LP3939 Power Amplifier Driver for Dual Band CDMA Handsets General Description Features Designed specifically for Qualcomm’s MSM3xxx and MSM5xxx series, the LP3939 is an integrated device that provides interface to the baseband processor to powerswitch two independent power amplifiers in dual band applications. By integrating the discrete components necessary to achieve the same functions, the LP3939 drastically reduces board space and component cost. n Power-switch for dual band CDMA power amplifier Key Specifications n 0.002 µA Quiescent Current (typ) n LLP16 Package Applications n Dual-band CDMA phones with MSM3xxx or MSM5xxx platform LP3939 Application Circuit 20083101 Note: This application circuit shows the connection interface to a typical Skyworks PA. Connections to other PA vendors may vary slightly. © 2003 National Semiconductor Corporation DS200831 www.national.com LP3939 Power Amplifier Driver for Dual Band CDMA Handsets November 2003 LP3939 Connection Diagram (LLP16: NSC Marketing Drawing LQA16A) 20083102 Top View See NS Package Number LQA16A Pin Description Pin Name Functional Description 1 INV_A1 2 VDD2 3 PCS_ON Output, open drain 4 PCS_GAIN Output, open drain 5 INV_Y1 6 GAIN_MODE Input 7 EN_CELL Input 8 EN_PCS 9 CELL_GAIN Output, open drain 10 CELL_ON Output, open drain 11 VDD1 Input Supply. VDD1 and VDD2 must be tied together externally. Output Input Supply. VDD1 and VDD2 must be tied together externally. 12 PA_ON Output 13 INV_A2 Input 14 INV_Y2 15 GND 16 A1_SINK Output, open drain GND Output, open drain Ordering Information LP3939 Supplied as 1k Units, Tape and Reel LP3939 Supplied as 4.5k Units, Tape and Reel Package Marking LP3939ILQ LP3939ILQX National Logo UZXYTT LP3939 Note: U-wafer fab code Z-assembly plant code XY-date code TT-die run traceability www.national.com 2 Storage Temperature (Notes 1, −65˚C to +150˚C ESD (Note 4): 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VDD1, VDD2 2 kV Machine Model 200V Operating Ratings (Notes 1, 2) −0.3V to +6.0V EN_CELL, EN_PCS, GAIN_MODE, INV_A1, INV_A2, PA_ON, INV_Y1, CELL_ON, CELL_GAIN, PCS_ON, PCS_GAIN, INV_Y2 and A1_SINK Human Body Model VDD1, VDD2 1.8V to 5.5V Junction Temperature −40˚C to +125˚C Operating Temperature Thermal Resistance θJA (LLP16) −0.3V to (VDD + 0.3V) GND to GND SLUG ± 0.3V Junction Temperature 150˚C Maximum Power Dissipation (Note 3) −40˚C to +85˚C 39.8˚C/W Maximum Power Dissipation (Note 5) 1.38W 2.0W DC Electrical Characteristics Unless otherwise noted, VDD1 = VDD2 = 3V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40˚C to +85˚C. (Note 6) Symbol Parameter Conditions Typ Limit Min Max Units IIN Input Current All Input Pins 0.05 5 µA IQ Quiescent Current All inputs tied to VDD or ground. No load at the outputs. 0.002 5 µA ILEAKAGE Output Leakage Current CELL_ON, PCS_ON CELL_GAIN, PCS_GAIN 10 A1_SINK 5 RDS-ON VIH VIL VOH VOL MOSFET’s ON Resistance Logic High Input Logic Low Input Logic High Output Logic Low Output P-Ch, VDD = 3V CELL_ON, PCS_ON CELL_GAIN, PCS_GAIN 275 P-Ch, VDD = 2V CELL_ON, PCS_ON CELL_GAIN, PCS_GAIN 430 500 mΩ 650 1.8V ≤ VDD < 2.5V EN_CELL, EN_PCS, INV_A1, GAIN_MODE, INV_A2 1.4 2.5V ≤ VDD ≤ 3.5V EN_CELL, EN_PCS, INV_A1, GAIN_MODE, INV_A2 2.0 V 1.8V ≤ VDD ≤ 3.5V EN_CELL, EN_PCS, INV_A1, GAIN_MODE, INV_A2 0.4 PA_ON, INV_Y1, ISOURCE = 1 mA 2.93 INV_Y2, ISOURCE = 1 mA 2.74 V 2.8 V 2.5 PA_ON, INV_Y1, ISINK = 1 mA 80 200 INV_Y2, A1_SINK ISINK = 1 mA 16 55 3 µA mV www.national.com LP3939 Absolute Maximum Ratings LP3939 AC Electrical Characteristics Unless otherwise noted, VDD1 = VDD2 = 3V, CLOAD = 50 pF. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40˚C to +85˚C. (Note 7) Symbol tPLH tPHL tRISE TFALL Parameter Propagations Delay Low to High Propagations Delay High to Low Rise Time Fall Time Conditions Typ Limit Min Max Units EN_CELL to PA_ON or EN_PCS to PA_ON 10 80 ns EN_CELL to CELL_ON or EN_PCS to PCS_ON RPD = 100Ω 7 56 ns GAIN_MODE to CELL_GAIN or GAIN_MODE to PCS_GAIN RPD = 100Ω 7 56 ns INV_A1 to INV_Y1 10 80 ns INV_A2 to INV_Y2 25 200 ns EN_CELL to PA_ON or EN_PCS to PA_ON 10 80 ns EN_CELL to CELL_ON or EN_PCS to PCS_ON RPD = 100Ω 25 200 ns GAIN_MODE to CELL_GAIN or GAIN_MODE to PCS_GAIN RPD = 100Ω 20 160 ns INV_A1 to INV_Y1 10 80 ns INV_A1 to A1_SINK RPU = 10 kΩ 5 40 ns INV_A2 to INV_Y2 5 40 ns PA_ON 15 120 INV_Y2 50 400 INV_Y1 20 160 PA_ON 15 120 INV_Y2 10 80 INV_Y1 20 160 ns ns Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient temperature. The 2.0W rating appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150˚C for TJ, 70˚C for TA and 39.8˚C/W for θJA. More power can be dissipated safely at ambient temperatures below 70˚C. Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute Maximum power dissipation can be increased by 25 mW for each degree below 70˚C, and it must be derated by 25 mW for each degree above 70˚C. Note 4: The human body model is 100 pF discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Note 5: Like the Absolute Maximum power dissipation, the maximum power dissipation depends on the ambient temperature. The 1.38W rating appearing under Absolute Maximum Ratings results from substituting the Maximum junction temperature, 125˚C for TJ, 70˚C for TA and 39.8˚C/W for θJA. More power can be dissipated safely at ambient temperatures below 70˚C. Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute Maximum power dissipation can be increased by 25 mW for each degree below 70˚C, and it must be derated by 25 mW for each degree above 70˚C. Note 6: All limits are guaranteed by testing or statistical analysis. Note 7: All AC parameters are guaranteed by design, not production tested. www.national.com 4 LP3939 LP3939 Block Diagram 20083104 Truth Tables TABLE 1. PA Enables INPUTS OUTPUTS EN_CELL EN_PCS CELL_ON PCS_ON PA_ON 0 0 0 0 0 1 0 1 0 1 0 1 0 1 1 1 1 Not Valid Note: Measured with a 10 kΩ pull down resistor on CELL_ON and PCS_ON. 5 www.national.com LP3939 Truth Tables (Continued) TABLE 2. PA Gain Mode INPUTS OUTPUTS GAIN_MODE EN_CELL EN_PCS CELL_GAIN PCS_GAIN 0 0 0 0 0 0 1 0 1 0 1 1 0 0 0 0 0 1 0 1 1 0 1 0 0 X 1 1 Not Valid Note: Measured with a 10 kΩ pull down resistor on CELL_GAIN and PCS_GAIN. TABLE 3. Current Sink Control INPUTS OUTPUTS INV_A1 INV_Y1 A1_SINK 0 1 0 1 1 0 INV_A2 INV_Y2 0 1 1 0 Note: Measured with a 10 kΩ pull up resistor on A1_SINK. www.national.com 6 inches (millimeters) unless otherwise noted NOTES: UNLESS OTHERWISE SPECIFIED 1. 2. STANDARD LEAD FINISH TO BE 5.08 MICROMETERS MINIMUM LEAD/TIN (SOLDER) ON COPPER. NO JEDEC REGISTRATION AS OF APRIL 2000. 16-Lead Plastic Quad Package Order Number LP3939ILQ or LP3939ILQX NS Package Number LQA16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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