EVALUATION KIT AVAILABLE MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter General Description The MAX16903 is a small, synchronous buck converter with integrated high-side and low-side switches. The device is designed to deliver 1A with input voltages from +3.5V to +28V while using only 25μA quiescent current at no load. Voltage quality can be monitored by observing the PGOOD signal. The MAX16903 can operate in dropout by running at 97% duty cycle, making it ideal for automotive and industrial applications. The MAX16903 operates at a 2.1MHz frequency, allowing for small external components and reduced output ripple. It guarantees no AM band interference. SYNC input programmability enables three frequency modes for optimized performance: forced fixed-frequency operation, skip mode (ultra-low quiescent current of 25μA), and synchronization to an external clock. The MAX16903 can be ordered with spread-spectrum frequency modulation, designed to minimize EMI-radiated emissions due to the modulation frequency. The MAX16903 is available in a thermally enhanced, 3mm x 3mm, 10-pin TDFN package or a 16-pin TSSOP package. The MAX16903 operates over the -40°C to +125°C automotive temperature range. Applications Features o Wide +3.5V to +28V Input Voltage Range o Tolerates Input Voltage Transients to +42V o 1A Minimum Output Current with Overcurrent Protection o Fixed Output Voltages (see the Selector Guide and contact the factory for all available trimmed output voltage options) o 2.1MHz Switching Frequency with 3 Modes of Operation 25µA Ultra-Low Quiescent Current Skip Mode Forced Fixed-Frequency Operation External Frequency Synchronization o Optional Spread-Spectrum Frequency Modulation o Power-Good Output o Enable-Pin Compatible from +3.3V Logic Level to +42V o Thermal Shutdown Protection o -40°C to +125°C Automotive Temperature Range o 10-Pin TDFN-EP or 16-Pin TSSOP-EP Packages o AEC-Q100 Qualified Automotive Ordering Information Industrial Military PART TEMP SPREAD SPECTRUM RANGE High-Voltage Input-Power DC-DC Applications PINPACKAGE MAX16903RAUE__/V+ Disabled -40°C to +125°C 16 TSSOP-EP* MAX16903RATB__/V+ Disabled -40°C to +125°C 10 TDFN-EP* MAX16903SAUE__/V+ Enabled -40°C to +125°C 16 TSSOP-EP* MAX16903SATB__/V+ Enabled -40°C to +125°C 10 TDFN-EP* Note: Insert the desired suffix letters (from Selector Guide) into the blanks to indicate the output voltage. Alternative output voltages available upon request. +Denotes a lead(Pb)-free/RoHS-compliant package. /V denotes an automotive qualified part. *EP = Exposed pad. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 19-5038; Rev 4; 4/13 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Typical Operating Circuits 33kΩ SUP 4.7μF VBAT LEVEL SIGNAL EN * MAX16903_50/V+ SYNC BST GND 0.1μF 4.7μH 5V AT 1A PGOOD LX 10μF 20kΩ PGND BIAS OUTS 2.2μF 33kΩ SUP 4.7μF VBAT LEVEL SIGNAL EN * MAX16903_33/V+ SYNC BST GND 0.1μF 3.3μH 3.3V AT 1A LX PGOOD 10μF 20kΩ PGND OUTS BIAS 2.2μF *PLACE INPUT SUPPLY CAPACITORS AS CLOSE AS POSSIBLE TO THE SUP PIN. SEE THE APPLICATIONS INFORMATION SECTION FOR MORE DETAILS. 2 Maxim Integrated MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) SUP, EN..................................................................-0.3V to +42V BST to LX..................................................................-0.3V to +6V LX..............................................................-0.3V to (VSUP + 0.3V) BST .........................................................................-0.3V to +47V OUTS ......................................................................-0.3V to +12V SYNC, PGOOD, BIAS............................................-0.3V to +6.0V PGND to GND .......................................................-0.3V to +0.3V LX Continuous RMS Current .................................................1.5A OUTS Short-Circuit Duration ......................................Continuous ESD Protection Human Body Model .........................................................±2kV Machine Model ..............................................................±200V Continuous Power Dissipation (TA = +70°C) TDFN (derate 24.4 mW/°C above +70°C)......................1951mW TSSOP (derate 26.1 mW/°C above +70°C) ...................2089mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TDFN Junction-to-Ambient Thermal Resistance (θJA) ...........41°C/W Junction-to-Case Thermal Resistance (θJC) ..................9°C/W TSSOP Junction-to-Ambient Thermal Resistance (θJA) ........38.3°C/W Junction-to-Case Thermal Resistance (θJC) ..................3°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (VSUP = +14V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage Range VSUP Supply Current I SUP CONDITIONS MIN (Note 2) UV Lockout 42 EN = low 4 8 EN = high, no load 25 35 Bias rising 1 2.8 VUVLO,HYS Hysteresis Bias Voltage VBIAS Bias Current Limit IBIAS MAX 28 t < 1s EN = high, continuous, no switching VUVLO TYP 3.5 3 V µA mA 3.2 0.4 +5.5V VSUP +42V UNITS 5 V V 10 mA BUCK CONVERTER VOUT,5V Voltage Accuracy VOUT,3.3V VOUT,5V VOUT,3.3V Maxim Integrated VOUT = 5V, fixed frequency VOUT = 5V, SKIP mode (Note 3) VOUT = 3.3V, fixed frequency VOUT = 3.3V, SKIP mode (Note 3) VOUT = 5V, fixed frequency VOUT = 5V, SKIP mode (Note 3) VOUT = 3.3V, fixed frequency VOUT = 3.3V, SKIP mode (Note 3) 6V VSUP 18V, ILOAD = 0 to 1A, TA = 0°C to +125°C 6V VSUP 18V, ILOAD = 0 to 1A, TA = -40°C to +125°C -2.0% 5 +2.5% -2.0% 5 +4% +2.5% -2.0% 3.3 -2.0% 3.3 +4% -3.0% -3.0% 5 +2.5% 5 +4% -3.0% 3.3 +2.5% -3.0% 3.3 +4% V 3 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter ELECTRICAL CHARACTERISTICS (continued) (VSUP = +14V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL Skip-Mode Peak Current I SKIP High-Side DMOS RDSON R ON,HS Low-Side DMOS RDSON R ON,LS DMOS Peak Current-Limit Threshold Soft-Start Ramp Time LX Rise Time CONDITIONS MIN TYP MAX UNITS 400 800 m 250 450 m 350 VBIAS = 5V IMAX 1.275 1.5 1.75 A t SS 7 8 9 ms tRISE,LX 5 Minimum On-Time t ON 80 PWM Switching Frequency f SW SYNC Input Frequency Range Spread-Spectrum Range mA Internally generated f SYNC SS 1.925 2.1 1.8 Spread-spectrum option only ns ns 2.275 MHz 2.6 MHz +6 % PGOOD PGOOD Threshold PGOOD Debounce VTHR,PGD VOUT rising VTHF,PGD VOUT falling 93 88 tDEB 91 94 10 % µs PGOOD HIGH Leakage Current ILEAK,PGD TA = +25°C 1 µA PGOOD Output Low Level VOUT,PGD Sinking 1mA 0.4 V LOGIC LEVELS EN Level EN Input Current SYNC Switching Threshold SYNC Internal Pulldown VIH,EN 2.4 0.6 VIL,EN I IN,EN VEN = V SUP = +42V, TA = +25°C VIH,SYNC 1 1.4 0.4 VIL,SYNC V µA V RPD,SYNC 200 k T SHDN 175 °C T SHDN,HYS 15 °C THERMAL PROTECTION Thermal Shutdown Thermal Shutdown Hysteresis Note 2: When the typical minimum on-time of 80ns is violated, the device skips pulses. Note 3: Guaranteed by design; not production tested. 4 Maxim Integrated MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Typical Operating Characteristics (VSUP = +14V, TA = +25°C, unless otherwise noted.) EFFICIENCY vs. LOAD CURRENT (5V VERSION) FFF MODE 60 50 40 30 20 40 5V PART 30 20 3.3V PART 10 0 0.001 0.01 0.1 MAX16903 toc03 0 -1 -2 8 10 12 14 16 18 20 22 24 26 28 6 8 10 12 14 16 18 20 22 24 26 28 INPUT VOLTAGE (V) INPUT VOLTAGE (V) LOAD REGULATION SHUTDOWN SUPPLY CURRENT vs. INPUT VOLTAGE STARTUP WAVEFORM (ILOAD = 1A) SKIP MODE 12 SUPPLY CURRENT (µA) 1 0 FFF MODE -2 MAX16903 toc06 MAX16903 toc05 15 MAX16903 toc04 OUTPUT-VOLTAGE CHANGE (%) 1 -4 6 2 -1 2 ILOAD (A) 4 3 1 3 -3 10 0 0.00001 0.0001 4 OUTPUT-VOLTAGE CHANGE (%) EFFICIENCY (%) 70 50 SUPPLY CURRENT (µA) SKIP MODE 80 60 MAX16903 toc02 90 MAX16903 toc01 100 LINE REGULATION (ILOAD = 1A) NO-LOAD SUPPLY CURRENT vs. INPUT VOLTAGE (SKIP MODE) EN 5V/div IINDUCTOR 1A/div 9 6 PGOOD 5V/div 3 -3 -4 0 0.2 0.4 0.6 0.8 1.0 VOUT 5V/div 0 6 LOAD CURRENT (A) 1ms/div 8 10 12 14 16 18 20 22 24 26 28 INPUT VOLTAGE (V) LOAD-TRANSIENT RESPONSE (FIXED MODE) SHUTDOWN WAVEFORM (ILOAD = 1A) MAX16903 toc08 MAX16903 toc07 ILOAD 1A/div EN 5V/div IINDUCTOR 1A/div PGOOD 5V/div VOUT 5V/div 20µs/div Maxim Integrated VOUT 200mV/div AC COUPLED 5V PGOOD 5V/div 5V ILOAD = 100mA TO 1A TO 100mA 200µs/div 5 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Typical Operating Characteristics (continued) (VSUP = +14V, TA = +25°C, unless otherwise noted.) LOAD-TRANSIENT RESPONSE (SKIP MODE) STANDBY CURRENT vs. LOAD CURRENT UNDERVOLTAGE PULSE (COLD CRANK) MAX16903 toc10 14V 3.5V VOUT 5V/div 250 150 100 ILOAD = 500mA ILOAD 1A/div ILOAD = 100mA TO 1A TO 100mA 50 0 10ms/div 200µs/div 300 200 PGOOD 5V/div PGOOD 5V/div 5V 400 350 VOUT 200mV/div ACCOUPLED 5V 450 VSUP 10V/div ISUP (µA) ILOAD 1A/div 500 MAX16903 toc11 MAX16903 toc09 0.01 1.00 0.10 ILOAD (mA) Pin Configurations TOP VIEW BST 1 SUP + 10 EN 2 9 GND LX 3 8 BIAS PGND 4 7 SYNC OUTS 5 6 PGOOD MAX16903 EP + BST 1 16 N.C. SUP 2 15 EN SUP 3 14 GND LX 4 LX 5 12 SYNC PGND 6 11 PGOOD PGND 7 10 N.C. OUTS 8 MAX16903 13 BIAS EP 9 N.C. TDFN TSSOP Pin Description PIN 6 TDFN TSSOP 1 1 NAME FUNCTION BST Bootstrap Capacitor for High-Side Driver (0.1μF) Voltage Supply Input. Connect a 4.7μF ceramic capacitor from SUP to PGND. Place the capacitor very close to the SUP pin. For the TSSOP-EP package, connect both SUP pins together for proper operation. 2 2, 3 SUP 3 4, 5 LX 4 6, 7 PGND Buck Switching Node. LX is high impedance when the device is off. For the TSSOP package, connect both LX pins together for proper operation. Power Ground. For the TSSOP-EP package, connect both PGND pins together for proper operation. Maxim Integrated MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Pin Description (continued) PIN NAME TDFN TSSOP 5 8 OUTS 6 11 PGOOD 7 FUNCTION Buck Regulator Voltage-Sense Input. Bypass OUTS to PGND with a 10µF or larger X7R ceramic capacitor. Open-Drain Power-Good Output Sync Input. SYNC allows the device to synchronize to other supplies. When connected to GND or unconnected, skip mode is enabled under light loads. When connected to a clock source or BIAS, forced PWM mode is enabled. 12 SYNC 8 13 BIAS +5V Internal Logic Supply. Connect a 2.2µF ceramic capacitor from BIAS to GND. 9 14 GND Analog Ground 10 15 EN 9, 10, 16 N.C. EP Enable Input. EN is high-voltage compatible. Drive EN HIGH for normal operation. No Connection. Not internally connected. Exposed Pad. Connect EP to PGND. Do not use EP as the only ground connection. Functional Diagram SYNC REF EN HVLDO BANDGAP OSC BST BIAS SUP CLK HSD SOFT-START CURRENT-SENSE AND SLOPE COMPENSATION LOGIC CONTROL LX BIAS OUTS PWM LSD EAMP COMP MAX16903 VGOOD PGND PGOOD Detailed Description The MAX16903 is a small, current-mode buck converter that features synchronous rectification and requires no external compensation network. The MAX16903 is designed for 1A output current. The MAX16903 can stay in dropout by running at 97% duty cycle. It provides an Maxim Integrated GND accurate output voltage within the input range of +6.5V to +18V. Voltage quality can be monitored by observing the PGOOD signal. The MAX16903 operates at 2.1MHz (typ) frequency, which allows for small external components, reduced output ripple, and guarantees no AM band interference. 7 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter The MAX16903 features an ultra-low 25μA (typ) quiescent supply current in standby mode. Standby mode is entered when load currents are below 5mA and when SYNC is low. The MAX16903 operates from a +3.5V to +28V supply voltage and tolerates transients up to +42V, making it ideal for automotive applications. The MAX16903 is available in factory-trimmed output voltages from 1.8V to 10.7V in 100mV steps. Please contact factory for availability of voltage options. Enable (EN) The MAX16903 is activated by driving EN high. EN is compatible from a +3.3V logic level to automotive battery levels. EN can be controlled by microcontrollers and automotive KEY or CAN inhibit signals. The EN input has no internal pullup/pulldown current to minimize overall quiescent supply current. To realize a programmable undervoltage lockout level, use a resistordivider from SUP to EN to GND. BIAS/UVLO The MAX16903 features undervoltage lockout. When the device is enabled, an internal bias generator turns on. LX begins switching after VBIAS has exceeded the internal undervoltage lockout level VUVLO = 3V (typ). Soft-Start The MAX16903 features an internal soft-start timer. The output voltage soft-start ramp time is 8ms (typ). If a short circuit or undervoltage is encountered, after the soft-start timer has expired, the device is disabled for 30ms (typ) and it reattempts soft-start again. This pattern repeats until the short circuit has been removed. Oscillator/Synchronization and Efficiency (SYNC) The MAX16903 has an on-chip oscillator that provides a switching frequency of 2.1MHz (typ). Depending on the condition of SYNC, two operation modes exist. If SYNC is unconnected or at GND, the device must operate in highly efficient pulse-skipping mode if the load current is below the SKIP mode current threshold. If SYNC is at BIAS or has a frequency applied to it, the device is in forced PWM mode. The MAX16903 offers the best of both worlds. The device can be switched during operation between forced PWM mode and SKIP mode by switching SYNC. SKIP Mode Operation SKIP mode is entered when the SYNC pin is connected to ground or is unconnected and the peak load current is < 350mA (typ). In this mode, the high-side FET is turned on until the current in the inductor is ramped up to 350mA (typ) peak value and the internal feedback voltage is above the regulation voltage (1.2V typ). At this point, both 8 the high-side and low-side FETs are turned off. Depending on the choice of the output capacitor and the load current the high-side FET turns on when OUTS (valley) drops below the 1.2V (typ) feedback voltage. Achieving High Efficiency at Light Loads The MAX16903 operates with very low quiescent current at light loads to enhance efficiency and conserve battery life. When the MAX16903 enters SKIP mode the output current is monitored to adjust the quiescent current. When the output current is < 5mA, the MAX16903 operates in the lowest quiescent current mode also called the standby mode. In this mode, the majority of the internal circuitry (excluding that necessary to maintain regulation) in the MAX16903, including the internal high-voltage LDO, is turned off to save current. Under no load and with SKIP mode enabled, the IC draws only 25μA (typ) current. For load currents > 5mA, the IC enters normal SKIP mode still maintaining very high efficiency. Controlled EMI with Forced-Fixed Frequency In forced PWM mode, the MAX16903 attempts to operate at a constant switching frequency for all load currents. For tightest frequency control, apply the operating frequency to SYNC. The advantage of this mode is a constant switching frequency, which improves EMI performance; the disadvantage is that considerable current can be thrown away. If the load current during a switching cycle is less than the current flowing through the inductor, the excess current is diverted to GND. With no external load present, the operating current is in the 10mA range. Extended Input Voltage Range In some cases, the MAX16903 is forced to deviate from its operating frequency independent of the state of SYNC. For input voltages above 18V, the required duty cycle to regulate its output may be smaller than the minimum ontime (80ns, typ). In this event, the MAX16903 is forced to lower its switching frequency by skipping pulses. If the input voltage is reduced and the MAX16903 approaches dropout the device tries to turn on the highside FET continuously. In order to maintain gate charge on the high-side FET, the BST capacitor must be periodically recharged. To ensure proper charge on the BST capacitor when in dropout, the high-side FET is turned off every 6.5μs and the low-side FET is turned on for about 150ns. This gives an effective duty cycle of > 97% and a switching frequency of 150kHz when in dropout. Spread-Spectrum Option The MAX16903 has an optional spread-spectrum version. If this option is selected, then the internal operating frequency varies by +6% relative to the internally generated Maxim Integrated MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter operating frequency of 2.1MHz (typ). Spread spectrum is offered to improve EMI performance of the MAX16903. By varying the frequency 6% only in the positive direction, the MAX16903 still guarantees that the 2.1MHz frequency does not drop into the AM band limit of 1.8MHz. Additionally, with the low minimum on-time of 80ns (typ) no pulse skipping is observed for a 5V output with 18V input maximum battery voltage in steady state. The internal spread spectrum does not interfere with the external clock applied on the SYNC pin. It is active only when the MAX16903 is running with internally generated switching frequency. Table 1. Nominal Output Voltage Values VOUT (V) LNOM (μH) 1.8 to 3.1 VOUT/0.55 3.2 to 6.5 VOUT/0.96 6.6 to 8.1 VOUT/1.40 8.2 to 10 VOUT/1.75 Table 2. Examples for Standard Output Voltages Power-Good (PGOOD) The MAX16903 features an open-drain power-good output. PGOOD is an active-high output that pulls low when the output voltage is below 91% of its nominal value. PGOOD is high impedance when the output voltage is above 93% of its nominal value. Connect a 20kΩ (typ) pullup resistor to an external supply or the on-chip BIAS output. Overcurrent Protection The MAX16903 limits the peak output current to 1.5A (typ). The accuracy of the current limit is ±15%, which makes selection of external components very easy. To protect against short-circuit events, the MAX16903 will shut off when OUTS is below 1.5V (typ) and one overcurrent event is detected. The MAX16903 attempts a soft-start restart every 30ms and stays off if the short circuit has not been removed. When the current limit is no longer present, it reaches the output voltage by following the normal soft-start sequence. If the MAX16903 die reaches the thermal limit of 175°C (typ) during the current-limit event, it immediately shuts off. Thermal-Overload Protection The MAX16903 features thermal-overload protection. The device turns off when the junction temperature exceeds +175°C (typ). Once the device cools by 15°C (typ), it turns back on with a soft-start sequence. Applications Information Inductor Selection The nominal inductor value can be calculated using Table 1 based on the nominal output voltage of the device. Select the nearest standard inductance value to the calculated nominal value. The nominal standard value selected should be within ±25% of LNOM for best performance. Maxim Integrated VOUT (V) CALCULATED LNOM (μH) STANDARD VALUE (μH) 1.8 3.3 3.3 3.3 3.4 3.3 5.0 5.2 4.7 8.0 5.7 5.6 Input Capacitor A low-ESR ceramic input capacitor of 1μF or larger is needed for proper device operation. This value may need to be larger based on application input-voltage ripple requirements. The discontinuous input current of the buck converter causes large input ripple current. The switching frequency, peak inductor current, and the allowable peak-topeak input-voltage ripple dictate the input capacitance requirement. Increasing the switching frequency or the inductor value lowers the peak-to-average current ratio yielding a lower input capacitance requirement. The input ripple comprises mainly of ΔVQ (caused by the capacitor discharge) and ΔVESR (caused by the ESR of the input capacitor). The total voltage ripple is the sum of ΔVQ and ΔVESR. Assume the input-voltage ripple from the ESR and the capacitor discharge is equal to 50% each. The following equations show the ESR and capacitor requirement for a target voltage ripple at the input: ΔVESR ESR = ΔIP − P ⎞ ⎛ ⎜⎝ IOUT + ⎟ 2 ⎠ I × D(1 − D) CIN = OUT ΔVQ × fSW 9 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter where: (V − VOUT ) × VOUT ΔIP − P = IN VIN × fSW × L and V D = OUT VIN where IOUT is the output current, D is the duty cycle, and f SW is the switching frequency. Use additional input capacitance at lower input voltages to avoid possible undershoot below the UVLO threshold during transient loading. Output Capacitor To maintain acceptable phase margin, a minimum ceramic output capacitor value of 10μF is needed with a voltage rating 2 times the VOUT voltage. Additional output capacitance may be needed based on application-specific output-voltage ripple requirements. The allowable output-voltage ripple and the maximum deviation of the output voltage during step load currents determine the output capacitance and its ESR. The output ripple comprises of ΔVQ (caused by the capacitor discharge) and ΔVESR (caused by the ESR of the output capacitor). Use low-ESR ceramic or aluminum electrolytic capacitors at the output. For aluminum electrolytic capacitors, the entire output ripple is contributed by ΔVESR. Use the ESROUT equation to calculate the ESR requirement and choose the capacitor accordingly. If using ceramic capacitors, assume the contribution to the output ripple voltage from the ESR and the capacitor discharge to be equal. The following equations show the output capacitance and ESR requirement for a specified output-voltage ripple. ESR = COUT = ΔVESR ΔIP − P ΔIP − P 8 × ΔVQ × fSW where: ΔIP − P = (VIN − VOUT ) × VOUT VIN × fSW × L VOUT _ RIPPLE ≅ ΔVESR + ΔVQ 10 ΔIP-P is the peak-to-peak inductor current as calculated above and fSW is the converter’s switching frequency. The allowable deviation of the output voltage during fast transient loads also determines the output capacitance and its ESR. The output capacitor supplies the step load current until the converter responds with a greater duty cycle. The response time (t RESPONSE ) depends on the closed-loop bandwidth of the converter. The high switching frequency of the MAX16903 allows for a higher closed-loop bandwidth, thus reducing t RESPONSE and the output capacitance requirement. The resistive drop across the output capacitor’s ESR and the capacitor discharge causes a voltage droop during a step load. Use a combination of lowESR tantalum and ceramic capacitors for better transient load and ripple/noise performance. Keep the maximum output-voltage deviations below the tolerable limits of the electronics being powered. When using a ceramic capacitor, assume an 80% and 20% contribution from the output capacitance discharge and the ESR drop, respectively. Use the following equations to calculate the required ESR and capacitance value: ESROUT = ΔVESR ISTEP I × tRESPONSE COUT = STEP ΔVQ where I STEP is the load step and t RESPONSE is the response time of the converter. The converter response time depends on the control-loop bandwidth. PCB Layout Guidelines Careful PCB layout is critical to achieve low switching power losses and clean stable operation. Use a multilayer board wherever possible for better noise immunity. Refer to MAX16903 Evaluation Kit for recommended PCB layout. Follow these guidelines for a good PCB layout: 1) The input capacitor (4.7μF, see the applications schematic in the Typical Operating Circuits) should be placed right next to the SUP pins (pins 2 and 3 on the TSSOP-EP package) of the MAX16903. Since the MAX16903 operates at 2.1MHz switching frequency, this placement is critical for effective decoupling of high-frequency noise from the SUP pins. 2) Solder the exposed pad to a large copper plane area under the device. To effectively use this copper area as heat exchanger between the PCB and ambient expose the copper area on the top and bottom side. Add a few small vias or 1 large via on the cop- Maxim Integrated MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter per pad for efficient heat transfer. Connect the exposed pad to PGND ideally at the return terminal of the output capacitor. 3) Isolate the power components and high current paths from sensitive analog circuitry. 4) Keep the high current paths short especially at the ground terminals. The practice is essential for stable jitter-free operation. 1MΩ CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE CS 100pF RD 1.5kΩ DISCHARGE RESISTANCE STORAGE CAPACITOR DEVICE UNDER TEST 5) Connect the PGND and GND together preferably at the return terminal of the output capacitor. Do not connect them anywhere else. 6) Keep the power traces and load connections short. This practice is essential for high efficiency. Use thick copper PCB to enhance full load efficiency and power dissipation capability. 7) Route high-speed switching nodes away from sensitive analog areas. Use internal PCB layers as PGND to act as EMI shields to keep radiated noise away from the device and analog bypass capacitor. ESD Protection The ESD tolerance for the MAX16903 is rated for Human Body Model and Machine Model. The Human Body Model discharge components are CS = 100pF and RD = 1.5kΩ (Figure 1). The Machine Model discharge components are CS = 200pF and RD = 0Ω (Figure 2). Maxim Integrated Figure 1. Human Body ESD Test Circuit RD 0Ω CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE CS 200pF DISCHARGE RESISTANCE STORAGE CAPACITOR DEVICE UNDER TEST Figure 2. Machine Model ESD Test Circuit 11 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Selector Guide OUTPUT VOLTAGE (V) PIN-PACKAGE SPREAD-SPECTRUM SWITCHING FREQUENCY TOP MARK MAX16903RATB50+ 5 10 TDFN-EP* (3mm x 3mm x 0.75mm) AZO MAX16903RATB50/V+ 5 10 TDFN-EP* (3mm x 3mm x 0.75mm) AVU MAX16903RAUE50+ 5 16 TSSOP-EP* (5mm x 4.4mm) MAX16903RAUE50/V+ 5 16 TSSOP-EP* (5mm x 4.4mm) MAX16903SATB50+ 5 10 TDFN-EP* (3mm x 3mm x 0.75mm) Yes AZQ MAX16903SATB50/V+ 5 10 TDFN-EP* (3mm x 3mm x 0.75mm) Yes AVW MAX16903SAUE50+ 5 16 TSSOP-EP* (5mm x 4.4mm) Yes MAX16903SAUE50/V+ 5 16 TSSOP-EP* (5mm x 4.4mm) Yes MAX16903RATB33+ 3.3 10 TDFN-EP* (3mm x 3mm x 0.75mm) AZN MAX16903RATB33/V+ 3.3 10 TDFN-EP* (3mm x 3mm x 0.75mm) AVT MAX16903RAUE33+ 3.3 16 TSSOP-EP* (5mm x 4.4mm) MAX16903RAUE33/V+ 3.3 16 TSSOP-EP* (5mm x 4.4mm) MAX16903SATB33+ 3.3 10 TDFN-EP* (3mm x 3mm x 0.75mm) Yes AZP MAX16903SATB33/V+ 3.3 10 TDFN-EP* (3mm x 3mm x 0.75mm) Yes AVV MAX16903SAUE33+ 3.3 16 TSSOP-EP* (5mm x 4.4mm) Yes MAX16903SAUE33/V+ 3.3 16 TSSOP-EP* (5mm x 4.4mm) Yes PART Note: All devices operate over the -40°C to +125°C automotive temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. /V denotes an automotive qualified part. *EP = Exposed pad. 12 Maxim Integrated MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Package Information Chip Information PROCESS: BiCMOS Maxim Integrated For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 10 TDFN-EP T1033+1 21-0137 90-0003 16 TSSOP-EP U16E+3 21-0108 90-0120 13 MAX16903 2.1MHz, High-Voltage, 1A Mini-Buck Converter Revision History REVISION NUMBER REVISION DATE 0 10/09 1 7/10 Updated the General Description, Typical Operating Circuits, Absolute Maximum Ratings, Electrical Characteristics table, Typical Operating Characteristics, Pin Description, and Detailed Description 2 8/10 Corrected a typo in the TSSOP Pin Configuration (pin 2 is SUP, not N.C.) 3 3/11 Updated the Voltage Accuracy and DMOS Peak Current-Limit Threshold parameters in the Electrical Characteristics, updated the high-side FET in the Skip Mode Operation section and the output current in the Inductor Selection section 4 6/13 Replaced the Inductor Selection section, and updated the Input Capacitor, Output Capacitor, and Selector Guide sections DESCRIPTION Initial release PAGES CHANGED — 1–10 6 3, 4, 8, 9 9–11 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. 14 ________________________________Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 © 2013 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.