MICROSEMI UMX5601

UMX5601
ULTRA LOW MAGNETIC MOMENT PIN
DIODE FOR MRI APPLICATIONS
RoHS COMPLIANT
KEY FEATURES
DESCRIPTION
TM
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Symbol
Value
 SOGO passivated chip
 Thermally matched configuration
 RoHS compliant 1
 Low capacitance at 0 V bias
 Low conductance at 0 V bias
 Metallurgical bond
 Fused-in-glass construction
IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com
Rating
 Ultra low magnetic construction
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The UMX5601 PIN diode series was designed to provide ultra low magnetic PIN
diodes for in bore surface coil applications associated with higher field strength (3T
and greater) MR scanners. These PIN diodes produce the minimum artifacts
(magnetic field distortions) available in the industry, today. The diodes have been
tested in magnetic fields of ±7 Tesla.
The UMX5601 PIN diodes have a magnetic moment at 7 T of 4E-8 (J/T).
The diodes are offered in a surface mount package. The SM package utilizes a
round end cap to mark the anode. The cathode is square. The fully passivated PIN
diode chip is full face metallurgically bonded to shortened high conductive pins for
lower thermal and electrical resistances. The PIN diodes feature low forward bias
resistance and high zero bias impedance. The UMX5601 PIN diodes are
characterized at 64, 128, and 300 MHz. The UMX5601SM meets RoHS requirements
per EU Directive 2002/95/EC.
 Non cavity design
Unit
 Available in surface mount
package.
 Compatible with automatic
insertion equipment
100
100
100
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
RMS Reverse Voltage
Storage Temperature
V R (RMS)
T stg
75
-65 to +175
V
ºC
Operating Temperature Non-Repetitive Peak
T op
-65 to +150
ºC
V
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
1- These devices are supplied with
Silver terminations. Other terminal
finishes may be available on request.
Consult factory for details.
APPLICATIONS/BENEFITS
Thermal Resistance
Symbol
Value
Unit
UMX5601SM
θ
2
ºC/Watt
 High B Field (3T+) in bore
APPLICATIONS:
 Active or semi-active
(not passive)
 MR blocking circuits
 MR detuning circuits
UMX5601
 MR disable circuits
 MR receiver protector circuits
Copyright  2005
Rev: 2010-02-03
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 1
UMX5601
ULTRA LOW MAGNETIC MOMENT PIN
DIODE FOR MRI APPLICATIONS
RoHS COMPLIANT
ELECTRICAL PARAMETERS @ 25C (unless otherwise specified)
Parameter
Conditions
Forward Voltage
VF
IF = 100 mA
Reverse Break Down Voltage
VBR
IR = 10 uA
Reverse Current
IR
VR = 100 V
Inductance
Ls
Magnetic moment
m
Mass Susceptibility
Volume Susceptibility
Min
Typ.
Max
Units
0.75
1.0
V
10
uA
100
V
900
pH
@ 7T
@ 1T
4E-8
1E-7
J/T
J/T
χρ
@ 7T
@ 1T
-3.3E-11
6.5E-10
m3/kg
m3/kg
χ
>1T to 7T
<1T
-3.1E-7
5.9E-6
SI
SI
VR = 0 V, F = 1 MHz
9
10
VR = 50 V, F = 1 MHz
2.6
3.0
Capacitance
CT
Parallel Resistance
RP
Series Resistance
RS
If = 100 mA F = 64 MHz
Lifetime
τ
If = 10 mA
VR = 0 V, F = 64 MHz
VR = 30 V, F = 64 MHz
5
9
100
250
0.3
5
10
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Symbol
pF
kΩ
0.5
Ω
us
ELECTRICALS
Copyright  2005
Rev: 2010-02-03
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 2
UMX5601
ULTRA LOW MAGNETIC MOMENT PIN
DIODE FOR MRI APPLICATIONS
RoHS COMPLIANT
MAGNETIC MOMENT VS FIELD
C-V CURVES
www.MICROSEMI.com
UMX5601
TYPICAL
10
3.0E-07
2.0E-07
8
7
1.0E-07
6
Ct (pF)
Magnetic Moment (J/T)
9
0.0E+00
1 MHz
5
4
-1.0E-07
3
64, 128, & 300 MHz
2
-2.0E-07
1
0
-3.0E-07
-10.0
-5.0
0.0
5.0
100
10.0
101
102
Vr (V)
Field (T)
RP – PARALLEL RESISTANCE
RS VS IF
UMX5601
TYPICAL
10
6
UMX5601
TYPICAL
64 MHz
128 MHz
102
300 MHz
Rp (Ohms)
105
Rs (Ohms)
101
104
0
10
103
0
5
10
15
20
25
30
35
40
45
50
Vr (V)
64, 100, 128 & 300 MHz
10-1
10-1
100
101
102
If (mA)
GRAPHS
Copyright  2005
Rev: 2010-02-03
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 3
UMX5601
ULTRA LOW MAGNETIC MOMENT PIN
DIODE FOR MRI APPLICATIONS
RoHS COMPLIANT
VF VS IF
SM STYLE SOLDER FOOTPRINT
www.MICROSEMI.com
NOTES:
1.
2.
These dimensions will match the terminals and provide
for additional solder fillets at the outboard ends
at least as wide as the terminals themselves,
assuming accuracy of device placement within .005
inches.
If the mounting method chosen requires use of an
adhesive separate from the solder compound, a round
(or square) spot of cement as shown should be
centrally located.
Dimensions shown are in inches
“SM” STYLE PACKAGE OUTLINE
MECHANICAL
DIMENSIONS SHOWN ARE IN INCHES
Copyright  2005
Rev: 2010-02-03
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 4