BOURNS MF-SMDF030/33T-2

Features
!
W
NE
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Applications
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Very low profile
High voltage
Lead-free construction
Symmetrical
2018 footprint
Agency recognition pending
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Power Over Ethernet (IEEE 802.3 af) port
protection
Firewire and i.Link IEEE 1394 port
protection
Automotive electronic control module
protection
Telecom equipment low voltage
protection
MF-SMDF Series - PTC Resettable Fuses
Electrical Characteristics
Ihold
Model
MF-SMDF030
MF-SMDF050
MF-SMDF100
MF-SMDF150
MF-SMDF150/33
MF-SMDF200
V max.
Volts
60
60
15
15
33
10
I max.
Amps
20
10
40
40
40
40
Itrip
Resistance
Amperes
at 23 °C
Hold
Trip
Ohms
at 23 °C
RMin.
R1Max.
0.30
0.55
1.10
1.50
1.50
2.00
0.450
0.200
0.100
0.070
0.070
0.048
0.80
1.20
2.20
3.00
3.00
4.10
2.250
0.950
0.390
0.175
0.175
0.095
Max. Time
To Trip
Tripped
Power
Dissipation
Amperes
at 23 °C
Seconds
at 23 °C
Watts
at 23 °C
Typ.
1.5
2.5
8.0
8.0
8.0
8.0
1.5
4.0
0.5
0.9
0.9
2.7
0.7
1.0
1.1
1.2
1.2
1.3
Environmental Characteristics
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-SMDF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
Thermal Derating Chart - Ihold / Itrip (Amps)
Ambient Operating Temperature
Model
MF-SMDF030
MF-SMDF050
MF-SMDF100
MF-SMDF150
MF-SMDF150/33
MF-SMDF200
-40 ˚C
0.48 / 0.96
0.86 / 1.72
1.59 / 3.18
2.21 / 4.42
2.21 / 4.42
2.81 / 5.62
-20 ˚C
0.42 / 0.84
0.77 / 1.54
1.43 / 2.86
1.97 / 3.94
1.97 / 3.94
2.54 / 5.08
0 ˚C
0.35 / 0.70
0.70 / 1.40
1.20 / 2.40
1.70 / 3.40
1.70 / 3.40
2.27 / 4.54
23 ˚C
0.30 / 0.60
0.55 / 1.10
1.10 / 2.20
1.50 / 3.00
1.50 / 3.00
2.00 / 4.00
40 ˚C
0.24 / 0.48
0.48 / 0.96
0.94 / 1.88
1.26 / 2.52
1.26 / 2.52
1.73 / 3.46
50 ˚C
0.21 / 0.42
0.43 / 0.86
0.85 / 1.70
1.15 / 2.30
1.15 / 2.30
1.59 / 3.18
60 ˚C
0.17 / 0.34
0.38 / 0.76
0.72 / 1.44
1.00 / 2.00
1.00 / 2.00
1.46 / 2.92
70 ˚C
0.15 / 0.30
0.36 / 0.72
0.69 / 1.38
0.91 / 1.82
0.91 / 1.82
1.32 / 2.64
85 ˚C
0.10 / 0.20
0.26 / 0.52
0.57 / 1.14
0.73 / 1.46
0.73 / 1.46
1.12 / 2.24
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Product Dimensions
A
Model
MF-SMDF030
MF-SMDF050
MF-SMDF100
MF-SMDF150
MF-SMDF150/33
MF-SMDF200
B
Min.
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
Max.
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
Min.
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
C
Max.
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
Min.
0.79
(0.031)
0.79
(0.031)
0.79
(0.031)
0.79
(0.031)
0.79
(0.031)
0.79
(0.031)
Max.
1.09
(0.043)
1.09
(0.043)
1.09
(0.043)
1.09
(0.043)
1.09
(0.043)
1.09
(0.043)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
Packaging: 2000 pcs. per reel.
Top and Bottom View
A
UNIT =
Side View
Recommended Pad Layout
C
1.5 ± 0.05
(.059 ± .002)
1.5 ± 0.05
(.059 ± .002)
4.6 ± 0.1
(.181 ± .004)
B
MM
(INCHES)
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Optional Sn finish:
Meets ANSI/J-STD-002 Category 3.
3.4 ± 0.1
(.134 ± .004)
D
E
Min.
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
E
Recommended Storage:
40 °C max./70 % RH max.
Typical Time to Trip at 23 ˚C
100
The Time to Trip curves
represent typical performance of a device in a
simulated application
environment. Actual
performance in specific
customer applications may
differ from these values due
to the influence of other
variables.
Time to Trip (Seconds)
10
MF-SMDF050
MF-SMDF030
1
0.1
MF-SMDF200
0.01
MF-SMDF150
MF-SMDF100
0.001
0.1
1
Fault Current (Amps)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
10
100
MF-SMDF Series - PTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
How to Order
Soldering
MF - SMDF 150/33 T - 2
Cooling
Multifuse® Product
Designator
Series
SMDF = 2018 Surface Mount
Component
Temperature (°C)
250
200
Hold Current, Ihold
030-200 (0.30 Amps - 2.00 Amps)
150
Higher Voltage Option
__ = Standard Voltage
/33 = 33 Volt Rated
100
Optional Terminal Finish
__ = Standard Au Finish
T = Optional Sn Finish
50
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
0
160–220
10–20
120
Time (seconds)
Typical Part Marking
Represents total content. Layout may vary.
BI-WEEKLY DATE CODE:
WEEKS 13-14 = G
10 3G
Notes:
• MF-SMDF models cannot be wave soldered.
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
• Compatible with Pb and Pb-free solder reflow profiles.
MANUFACTURER'S
TRADEMARK
YEAR CODE:
3 = 2003
PART
IDENTIFICATION:
30 = MF-SMDF030
05 = MF-SMDF050
10 = MF-SMDF100
15 = MF-SMDF150
20 = MF-SMDF200
MF-SMDF SERIES, REV. B, 05/04
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-NSMF & MF-SMDF Series Tape and Reel Specifications
MF-NSMF Series
per EIA 481-1
MF-SMDF Series
per EIA 481-2
W
8.0 ± 0.30
(0.315 ± 0.012)
16.0 ± 0.3
(0.630 ± 0.012)
P0
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
P1
P2
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
8.0 ± 0.1
(0.315 ± 0.004)
2.0 ± 0.1
(0.079 ± 0.004)
A0
1.85 ± 0.10
(0.073 ± 0.004)
5.1 ± 0.15
(0.201 ± 0.006)
B0
3.45 ± 0.10
(0.136 ± 0.004)
5.6 ± 0.23
(0.220 ± 0.009)
Tape Dimensions
12.1
(0.476)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
7.5 ± 0.10
(0.295 ± 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
4.35
(0.171)
1.50 + 0.1/-0.0
(0.059 + 0.004/-0)
B1 max.
D0
F
1.75 ± 0.10
(0.069 ± 0.004)
6.25
(0.246)
0.6
(0.024)
E1
E2 min.
T max.
0.1
(0.004)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
0.74 ± 0.10
(0.029 ± 0.004)
1.0 ± 0.15
(0.039 ± 0.015)
390
(15.35)
160
(6.30)
390
(15.35)
160
(6.30)
185
(7.28)
50
(1.97)
8.4 + 1.5/-0.0
(0.331 + 0.059/-0.0)
14.4
(0.567)
331
(13.03)
50
(1.97)
T1 max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
UNIT =
P0
T
D0
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0.0)
22.4
(0.882)
P2
MM
(INCHES)
E1
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
P1
A0
W1(MEASURED
AT HUB)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.