WINBOND W681360SG

W681360
3V SINGLE-CHANNEL 13-BIT LINEAR VOICE-BAND CODEC
Data Sheet
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Publication Release Date: September 2005
Revision A.2
W681360
1. GENERAL DESCRIPTION
The W681360 is a general-purpose single channel 13–bit linear PCM CODEC with 2s complement
data format. It operates from a single +3V power supply and is available in 20-pin SOG(SOP), SSOP
and TSSOP package options. The primary function of the device is the digitization and reconstruction
of voice signals, including the band limiting and smoothing required for PCM systems. The W681360
performance is specified over the industrial temperature range of –40°C to +85°C.
The W681360 includes an on-chip precision voltage reference. The analog section is fully differential,
reducing noise and improving the power supply rejection ratio. The VAG reference pin allows for
decoupling of the internal circuitry that generates the reference voltage to the VSS power supply
ground, minimizing clock noise on the analog circuitry when external analog signals are referenced to
VSS.
The data transfer protocol supports both long-frame and short-frame, synchronous and asynchronous
communications for PCM applications. The W681360 accepts eight master clock rates between
256kHz and 4.800MHz, and an on-chip pre-scaler automatically determines the division ratio for the
required internal clock.
An additional on-chip power amplifier is capable of driving 300Ω loads differentially up to a level of
3.544V peak-to-peak.
For fast evaluation a development kit (W681360DK) is available.
For fast prototyping purposes a low-cost evaluation board (W681360ES) is also available.
2. FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
Single +3V power supply (2.7V to 5.25V)
Typical power dissipation: 9.8mW
Standby power dissipation: 3µW
Power-Down dissipation: 0.09µW
Fully-differential analog circuit design for
low noise
13-bit linear A/D & D/A conversions with 2s
complement data format
CODEC A/D and D/A filtering compliant
with ITU G.712
Eight master clock rates of 256kHz to
4.800 MHz
256KHz – 4.8MHz bit clock rates on the
serial PCM port
On-chip precision reference of 0.886 V for
a -5 dBm TLP at 600 Ω (436mVRMS)
Programmable receive gain: 0 to –21dB in
3dB steps
Industrial temp. range (–40°C to +85°C)
20-pin SOG (SOP), SSOP and TSSOP as
well as a QFN-32L package
Pb-Free / RoHS package options available
Applications
• VoIP, Voice over Networks equipment
• Digital telephone and communication
systems
• Wireless Voice devices
• DECT/Digital Cordless phones
• Broadband Access Equipment
• Bluetooth Headsets
• Fiber-to-curb equipment
• Enterprise phones
• Digital Voice Recorders
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Publication Release Date: September 2005
Revision A2
W681360
3. BLOCK DIAGRAM
Transmit Receive
PCM
PCM
Interface Interface
BCLKR
FSR
PCMR
BCLKT
FST
PCMT
PAO+
PAOPAI
G.712 CODEC
ROAO
AI+
AIHB
Voltage reference
256 kHz
8 kHz
VAGREF
Power Conditioning
PUI
Pre-scaler
VDD
256 kHz
512 kHz
1536 kHz
1544 kHz
2048 kHz
2560 kHz
4096 kHz
4800 kHz
VSS
MCLK
VAG
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Publication Release Date: September 2005
Revision A.2
W681360
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM............................................................................................................................... 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 6
6. PIN DESCRIPTION ............................................................................................................................. 7
7. FUNCTIONAL DESCRIPTION............................................................................................................ 8
7.1. Transmit Path................................................................................................................................ 8
7.1.1 Input Operational Amplifier Gain ............................................................................................. 9
7.2. Receive Path............................................................................................................................... 10
7.2.1. Receive Gain Adjust Mode................................................................................................... 11
7.3. Power Management.................................................................................................................... 11
7.3.1. Analog and Digital Supply .................................................................................................... 11
7.3.2. Analog Ground Reference Bypass ...................................................................................... 11
7.3.3. Analog Ground Reference Voltage Output .......................................................................... 11
7.4. PCM Interface ............................................................................................................................. 12
7.4.1. Long Frame Sync................................................................................................................. 12
7.4.2. Short Frame Sync ................................................................................................................ 12
7.4.3. Special 16-bit Receive Modes.............................................................................................. 13
7.4.3.1. Sign-Extended Mode Timing............................................................................................. 13
7.4.3.2. Receive Gain Adjust Mode Timing.................................................................................... 13
7.4.4. System Timing ..................................................................................................................... 14
7.5. On-Chip Power Amplifier ............................................................................................................ 14
8. TIMING DIAGRAMS.......................................................................................................................... 15
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20
9.1. Absolute Maximum Ratings ........................................................................................................ 20
9.2. Operating Conditions .................................................................................................................. 20
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21
10.1. General Parameters ................................................................................................................. 21
10.2. Analog Signal Level and Gain Parameters............................................................................... 22
10.3. Analog Distortion and Noise Parameters ................................................................................. 23
10.4. Analog Input and Output Amplifier Parameters ........................................................................ 24
10.5. Digital I/O .................................................................................................................................. 26
10.5.1. PCM Codes for Zero and Full Scale .................................................................................. 26
10.5.2. PCM Codes for 1kHz Digital Milliwatt ................................................................................ 26
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 28
12.1. 20L SOG (SOP)-300mil ............................................................................................................ 28
12.2. 20L SSOP-209 mil .................................................................................................................... 29
12.3. 20L TSSOP - 4.4X6.5mm ......................................................................................................... 30
12.3. QFN-32L ................................................................................................................................... 31
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Publication Release Date: September 2005
Revision A.2
W681360
13. ORDERING INFORMATION........................................................................................................... 32
14. VERSION HISTORY ....................................................................................................................... 33
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Publication Release Date: September 2005
Revision A.2
W681360
5. PIN CONFIGURATION
VREF
ROPAI
PAOPAO+
VDD
FSR
PCMR
BCLKR
PUI
1
20
2
19
3
18
4
17
W681360
SINGLE
CHANNEL
CODEC
5
6
7
8
16
15
14
13
9
12
10
11
VAG
AI+
AIAO
HB
VSS
FST
PCMT
BCLKT
MCLK
32 31
AI+
NC
NC
VAG
VREF
NC
NC
SOG, SSOP,TSSOP
30 29 28 27 26
RO- 1
25 NC
PAI
2
24 AI-
PAO-
3
23 AO
NC 4
22 HB
PAO+ 5
21 NC
VDD
6
20 VSS
FSR
7
19 FST
18 NC
PCMR 8
17 PCMT
NC
BCLKT
15 16
NC
NC
13 14
MCLK
11 12
PUI
10
NC
BCLKR 9
QFN-32L
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Publication Release Date: September 2005
Revision A.2
W681360
6. PIN DESCRIPTION
Pin
Name
Pin No.
nonQFN
QFN
VREF
1
30
RO-
2
1
PAI
3
2
PAO-
4
3
PAO+
5
5
VDD
FSR
6
7
6
7
PCMR
8
8
BCLKR
9
9
PUI
10
12
MCLK
11
13
BCLKT
12
16
PCMT
13
17
FST
VSS
HB
14
15
16
19
20
22
AO
AIAI+
VAG
17
18
19
20
23
24
26
29
Functionality
This pin is used to bypass the on–chip VDD/2 voltage reference for the VAG output pin.
This pin should be bypassed to VSS with a 0.1μF ceramic capacitor using short, low
inductance traces. The VREF pin is only used for generating the reference voltage for the
VAG pin. Nothing is to be connected to this pin except the bypass capacitor.
Inverting output of the receive smoothing filter. This pin can typically drive a 2kΩ load to
0.886VPEAK referenced to analog ground.
Inverting input to the power amplifier. The non-inverting input is tied internally to VAG
voltage.
Inverting power amplifier output. The PAO- and PAO+ can drive a 300Ω load differentially
to 1.772VPEAK.
Non-inverting power amplifier output. The PAO- and PAO+ can drive a 300Ω load
differentially to 1.772VPEAK.
Power supply. Should be decoupled to VSS with a 0.1μF ceramic capacitor.
8kHz Frame Sync input for the PCM receive section. FSR can be asynchronous to FST in
either Long Frame Sync or Short Frame Sync mode.
PCM input data receive pin. The data needs to be synchronous with the FSR and BCLKR
pins.
PCM receive bit clock input pin. Can accept any bit clock frequency from 256 to 4800kHz.
When not clocked it can be used to select the 16 sign-bit extended synchronous mode
(BCLKR=0) or the receive gain adjust synchronous mode (BCLKR=1)
Power up input signal. When this pin is tied to VDD, the part is powered up. When tied to
VSS, the part is powered down.
System master clock input. Possible input frequencies are 256kHz, 512kHz, 1536kHz,
1544kHz, 2048kHz, 2560kHz, 4096kHz & 4800kHz. For performance reasons, it is
recommended that MCLK be synchronous and aligned to the FST signal. This is a
requirement in the case of 256 and 512kHz frequencies.
PCM transmit bit clock input pin. Can accept any bit clock frequency from 256 to
4800kHz.
PCM output data transmit pin. The output data is synchronous with the FST and BCLKT
pins.
8kHz transmit frame sync input. This pin synchronizes the transmit data bytes.
This is the supply ground. This pin should be connected to 0V.
High-pass Bypass. Determines if the transmit high-pass filter is used (HB=’0’) or
bypassed (HB=’1’). When the high pass is bypassed the frequency response extends to
DC.
Analog output of the first gain stage in the transmit path.
Inverting input of the first gain stage in the transmit path.
Non-inverting input of the first gain stage in the transmit path.
Mid-Supply analog ground pin, which supplies a VDD/2 volt reference voltage for allanalog signal processing. This pin should be decoupled to VSS with a 0.01μF capacitor.
This pin becomes high impedance when the chip is powered down.
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Publication Release Date: September 2005
Revision A.2
W681360
7. FUNCTIONAL DESCRIPTION
W681360 is a single-rail, single channel PCM CODEC for voiceband applications. The CODEC
complies with the specifications of the ITU-T G.712 recommendation.
The CODEC block diagram in Section 3 illustrates the main components of the W681360. The chip
consists of a PCM interface, which can process long and short frame sync formats. The pre-scaler of
the chip provides the internal clock signals and synchronizes the CODEC sample rate with the
external frame sync frequency. The power conditioning block provides the internal power supply for
the digital and the analog section, while the voltage reference block provides a precision analog
ground voltage for the analog signal processing.
The calibration level for both the Analog to Digital Converter (ADC) and the Digital to Analog
Converter (DAC) is referenced to μ-Law with the same bit voltage weighing about the zero crossing,
resulting in the 0dBm0 calibration level 3.2dB below the peak sinusoidal level before clipping, Based
on the reference voltage of 0.886V the calibration level is 0.436 Vrms or –5dBm at 600Ω.
VAG
+
-
PAO+
-
+
PAOPAI
13
DATA
Receive
13 bit linear
DAC
fC = 3400 Hz
Smoothing
Filter a
Buffer1
Av=1
Smoothing
Filter b
High Pass
Bypass
13
DATA
Transmit
13 bit linear
ADC
fC = 200 Hz
High Pass
Filter
fC = 3400 Hz
Anti-Aliasing
Filter a
RO-
AO
-
AI-
+
AI+
Anti-Aliasing
Filter b
FIGURE 7.1: THE W681360 SIGNAL PATH
7.1. Transmit Path
The first stage of the A-to-D path of the CODEC is an analog input operational
amplifier with externally configurable gain settings. A differential analog input may be
applied to the Inputs AI+ and AI-. Alternately the input amplifier may be powered
down and a single-ended input signal can be applied to either the AO pin or the AIpin. The input amplifier can be powered down by connecting the AI+ pin to either VDD
or VSS which also determines whether AO or AI+ is selected as input according to
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Publication Release Date: September 2005
Revision A.2
W681360
Table 7.1. When the input operational amplifier is powered down the AO pin becomes high input
impedance.
TABLE 7.1: INPUT AMPLIFIER MODES OF OPERATION
AI+ (Pin 19)
Input Amplifier
Input
VDD
1.2 to VDD-1.2
VSS
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AO (Pin 17)
AI+, AI- (Pins 19, 18)
AI- (Pin 18)
When the input amplifier is powered down, the input signal at AO or AI- should be referenced to the
analog ground voltage VAG.
The output of the input operational amplifier is first fed through a low-pass filter to prevent aliasing at
the switched capacitor 3.4kHz low pass filter. Subsequently the 3.4kHz switched capacitor low pass
filter bandlimits the input signals well below 4kHz. Signals above 4kHz would be aliased at the
sampling rate of 8kHz. A high pass filter with a 200Hz cut-off frequency prevents DC coupling. All
filters are designed according to the G.712 ITU-T specification. The high-pass filter may be bypassed
depending on the logic level on the HB pin. If the high pass is removed the frequency response of the
device extends down to DC.
After filtering the signal is digitized as a 13-bit linear PCM code and fed to the PCM interface for serial
transmission at the sample rate supplied by the external frame sync FST.
7.1.1 Input Operational Amplifier Gain
The gain of the input operational amplifier can be adjusted using external resistors. For single-ended
input operation the gain is given by a simple resistive ratio.
FIGURE 7.2: INPUT OPERATIONAL AMPLIFIER GAIN – SINGLE-ENDED INPUT
Ro
AO
AI-
Ri
-
Vin
VAG
+
AI+
Gin = Ro/Ri
For differential input operation the external resistor network is more complex but the gain is expressed
in the same way. Of course, a differential input also has an inherent 6dB advantage over a
corresponding single-ended input.
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Publication Release Date: September 2005
Revision A.2
W681360
Ro
AO
AI-
Ri
AI+
Ri
+
Gin = Ro/Ri
VinVin+
Ro
VAG
FIGURE 7.3: INPUT OPERATIONAL AMPLIFIER GAIN – DIFFERENTIAL INPUT
The gain of the operational amplifier will be typically be set to 30dB for microphone interface circuits.
However the gain may be used for more than 30dB but this will require a compact layout with minimal
trace lengths and good isolation from noise sources. It is also recommended that the layout be as
symmetrical as possible as imbalances work against the noise canceling advantages of the differential
design.
7.2. Receive Path
The 13-bit digital input samples for the D-to-A path are serially shifted in by the PCM interface and
converted to parallel data bits. During every cycle of the frame sync FSR, the parallel data bits are fed
through the 13-bit linear DAC and converted to analog samples. The analog samples are filtered by a
low-pass smoothing filter with a 3.4kHz cut-off frequency, according to the ITU-T G.712 specification.
A sin(x)/x compensation is integrated with the low pass smoothing filter. The output of this filter is
buffered to provide the receive output signal RO-. The output may be also be attenuated when the
device is in the receive path adjust mode. If the device is operated half–channel with the FST pin
clocking and FSR pin held LOW, the receive filter input will be connected to the VAG voltage. This
minimizes transients at the RO– pin when full–channel operation is resumed by clocking the FSR pin.
The RO- output can be externally connected to the PAI pin to provide a differential output with high
driving capability at the PAO+ and PAO- pins. By using external resistors various gain settings of this
output amplifier can be achieved. If the transmit power amplifier is not in use, it can be powered down
by connecting PAI to VDD. The bias voltage and signal reference of the PAO+ & PAO– outputs is the
VAG pin. The VAG pin cannot source or sink as much current as these pins, and therefore low
impedance loads must be placed between PAO+ and PAO–. The PAO+ and PAO– differential drivers
are also capable of driving a 100Ω resistive load or a 100nF piezoelectric transducer in series with a
20Ω resister with a small increase in distortion. These drivers may be used to drive resistive loads of
32Ω when the gain of PAO– is set to 1/4 or less.
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Publication Release Date: September 2005
Revision A.2
W681360
7.2.1. Receive Gain Adjust Mode
The W681360 can be put in the receive path adjust mode by applying a logic “1” to the BCLKR pin
while all other clocks are clocked normally. The device is then in a position to read 16-bits of data,
with three additional coefficient bits an addend to the 13-bit digital voice data. These three coefficients
are used to program a receive path attenuation, thereby allowing the receive signal to be attenuated
according to the values in the following table. If the feature is not used the default value is 0dB.
TABLE 7.2: ATTENUATION COEFFICIENT RELATIONSHIP IN RECEIVE GAIN ADJUST MODE
Coefficient
Attenuation (dB)
000
0
001
3
010
6
011
9
100
12
101
15
110
18
111
21
7.3. POWER MANAGEMENT
7.3.1. Analog and Digital Supply
The power supply for the analog and digital parts of the W681360 must be 2.7V to 5.25V. This supply
voltage is connected to the VDD pin. The VDD pin needs to be decoupled to ground through a 0.1 μF
ceramic capacitor.
7.3.2. Analog Ground Reference Bypass
The system has an internal precision voltage reference which generates the VDD/2 mid-supply analog
ground voltage. This voltage needs to be decoupled to VSS at the VREF pin through a 0.1 μF ceramic
capacitor.
7.3.3. Analog Ground Reference Voltage Output
The analog ground reference voltage is available for external reference at the VAG pin. This voltage
needs to be decoupled to VSS through a 0.01 μF ceramic capacitor. The analog ground reference
voltage is generated from the voltage on the VREF pin and is also used for the internal signal
processing.
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Publication Release Date: September 2005
Revision A.2
W681360
7.4. PCM INTERFACE
The PCM interface is controlled by pins BCLKR, FSR, BCLKT & FST. The input data is received
through the PCMR pin and the output data is transmitted through the PCMT pin.
The Long Frame Sync or Short Frame Sync interface mode can be selected by connecting the BCLKR
or BCLKT pin to a 256kHz to 4.800 MHz clock and connecting the FSR or FST pin to the 8kHz frame
sync. The device synchronizes the data word for the PCM interface and the CODEC sample rate on
the positive edge of the Frame Sync signal. Long Frame Sync is recognized when the FST pin is held
HIGH for two consecutive falling edges of the bit-clock at the BCLKT pin. Short Frame Sync Mode is
recognized when the Frame Sync signal at pin FST is HIGH for one and only one falling edge of the
bit-clock at the BCLKT pin.
7.4.1. Long Frame Sync
The device recognizes a Long Frame Sync when the FST pin is held HIGH for two consecutive falling
edges of the bit-clock at the BCLKT pin. The length of the Frame Sync pulse can vary from frame to
frame, as long as the positive frame sync edge occurs every 125 μsec. During data transmission in the
Long Frame Sync mode, the transmit data pin PCMT will become low impedance when the Frame
Sync signal FST is HIGH or when the 13-bit data word is being transmitted. The transmit data pin
PCMT will become high impedance when the Frame Sync signal FST becomes LOW while the data is
transmitted or when half of the LSB is transmitted. The internal decision logic will determine whether
the next frame sync is a long or a short frame sync, based on the previous frame sync pulse. To avoid
bus collisions, the PCMT pin will be high impedance for two frame sync cycles after every power down
state. Long Frame Sync mode is illustrated below. More detailed timing information can be found in
the interface timing section.
BCLKT
(BCLKR)
FST
(FSR)
PCMT
1
2
3
4
5
6
7
8
9
10
11
12 13
PCMR don't care
1
2
3
4
5
6
7
8
9
10
11
12
13
don't care
Long Frame Sync (Transmit and Receive Have Individual Clocking)
FIGURE 7.4: LONG FRAME SYNC PCM MODE
7.4.2. Short Frame Sync
The W681360 operates in the Short Frame Sync Mode when the Frame Sync signal at pin FST is
HIGH for one and only one falling edge of the bit-clock at the BCLKT pin. On the following rising edge
of the bit-clock, the W681360 starts clocking out the data on the PCMT pin, which will also change
from high to low impedance state. The data transmit pin PCMT will go back to the high impedance
state halfway through the LSB. The Short Frame Sync operation of the W681360 is based on a 13-bit
data word. When receiving data on the PCMR pin, the data is clocked in on the first falling edge after
the falling edge that coincides with the Frame Sync signal. The internal decision logic will determine
whether the next frame sync is a long or a short frame sync, based on the previous frame sync pulse.
To avoid bus collisions, the PCMT pin will be high impedance for two frame sync cycles after every
power down state. Short Frame Sync mode is illustrated below. More detailed timing information can
be found in the interface timing section.
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Publication Release Date: September 2005
Revision A.2
W681360
BCLKT
(BCLKR)
FST
(FSR)
PCMT
1
2
3
4
5
6
7
8
9
10
11
12 13
PCMR don't care
1
2
3
4
5
6
7
8
9
10
11
12
13
don't care
Short Frame Sync (Transmit and Receive Have Individual Clocking)
FIGURE 7.5: SHORT FRAME SYNC PCM MODE
7.4.3. Special 16-bit Receive Modes
7.4.3.1. Sign-Extended Mode Timing
The Sign-bit extended mode is entered by applying a logic “0” to the BCLKR pin while all other clocks
are clocked normally. In standard 13-bit mode the first bit is the sign bit. In this mode the device
transmits and receives 16-bit data where the sign bit is extended to the first four data bits. The PCM
timing for this mode is illustrated below.
BCLKT
(BCLKR)
FST (FSR)
SHORT OR
LONG FRAME
SYNC
PCMT
1
2
3
4
5
6
7
8
9
10
11
12 13
14
15 16
PCMR don't care
1
2
3
4
5
6
7
8
9
10
11
12
14
15
13
16 don't care don't care
Sign-Extended (BCLKR=0)
Transmit and Receive both use BCLKT, and the first four data bits are the sign bit.
FST may occur at a different time than FSR
FIGURE 7.6: SIGN EXTENDED MODE
7.4.3.2. Receive Gain Adjust Mode Timing
The Receive Path Adjust Mode is entered by applying a logic “1” to the BCLKR pin while all other
clocks are clocked normally. In this mode the device receives 16-bit data where the last three bits are
coefficients to program the Receive Gain Adjust Attenuation described above. The PCM timing for
this mode is illustrated below.
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Publication Release Date: September 2005
Revision A.2
W681360
BCLKT
(BCLKR)
FST (FSR)
SHORT O R
LONG FRAM E
SYNC
PCMT
1
2
3
4
5
6
7
8
9
10
11
12 13
PCMR don't care
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16 don't care
don't care
Receive Gain Adjust (BCLKR=1)
Transm it and Receive both use BCLKT. FST m ay occur at a different tim e than FSR.
Bits 14, 15, and 16, clocked into PCMR, are used for attenuation control for the
receive analog output.
FIGURE 7.7: RECEIVE GAIN ADJUST TIMING MODE
7.4.4. System Timing
The system can work at 256kHz, 512kHz, 1536kHz, 1544kHz, 2048kHz, 2560kHz, 4096kHz &
4800kHz master clock rates. The system clock is supplied through the master clock input MCLK and
can be derived from the bit-clock if desired. An internal pre-scaler is used to generate a fixed 256kHz
and 8kHz sample clock for the internal CODEC. The pre-scaler measures the master clock frequency
versus the Frame Sync frequency and sets the division ratio accordingly. If both Frame Syncs are
LOW for the entire frame sync period while the MCLK and BCLK pin clock signals are still present, the
W681360 will enter the low power standby mode. Another way to power down is to set the PUI pin to
LOW. When the system needs to be powered up again, the PUI pin needs to be set to HIGH and the
transmit Frame Sync pulse needs to be present. It will take two transmit Frame Sync cycles before the
pin PCMT becomes low impedance.
7.5. ON-CHIP POWER AMPLIFIER
The on-chip power amplifier is typically used to drive an external loudspeaker. The inverting input to
the power amplifier is available at pin PAI. The non-inverting input is tied internally to VAG. The
inverting output PAO– is used to provide a feedback signal to the PAI pin to set the gain of the power
amplifier outputs (PAO+ and PAO-). These push–pull outputs are capable of driving a 300Ω load to
1.772 VPEAK.
Connecting PAI to VDD will power down the power driver amplifiers and the PAO+ and PAO– outputs
will be high impedance.
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Publication Release Date: September 2005
Revision A.2
W681360
8. TIMING DIAGRAMS
TFTRHM
TMCK
TFTRSM
TRISE
TFALL
MCLK
TMCKH
TMCKL
TBCK
BCLKT
TFTRS
TFTRH
TBCKH
TFTFH
TBCKL
TFS
TFSL
FST
TFDTD
TFDTD
TBDTD
THID
THID
PCMT
MSB
BCLKR
(BCLKT)
TFRRS
TFRRH
LSB
TBCK
TBCKH
TFRFH
TBCKL
FSR
TDRS
PCMR
MSB
TDRH
LSB
FIGURE 8.1: LONG FRAME SYNC PCM TIMING
NOTE: The Data is clocked out on the rising edge of BCLK.
The Data is clocked in on the falling edge of BCLK.
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Publication Release Date: September 2005
Revision A.2
W681360
TABLE 8.1: LONG FRAME SYNC PCM TIMING PARAMETERS
SYMBOL
1/TFS
TFSL
1/TBCK
TBCKH
TBCKL
TFTRH
TFTRS
TFTFH
TFDTD
TBDTD
THID
TFRRH
TFRRS
TFRFH
TDRS
TDRH
1
DESCRIPTION
FST, FSR Frequency
FST / FSR Minimum LOW Width 1
BCLKT, BCLKR Frequency 1
BCLKT, BCLKR HIGH Pulse Width
BCLKT, BCLKR LOW Pulse Width
BCLKT Falling Edge to FST Rising
Edge Hold Time
FST Rising Edge to BCLKT Falling
edge Setup Time
BCLKT Falling Edge to FST Falling
Edge Hold Time
The later of BCLKT rising edge, or FST
rising edge to first valid PCMT Bit Delay
Time
BCLKT Rising Edge to Valid PCMT
Delay Time
Delay Time from the Later of FST
Falling Edge, or
BCLKT Falling Edge of last PCMT Bit to
PCMT Output High Impedance
BCLKR Falling Edge to FSR Rising
Edge Hold Time
FSR Rising Edge to BCLKR Falling
edge Setup Time
BCLKR Falling Edge to FSR Falling
Edge Hold Time
Valid PCMR to BCLKR Falling Edge
Setup Time
PCMR Hold Time from BCLKR Falling
Edge
MIN
--TBCK
256
50
50
20
TYP
8
MAX
---
UNIT
kHz
sec
kHz
ns
ns
ns
---------
4800
-------
80
---
---
ns
50
---
---
ns
---
---
60
ns
---
---
60
ns
10
---
60
ns
20
---
---
ns
80
---
---
ns
50
---
---
ns
1
---
---
ns
50
---
---
ns
TFSL must be at least ≥ TBCK
- 16 -
Publication Release Date: September 2005
Revision A.2
W681360
TFTRHM
TMCK
TFTRSM
TRISE
TFALL
MCLK
TMCKH
BCLKT
TFTRS
TFTRH
TMCKL
TBCK
TBCKH
TFTFS
TBCKL
TFS
TFTFH
FST
TBDTD
TBDTD
THID
PCMT
MSB
BCLKR
(BCLKT)
TFRRS
TFRRH
LSB
TBCK
TBCKH
TFRFS
TBCKL
TFRFH
FSR
TDRS
PCMR
MSB
TDRH
LSB
FIGURE 8.2: SHORT FRAME SYNC PCM TIMING
- 17 -
Publication Release Date: September 2005
Revision A.2
W681360
TABLE 8.2: SHORT FRAME SYNC PCM TIMING PARAMETERS
SYMBOL
1/TFS
DESCRIPTION
FST, FSR Frequency
1/TBCK
TBCKH
TBCKL
TFTRH
TFTRS
TFTFH
TFTFS
TBDTD
THID
BCLKT, BCLKR Frequency
BCLKT, BCLKR HIGH Pulse Width
BCLKT, BCLKR LOW Pulse Width
BCLKT Falling Edge to FST Rising Edge Hold Time
FST Rising Edge to BCLKT Falling edge Setup Time
BCLKT Falling Edge to FST Falling Edge Hold Time
FST Falling Edge to BCLKT Falling Edge Setup Time
BCLKT Rising Edge to Valid PCMT Delay Time
Delay Time from BCLKT Falling Edge at last PCMT bit
(LSB) to PCMT Output High Impedance
BCLKR Falling Edge to FSR Rising Edge Hold Time
FSR Rising Edge to BCLKR Falling edge Setup Time
BCLKR Falling Edge to FSR Falling Edge Hold Time
FSR Falling Edge to BCLKR Falling Edge Setup Time
Valid PCMR to BCLKR Falling Edge Setup Time
PCMR Hold Time from BCLKR Falling Edge
TFRRH
TFRRS
TFRFH
TFRFS
TDRS
TDRH
MIN
---
- 18 -
TYP
8
MAX
---
256
50
50
20
80
50
50
10
10
-------------------
4800
------------60
60
20
80
50
50
1
50
-------------
-------------
UNIT
kHz
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Publication Release Date: September 2005
Revision A.2
W681360
TABLE 8.3: GENERAL PCM TIMING PARAMETERS
SYMBOL
1/TMCK
DESCRIPTION
Master Clock Frequency
TMCKH /
TMCK
TMCKH
MCLK Duty Cycle for 256kHz Operation
45%
Minimum Pulse Width HIGH for
MCLK(512kHz or Higher)
Minimum Pulse Width LOW for MCLK
(512kHz or Higher)
MCLK falling Edge to FST Rising Edge
Hold Time
FST Rising Edge to MCLK Falling edge
Setup Time
Rise Time for All Digital Signals
Fall Time for All Digital Signals
50
---
---
ns
50
---
---
ns
50
---
---
ns
50
---
---
ns
-----
-----
50
50
ns
ns
TMCKL
TFTRHM
TFTRSM
TRISE
TFALL
MIN
---
- 19 -
TYP
256
512
1536
1544
2048
2560
4096
4800
MAX
---
UNIT
kHz
55%
Publication Release Date: September 2005
Revision A.2
W681360
9. ABSOLUTE MAXIMUM RATINGS
9.1. ABSOLUTE MAXIMUM RATINGS
Condition
Value
0
Junction temperature
150 C
Storage temperature range
-650C to +1500C
Voltage applied to any pin
(VSS - 0.3V) to (VDD + 0.3V)
Voltage applied to any pin (Input current limited to +/-20 mA)
(VSS – 1.0V) to (VDD + 1.0V)
VDD - VSS
-0.5V to +6V
1. Stresses above those listed may cause permanent damage to the device. Exposure to the absolute
maximum ratings may affect device reliability. Functional operation is not implied at these conditions.
9.2. OPERATING CONDITIONS
Condition
Value
Industrial operating temperature
-400C to +850C
Supply voltage (VDD)
+2.7V to +5.25V
Ground voltage (VSS)
0V
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely
affect the life and reliability of the device.
- 20 -
Publication Release Date: September 2005
Revision A.2
W681360
10. ELECTRICAL CHARACTERISTICS
10.1. GENERAL PARAMETERS
VDD=2.7V – 3.6V; VSS=0V; TA=-40°C to +85°C;
Symbol
Parameters
Conditions
VIL
Input LOW Voltage
VIH
Input HIGH Voltage
VOL
PCMT Output LOW Voltage
IOL = 1.6 mA
VOH
PCMT Output HIGH Voltage
IOL = -1.6 mA
IDD
VDD Current (Operating) - ADC + DAC
No Load
ISB
VDD Current (Standby)
FST&FSR =Vss ; PUI=VDD (3)
Min (2)
Typ
(1)
Max
Units
0.6
V
(2)
2.2
V
0.4
VDD–0.5
(3)
V
V
3.25
4.7
mA
1
100
μA
0.03
10
μA
IPD
VDD Current (Power Down)
PUI= Vss
IIL
Input Leakage Current
VSS<VIN<VDD
-10
+10
μA
IOL
PCMT Output Leakage Current
VSS<PCMT<VDD
High Z State
-10
+10
μA
CIN
Digital Input Capacitance
10
pF
COUT
PCMT Output Capacitance
15
pF
1.
PCMT High Z
Typical values: TA = 25°C , VDD = 3.0 V
2.
All min/max limits are guaranteed by Winbond via electrical testing or characterization. Not all
specifications are 100 percent tested.
3. No DC load from VREF & VAG to Vss
- 21 -
Publication Release Date: September 2005
Revision A.2
W681360
10.2. ANALOG SIGNAL LEVEL AND GAIN PARAMETERS
VDD=2.7V to 3.6V; VSS=0V; TA=-40°C to +85°C; all analog signals referred to VAG; 0dBm0 = 0.436 Vrms = 5dBm @ 600 Ohm; FST =FSR = 8kHz;MCLK=BCLK= 2.048 MHz
PARAMETER
SYM.
Absolute Level
LABS
Max. Transmit
Level
Absolute Gain (0
dBm0 @ 1020Hz;
TA=+25°C)
Absolute Gain
variation with
Temperature
Frequency
Response,
Relative to 0dBm0
@ 1020Hz
(HB=0)
TXMAX
CONDITION
TYP.
0 dBm0 = -5dBm @ 600Ω
0.616
0.436
3.2
0.886
0
TRANSMIT
(A/D)
MIN.
MAX.
-----
RECEIVE
(D/A)
MIN.
MAX.
-----
---
---
---
---
-0.20
+0.20
-0.20
+0.20
UNIT
VPK
VRMS
dBm0
VPK
dB
GABS
0 dBm0 @ 1020Hz;
TA=+25°C
GABST
TA=0°C to TA=+70°C
TA=-40°C to TA=+85°C
0
-0.05
-0.10
+0.05
+0.10
-0.05
-0.10
+0.05
+0.10
dB
GRTV
15Hz
50Hz
60Hz
200Hz
300 to 1600Hz
1600 to 2400Hz
2400 to 3000Hz
3300Hz
3400Hz
3600Hz
4000Hz
4600Hz to 100kHz
-------------------------
-------1.4
-0.2
-0.2
-0.2
-0.2
-0.7
-------
-45
-30
-26
-0.4
+0.2
+0.2
+0.2
+0.2
+0.15
0
-12.5
-32
-0.5
-0.5
-0.5
-0.5
-0.2
-0.2
-0.25
-0.4
-0.8
-------
0
0
0
0
+0.2
+0.25
+0.2
+0.15
0
0
-12.5
-30
dB
- 22 -
Publication Release Date: September 2005
Revision A.2
W681360
10.3. ANALOG DISTORTION AND NOISE PARAMETERS
VDD=2.7V to 3.6V; VSS=0V; TA=-40°C to +85°C; all analog signals referred to VAG; 0dBm0 = 0.436 Vrms = 5dBm @ 600 Ohm; FST =FSR = 8kHz;MCLK=BCLK= 2.048 MHz
PARAMETER
SYM.
CONDITION
Total Distortion
vs. Level Tone
(1020Hz, CMessage
Weighted)
DLT
+3 dBm0
0 dBm0
-10 dBm0
-20 dBm0
-30 dBm0
-40 dBm0
-50 dBm0
-60 dBm0
Spurious Out-OfBand at RO(300Hz to 3400Hz
@ 0dBm0)
Crosstalk
(1020Hz @
0dBm0)
Absolute Group
Delay
Group Delay
Distortion (relative
to group delay @
1200Hz)
DSPO
4600Hz to 7600Hz
7600Hz to 8400Hz
8400Hz to 100000Hz
Idle Channel
Noise
NIDL
DXT
TRANSMIT (A/D)
MIN. TYP. MAX.
55
--45
60
--50
60
--51
54
--50
44
--41
34
--32
24
--22
14
--12
-------------------
RECEIVE (D/A)
MIN.
TYP. MAX.
60
--50
63
--48
60
--45
55
--48
47
--45
37
--35
27
--25
17
--14
-----30
-----40
-----30
UNIT
dBC
dB
---
---
-75
---
---
-75
dB
τABS
1200Hz (HB=0)
---
---
360
---
---
240
μsec
τD
500Hz
600Hz
1000Hz
2600Hz
2800Hz
C-message weighted
Psophometric weighted
---------------
---------------
750
380
130
130
750
18
-72
---------------
---------------
750
370
120
120
750
12
-74
μsec
- 23 -
dBrnc0
dBm0p
Publication Release Date: September 2005
Revision A.2
W681360
10.4. ANALOG INPUT AND OUTPUT AMPLIFIER PARAMETERS
VDD=2.7V to 3.6V; VSS=0V; TA=-40°C to +85°C; all analog signals referred to VAG;
PARAMETER
AI Input Offset Voltage
AI Input Current
AI Input Resistance
AI Input Capacitance
AI Common Mode Input Voltage
Range
AI Common Mode Rejection Ratio
AI Amp Gain Bandwidth Product
SYM.
VOFF,AI
IIN,AI
RIN,AI
CIN,AI
VCM,AI
CONDITION
AI+, AIAI+, AIAI+, AI- to VAG
AI+, AIAI+, AI-
MIN.
----10
--1.2
TYP.
--±0.1
-------
MAX.
±25
±1.0
--10
VDD-1.2
UNIT.
mV
μA
MΩ
pF
V
CMRRTI
GBWTI
AI+, AIAO, RLD≥10kΩ
-----
-----
dB
kHz
----0.4
2
----±1.0
----VDD/2-0.1
60
2500
95
-24
----------1
--VDD/2
AI Amp DC Open Loop Gain
AI Amp Equivalent Input Noise
AO Output Voltage Range
Load Resistance
Load Capacitance
Load Capacitance
AO & RO Output Current
RO- Output Resistance
RO- Output Offset Voltage
Analog Ground Voltage
GTI
NTI
VTG
RLDTGRO
CLDTGAO
CLDTGRO
IOUT1
RROVOFF,ROVAG
VAG Output Resistance
RVAG
AO, RLD≥10kΩ
C-Message Weighted
RLD=2kΩ to VAG
AO, RO to VAG
AO
RO
0.5 ≤AO,RO-≤ VDD-0.5
RO-, 0 to 3400Hz
RO- to VAG
Relative to VSS (no
load)
Within ±25mV change
----VDD-0.4
--100
200
----±25
VDD/2+0.1
dB
dBrnC
V
kΩ
pF
pF
mA
Ω
mV
V
---
12.5
Ω
Transmit
Receive
40
40
60
60
25
-----
Power Supply Rejection Ratio (0 to
100kHz to VDD, C-message. All
signals referenced to VAG)
PAI Input Offset Voltage
PAI Input Current
PAI Input Resistance
PAI Amp Gain Bandwidth Product
PSRR
dBC
VOFF,PAI
IIN,PAI
RIN,PAI
GBWPI
PAI
PAI
PAI to VAG
PAO- no load
(@10kHz)
PAO+ to PAOPAO+, PAOdifferentially or PAO+,
PAO to VAG
----10
---
--±0.05
--1000
±25
±1.0
-----
mV
μA
MΩ
kHz
Output Offset Voltage
Load Capacitance
VOFF,PO
CLDPO
-----
-----
±50
1000
mV
pF
- 24 -
Publication Release Date: September 2005
Revision A.2
W681360
VDD=2.7V to 3.6V; VSS=0V; TA=-40°C to +85°C; all analog signals referred to VAG;
PARAMETER
PAO Output Current
SYM.
IOUTPAO
PAO Output Resistance
PAO Differential Gain
RPAO
GPAO
PAO Differential Signal to Distortion
C-Message weighted
DPAO
PAO Power Supply Rejection Ratio
(0 to 25kHz to VDD, Differential out)
PSRRPA
O
CONDITION
0.4 ≤ PAO+,PAO--≤
VDD-0.4
PAO+ to PAORLD=300Ω, +3dBm0,
1kHz, PAO+ to PAOZLD=300Ω
ZLD=100nF + 20Ω
ZLD=100Ω (10mA
limit)
0 to 4kHz
4 to 25kHz
- 25 -
MIN.
±10.0
TYP.
---
MAX.
---
UNIT.
mA
---0.2
1
0
--+0.2
Ω
dB
45
-----
60
40
40
-------
dBC
40
---
55
40
-----
dB
Publication Release Date: September 2005
Revision A.2
W681360
10.5. DIGITAL I/O
10.5.1. PCM Codes for Zero and Full Scale
Level
Sign bit
Magnitude Bits
+ Full Scale
+ One Step
Zero
- One Step
- Full Scale
0
0
0
1
1
1111 1111 1111
0000 0000 0001
0000 0000 0000
1111 1111 1111
0000 0000 0000
10.5.2. PCM Codes for 1kHz Digital Milliwatt
Phase
Sign bit
Magnitude Bits
π/8
0
0100 0011 1100
3π / 8
0
1010 0011 1001
5π / 8
0
1010 0011 1001
7π / 8
0
0100 0011 1100
9π / 8
1
1011 1100 0100
11π / 8
1
0101 1100 0111
13π / 8
1
0101 1100 0111
15π / 8
1
1011 1100 0100
- 26 -
Publication Release Date: September 2005
Revision A.2
W681360
11. TYPICAL APPLICATION CIRCUIT
VDD
1K
1.0 uF
ELECTRET
MICROPHONE
17
100pF
3.9K
18
100pF
62K
0.01 uF
0.1 uF
27K
1.5K
3.9K
19
20
1
27K
27K
2
3
4
5
AO
FST
BCLKT
PCMT
AIAI+
MCLK
VAG
VREF
PCMR
BCLKR
FSR
RO-
14
12
13
11
8
9
7
8 KHz Frame Sy nc
2.048 MHz
Bit Clock
PCM OUT
PCM IN
PAI
PAOVSS
1.0 uF
VDD
U2
62K
+
6
22 uF
0.1 uF
PAO+
W681360
HB
PUI
16
10
HP FILTER SELECT
POWER CONTROL
15
1.5K
SPEAKER
FIGURE 11.1: TYPICAL HANDSET INTERFACE
- 27 -
Publication Release Date: September 2005
Revision A.2
W681360
12. PACKAGE DRAWING AND DIMENSIONS
12.1. 20L SOG (SOP)-300MIL
SMALL OUTLINE PACKAGE (SAME AS SOG & SOIC) DIMENSIONS
11
20
c
E
HE
L
1
10
D
0.2
O
A
Y
SEATING
e
GAUGE
A
b
SYMBOL
A
A1
b
c
E
D
e
HE
Y
L
0
DIMENSION (MM)
MAX.
MIN.
2.35
0.10
2.65
0.30
0.33
0.51
0.23
0.32
7.40
7.60
12.60
13.00
1.27 BSC
10.00
10.65
0.10
0.40
1.27
0º
8º
- 28 -
DIMENSION (INCH)
MIN.
MAX.
0.093
0.004
0.104
0.012
0.013
0.020
0.009
0.013
0.291
0.299
0.496
0.512
0.050 BSC
0.394
0.419
0.004
0.016
0.050
0º
8º
Publication Release Date: September 2005
Revision A.2
W681360
12.2. 20L SSOP-209 MIL
SHRINK SMALL OUTLINE PACKAGE DIMENSIONS
D
11
20
DTEAIL
HE E
1
10
A
b
A
SEATING PLANE
Y
e
SYMBOL
A
A1
A2
b
c
D
E
HE
e
L
L1
Y
0
SEATING PLANE
θ
L
L
b
A
DETAIL
DIMENSION (MM)
NOM.
MAX.
MIN.
DIMENSION (INCH)
MIN.
NOM.
MAX.
0.05
1.65
0.22
0.09
6.90
5.00
7.40
0.55
0º
0.002
0.065
0.009
0.004
0.272
0.197
0.291
0.021
0
1.75
7.20
5.30
7.80
0.65
0.75
1.25
-
2.00
1.85
0.38
0.25
7.50
5.60
8.20
0.95
0.10
8º
- 29 -
0.069
0.283
0.209
0.307
0.0256
0.030
0.050
-
0.079
0.015
0.010
0.295
0.220
0.323
0.037
0.004
8º
Publication Release Date: September 2005
Revision A.2
W681360
12.3. 20L TSSOP - 4.4X6.5MM
PLASTIC THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) DIMENSIONS
SYMBOL
A
A1
A2
E
HE
D
L
L1
b
e
c
0
Y
MIN.
0.05
0.80
4.30
6.40
0.50
0.19
0.09
0º
DIMENSION (MM)
NOM.
MAX.
1.20
0.15
0.90
1.05
4.40
4.50
6.40 BSC
6.50
6.60
0.60
0.75
1.00 REF
0.30
0.65 BSC
0.20
8º
0.10 BASIC
- 30 -
DIMENSION (INCH)
MIN.
NOM.
MAX.
0.047
0.002
0.006
0.031
0.035
0.041
0.169
0.173
0.177
.252 BSC
0.252
0.256
0.260
0.020
0.024
0.030
0.039 REF
0.007
0.012
0.026 BSC
0.004
0.008
0º
8º
0.004 BASIC
Publication Release Date: September 2005
Revision A.2
W681360
12.3. QFN-32L
QUAD FLAT PACK NO LEADS PACKAGE (QFN) DIMENSIONS
L
- 31 -
Publication Release Date: September 2005
Revision A.2
W681360
13. ORDERING INFORMATION
Winbond Part Number Description
W681360_ _
Product Family
W681360
Package Material:
Blank =
Standard Package
G
=
Pb-free (RoHS) Package
Package Type:
S
=
20-Lead Plastic Small Outline Package (SOG/SOP)
R
=
20-Lead Plastic Shrink Small Outline Package (SSOP)
W
=
20-Lead Plastic Thin Shrink Small Outline Package (TSSOP)
Y
=
32-Quad Flat No leads Package (QFN)
When ordering W681360 series devices, please refer to the following part numbers.
Part Number
W681360S
W681360R
W681360W
W681360SG
W681360RG
W681360WG
W681360YG*
* W681360YG available in Pb-free (RoHS) package only
- 32 -
Publication Release Date: September 2005
Revision A.2
W681360
14. VERSION HISTORY
VERSION
A.1
A.15
A.16
DATE
April 2004
April 2005
September,
2005
PAGE
All
32
2
6, 7
9
10, 12
22
27
31
32
DESCRIPTION
Preliminary Specification
Add Important Note
Added reference to Pb-free RoHS packaging and to VRMS
Added reference to QFN-32L package
Added QFN-32L Pinout
Added Pin numbers to Tables
Capitalized logic HIGH/LOW
Added Reference to VRMS
Improved Application Diagram
Added QFN-32L Mechanical Dimensions
Added Y and G package ordering code
- 33 -
Publication Release Date: September 2005
Revision A.2
W681360
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control instruments,
airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, or for other applications intended to support or sustain life.
Further more, Winbond products are not intended for applications wherein failure of Winbond
products could result or lead to a situation wherein personal injury, death or severe property
or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
The information contained in this datasheet may be subject to change
without notice. It is the responsibility of the customer to check the
Winbond USA website (www.winbond-usa.com) periodically for the latest
version of this document, and any Errata Sheets that may be generated
- 34 -
Publication Release Date: September 2005
Revision A.2