UMX5601 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS RoHS COMPLAINT KEY FEATURE S DESCRIPTION TM IMPORTANT:Forthemostcurrentdata,consultMICROSEMI’s website: www.microsemi.com ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Symbol Value Ultra low magnetic construction SOGO passivated chip Thermally matched configuration RoHS compliant 1 Low capacitance at 0 V bias Low conductance at 0 V bias Metallurgical bond www.MICROSEMI.com The UMX5601 PIN diode series was designed to provide ultra low magnetic PIN diodes for in bore surface coil applications associated with higher field strength (3T and greater) MR scanners. These PIN diodes produce the minimum artifacts (magnetic field distortions) available in the industry, today. The diodes have been tested in magnetic fields of ±7 Tesla. The UMX5601 PIN diodes have a magnetic moment at 7 T of 4E-8 (J/T). The diodes are offered in a surface mount package. The SM package utilizes a round end cap to mark the anode. The cathode is square. The fully passivated PIN diode chip is full face metallurgically bonded to shortened high conductive pins for lower thermal and electrical resistances. The PIN diodes feature low forward bias resistance and high zero bias impedance. The UMX5601 PIN diodes are characterized at 64, 128, and 300 MHz. The UMX5601SM meets RoHS requirements per EU Directive 2002/95/EC. Fused-in-glass construction Non cavity design Unit Available in surface mount package. Compatible with automatic insertion equipment Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 100 100 100 RMS Reverse Voltage V R (RMS) 75 V Storage Temperature T stg -65 to +175 ºC Operating Temperature Non-Repetitive Peak T op -65 to +150 ºC V 1- These devices are supplied with Silver terminations. Other terminal finishes may be available on request. Consult factory for details. THERMAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED) Thermal Resistance UMX5601SM Symbol θ Value 2 Unit ºC/Watt APPLICATIONS/BENEFITS High B Field (3T+) in bore APPLICATIONS: Active or semi-active (not passive) MR blocking circuits MR detuning circuits UMX 5601 MR disable circuits MR receiver protector circuits Copyright 2005 Rev. B, 2006-12-20 Microsemi Lowell Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 1 UMX5601 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS RoHS COMPLAINT ELECTRICAL PARAMETERS @ 25 C (unless otherwise specified) Parameter Conditions Forward Voltage (Note 1) VF I F = 100 mA Reverse Break Down Voltage VBR I R = 10 uA Reverse Current IR VR = 100 V Inductance Ls Magnetic moment m @ 7T @ 1T χ ρ @ 7T @ 1T Volume Susceptibility χ >1T to 7T <1 T Capacitance CT Parallel Resistance Rp Series Resistance Rs If = 100 mA F = 64 MHz Lifetime τ If = 10 mA Mass Susceptibility VR = 0 V, F = 1 MHZ VR = 50 V, F = 1 MHz VR = 0 V, F = 64 MHz VR = 30 V, F = 64 MHz Min Typ. Max Units 0.75 1.0 V 100 V 10 uA 900 pH 4E-8 1E-7 J/T J/T -3.3E-11 6.5E-10 m3/kg m3/kg -3.1E-7 5.9E-6 SI SI 5 100 5 9 2.6 9 250 10 3.0 0.3 0.5 10 www.MICROSEMI.com Symbol pF kOhms Ohms us ELEC TR IC ALS Copyright 2005 Rev. B, 2006-12-20 Microsemi Lowell Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 2 UMX5601 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS RoHS COMPLAINT MAGNETIC MOMENT VS F IELD C - V CURVES www.MICROSEMI.com Ma gn etic Mo ment (J/T ) 3.0E-07 2.0E-07 1.0E-07 0.0E+00 -1.0E-07 -2.0E-07 -3.0E-07 -10.0 -5.0 0.0 5.0 10.0 Field (T) RP – PARALLEL R ESISTANCE RS VS IF GR APHS Copyright 2005 Rev. B, 2006-12-20 Microsemi Lowell Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 3 UMX5601 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS RoHS COMPLAINT VF VS IF SM STYLE SOLDER FOOTPRINT www.MICROSEMI.com NOTES: 1. 2. These dimensions will match the terminals and provide for additional solder fillets at the outboard ends at least as wide as the terminals themselves, assuming accuracy of device placement within .005 inches. If the mounting method chosen requires use of an adhesive separate from the solder compound, a round (or square) spot of cement as shown should be centrally located. Dimensions shown are in inches “SM” STYLE PACKAGE OUTLI NE DIMENSIONS SHOWN ARE IN INCHES Copyright 2005 Rev. B, 2006-12-20 Microsemi Lowell Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 4 UMX5601 ULTRA LOW MAGNETIC MOMENT PIN DIODE FOR MRI APPLICATIONS RoHS COMPLAINT www.MICROSEMI.com NOTES: N OTES Copyright 2005 Rev. B, 2006-12-20 Microsemi Lowell Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 5