CYStech Electronics Corp. Spec. No. : C211A3 Issued Date : 2003.03.026 Revised Date :2005.03.21 Page No. : 1/5 High Voltage NPN Epitaxial Planar Transistor BTNA44A3 Features • High breakdown voltage. (BVCEO =400V) • Low saturation voltage, typically VCE(sat) =60mV at IC/IB=10mA/1mA. • Complementary to BTPA94A3 Symbol Outline BTNA44A3 TO-92 B：Base C：Collector E：Emitter EBC Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation (TA=25℃) Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC PD Tj Tstg Limit 400 400 6 300 0.625 150 -55~+150 Unit V V V mA W °C °C Note : *1. Single Pulse Pw≦380µs,Duty≦2%. BTNA44A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211A3 Issued Date : 2003.03.026 Revised Date :2005.03.21 Page No. : 2/5 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES VCE(sat) 1 VCE(sat) 2 *VCE(sat) 3 VBE(sat) hFE 1 hFE 2 *hFE 3 *hFE 4 fT Cob Min. 400 400 6 40 52 45 40 50 - Typ. 0.06 0.06 0.1 0.68 4 Max. 0.1 0.1 0.5 0.35 0.35 0.75 0.75 270 - Unit V V V µA µA µA V V V V MHz pF Test Conditions IC=100µA, IE=0 IC=1mA, IB=0 IE=10µA, IC=0 VCB=400V, IE=0 VEB=4V, IC=0 VCE=400V, VBE=0 IC=1mA, IB=0.1mA IC=10mA, IB=1mA IC=50mA, IB=5mA IC=10mA, IB=1mA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=50mA VCE=10V, IC=100mA VCE=20V, IE=10mA, f=100MHz VCB=20V, f=1MHz *Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE2 Rank Range BTNA44A3 K 52~120 P 82~180 Q 120~270 CYStek Product Specification Spec. No. : C211A3 Issued Date : 2003.03.026 Revised Date :2005.03.21 Page No. : 3/5 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 10000 1000 Saturation Voltage-(mV) Current Gain---HFE VCESAT VCE=10V 100 VCE=5V 1000 IC=30IB 100 IC=20IB IC=10IB 10 10 1 10 100 1 1000 10 Collector Current ---IC(mA) Saturation Voltage vs Collector Current 700 Power Dissipation---PD(mW) Saturation Voltage-(mV) 1000 Power Derating Curve 10000 VBESAT@IC=10IB 1000 100 600 500 400 300 200 100 0 1 10 100 Collector Current--- IC(mA) BTNA44A3 100 Collector Current ---IC(mA) 1000 0 50 100 150 200 Ambient Temperature---TA(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211A3 Issued Date : 2003.03.026 Revised Date :2005.03.21 Page No. : 4/5 TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - BTNA44A3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification Spec. No. : C211A3 Issued Date : 2003.03.026 Revised Date :2005.03.21 Page No. : 5/5 CYStech Electronics Corp. TO-92 Dimension Marking: α2 A B 1 2 NA44 3 α3 C D 1 H I 2 3 G α1 Style: Pin 1.Emitter 2.Base 3.Collector E 3-Lead TO-92 Plastic Package CYStek Package Code: A3 F *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTNA44A3 CYStek Product Specification