE VALUES
Charge Termination Flag
Set to 1 when: ( VOLT > VCHG ) AND ( 0 < IAVG < IMIN ) continuously
for a period between two IAVG register updates ( 28s to 56s ).
Cleared to 0 when: RARC < 90%
Active Empty Flag
Set to 1 when: VOLT < VAE
Cleared to 0 when: RARC > 5%
Standby Empty Flag
Set to 1 when: RSRC < 10%
Cleared to 0 when: RSRC > 15%
Learn Flag – When set to 1, a charge cycle can be used to learn battery
capacity.
Set to 1 when: ( VOLT falls from above VAE to below VAE ) AND
( CURRENT > IAE )
Cleared to 0 when: ( CHGTF = 1 ) OR ( CURRENT < +100µV ) OR
( ACR = 0 **) OR ( ACR written or recalled from EEPROM) OR ( SLEEP
Entered )
Undefined
Under-Voltage Flag
Set to 1 when: VOLT < VSLEEP
Cleared to 0 by: User
Power-On Reset Flag – Useful for reset detection, see text below.
1
Read / Write * Set to 1 upon Power-Up by hardware.
PORF
Cleared to 0 by: User
0
Read Only
Undefined
Reserved
* - This bit can be set by the DS2782, and may only be cleared via the 2-Wire interface.
** - LEARNF is only cleared if ACR reaches 0 after VOLT < VAE.
UVF
2
Read / Write *
19 of 28
DS2782
CONTROL REGISTER
All CONTROL register bits are read and write accessible. The CONTROL register is recalled from Parameter
EEPROM memory at power-up. Register bit values can be modified in shadow RAM after power-up. Shadow RAM
values can be saved as the power up default values by using the Copy Data command.
Figure 19. Control Register Format
ADDRESS
FIELD
Reserved
60h
BIT
7
FORMAT
UVEN
6
Read/Write
PMOD
5
Read/Write
Reserved
0:4
BIT DEFINITION
ALLOWABLE VALUEs
Undefined
Under Voltage SLEEP Enable
0: Disables transition to SLEEP mode based on VIN voltage
1: Enables transition to SLEEP mode if,
VIN < VSLEEP AND SDA, SCL stable at either logic level for tSLEEP
Power Mode Enable
0: Disables transition to SLEEP mode based on SDA, SCL logic state
1: Enables transition to SLEEP mode if SDA, SCL at a logic low for
tSLEEP
Undefined
SPECIAL FEATURE REGISTER
All Special Feature Register bits are read and write accessible, with default values specified in each bit definition.
Figure 20. Special Feature Register Format
ADDRESS
FIELD
Reserved
15h
BIT
2:7
FORMAT
SAWE
1
Read/Write
PIOSC
0
Read/Write
BIT DEFINITION
ALLOWABLE VALUES
Undefined
Slave Address Write Enable
0: Disables writes to the Slave Address Register
1: Enables writes to the Slave Address Register
Power-up default: 0 (writes disabled)
PIO Sense and Control
Read values
0: PIO pin ≤ Vil
1: PIO pin ≥ Vih
Write values
0: Activates PIO pin open-drain output driver, forcing the PIO pin low
1: Disables the output driver, allowing the PIO pin to be pulled high or
used as an input
Power-up and SLEEP mode default: 1 (PIO pin is hi-Z)
Note: PIO pin has weak pulldown
20 of 28
DS2782
EEPROM REGISTER
The EEPROM register provides access control of the EEPROM blocks. EEPROM blocks can be locked to prevent
alteration of data within the block. Locking a block disables write access to the block. Once a block is locked, it
cannot be unlocked. Read access to EEPROM blocks is unaffected by the lock/unlock status.
Figure 21. EEPROM Register Format
ADDRESS
FIELD
1Fh
BIT
EEC
7
Read Only
LOCK
6
Read /
Write to 1
Reserved
BIT DEFINITION
ALLOWABLE VALUES
FORMAT
EEPROM Copy Flag
Set to 1 when: Copy Data command executed
Cleared to 0 when: Copy Data command completes
Note: While EEC = 1, writes to EEPROM addresses are ignored
Power-up default: 0
EEPROM Lock Enable
Host write to 1: Enables the Lock command. Host must issue Lock
command as next command after writing Lock Enable bit to 1.
Cleared to 0 when: Lock command completes or when Lock command
not the command issued immediately following the Write command
used to set the Lock Enable bit.
Power-up default: 0
Undefined
EEPROM Block 1 Lock Flag (Parameter EEPROM 60h – 7Fh)
0: EEPROM is not locked
1: EEPROM block is locked
Factory default: 0
EEPROM Block 0 Lock Flag (User EEPROM 20h – 2Fh)
0: EEPROM is not locked
1: EEPROM block is locked
Factory default: 0
2:6
BL1
1
Read Only
BL0
0
Read Only
PROGRAMMABLE SLAVE ADDRESS
The 2-Wire slave address of the DS2782 is stored in the parameter EEPROM block, address 7Eh. Programming
the slave address requires a write to set the SAWE (Slave Address Write Enable) bit in the Special Features
register, followed by a write to 7Eh with the desired slave address. The new slave address value is effective
following the write to 7Eh, and must be used to address the DS2782 on subsequent bus transactions. The slave
address value is not stored to EEPROM until a Copy EEPROM block 1 command is executed. Prior to executing
the Copy command, power cycling the DS2782 restores the original slave address value. The data format of the
slave address value in address 7Eh is shown in Figure 22. When not writing the slave address, the SAWE bit
should be written to a 0.
Figure 22. Slave Address Format
ADDRESS 7Eh
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
A6
A5
A4
A3
A2
A1
A0
X
A6-A0: Slave Address. A6-A0 contains the 7-bit slave address of the DS2782. The factory default is 0110100b.
X:
Reserved Bits.
21 of 28
DS2782
MEMORY
The DS2782 has a 256 byte linear memory space with registers for instrumentation, status, and control, as well as
EEPROM memory blocks to store parameters and user information. Byte addresses designated as “Reserved”
return undefined data when read. Reserved bytes should not be written. Several byte registers are paired into twobyte registers in order to store 16-bit values. The most significant byte (MSB) of the 16 bit value is located at a
even address and the least significant byte (LSB) is located at the next address (odd) byte. When the MSB of a
two-byte register is read, the MSB and LSB are latched simultaneously and held for the duration of the read data
command to prevent updates to the LSB during the read. This ensures synchronization between the two register
bytes. For consistent results, always read the MSB and the LSB of a two-byte register during the same read data
command sequence.
EEPROM memory consists of the NV EEPROM cells overlaid with volatile shadow RAM. The Read Data and Write
Data commands allow the 2-Wire interface to directly accesses only the shadow RAM. The Copy Data and Recall
Data function commands transfer data between the shadow RAM and the EEPROM cells. In order to modify the
data stored in the EEPROM cells, data must be written to the shadow RAM and then copied to the EEPROM. In
order to verify the data stored in the EEPROM cells, the EEPROM data must be recalled to the shadow RAM and
then read from the shadow RAM. See Figure 23.
USER EEPROM
A 16 byte User EEPROM memory (block 0, addresses 20h - 2Fh) provides NV memory that is uncommitted to
other DS2782 functions. Accessing the User EEPROM block does not affect the operation of the DS2782. User
EEPROM is lockable, and once locked, write access is not allowed. The battery pack or host system manufacturer
can program lot codes, date codes and other manufacturing, warranty, or diagnostic information and then lock it to
safeguard the data. User EEPROM can also store parameters for charging to support different size batteries in a
host device as well as auxiliary model data such as time to full charge estimation parameters.
PARAMETER EEPROM
Model data for the cells, as well as application operating parameters are stored in the Parameter EEPROM
memory (block 1, addresses 60h - 7Fh). The ACR (MSB and LSB) and AS registers are automatically saved to
EEPROM when the RARC result crosses 4% boundaries. This allows the DS2782 to be located outside the
protection FETs. In this manner, if a protection device is triggered, the DS2782 cannot lose more that 4% of charge
or discharge data.
Figure 23. EEPROM Access via Shadow RAM
Copy
EEPROM
Serial
Interface
Write
Read
Shadow RAM
22 of 28
Recall
DS2782
Table 2. Memory Map
ADDRESS (HEX)
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C to 1E
1F
20 to 2F
30 to 37
38 to 5F
60 to 7F
80 to EF
F0 to F7
80 to FF
FE
FF
DESCRIPTION
Reserved
STATUS - Status Register
RAAC - Remaining Active Absolute Capacity MSB
RAAC - Remaining Active Absolute Capacity LSB
RSAC - Remaining Standby Absolute Capacity MSB
RSAC - Remaining Standby Absolute Capacity LSB
RARC - Remaining Active Relative Capacity
RSRC - Remaining Standby Relative Capacity
IAVG - Average Current Register MSB
IAVG - Average Current Register LSB
TEMP - Temperature Register MSB
TEMP - Temperature Register LSB
VOLT - Voltage Register MSB
VOLT - Voltage Register LSB
CURRENT - Current Register MSB
CURRENT - Current Register LSB
ACR - Accumulated Current Register MSB
ACR - Accumulated Current Register LSB
ACRL - Low Accumulated Current Register MSB
ACRL - Low Accumulated Current Register LSB
AS - Age Scalar
SFR - Special Feature Register
FULL - Full Capacity MSB
FULL - Full Capacity LSB
AE - Active Empty MSB
AE - Active Empty LSB
SE - Standby Empty MSB
SE - Standby Empty LSB
Reserved
EEPROM - EEPROM Register
User EEPROM, Lockable, Block 0
Additional User EEPROM, Lockable, Block 0
Reserved
Parameter EEPROM, Lockable, Block 1
Reserved
Unique ID
Reserved
Function Command Register
Reserved
READ/WRITE
R
R/W
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R/W*
R/W*
R
R
R/W*
R/W
R
R
R
R
R
R
—
R/W
R/W
R/W+
—
R/W
—
R+
—
W
—
* Register value is automatically saved to EEPROM during ACTIVE mode operation and recalled from EEPROM on power up.
+ Unique 64 bit ID is a factory option available by special order. Units with IDs do not allow access to additional user EEPROM block 0.
23 of 28
DS2782
Table 3. Parameter EEPROM Memory Block 1
ADDRESS
(HEX)
60
DESCRIPTION
CONTROL - Control Register
ADDRESS
(HEX)
70
DESCRIPTION
AE 3040 Slope
61
AB - Accumulation Bias
71
AE 2030 Slope
62
AC - Aging Capacity MSB
72
AE 1020 Slope
63
AC - Aging Capacity LSB
73
AE 0010 Slope
64
VCHG - Charge Voltage
74
SE 3040 Slope
65
IMIN - Minimum Charge Current
75
SE 2030 Slope
66
VAE - Active Empty Voltage
76
SE 1020 Slope
67
IAE - Active Empty Current
77
SE 0010 Slope
68
Active Empty 40
78
RSGAIN - Sense Resistor Gain MSB
69
RSNSP - Sense Resistor Prime
79
RSGAIN - Sense Resistor Gain LSB
6A
Full 40 MSB
7A
RSTC - Sense Resistor Temp. Coeff.
6B
Full 40 LSB
7B
FRSGAIN - Factory Gain MSB
6C
Full 3040 Slope
7C
FRSGAIN - Factory Gain LSB
6D
Full 2030 Slope
7D
Reserved
6E
Full 1020 Slope
7E
2-Wire Slave Address
6F
Full 0010 Slope
7F
Reserved
2-WIRE BUS SYSTEM
The 2-Wire bus system supports operation as a slave only device in a single or multi-slave, and single or multimaster system. Up to 128 slave devices may share the bus by uniquely setting the 7-bit slave address. The 2-wire
interface consists of a serial data line (SDA) and serial clock line (SCL). SDA and SCL provide bidirectional
communication between the DS2782 slave device and a master device at speeds up to 400 kHz. The DS2782’s
SDA pin operates bi-directionally, that is, when the DS2782 receives data, SDA operates as an input, and when the
DS2782 returns data, SDA operates as an open drain output, with the host system providing a resistive pull-up.
The DS2782 always operates as a slave device, receiving and transmitting data under the control of a master
device. The master initiates all transactions on the bus and generates the SCL signal as well as the START and
STOP bits which begin and end each transaction.
Bit Transfer
One data bit is transferred during each SCL clock cycle, with the cycle defined by SCL transitioning low-to-high and
then high-to-low. The SDA logic level must remain stable during the high period of the SCL clock pulse. Any
change in SDA when SCL is high is interpreted as a START or STOP control signal.
Bus Idle
The bus is defined to be idle, or not busy, when no master device has control. Both SDA and SCL remain high
when the bus is idle. The STOP condition is the proper method to return the bus to the idle state.
START and STOP Conditions
The master initiates transactions with a START condition (S), by forcing a high-to-low transition on SDA while SCL
is high. The master terminates a transaction with a STOP condition (P), a low-to-high transition on SDA while SCL
is high. A Repeated START condition (Sr) can be used in place of a STOP then START sequence to terminate one
transaction and begin another without returning the bus to the idle state. In multi-master systems, a Repeated
START allows the master to retain control of the bus. The START and STOP conditions are the only bus activities
in which the SDA transitions when SCL is high.
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DS2782
Acknowledge Bits
Each byte of a data transfer is acknowledged with an Acknowledge bit (A) or a No Acknowledge bit (N). Both the
master and the DS2782 slave generate acknowledge bits. To generate an Acknowledge, the receiving device must
pull SDA low before the rising edge of the acknowledge-related clock pulse (ninth pulse) and keep it low until SCL
returns low. To generate a No Acknowledge (also called NAK), the receiver releases SDA before the rising edge of
the acknowledge-related clock pulse and leaves SDA high until SCL returns low. Monitoring the acknowledge bits
allows for detection of unsuccessful data transfers. An unsuccessful data transfer can occur if a receiving device is
busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the bus master should reattempt communication.
Data Order
A byte of data consists of 8 bits ordered most significant bit (msb) first. The least significant bit (lsb) of each byte is
followed by the Acknowledge bit. DS2782 registers composed of multi-byte values are ordered most significant
byte (MSB) first. The MSB of multi-byte registers is stored on even data memory addresses.
Slave Address
A bus master initiates communication with a slave device by issuing a START condition followed by a Slave
Address (SAddr) and the read/write (R/W) bit. When the bus is idle, the DS2782 continuously monitors for a
START condition followed by its slave address. When the DS2782 receives a slave address that matches the value
in its Programmable Slave Address register, it responds with an Acknowledge bit during the clock period following
the R/W bit. The 7-bit Programmable Slave Address register is factory programmed to 0110100. The slave address
can be re-programmed, refer to the Programmable Slave Address section for details.
Read/Write Bit
The R/W bit following the slave address determines the data direction of subsequent bytes in the transfer. R/W = 0
selects a write transaction, with the following bytes being written by the master to the slave. R/W = 1 selects a read
transaction, with the following bytes being read from the stave by the master.
Bus Timing
The DS2782 is compatible with any bus timing up to 400kHz. No special configuration is required to operate at any
speed.
2-Wire Command Protocols
The command protocols involve several transaction formats. The simplest format consists of the master writing the
START bit, slave address, R/W bit, and then monitoring the acknowledge bit for presence of the DS2782. More
complex formats such as the Write Data, Read Data and Function command protocols write data, read data and
execute device specific operations. All bytes in each command format require the slave or host to return an
Acknowledge bit before continuing with the next byte. Each function command definition outlines the required
transaction format. The following key applies to the transaction formats.
Table 4. 2-Wire Protocol Key
KEY
S
SAddr
FCmd
MAddr
Data
A
N
DESCRIPTION
START bit
Slave Address (7-bit)
Function Command byte
Memory Address byte
Data byte written by master
Acknowledge bit - Master
No Acknowledge - Master
KEY
Sr
W
R
P
Data
A
N
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DESCRIPTION
Repeated START
R/W bit = 0
R/W bit = 1
STOP bit
Data byte returned by slave
Acknowledge bit - Slave
No Acknowledge - Slave
DS2782
Basic Transaction Formats
Write:
S SAddr W A MAddr A Data0 A P
A write transaction transfers one or more data bytes to the DS2782. The data transfer begins at the memory
address supplied in the MAddr byte. Control of the SDA signal is retained by the master throughout the transaction,
except for the Acknowledge cycles.
Read:
S SAddr W A MAddr A Sr SAddr R A Data0 N P
Write Portion
Read Portion
A read transaction transfers one or more bytes from the DS2782. Read transactions are composed of two parts, a
write portion followed by a read portion, and is therefore inherently longer than a write transaction. The write portion
communicates the starting point for the read operation. The read portion follows immediately, beginning with a
Repeated START, Slave Address with R/W set to a 1. Control of SDA is assumed by the DS2782 beginning with
the Slave Address Acknowledge cycle. Control of the SDA signal is retained by the DS2782 throughout the
transaction, except for the Acknowledge cycles. The master indicates the end of a read transaction by responding
to the last byte it requires with a No Acknowledge. This signals the DS2782 that control of SDA is to remain with
the master following the Acknowledge clock.
Write Data Protocol
The write data protocol is used to write to register and shadow RAM data to the DS2782 starting at memory
address MAddr. Data0 represents the data written to MAddr, Data1 represents the data written to MAddr + 1 and
DataN represents the last data byte, written to MAddr + N. The master indicates the end of a write transaction by
sending a STOP or Repeated START after receiving the last acknowledge bit.
S SAddr W A MAddr A Data0 A Data1 A … DataN A P
The msb of the data to be stored at address MAddr can be written immediately after the MAddr byte is
acknowledged. Because the address is automatically incremented after the least significant bit (lsb) of each byte is
received by the DS2782, the msb of the data at address MAddr + 1 is can be written immediately after the
acknowledgement of the data at address MAddr. If the bus master continues an auto-incremented write transaction
beyond address 4Fh, the DS2782 ignores the data. Data is also ignored on writes to read-only addresses and
reserved addresses, locked EEPROM blocks as well as a write that auto increments to the Function Command
register (address FEh). Incomplete bytes and bytes that are Not Acknowledged by the DS2782 are not written to
memory. As noted in the Memory Section, writes to unlocked EEPROM blocks modify the shadow RAM only.
Read Data Protocol
The Read Data protocol is used to read register and shadow RAM data from the DS2782 starting at memory
address specified by MAddr. Data0 represents the data byte in memory location MAddr, Data1 represents the data
from MAddr + 1 and DataN represents the last byte read by the master.
S SAddr W A MAddr A Sr SAddr R A Data0 A Data1 A … DataN N P
Data is returned beginning with the most significant bit (msb) of the data in MAddr. Because the address is
automatically incremented after the least significant bit (lsb) of each byte is returned, the msb of the data at
address MAddr + 1 is available to the host immediately after the acknowledgement of the data at address MAddr. If
the bus master continues to read beyond address FFh, the DS2782 outputs data values of FFh. Addresses labeled
“Reserved” in the memory map return undefined data. The bus master terminates the read transaction at any byte
boundary by issuing a No Acknowledge followed by a STOP or Repeated START.
Function Command Protocol
The Function Command protocol executes a device specific operation by writing one of the function command
values (FCmd) to memory address FEh. Table 5 lists the DS2782 FCmd values and describes the actions taken by
each. A one byte write protocol is used to transmit the function command, with the MAddr set to FEh and the data
byte set to the desired FCmd value. Additional data bytes are ignored. Data read from memory address FEh is
undefined.
S SAddr W A MAddr=0FEh A FCmd A P
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DS2782
Table 5. Function Commands
FUNCTION
COMMAND
TARGET
EEPROM
BLOCK
FCMD
VALUE
0
42h
1
44h
0
B2h
1
B4h
0
63h
1
66h
Copy Data
Recall Data
Lock
DESCRIPTION
This command copies the shadow RAM to the target EEPROM block.
Copy Data commands that target locked blocks are ignored. While the
Copy Data command is executing, the EEC bit in the EEPROM register is
set to 1, and Write Data commands with MAddr set to any address within
the target block are ignored. Read Data and Write Data commands with
MAddr set outside the target block are processed while the copy is in
progress. The Copy Data command execution time, tEEC, is 2ms typical
and starts after the FCMD byte is acknowledged. Subsequent Copy or
Lock commands must be delayed until the EEPROM programming cycle
completes.
This command recalls the contents of the targeted EEPROM block to its
shadow RAM.
This command locks (write-protects) the targeted EEPROM block. The
LOCK bit in the EEPROM register must be set to 1 before the lock
command is executed. If the LOCK bit is 0, the lock command has no
effect. The lock command is permanent; a locked block can never be
written again. The Lock command execution time, tEEC, is 2ms typical and
starts after the FCMD byte is acknowledged. Subsequent Copy or Lock
commands must be delayed until the EEPROM programming cycle
completes.
64-BIT UNIQUE ID
The DS2782 can be special ordered with a unique, factory-programmed ID that is 64 bits in length. The first eight
bits are the product family code (B2h for DS2782). The next 48 bits are a unique 40-bit serial number followed by
0x82h. The last eight bits are a cyclic redundancy check (CRC) of the first 56 bits (see Figure 24). The 64-bit ID
can be read as 8 bytes starting at memory address F0h. The 64-bit ID is read only.
Figure 24. 64-Bit ID Format
8-BIT CRC
48-BIT SERIAL NUMBER
msb
8-BIT FAMILY
CODE (B2h)
lsb
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
8 TSSOP
H8+2
21-0175
10 TDFN-EP
T1034+1
21-0268
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DS2782
REVISION HISTORY
REVISION
DATE
062708
101708
051209
DESCRIPTION
Changed the Figure 3 multicell circuit to properly divide cell voltage and added a
note describing n = number of cells.
Added Figures 14 to 17 for the RAAC, RSAC, RARC, and RSRC descriptions.
Added Package Information table.
Changed operating voltage to 4.5V maximum
Changed the VDD maximum operating range in the Electrical Characteristics
table to 4.5V.
Multicell schematic regulator changed to MAX1616 and set to 4.5V.
Added “VIN pin is limited to VDD voltage” text in the Voltage Measurement
section.
PAGES
CHANGED
6
17, 18
27
2,3,6,7
2, 3
6
7
28 of 28
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