AD AD7899

a
FEATURES
Fast (2.2 ␮s) 14-Bit ADC
400 kSPS Throughput Rate
0.3 ␮s Track/Hold Acquisition Time
Single Supply Operation
Selection of Input Ranges: ⴞ10 V, ⴞ5 V and ⴞ2.5 V
0 V to 2.5 V and 0 V to 5 V
High-Speed Parallel Interface which Also Allows
Interfacing to 3 V Processors
Low Power, 80 mW Typ
Power-Saving Mode, 20 ␮W Typ
Overvoltage Protection on Analog Inputs
Power-Down Mode via STBY Pin
5 V Single Supply
14-Bit 400 kSPS ADC
AD7899
FUNCTIONAL BLOCK DIAGRAM
VREF
AVDD
VDRIVE
6k⍀
STBY
AD7899
2.5V
REFERENCE
+
–
RD
TRACK/HOLD
VINA
VINB
DB13
SIGNAL
SCALING
14-BIT
ADC
OUTPUT
LATCH
DB0
CS
BUSY/EOC
CONVERSION
CONTROL
LOGIC
CONVST
INT/EXT
CLOCK
SELECT
CLKIN
INT
CLOCK
GND
OPGND
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD7899 is a fast, low-power, 14-bit A/D converter that
operates from a single 5 V supply. The part contains a 2.2 µs
successive-approximation ADC, a track/hold amplifier, 2.5 V
reference, on-chip clock oscillator, signal conditioning circuitry,
and a high-speed parallel interface. The part accepts analog input
ranges of ± 10 V, ± 5 V, ± 2.5 V, 0 V to 2.5 V, and 0 V to 5 V.
Overvoltage protection on the analog input for the part allows
the input voltage to be exceeded without damaging the parts.
1. The AD7899 features a fast (2.2 µs) ADC allowing throughput rates of up to 400 kSPS.
Speed of conversion can be controlled either by an internally
trimmed clock oscillator or by an external clock.
A conversion start signal (CONVST) places the track/hold into
hold mode and initiates conversion. The BUSY/EOC signal
indicates the end of the conversion.
Data is read from the part via a 14-bit parallel data bus using the
standard CS and RD signals. Maximum throughput for the
AD7899 is 400 kSPS.
2. The AD7899 operates from a single 5 V supply and consumes only 80 mW typ making it ideal for low power and
portable applications.
3. The part offers a high-speed parallel interface. The interface
can operate in 3 V and 5 V mode allowing for easy connection to 3 V or 5 V microprocessors, microcontrollers, and
digital signal processors.
4. The part is offered in three versions with different analog
input ranges. The AD7899-1 offers the standard industrial
ranges of ± 10 V and ± 5 V; the AD7899-2 offers a unipolar
range of 0 V to 2.5 or 0 V to 5 V, and the AD7899-3 has an
input range of ± 2.5 V.
The AD7899 is available in a 28-lead SOIC and SSOP packages.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2001
(VDD = 5 V ⴞ 5%, AGND = DGND = 0 V, VREF = Internal. Clock = Internal, all specifications
MIN to TMAX and valid for VDRIVE = 3 V ⴞ 5% and 5 V ⴞ 5% unless otherwise noted.)
AD7899–SPECIFICATIONS T
Parameter
A
Version1
B
Version1
S
Version1
Unit
SAMPLE AND HOLD
–0.1 dB Full Power Bandwidth
–3 dB Full Power Bandwidth
Aperture Delay
Aperture Jitter
500
4.5
20
25
500
4.5
20
25
500
4.5
20
25
kHz typ
MHz typ
ns max
ps typ
DYNAMIC PERFORMANCE2
AD7899-1
Signal to (Noise + Distortion)
Ratio3 @ 25C
TMIN to TMAX
Total Harmonic Distortion3
Peak Harmonic or Spurious Noise 3
AD7899-2
Signal to (Noise + Distortion)
Ratio3 @ 25C
TMIN to TMAX
Total Harmonic Distortion3
Peak Harmonic or Spurious Noise 3
AD7899-3
Signal to (Noise + Distortion)
Ratio3 @ 25C
TMIN to TMAX
Total Harmonic Distortion3
Peak Harmonic or Spurious Noise 3
Intermodulation Distortion 3
2nd Order Terms
3rd Order Terms
DC ACCURACY
Resolution
Relative Accuracy (INL)3
Differential Nonlinearity (DNL)3
AD7899-1
Input Voltage Range
Input Current
Positive Gain Error3
Negative Gain Error3
Bipolar Zero Error
AD7899-2
Input Voltage Range
Input Current
Positive Gain Error3
Offset Error3
AD7899-3
Input Voltage Range
Input Current
Positive Gain Error3
Negative Gain Error3
Bipolar Zero Error
REFERENCE INPUT/OUTPUT
VREF IN Input Voltage Range
VREF IN Input Capacitance4
VREF OUT Output Voltage
VREF OUT Error @ 25C
VREF OUT Error T MIN to TMAX
VREF OUT Temperature Coefficient
VREF OUT Output Impedance
Test Conditions/Comments
fIN = 100 kHz, fS = 400 kSPS
78
78
–84
–86
78
78
–84
–86
78
77
–82
–85
78
77
–82
–82
dB min
dB min
dB max
dB max
dB min
dB min
dB max
dB max
78
77
–84
–86
78
77
–84
–86
dB min
dB min
dB max
dB max
–89
–89
–89
–89
–89
–89
dB typ
dB typ
14
±2
±1
14
± 1.5
±1
14
±2
±1
Bits
LSB max
LSB max
± 5, ± 10
0.8, 0.8
± 10
± 10
± 12
± 5, ± 10
0.8, 0.8
±8
±8
±8
± 12
± 12
± 12
Volts
mA max
LSB max
LSB max
LSB max
fa = 49 kHz, fb = 50 kHz
0 to 2.5
0 to 5
0.4, 800
± 14
± 10
No Missing Codes Guaranteed
VIN = –5 V and –10 V Respectively
Volts
µA max
LSB max
LSB max
± 2.5
0.8
± 14
± 14
± 14
± 2.5
0.8
± 12
± 12
± 12
2.375/2.625
10
2.5
± 10
± 20
25
6
2.375/2.625
10
2.5
± 10
± 20
25
6
Volts
mA max
LSB max
LSB max
LSB max
–2–
2.375/2.625
10
2.5
± 10
± 25
25
6
VMIN/VMAX
pF max
V nom
mV max
mV max
ppm/C typ
kΩ typ
VIN = 2.5 V, VIN = 5 V
VIN = –2.5 V
2.5 V ± 5%
See Reference Section
REV. A
AD7899
Parameter
A
Version1
B
Version1
S
Version1
Unit
Test Conditions/Comments
VDRIVE/2 + 0.4
VDRIVE/2 – 0.4
± 10
10
VDRIVE/2 + 0.4
VDRIVE/2 – 0.4
± 10
10
VDRIVE/2 + 0.4
VDRIVE/2 – 0.4
± 10
10
V min
V max
µA max
pF max
VDD = 5 V ± 5%
VDD = 5 V ± 5%
VDRIVE – 0.4
0.4
VDRIVE – 0.4
0.4
VDRIVE – 0.4
0.4
V min
V max
ISOURCE = 400 µA
ISINK = 1.6 mA
± 10
10
± 10
10
± 10
10
µA max
pF max
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, C IN4
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
DB13–DB0
High Impedance
Leakage Current
Capacitance4
Output Coding
AD7899-1, AD7899-3
AD7899-2
CONVERSION RATE
Conversion Time
Track/Hold Acquisition Time2, 3
Throughput Time
POWER REQUIREMENTS
VDD
IDD
Normal Mode
Standby Mode
Power Dissipation
Normal Mode
Standby Mode
Two’s Complement
Straight (Natural) Binary
2.2
0.3
400
2.2
0.3
400
2.2
0.3
400
µs max
µs max
kSPS max
5
5
5
V nom
25
20
25
20
25
20
mA max
µA max
Typically 16 mA
(5 µA typ) Logic Inputs = 0 V or
VDD
125
100
125
100
125
125
mW max
µW max
Typically 80 mW, VDD = 5 V
NOTES
1
Temperature Ranges are as follows : A, B Versions: –40C to +85C. S Version: –55°C to +125°C.
2
Performance measured through full channel (SHA and ADC).
3
See Terminology.
4
Sample tested @ 25°C to ensure compliance.
Specifications subject to change without notice.
REV. A
–3–
AD7899
TIMING CHARACTERISTICS1, 2 (V
DD = 5 V ⴞ 5%, AGND = DGND = 0 V, VREF = Internal, Clock = Internal; All specifications TMIN
to TMAX and valid for VDRIVE = 3 V ⴞ 5% and 5 V ⴞ 5% unless otherwise noted.)
A, B and S
Versions
Unit
Test Conditions/Comments
µs max
µs max
µs max
ns min
ns max
µs max
Conversion Time, Internal Clock
CLKIN = 6.5 MHz
Acquisition Time
EOC Pulsewidth
tWAKE-UP – External VREF5
2.2
2.46
0.3
120
180
2
t1
t2
35
70
ns min
ns min
0
0
35
35
40
5
30
0
ns min
ns min
ns min
ns max
ns max
ns min
ns max
ns min
CS to RD Setup Time
CS to RD Hold Time
Read Pulsewidth
Data Access Time after Falling Edge of RD, VDRIVE = 5 V
Data Access Time after Falling Edge of RD, VDRIVE = 3 V
Bus Relinquish Time after Rising Edge of RD
0
20
100
ns min
ns min
ns min
CLKIN to CONVST Rising Edge Setup Time
CLKIN to CONVST Rising Edge Hold Time
CONVST Rising Edge to CLK Falling Edge
Parameter
tCONV
tACQ
tEOC
Read Operation
t3
t4
t5
t6 3
t7 4
t8
External Clock
t9
t10
t11
STBY Rising Edge to CONVST Rising Edge
(See Standby Mode Operation)
CONVST Pulsewidth
CONVST Rising Edge to BUSY Rising Edge
BUSY Falling Edge to RD Delay
NOTES
1
Sample tested at 25°C to ensure compliance. All input signals are measured with tr = tf = 1 ns (10% to 90% of V DRIVE) and timed from a voltage level of V DRIVE/2.
2
See Figures 5, 6, 7, and 8.
3
Measured with the load circuit of Figure 1 and defined as the time required for an output to cross 0.8 V or 2.0 V.
4
These times are derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then
extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that the times quoted in the timing characteristics are the true bus
relinquish times of the part and as such are independent of external bus loading capacitances.
5
Refer to the Standby Mode Operation section.
Specifications subject to change without notice.
1.6mA
TO
OUTPUT
PIN
1.6V
50pF
400␮A
Figure 1. Load Circuit for Access Time and Bus Relinquish Time
–4–
REV. A
AD7899
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDRIVE to DGND . . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V
Analog Input Voltage to AGND
AD7899-1 (± 10 V Range) . . . . . . . . . . . . . . . . . . . . ± 18 V
AD7899-1 (± 5 V Range) . . . . . . . . . . . . . . . –9 V to +18 V
AD7899-2 . . . . . . . . . . . . . . . . . . . . . . . . . . –1 V to +18 V
AD7899-3 . . . . . . . . . . . . . . . . . . . . . . . . . . –4 V to +18 V
Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (A, B Version) . . . . . . . . . . . –40°C to +85°C
Military (S Version) . . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . 220°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7899 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model
Input Ranges
AD7899AR-1
AD7899BR-1
AD7899SR-1
AD7899AR-2
AD7899AR-3
AD7899BR-3
AD7899ARS-1
AD7899ARS-2
AD7899ARS-3
± 5 V, ± 10 V
± 5 V, ± 10 V
± 5 V, ± 10 V
REV. A
0 V to 5 V, 0 V to 2.5 V
± 2.5 V
± 2.5 V
± 5 V, ± 10 V
0 V to 5 V, 0 V to 2.5 V
± 2.5 V
Relative
Accuracy
Temperature
Range
Package
Description
Package
Option
± 2 LSB
± 1.5 LSB
± 2 LSB
± 2 LSB
± 2 LSB
± 1.5 LSB
± 2 LSB
± 2 LSB
± 2 LSB
–40C to +85C
–40C to +85C
–55C to +125C
–40C to +85C
–40C to +85C
–40C to +85C
–40C to +85C
–40C to +85C
–40C to +85C
Small Outline
Small Outline
Small Outline
Small Outline
Small Outline
Small Outline
Shrink Small Outline
Shrink Small Outline
Shrink Small Outline
R-28
R-28
R-28
R-28
R-28
R-28
RS-28
RS-28
RS-28
–5–
AD7899
PIN FUNCTION DESCRIPTIONS
Pin
No.
Mnemonic
Description
1
VREF
2, 6
3, 4
5
7–13
14
GND
VINB, VINA
VDD
DB13–DB7
OPGND
15
VDRIVE
16–22
23
DB6–DB0
BUSY/EOC
24
25
26
RD
CS
CONVST
27
CLKIN
28
STBY
Reference Input/Output. This pin is provides access to the internal reference (2.5 V ± 20 mV) and
also allows the internal reference to be overdriven by an external reference source (2.5 V ± 5%).
A 0.1 µF decoupling capacitor should be connected between this pin and GND.
Ground Pin. This pin should be connected to the system’s analog ground plane.
Analog Inputs. See Analog Input Section.
Positive Supply Voltage, 5.0 V ± 5%.
Data Bit 13 is the MSB, followed by Data Bit 12 to Data Bit 7. Three-state outputs.
Output Driver Ground. This is the ground pin of the output drivers for D13 to D0 and BUSY/EOC. It should
be connected to the system’s analog ground plane .
This pin provides the positive supply voltage for the digital inputs and outputs. It is normally tied to VDD
but may also be powered by a 3 V ± 10% supply which allows the inputs and outputs to be interfaced
to 3 V processors and DSPs. VDRIVE should be decoupled with a 0.1 µF capacitor to GND.
Data Bit 6 to Data Bit 0. Three-state Outputs.
BUSY/EOC Output. Digital output pin used to signify that a conversion is in progress or that a conversion
has finished. The function of the BUSY/EOC is determined by the state of CONVST at the end of conversion. See the Timing and Control Section.
Read Input. Active low logic input which is used in conjunction with CS low to enable the data outputs.
Chip Select Input. Active low logic input. The device is selected when this input is active.
Convert Start Input. Logic Input. A low to high transition on this input puts the track/hold into hold mode
and starts conversion.
Conversion Clock Input. CLKIN is an externally applied clock which allows the user to control the
conversion rate of the AD7899. If the CLKIN input is high on the rising edge of CONVST an externally
applied clock will be used as the conversion clock. If the CLKIN is low on the rising edge of CONVST
the internal laser-trimmed oscillator is used as the conversion clock. Each conversion needs sixteen clock
cycles in order for the conversion to be completed. The externally applied clock should have a duty cycle
no greater than 60/40. The CLKIN pin can be tied to GND if an external clock is not required.
Standby Mode Input. Logic input which is used to put the device into the power save or standby mode.
The STBY input is high for normal operation and low for standby operation.
PIN CONFIGURATION
SOIC/SSOP
VREF 1
28 STBY
GND 2
27 CLKIN
VINB 3
26 CONVST
VINA 4
25 CS
VDD 5
24 RD
GND 6
AD7899
23 BUSY/EOC
TOP VIEW 22 DB0
DB12 8 (Not to Scale) 21 DB1
DB13 7
DB11 9
20 DB2
DB10 10
19 DB3
DB9 11
18 DB4
DB8 12
17 DB5
DB7 13
16 DB6
15 VDRIVE
OPGND 14
–6–
REV. A
AD7899
TERMINOLOGY
Signal to (Noise + Distortion) Ratio
This is the measured ratio of signal to (noise + distortion) at the
output of the A/D converter. The signal is the rms amplitude of
the fundamental. Noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (fS/2), excluding dc.
The ratio is dependent upon the number of quantization levels
in the digitization process; the more levels, the smaller the quantization noise. The theoretical signal to (noise + distortion) ratio
for an ideal N-bit converter with a sine wave input is given by:
Signal to (Noise + Distortion) = (6.02N + 1.76) dB
Thus for a 14-bit converter, this is 86.04 dB.
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the rms sum of
harmonics to the fundamental. For the AD7899 it is defined
2
2
2
2
2
V2 + V3 + V4 + V5 + V6
as: THD ( dB ) = 20 log
V1
where V1 is the rms amplitude of the fundamental and V2, V3,
V4, and V5 are the rms amplitudes of the second through the
fifth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2 and excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum, but for parts
where the harmonics are buried in the noise floor, it will be a
noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion
products at sum and difference frequencies of mfa ± nfb where
m, n = 0, 1, 2, 3, etc. Intermodulation terms are those for which
neither m nor n are equal to zero. For example, the second order
terms include (fa + fb) and (fa – fb), while the third order terms
include (2fa + fb), (2fa – fb), (fa + 2fb) and (fa – 2fb).
The AD7899 is tested using two input frequencies. In this case, the
second and third order terms are of different significance. The
second order terms are usually distanced in frequency from the
original sine waves while the third order terms are usually at a
frequency close to the input frequencies. As a result, the second
REV. A
and third order terms are specified separately. The calculation
of the intermodulation distortion is as per the THD specification where it is the ratio of the rms sum of the individual
distortion products to the rms amplitude of the fundamental
expressed in dBs.
Differential Nonlinearity
This is the difference between the measured and the ideal
1 LSB change between any two adjacent codes in the ADC.
Positive Gain Error (AD7899-1, AD7899-3)
This is the deviation of the last code transition (01 . . . 110 to
01 . . . 111) from the ideal 4 × VREF – 3/2 LSB (AD7899 at
± 10 V), 2 × VREF – 3/2 LSB (AD7899 at ± 5 V range) or VREF
– 3/2 LSB (AD7899 at ± 2.5 V range) after the Bipolar Offset
Error has been adjusted out.
Positive Gain Error (AD7899-2)
This is the deviation of the last code transition (11 . . . 110 to
11 . . . 111) from the ideal 2 × VREF – 3/2 LSB (AD7899 at
± 10 V), 2 × VREF – 3/2 LSB (AD7899 at 0 V to 5 V range) or
VREF – 3/2 LSB (AD7899 at 0 V to 2.5 V range) after the Unipolar Offset Error has been adjusted out.
Unipolar Offset Error (AD7899-2)
This is the deviation of the first code transition (00 . . . 00 to
00 . . . 01) from the ideal AGND +1/2 LSB
Bipolar Zero Error (AD7899-1, AD7899-2)
This is the deviation of the midscale transition (all 0s to all 1s)
from the ideal AGND – 1/2 LSB.
Negative Gain Error (AD7899-1, AD7899-3)
This is the deviation of the first code transition (10 . . . 000 to
10 . . . 001) from the ideal –4 × VREF + 1/2 LSB (AD7899 at
± 10 V), –2 × VREF + 1/2 LSB (AD7899 at ± 5 V range) or –VREF
+ 1/2 LSB (AD7899 at ± 2.5 V range) after Bipolar Zero Error
has been adjusted out.
Track/Hold Acquisition Time
Track/Hold acquisition time is the time required for the output
of the track/hold amplifier to reach its final value, within ± 1/2 LSB,
after the end of conversion (the point at which the track/hold
returns to track mode). It also applies to situations where there
is a step input change on the input voltage applied to the selected
VINA/VINB input of the AD7899. It means that the user must wait
for the duration of the track/hold acquisition time after the end
of conversion or after a step input change to VINA/VINB before
starting another conversion, to ensure that the part operates to
specification.
–7–
AD7899
external CONVST signal and the track/hold actually going into
hold) is typically 15 ns and, more importantly, is well matched
from device to device. It allows multiple AD7899s to sample
more than one channel simultaneously. At the end of a conversion,
the part returns to its tracking mode. The acquisition time of
the track/hold amplifier begins at this point.
CONVERTER DETAILS
The AD7899 is a high-speed, low-power, 14-bit A/D converter
that operates from a single 5 V supply. The part contains a
2.2 µs successive-approximation ADC, track/hold amplifier, an
internal 2.5 V reference and a high-speed parallel interface. The
part accepts an analog input range of ±10 V or ±5 V (AD7899-1),
0 V to 2.5 V or 0 V to 5 V (AD7899-2) and ±2.5 V (AD7899-3).
Overvoltage protection on the analog inputs for the part allows
the input voltage to go to ± 18 V (AD7899-1 with ± 10 V input
range), –9 V to +18 V (AD7899-1 with ± 5 V input range), –1 V
to +18 V (AD7899-2) and –4 V to +18 V (AD7899-3) without
causing damage.
Reference Section
The AD7899 contains a single reference pin, labelled VREF,
which either provides access to the part’s own 2.5 V reference or
allows an external 2.5 V reference to be connected to provide
the reference source for the part. The part is specified with a
2.5 V reference voltage.
A conversion is initiated on the AD7899 by pulsing the CONVST
input. On the rising edge of CONVST, the on-chip track/hold is
placed into hold and the conversion is started. The BUSY/EOC
output signal is triggered high on the rising edge of CONVST
and will remain high for the duration of the conversion sequence.
The conversion clock for the part is generated internally using a
laser-trimmed clock oscillator circuit. There is also the option of
using an external clock. An external noncontinuous clock is applied
to the CLKIN pin. If, on the rising edge of CONVST, this input
is high, the external clock will be used. The external clock should
not start until 100 ns after the rising edge of CONVST. The
optimum throughput is obtained by using the internally generated clock—see Using an External Clock. The BUSY/EOC signal
indicates the end of the conversion, and at this time the Track and
Hold returns to tracking mode. The conversion results can be
read at the end of the conversion (indicated by BUSY/EOC
going low) via a 14-bit parallel data bus with standard CS and RD
signals—see Timing and Control.
To use the internal reference as the reference source for the
AD7899, simply connect a 0.1 µF capacitor from the VREF pin
to AGND. The voltage that appears at this pin is internally
buffered before being applied to the ADC. If this reference is
required for use external to the AD7899, it should be buffered,
as the part has a FET switch in series with the reference output
resulting in a source impedance for this output of 6 kΩ nominal.
The tolerance on the internal reference is ± 10 mV at 25°C with
a typical temperature coefficient of 25 ppm/°C and a maximum
error over temperature of ± 20 mV.
If the application requires a reference with a tighter tolerance or
the AD7899 needs to be used with a system reference, the user
has the option of connecting an external reference to this VREF
pin. The external reference will effectively overdrive the internal
reference and thus provide the reference source for the ADC.
The reference input is buffered before being applied to the ADC
with the maximum input current of ± 100 µA. Suitable reference
sources for the AD7899 include the AD680, AD780, REF192,
and REF43 precision 2.5 V references.
Conversion time for the AD7899 is 2.2 µs and the track/hold
acquisition time is 0.3 µs. To obtain optimum performance from
the part, the read operation should not occur during a conversion
or during the 150 ns prior to the next CONVST rising edge.
This allows the part to operate at throughput rates up to 400 kHz
and achieve data sheet specifications.
Analog Input Section
The AD7899 is offered as three part types, the AD7899-1 where
the input can be configured for ± 10 V or a ± 5 V input voltage
range, the AD7899-2 where the input can be configured for 0 V
to 5 V or a 0 V to 2.5 V input voltage range and the AD7899-3
which handles input voltage range ± 2.5 V. The amount of current
flowing into the analog input will depend on the analog input
range and the analog input voltage. The maximum current flows
when negative full-scale is applied.
CIRCUIT DESCRIPTION
Track/Hold Section
The track/hold amplifier on the AD7899 allows the ADCs to
accurately convert an input sine wave of full-scale amplitude to
14-bit accuracy. The input bandwidth of the track/hold is greater
than the Nyquist rate of the ADC even when the ADC is operated at its maximum throughput rate of 400 kSPS (i.e., the
track/hold can handle input frequencies in excess of 200 kHz).
AD7899-1
Figure 2 shows the analog input section of the AD7899-1. The
input can be configured for ± 5 V or ± 10 V operation on the
AD7899-1. For ± 5 V operation, the VINA and VINB inputs are
tied together and the input voltage is applied to both. For ± 10 V
operation, the VINB input is tied to AGND and the input voltage
is applied to the VINA input. The VINA and VINB inputs are symmetrical and fully interchangeable.
The track/hold amplifier’s acquire input signals to 14-bit
accuracy in less than 300 ns The operation of the track/hold is
essentially transparent to the user. The track/hold amplifier
samples the input channel on the rising edge of CONVST. The
aperture time for the track/hold (i.e., the delay time between the
–8–
REV. A
AD7899
AD7899-2
AD7899-1
2.5V
REFERENCE
6k⍀
TO ADC
REFERENCE
CIRCUITRY
VREF
R1
VINA
VINB
R2
TO INTERNAL
COMPARATOR
TRACK/HOLD
R3
R4
Figure 3 shows the analog input section of the AD7899-2. Each
input can be configured for 0 V to 5 V operation or 0 V to 2.5 V
operation. For 0 V to 5 V operation, the VINB input is tied to
GND and the input voltage is applied to the VINA input. For
0 V to 2.5 V operation, the VINA and VINB inputs are tied together
and the input voltage is applied to both. The VINA and VINB
inputs are symmetrical and fully interchangeable.
For the AD7899-2, R1 = 4 kΩ and R2 = 4 kΩ. Once again, the
designed code transitions occur on successive integer LSB values.
Output coding is straight (natural) binary with 1 LSB = FSR/
16384 = 2.5 V/16384 = 0.153 mV, and 5 V/16384 = 0.305 mV,
for the 0 to 2.5 V and the 0 to 5 V options respectively. Table
II shows the ideal input and output transfer function for the
AD7899-2.
GND
AD7899-2
Figure 2. AD7899-1 Analog Input Structure
2.5V
REFERENCE
For the AD7899-1, R1 = 4 kΩ, R2 = 16 kΩ, R3 = 16 kΩ and
R4 = 8 kΩ. The resistor input stage is followed by the high
input impedance stage of the track/hold amplifier.
6k⍀
The designed code transitions take place midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, 5/2 LSBs
etc.) LSB size is given by the formula, 1 LSB = FSR/16384. For
the ±5 V range, 1 LSB = 10 V/16384 = 610.4 µV. For the ±10 V
range, 1 LSB = 20 V/16384 = 1.22 mV. Output coding is
two’s complement binary with 1 LSB = FSR/16384. The ideal
input/output transfer function for the AD7899-1 is shown in
Table I.
TO ADC
REFERENCE
CIRCUITRY
VREF
VINA
VINB
R1
TO INTERNAL
COMPARATOR
TRACK/HOLD
R2
Table I. Ideal Input/Output Code Table for the AD7899-1
Analog Input1
Digital Output
Code Transition
+FSR/2 – 3/2 LSB2
+FSR/2 – 5/2 LSB
+FSR/2 – 7/2 LSB
011 . . . 110 to 011 . . . 111
011 . . . 101 to 011 . . . 110
011 . . . 100 to 011 . . . 101
GND + 3/2 LSB
GND + 1/2 LSB
GND – 1/2 LSB
GND – 3/2 LSB
000 . . . 001 to 000 . . . 010
000 . . . 000 to 000 . . . 001
111 . . . 111 to 000 . . . 000
111 . . . 110 to 111 . . . 111
–FSR/2 + 5/2 LSB
–FSR/2 + 3/2 LSB
–FSR/2 + 1/2 LSB
100 . . . 010 to 100 . . . 011
100 . . . 001 to 100 . . . 010
100 . . . 000 to 100 . . . 001
NOTES
1
FSR is full-scale range and is 20 V for the ±10 V range and 10 V for the ±5 V
range, with VREF = 2.5 V.
2
1 LSB = FSR/16384 = 1.22 mV (±10 V – AD7899-1) and 610.4 µV (±5 V –
AD7899-1) with VREF = 2.5 V.
REV. A
Figure 3. AD7899-2 Analog Input Structure
Table II. Ideal Input/Output Code Table for the AD7899-2
Analog Input1
Digital Output
Code Transition
+FSR – 3/2 LSB2
+FSR – 5/2 LSB
+FSR – 7/2 LSB
111 . . . 110 to 111 . . . 111
111 . . . 101 to 111 . . . 110
111 . . . 100 to 111 . . . 101
GND + 5/2 LSB
GND + 3/2 LSB
GND + 1/2 LSB
000 . . . 010 to 000 . . . 011
000 . . . 001 to 000 . . . 010
000 . . . 000 to 000 . . . 001
NOTES
1
FSR is Full-Scale Range and is 0 to 2.5 V and 0 to 5 V for AD7899-2 with V REF
= 2.5 V.
2
1 LSB = FSR/16384 and is 0.153 mV (0 to 2.5 V) and 0.305 mV (0 to 5 V) for
AD7899-2 with VREF = 2.5 V.
–9–
AD7899
AD7899-3
Figure 4 shows the analog input section of the AD7899-3. The
analog input range is ± 2.5 V on the VINA input. The VINB input
can be left unconnected but if it is connected to a potential then
that potential must be GND.
AD7899-3
2.5V
REFERENCE
TIMING AND CONTROL
Starting a Conversion
The conversion is initiated by applying a rising edge to the
CONVST signal. This places the track/hold into hold mode and
starts the conversion. The status of the conversion is indicated
by the dual function signal BUSY/EOC. The AD7899 can operate
in two conversion modes, EOC (End Of Conversion) mode and
BUSY mode. The operating mode is determined by the state of
CONVST at the end of the conversion.
Selecting a Conversion Clock
6k⍀
The AD7899 has an internal laser trimmed oscillator which can
be used to control the conversion process. Alternatively an external
clock source can be used to control the conversion process. The
highest external clock frequency allowed is 6.5 MHz. This means
a conversion time of 2.46 µs compared to 2.2 µs using the internal clock. However in some instances it may be useful to use an
external clock when high throughput rates are not required. For
example two or more AD7899s may be synchronized by using
the same external clock for all devices. In this way there is no
latency between output logic signals due to differences in the
frequency of the internal clock oscillators.
TO ADC
REFERENCE
CIRCUITRY
VREF
R1
VINA
R2
TO INTERNAL
COMPARATOR
TRACK/HOLD
VINB
Figure 4. AD7899-3 Analog Input Structure
For the AD7899-3, R1 = 4 kΩ and R2 = 4 kΩ. The resistor
input stage is followed by the high input impedance stage of the
track/hold amplifier.
The designed code transitions take place midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, 5/2 LSBs
etc.) LSB size is given by the formula, 1 LSB = FSR/16384.
Output coding is two’s complement binary with 1 LSB = FSR/
16384 = 5 V/16384 = 610.4 µV. The ideal input/output transfer
function for the AD7899-3 is shown in Table III.
Table III. Ideal Input/Output Code Table for the AD7899-3
Analog Inputl
Digital Output
Code Transition
+FSR/2 – 3/2 LSB2
+FSR/2 – 5/2 LSB
+FSR/2 – 7/2 LSB
011 . . . 110 to 011 . . . 111
011 . . . 101 to 011 . . . 110
011 . . . 100 to 011 . . . 101
GND + 3/2 LSB
GND + 1/2 LSB
GND – 1/2 LSB
GND – 3/2 LSB
000 . . . 001 to 000 . . . 010
000 . . . 000 to 000 . . . 001
111 . . . 111 to 000 . . . 000
111 . . . 110 to 111 . . . 111
–FSR/2 + 5/2 LSB
–FSR/2 + 3/2 LSB
–FSR/2 + 1/2 LSB
100 . . . 010 to 100 . . . 011
100 . . . 001 to 100 . . . 010
100 . . . 000 to 100 . . . 001
On the rising edge of CONVST the AD7899 will examine the
status of the CLKIN pin. If this pin is low it will use the internal
laser trimmed oscillator as the conversion clock. If the CLKIN pin
is high the AD7899 will wait for an external clock to be supplied
to this pin which will then be used as the conversion clock. The
first falling edge of the external clock should not happen for at
least 100 ns after the rising edge of CONVST to ensure correct
operation. Figure 5 shows how the BUSY/EOC output is synchronized to the CLKIN signal. Each conversion requires 16 clocks.
The result of the conversion is transferred to the output data
register on the falling edge of the 15th clock cycle. When the
internal clock is selected the status of the CLKIN pin is free to
change during conversion but the CLKIN setup and hold times
must be observed in order to ensure that the correct conversion
clock is used. The CLKIN pin can also be tied low permanently if
the internal conversion clock is to be used.
t9
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
CLKIN
t 11
CONVST
BUSY/EOC
RD
NOTES
1
FSR is full-scale range is 5 V, with V REF = 2.5 V
2
1 LSB = FSR/16384 = 610.4 µV (± 2.5 V – AD7899-3) with V REF = 2.5 V.
CS
Figure 5. Using an External Clock
–10–
REV. A
AD7899
t 10
t9
CLKIN
t1
t ACQ
t EOC
CONVST
t2
QUIET
TIME
t8
BUSY/EOC
t CONV
t5
RD
t3
CS
t4
THREE-STATE
DATA
THREE-STATE
t6
t7
Figure 6. Conversion Sequence Timing Diagram (EOC Mode)
t 10
t9
CLKIN
t1
t ACQ
CONVST
t8
QUIET
TIME
BUSY/EOC
t CONV
t5
RD
t3
CS
THREE-STATE
t4
THREE-STATE
DATA
t6
t7
Figure 7. Conversion Sequence Timing Diagram (BUSY Mode)
EOC Mode
Continuous Conversion Mode
The CONVST signal is normally high. Pulsing the CONVST low
will initiate a conversion on its rising edge. The state of the
CONVST signal is checked at the end of conversion. Since the
CONVST will be high when this happens the AD7899 BUSY/
EOC pin will take on its EOC function and bring the BUSY/EOC
line low for one clock period before returning high again. In this
mode the EOC can be tied to the RD and CS signals to allow
automatic reading of the conversion result if required. The timing
diagram for operation in EOC mode is shown in Figure 6.
When the AD7899 is used with an external clock, connecting
the CLKIN and CONVST signals together will cause the AD7899
to continuously perform conversions. As each conversion completes the BUSY/EOC pin will pulse low for one clock period
(EOC function) indicating that the conversion result is available.
Figure 8 shows the timing and control sequence of the AD7899
in Continuous Conversion Mode.
BUSY Mode
The CONVST signal is normally low. Pulsing the CONVST
high will initiate a conversion on its rising edge. The state of the
CONVST signal is checked at the end of conversion. Since the
CONVST will be low when this happens the AD7899 BUSY/
EOC pin will take on its BUSY function will bring BUSY/EOC
low, indicating that the conversion is complete. BUSY/EOC will
remain low until the next rising edge of CONVST where BUSY/
EOC returns high. The timing diagram for operation in BUSY
mode is shown in Figure 7.
REV. A
Reading Data from the AD7899
Data is read from the part via a 14-bit parallel data bus with
standard CS and RD signals. The CS and RD inputs are internally gated to enable the conversion result onto the data bus.
The data lines DB0 to DB13 leave their high impedance state
when both CS and RD are logic low. Therefore CS may be
permanently tied logic low and the RD signal used to access the
conversion result if required. Figures 6 and 7 show a timing
specification called “Quiet Time.” This is the amount of time
which should be left after a read operation and before the next
conversion is initiated. The quiet time depends heavily on data
bus capacitance but a figure of 50 ns to 100 ns is typical, with a
worst case figure of 150 ns.
–11–
AD7899
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
CONVST/
CLKIN
EOC
START OF NEW
CONVERSION
(INPUT SAMPLED)
CONVERSION
COMPLETE
Figure 8. Continuous Conversion Mode
Standby Mode Operation
Signal-to-Noise Ratio (SNR)
The AD7899 has a Standby Mode whereby the device can be
placed in a low current consumption mode (5 µA typ). The
AD7899 is placed in Standby by bringing the logic input STBY
low. The AD7899 can be powered again up for normal operation by bringing STBY logic high. The output data buffers are
still operational while the AD7899 is in Standby. This means
the user can still continue to access the conversion results while
the AD7899 is in standby. This feature can be used to reduce
the average power consumption in a system using low throughput
rates. To reduce the average power consumption, the AD7899
can be placed in standby at the end of each conversion sequence
and taken out of standby again prior to the start of the next
conversion sequence. The time it takes the AD7899 to come out
of standby is called the “wake up” time. This wake-up time will
limit the maximum throughput rate at which the AD7899 can
be operated when powering down between conversions. When
the AD7899 is used with the internal reference, the reference
capacitor will begin to discharge during standby. The voltage
remaining on the capacitor at wake-up time will depend upon
the standby time and hence affect the wake-up time. The minimum wake-up time is typically 2 µs. The maximum wake-up
time will be when the AD7899 has been in standby long enough
for the reference capacitor to fully discharge. The wake-up time
in this case will typically be 15 ms. The AD7899 will wake up in
approximately 1 µs when using an external reference, regardless
of sleep time.
SNR is the measured signal-to-noise ratio at the output of the
ADC. The signal is the rms magnitude of the fundamental.
Noise is the rms sum of all the nonfundamental signals up to
half the sampling frequency (fS/2) excluding dc. SNR is dependent
upon the number of quantization levels used in the digitization
process; the more levels, the smaller the quantization noise. The
theoretical signal to noise ratio for a sine wave input is given by
SNR = (6.02N + 1.76) dB
where N is the number of bits.
Thus for an ideal 14-bit converter, SNR = 86.04 dB.
Figure 9 shows a histogram plot for 8192 conversions of a dc
input using the AD7899 with 5 V supply. The analog input was
set at the center of a code transition. It can be seen that most of
the codes appear in one output bin, indicating very good noise
performance from the ADC.
7000
6000
5000
4000
3000
When operating the AD7899 in a Standby mode between conversions, the power savings can be significant. For example,
with a throughput rate of 10 kSPS and an external reference, the
AD7899 will be powered up for 4.2 µs out of every 100 µs (2 µs
for wake-up time and 2.2 µs for conversion time). Therefore, the
average power consumption drops to 80 mW × 4.2% or approximately 3.36 mW.
AD7899 DYNAMIC SPECIFICATIONS
The AD7899 is specified and 100% tested for dynamic performance specifications as well as traditional dc specifications such
as Integral and Differential Nonlinearity. These ac specifications
are required for the signal processing applications such as phased
array sonar, adaptive filters, and spectrum analysis. These applications require information on the ADC’s effect on the spectral
content of the input signal. Hence, the parameters for which the
AD7899 is specified include SNR, harmonic distortion, intermodulation distortion, and peak harmonics. These terms are
discussed in more detail in the following sections.
(1)
2000
1000
0
Figure 9. Histogram of 8192 Conversions of a DC Input
The output spectrum from the ADC is evaluated by applying a
sine wave signal of very low distortion to the analog input. A
Fast Fourier Transform (FFT) plot is generated from which the
SNR data can be obtained. Figure 10 shows a typical 4096 point
FFT plot of the AD7899 with an input signal of 100 kHz and a
sampling frequency of 400 kHz. The SNR obtained from this
graph is 80.5 dB. It should be noted that the harmonics are
taken into account when calculating the SNR.
–12–
REV. A
AD7899
second and third order terms are specified separately. The calculation of the intermodulation distortion is as per the THD
specification where it is the ratio of the rms sum of the individual distortion products to the rms amplitude of the fundamental
expressed in dBs. In this case, the input consists of two, equal
amplitude, low distortion sine waves. Figure 12 shows a typical
IMD plot for the AD7899.
0
–20
fs = 400kHz
fIN = 100kHz
SNR = 80.5dB
–40
dB
–60
–80
0
–100
–20
–120
0
50000
100000
FREQUENCY – Hz
150000
–60
200000
dB
–140
–40
–80
Figure 10. FFT Plot
Effective Number of Bits
–100
The formula given in Equation 1 relates the SNR to the number
of bits. Rewriting the formula, as in Equation 2, it is possible to
obtain a measure of performance expressed in effective number
of bits (N).
N=
SNR − 1.76
6.02
–120
–140
0
50000
150000
200000
Figure 12. IMD Plot
(2)
The effective number of bits for a device can be calculated directly
from its measured SNR. Figure 11 shows a typical plot of effective number of bits versus frequency for an AD7899.
100000
FREQUENCY – Hz
AC Linearity Plots
The plots in Figure 13 show typical DNL and INL for the
AD7899.
1.00
14
–55ⴗC
13
12
0.50
+25ⴗC
11
10
DNL – LSB
ENOB
9
+125ⴗC
8
7
6
0
5
–0.50
4
3
2
1
–1.00
0
0
100
1000
INPUT FREQUENCY – kHz
0
2000
4000
6000 8000 10000 12000
ADC – Code
14000 16000
0
2000
4000
6000 8000 10000 12000
ADC – Code
14000 16000
10000
1.00
Figure 11. Effective Numbers of Bits vs. Frequency
Intermodulation Distortion
0.50
INL – LSB
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion
products at sum and difference frequencies of mfa ± nfb where
m, n = 0, 1, 2, 3 . . ., etc. Intermodulation terms are those for
which neither m nor n are equal to zero. For example, the second order terms include (fa + fb) and (fa – fb) while the third
order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and (fa – 2fb).
0
–0.50
The AD7899 is tested using two input frequencies. In this case
the second and third order terms are of different significance.
The second order terms are usually distanced in frequency from
the original sine waves while the third order terms are usually at
a frequency close to the input frequencies. As a result, the
–1.00
Figure 13. Typical DNL and INL Plots
REV. A
–13–
AD7899
MICROPROCESSOR INTERFACING
AD7899–TMS320C5x Interface
The high-speed parallel interface of the AD7899 allows easy
interfacing to most DSPs and microprocessors. The AD7899
interface of the AD7899 consists of the data lines (DB0 to DB13),
CS, RD, and BUSY/EOC.
Figure 15 shows an interface between the AD7899 and the
TMS320C5x. As with the previous interfaces, conversion can be
initiated from the TMS320C5x or from an external source and
the processor is interrupted when the conversion sequence is
completed. The CS signal to the AD7899 derived from the DS
signal and a decode of the address bus. This maps the AD7899
into external data memory. The RD signal from the TMS320 is
used to enable the ADC data onto the data bus. The AD7899 has
a fast parallel bus so there are no wait state requirements. The
following instruction is used to read the conversion results from
the AD7899:
AD7899–ADSP-21xx Interface
Figure 14 shows an interface between the AD7899 and the
ADSP-21xx. The CONVST signal can be generated by the
ADSP-21xx or from some other external source. Figure 14 shows
the CS being generated by a combination of the DMS signal and
the address bus of the ADSP-21xx. In this way the AD7899 is
mapped into the data memory space of the ADSP-21xx.
The AD7899 BUSY/EOC line provides an interrupt to the
ADSP-21xx when the conversion is complete. The conversion
result can then be read from the AD7899 using a read operation.
The AD7899 is read using the following instruction
IN D,ADC
where D is Data Memory address and ADC is the AD7899
address.
MR0 = DM(ADC)
TMS320C5x
where MR0 is the ADSP-21xx MR0 register and ADC is the
AD7899 address.
ADDRESS
DECODE
VIN
RD
DB0–DB13
DMS
DB0–DB13
CONVST
RD
D0–D13
AD7899
RD
D8–D21
AD7899
BUSY/EOC
RD
A0–A13
CS
VIN
DS
CS
ADSP-21xx
ADDRESS
DECODE
A0–A13
BUSY/EOC
INTn
CONVST
PA0
Figure 15. AD7899–TMS320C5x Interface
IRQn
DT1/F0
Figure 14. AD7899–ADSP-21xx Interface
–14–
REV. A
AD7899
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Small Outline
(R-28)
0.7125 (18.10)
0.6969 (17.70)
28
15
0.2992 (7.60)
0.2914 (7.40)
1
0.4193 (10.65)
0.3937 (10.00)
14
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.0118 (0.30)
0.0040 (0.10)
0.0500
(1.27)
BSC
8ⴗ
0ⴗ
0.0192 (0.49) SEATING
0.0125
(0.32)
0.0138 (0.35) PLANE
0.0091 (0.23)
0.0291 (0.74)
ⴛ 45ⴗ
0.0098 (0.25)
0.0500 (1.27)
0.0157 (0.40)
28-Lead Shrink Small Outline
(RS-28)
0.407 (10.34)
0.397 (10.08)
15
1
14
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.21)
28
0.078 (1.98) PIN 1
0.068 (1.73)
0.008 (0.203) 0.0256
(0.65)
0.002 (0.050) BSC
0.07 (1.79)
0.066 (1.67)
8°
0.015 (0.38)
0°
SEATING 0.009 (0.229)
0.010 (0.25)
PLANE
0.005 (0.127)
0.03 (0.762)
0.022 (0.558)
AD7899–Revision History
Location
Page
Data Sheet changed from REV. 0 to REV. A.
Edit to Timing page heading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Edit to Converter Details section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Edit to Figure 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
REV. A
–15–
–16–
PRINTED IN U.S.A.
C01365–0–6/01(A)