ETC MF-MSMF150

Features
!
W
NE
■
■
■
■
Applications
100 % compatible with all previous
generations of 1812 SMT devices
Compatible with Pb and Pb-free solder
reflow profiles
Surface mount packaging for automated
assembly
Agency recognition:
High Density Circuit Board Applications:
■ Hard disk drives
■ PC motherboards
■ PC peripherals
■ Point-of-sale (POS) equipment
■ PCMCIA cards
■ USB ports
T V Rheinland
MF-MSMF Series - PTC Resettable Fuses
Electrical Characteristics
Ihold
Model
V max.
Volts
I max.
Amps
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF200
MF-MSMF250/16
MF-MSMF260
60.0
60.0
30.0
30.0
15.0
13.2
24.0
6.0
16.0
6.0
6.0
8.0
6.0
16.0
6.0
40
40
80
10
100
100
40
100
100
100
100
100
100
100
100
Itrip
Resistance
Amperes
at 23 °C
Hold
Trip
Ohms
at 23 °C
RMin.
R1Max.
0.10
0.14
0.20
0.30
0.50
0.75
0.75
1.10
1.10
1.25
1.50
1.60
2.00
2.50
2.60
0.70
0.40
0.40
0.30
0.15
0.11
0.11
0.04
0.04
0.035
0.03
0.035
0.020
0.015
0.015
0.30
0.34
0.40
0.60
1.00
1.50
1.50
2.20
2.20
2.50
3.00
2.80
4.00
5.00
5.20
15.00
6.50
6.00
3.00
1.00
0.45
0.45
0.21
0.21
0.14
0.120
0.099
0.100
0.100
0.080
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
0.5
1.5
6.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.15
0.06
0.10
0.15
0.20
0.20
0.30
0.30
0.40
0.5
2.0
3.0
5.0
5.0
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
Environmental Characteristics
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Additional Features
■
■
■
Standard 4532 mm (1812 mils) footprint
Symmetrical design
Patents pending
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions
A
Model
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF200
MF-MSMF250/16
MF-MSMF260
B
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
C
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
Packaging:
MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel.
MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel.
MF-MSMF250/16 = 1000 pcs. per reel.
Top and Bottom View
A
Side View
Recommended Pad Layout
C
1.5 ± 0.05
(.059 ± .002)
2.7 ± 0.1
(.106 ± .004)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
Max.
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.75
(0.030)
0.75
(0.030)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
2.00
(0.078)
0.85
(0.033)
UNIT =
1.5 ± 0.05
(.059 ± .002)
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Optional Sn finish:
Meets ANSI/J-STD-002 Category 3.
D
Recommended Storage:
40 °C max./70 % RH max.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MM
(INCHES)
Terminal material:
Electroless Ni under immersion Au
3.2 ± 0.1
(0.126 ± .004)
B
Min.
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
0.45
(0.018)
0.45
(0.018)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
1.00
(0.039)
0.48
(0.019)
MF-MSMF Series - PTC Resettable Fuses
How to Order
Typical Time to Trip at 23 ˚C
100
MF - MSMF 075/24 T - 2
Multifuse® Product
Designator
MF-MSMF200
MF-MSMF010
Series
MSMF = 4532 mm (1812 mils)
Surface Mount Component
Time to Trip (Seconds)
10
Hold Current, Ihold
010-260 (0.10 Amps - 2.60 Amps)
MF-MSMF030
Higher Voltage Option
__ = Standard Voltage
/16 = 16 Volt Rated
/24 = 24 Volt Rated
1
Optional Terminal Finish
__ = Standard Au Finish
T = Optional Sn Finish
0.1
MF-MSMF260
MF-MSMF250/16
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
MF-MSMF160
0.01
MF-MSMF150
MF-MSMF125
MF-MSMF110
MF-MSMF075
MF-MSMF110/16
MF-MSMF014
MF-MSMF020
MF-MSMF075/24
MF-MSMF050
0.001
1
0.1
10
Typical Part Marking
Represents total content. Layout may vary.
100
113G
Fault Current (Amps)
The Time to Trip curves represent typical performance of a device in a simulated application
environment. Actual performance in specific customer applications may differ from these values due
to the influence of other variables.
MANUFACTURER'S
TRADEMARK
DATE CODE:
WEEK 1 AND 2 OF 2003 = 3A
WEEK 51 AND 52 OF 2003 = 3Z
PART IDENTIFICATION EXAMPLES:
MF-MSMF050 = 50
MF-MSMF075 = 75
MF-MSMF110 = 11
MF-MSMF150 = 15
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
Temperature (°C)
250
200
150
100
50
0
160–220
10–20
120
Time (seconds)
Notes:
• MF-MSMF models cannot be wave soldered.
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
• Compatible with Pb and Pb-free solder reflow profiles.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-MSMF Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold / Itrip (Amps)
Ambient Operating Temperature
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF200
MF-MSMF250/16
MF-MSMF260
-40 ˚C
0.16 / 0.32
0.23 / 0.52
0.29 / 0.58
0.44 / 0.88
0.77 / 1.54
1.15 / 2.30
1.15 / 2.30
1.59 / 3.18
1.59 / 3.18
1.80 / 3.61
2.17 / 4.34
2.30 / 5.00
3.08 / 5.40
3.9 / 7.8
4.00 / 7.98
-20 ˚C
0.14 / 0.28
0.19 / 0.45
0.26 / 0.52
0.39 / 0.78
0.68 / 1.36
1.01 / 2.02
1.01 / 2.02
1.43 / 2.86
1.43 / 2.86
1.63 / 3.25
1.95 / 3.90
2.20 / 4.40
2.71 / 4.74
3.42 / 6.84
3.52 / 7.01
0 ˚C
0.12 / 0.24
0.17 / 0.40
0.23 / 0.46
0.35 / 0.70
0.59 / 1.18
0.88 / 1.76
0.88 / 1.76
1.26 / 2.52
1.26 / 2.52
1.43 / 2.86
1.72 / 3.44
1.90 / 3.80
2.35 / 4.11
2.96 / 5.92
3.06 / 6.09
23 ˚C
0.11 / 0.22
0.14 / 0.34
0.20 / 0.40
0.30 / 0.60
0.50 / 1.00
0.75 / 1.50
0.75 / 1.50
1.10 / 2.20
1.10 / 2.20
1.25 / 2.50
1.50 / 3.00
1.60 / 2.80
2.00 / 3.50
2.50 / 5.00
2.60 / 5.15
40 ˚C
0.08 / 0.16
0.12 / 0.29
0.17 / 0.34
0.26 / 0.52
0.44 / 0.88
0.65 / 1.30
0.65 / 1.30
0.95 / 1.90
0.95 / 1.90
1.08 / 2.16
1.30 / 2.59
1.45 / 2.90
1.80 / 3.15
2.24 / 4.48
2.34 / 4.64
50 ˚C
0.07 / 0.14
0.10 / 0.25
0.15 / 0.30
0.23 / 0.46
0.40 / 0.80
0.60 / 1.20
0.60 / 1.20
0.87 / 1.74
0.87 / 1.74
0.99 / 1.98
1.18 / 2.37
1.30 / 2.60
1.60 / 2.80
1.98 / 3.96
2.08 / 4.13
Circuit Protection Division
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
North America:
Tel: +1-909 781-5500
Fax: +1-909 781-5700
Tel: +1-951 781-5500 (after 7/17/04)
Fax: +1-951 781-5700 (after 7/17/04)
www.bourns.com
MF-MSMF SERIES, REV. C, 04/04
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
60 ˚C
0.06 / 0.12
0.09 / 0.23
0.14 / 0.28
0.21 / 0.42
0.37 / 0.74
0.55 / 1.10
0.55 / 1.10
0.80 / 1.60
0.80 / 1.60
0.91 / 1.82
1.09 / 2.18
1.15 / 2.30
1.50 / 2.63
1.85 / 3.70
1.95 / 3.87
70 ˚C
0.05 / 0.10
0.08 / 0.21
0.12 / 0.24
0.18 / 0.36
0.33 / 0.66
0.49 / 0.98
0.49 / 0.98
0.71 / 1.42
0.71 / 1.42
0.81 / 1.62
0.97 / 1.94
1.03 / 2.06
1.40 / 2.40
1.29 / 2.58
1.39 / 2.74
85 ˚C
0.03 / 0.06
0.06 / 0.16
0.10 / 0.20
0.15 / 0.30
0.29 / 0.58
0.43 / 0.86
0.43 / 0.86
0.60 / 1.20
0.60 / 1.20
0.68 / 1.36
0.82 / 1.64
0.91 / 1.82
1.25 / 2.10
0.94 / 1.88
1.04 / 2.05
MF-MSMF Series Tape and Reel Specifications
MF-MSMF010 - MF-MSMF030
per EIA-481-1
MF-MSMF050 - MF-MSMF260
per EIA 481-1
MF-MSMF250/16
per EIA 481-1
W
12.0 ± 0.30
(0.472 ± 0.012)
12.0 ± 0.30
(0.472 ± 0.012)
12.0 ± 0.30
(0.472 ± 0.012)
P0
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
P1
P2
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
A0
3.58 ± 0.10
(0.141 ± 0.004)
3.66 ± 0.15
(0.144 ± 0.006)
3.43 ± 0.10
(0.135 ± 0.004)
B0
4.93 ± 0.10
(0.194 ± 0.004)
4.98 ± 0.10
(0.196 ± 0.004)
4.83 ± 0.10
(0.190 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.00
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.00
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.00
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
1.30 ± 0.10
(0.051 ± 0.004)
0.95 ± 0.10
(0.037 ± 0.004)
1.70 ± 0.10
(0.067 ± 0.004)
390
(15.35)
160
(6.30)
390
(15.35)
160
(6.30)
390
(15.35)
160
(6.30)
185
(7.28)
50
(1.97)
185
(7.28)
50
(1.97)
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
Tape Dimensions
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
UNIT =
P0
T
D0
P2
MM
(INCHES)
E1
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
P1
A0
W1(MEASURED
AT HUB)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.