FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products tm Features General Description 1.8 to 5.5V Input Voltage Range The FPF2000 through FPF2007 is a family of load switches which provide full protection to systems and loads which may encounter large current conditions. These devices contain a 0.7Ω currentlimited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part contains thermal shutdown protection which shuts off the switch to prevent damage to the part when a continuous overcurrent condition causes excessive heating. Controlled Turn-On 50mA and 100mA Current Limit Options Undervoltage Lockout Thermal Shutdown <1µA Shutdown Current Auto restart Fast Current limit Response Time When the switch current reaches the current limit, the part operates in a constant current mode to prohibit excessive currents from causing damage. For the FPF2000-FPF2002 and FPF2004FPF2006, if the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2000, FPF2001, FPF2004 and FPF2005, have an auto-restart feature which will turn the switch on again after 80ms if the ON pin is still active. The FPF2002 and FPF2006 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2003 and FPF2007, a current limit condition will immediately pull the fault signal pin low and the part will remain in the constant-current mode until the switch current falls below the current limit. For the FPF2000 through FPF2003, the minimum current limit is 50mA while that for the FPF2004 through FPF2007 is 100mA. 3µs to Moderate Over Currents 20ns to Hard Shorts Fault Blanking RoHS Compliant Applications PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies These parts are available in a space-saving 5 pin SC-70 package. Ordering Information Part Current Limit [mA] Current Limit Blanking Time [ms] Auto-Restart Time [ms] ON Pin Activity Top Mark FPF2000 50 10 80 Active HI 200 FPF2001 50 10 80 Active LO 201 FPF2002 50 10 NA Active HI 202 FPF2003 50 0 NA Active HI 203 FPF2004 100 10 80 Active HI 204 FPF2005 100 10 80 Active LO 205 FPF2006 100 10 NA Active HI 206 FPF2007 100 0 NA Active HI 207 ©2007 Fairchild Semiconductor Corporation FPF2000-FPF2007 Rev. E 1 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products May 2007 TO LOAD VOUT VIN FPF2000 - FPF2007 OFF ON ON FLAGB GND Functional Block Diagram VIN UVLO CONTROL LOGIC ON CURRENT LIMIT VOUT THERMAL SHUTDOWN FLAGB GND Pin Configuration VOUT 1 GND 2 FLAGB 3 5 VIN 4 ON SC70-5 Pin Description Pin Name 1 VOUT Switch Output: Output of the power switch 2 GND Ground 3 FLAGB 4 ON On Control Input 5 VIN Supply Input: Input to the power switch and the supply voltage for the IC FPF2000-FPF2007 Rev. E Function Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over temperature state. 2 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Typical Application Circuit Parameter Min VIN, VOUT, ON, FLAGB to GND -0.3 Max Power Dissipation @ TA = 25°C (note 1) Unit 6 V 250 mW Operating Junction Temperature -40 125 °C Storage Temperature -65 150 °C 400 °C/W Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 4000 V MM 400 V Recommended Operating Range Parameter Min Max Unit VIN 1.8 5.5 V Ambient Operating Temperature, TA -40 85 °C Electrical Characteristics VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Symbol Conditions Min Typ Max Units 5.5 V Basic Operation Operating Voltage VIN Quiescent Current IQ Shutdown Current ISHDN Latch-Off Current (note 2) ILATCHOFF On-Resistance RON ON Input Logic High Voltage VIH ON Input Logic Low Voltage VIL ON Input Leakage Off Switch Leakage ISWOFF FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current 1.8 IOUT = 0mA VIN = 1.8 to 3.3V VON active VIN = 3.3 to 5.5V 60 100 1 VON = VIN, after an overcurrent fault 40 TA = 25°C, IOUT = 20mA 0.7 TA = -40 to +85°C, IOUT = 20mA 0.85 VIN = 1.8V 0.8 VIN = 5.5V 1.5 µA µA µA 1 Ω V VIN = 1.8V 0.5 VIN = 5.5V 0.9 V VON = VIN or GND 1 µA VON = 0V, VOUT = 0V @ VIN = 5.5V, TA = 85°C 1 µA nA VON = 0V, VOUT = 0V @ VIN = 3.3V, TA = 25°C 10 100 VIN = 5V, ISINK = 10mA 0.1 0.2 VIN = 1.8V, ISINK = 10mA 0.1 0.3 VIN = 5V, Switch on 1 V µA Protections Current Limit Thermal Shutdown FPF2000-FPF2007 Rev. E ILIM VIN = 3.3V, VOUT = 3.0V FPF2000, FPF2001, FPF2002, FPF2003 50 75 100 FPF2004, FPF2005, FPF2006, FPF2007 100 150 200 mA Shutdown Threshold 140 Return from Shutdown 130 Hysteresis 10 3 °C www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Absolute Maximum Ratings VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Symbol Conditions Min Typ Max 1.5 1.6 1.7 Units Protections Under Voltage Shutdown UVLO VIN Increasing Under Voltage Shutdown Hysteresis V 50 mV µs Dynamic Turn on time tON RL = 500Ω, CL = 0.1µF 50 Turn off time tOFF RL = 500Ω, CL = 0.1µF 0.5 µs VOUT Rise Time tR RL = 500Ω, CL = 0.1µF 10 µs VOUT Fall Time tF RL = 500Ω, CL = 0.1µF 0.1 µs Over Current Blanking Time tBLANK FPF2000, FPF2001, FPF2002, FPF2004, FPF2005, FPF2006 5 10 20 ms Auto-Restart Time tRSTRT FPF2000, FPF2001, FPF2004, FPF2005 40 80 160 ms Short Circuit Response Time VIN = VON = 3.3V. Moderate Over-Current Condition. 3 µs VIN = VON = 3.3V. Hard Short. 20 ns Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board. Note 2: Applicable only to FPF2002 and FPF2006. Watchful current does not include current flowing into FLAGB. FPF2000-FPF2007 Rev. E 4 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Electrical Characteristics Cont. 75 90 VON = VIN 85 QUIESCENT CURRENT (uA) QUIESCENT CURRENT (uA) VON = VIN 70 65 60 55 80 75 VIN = 5.5V 70 65 VIN = 3.3V 60 55 VIN = 1.8V 50 45 40 -40 50 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (oC) SUPPLY VOLTAGE (V) Figure 1. Quiescent Current vs. Input Voltage Figure 2. Quiescent Current vs. Temperature 35 35 30 SWITCH-OFF CURRENT (nA) SHUTDOWN CURRENT (nA) I_SHDN 25 20 15 VIN = 5V 10 VIN = 3.3V 5 0 -40 -15 10 35 60 30 25 20 15 VIN = 5V 10 VIN = 3.3V 5 0 -40 85 -15 TJ, JUNCTION TEMPERATURE (oC) 10 35 60 85 TJ, JUNCTION TEMPERATURE (oC) Figure 3. ISHUTDOWN Current vs. Temperature Figure 4. ISWITCH-OFF Current vs. Temperature 52 1.5 48 1.25 ON THRESHOLD (V) LATCH-OFF CURRENT (uA) VIN = 3.3V 44 40 36 32 28 -40 FPF2000, 2002, 2003, 2004, 2006, 2007 1 FPF2001, 2005 0.75 0.5 0.25 0 -15 10 35 60 85 1.5 TJ, JUNCTION TEMPERATURE (oC) 2.5 3 3.5 4 4.5 5 5.5 6 VIN , INPUT VOLTAGE (V) Figure 5. ILATCHOFF vs. Temperature FPF2000-FPF2007 Rev. E 2 Figure 6. VIH vs. VIN 5 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Typical Characteristics 180 140 160 FPF2004, 2005, 2006, 2007 120 CURRENT LIMIT (mA) OUTPUT CURRENT (mA) 160 100 80 60 FPF2000, 2001, 2002, 2003 40 20 140 FPF2004, 2005, 2006, 2007 120 100 80 60 FPF2000, 2001, 2002, 2003 40 20 0 -40 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 -15 35 60 85 o TJ, JUNCTION TEMPERATURE ( C) Figure 7. Current Limit vs. Output Voltage Figure 8. Current Limit vs. Temperature 1.1 SWITCH RESISTANCE (Ohms) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 0.9 VIN = 1.8V 0.8 0.7 VIN = 3.6V 0.6 VIN = 5V 0.5 0.4 0.3 -40 5.5 -15 10 35 60 85 60 85 TJ, JUNCTION TEMPERATURE (oC) VIN, INPUT VOLTAGE (V) Figure 9. R(ON) vs. VIN Figure 10. R(ON) vs. Temperature 100 100 ILOAD = 10mA VCC = 3.3V ILOAD = 10mA VCC = 3.3V TON TURN-RISE/FALL TIMES (uS) TURN-ON/OFF TIMES (uS) 10 VIN - VOUT (V) 1.0 SWITCH RESISTANCE (Ohms) I_LIMIT 10 1 TRise 10 1 TFall 0.1 TOFF 0.1 -40 -15 10 35 60 0.01 -40 85 -15 10 35 TJ, JUNCTION TEMPERATURE (oC) TJ, JUNCTION TEMPERATURE (oC) Figure 11. TON/TOff vs. Temperature Figure 12. TRISE/TFALL vs. Temperature FPF2000-FPF2007 Rev. E 6 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Typical Characteristics 100 11 RESTART TIME (mS) FLAG-BLANKING TIME (mS) 12 10 9 8 -40 -15 10 35 60 80 60 40 -40 85 10 35 60 85 TJ, JUNCTION TEMPERATURE ( C) Figure 13. TBLANK vs. Temperature Figure 14. TRESTART vs. Temperature VDRV3 2V/DIV VDRV3 2V/DIV VOUT 2V/DIV VOUT 2V/DIV IOUT 50mA/DIV IOUT 50mA/DIV VFLAGB 2V/DIV VFLAGB 2V/DIV 5mS/DIV 10mS/DIV Figure 15. TBLANK Response Figure 16. TRESTART Response RL = 500Ω, CL = 0.1µF RL = 500Ω, CL = 0.1µF VON 2V/DIV VON 2V/DIV IOUT 10mA/DIV IOUT 10mA/DIV 50µS/DIV 100nS/DIV Figure 17. TON Response FPF2000-FPF2007 Rev. E -15 o TJ, JUNCTION TEMPERATURE (oC) Figure 18. TOFF Response 7 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Typical Characteristics VIN 2V / DIV VIN = VON C IN = 10µF COUT = 1µF CIN = 10µF COUT = 1µF VIN/VON 2V/DIV IOUT 2A/DIV IOUT 200mA/DIV VOUT 2V/DIV VIN 2V/DIV VON 2V/DIV 20µS/DIV 20µS/DIV Figure 19. Short Circuit Response Time (Output Shorted to GND) Figure 20. Current Limit Response (Switch power up to hard short) CIN = 10µF COUT = 1µF IOUT 100mA/DIV VOUT (SHORTED TO GND) 20µS/DIV Figure 21. Current Limit Response Time Note 3: VDRV signal forces the device to go into overcurrent condition. FPF2000-FPF2007 Rev. E 8 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Typical Characteristics Current Limiting The current limit ensures that the current through the switch doesn’t exceed a maximum value while not limiting at less than a minimum value. For the FPF2000-FPF2003 the minimum current is 50mA and the maximum current is 100mA and for the FPF2004-FPF2007 the minimum current is 100mA and the maximum current is 200mA. The FPF2000-FPF2002 and the FPF2004-FPF2006, have a blanking time of 10ms, nominally, during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off and the FLAGB pin will activate to indicate that current limiting has occurred. The FPF2003 and FPF2007 have no current limit blanking period so immediately upon a current limit condition FLAGB is activated. These parts will remain in a constant current state until the ON pin is deactivated or the thermal shutdown turns-off the switch. The FPF2000-FPF2007 are current limited switches that protect systems and loads which can be damaged or disrupted by the application of high currents. The core of each device is a 0.7Ω P-channel MOSFET and a controller capable of functioning over a wide input operating range of 1.8-5.5V. The controller protects against system malfunctions through current limiting, undervoltage lockout and thermal shutdown. The current limit is preset for either 50mA or 100mA. On/Off Control The ON pin controls the state of the switch. Active HI and LO versions are available. Refer to the Ordering Information for details. Activating ON continuously holds the switch in the on state so long as there is no fault. For all versions, an undervoltage on VIN or a junction temperature in excess of 150°C overrides the ON control to turn off the switch. In addition, excessive currents will cause the switch to turn off in FPF2000FPF2002 and FPF2004-FPF2007. The FPF2000, FPF2001, FPF2004 and FPF2005 have an Auto-Restart feature which will automatically turn the switch on again after 80ms. For the FPF2002 and FPF2006, the ON pin must be toggled to turn-on the switch again. The FPF2003 and FPF2007 do not turn off in response to a over current condition but instead remain operating in a constant current mode so long as ON is active and the thermal shutdown or under-voltage lockout have not activated. Reverse Voltage If the voltage at the VOUT pin is larger than the VIN pin, large currents may flow and can cause permanent damage to the device. FPF2000-FPF2007 is designed to control current flow from VIN to VOUT. Under-Voltage Lockout The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots. Fault Reporting Thermal Shutdown Upon the detection of an over-current, an input under-voltage, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. For the FPF2000-FPF2002 and FPF2004-FPF2006, the FLAGB goes LO at the end of the blanking time while FLAGB goes LO immediately for the FPF2003 and FPF2007. FLAGB remains LO through the AutoRestart Time for the FPF2000, FPF2001 FPF2004 and FPF2005. For the FPF2002 and FPF2006, FLAGB is latched LO and ON must be toggled to release it. With the FPF2003 and FPF2007, FLAGB is LO during the faults and immediately returns HI at the end of the fault condition. FLAGB is an opendrain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. FPF2000-FPF2007 Rev. E The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an overtemperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature. 9 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Description of Operation Typical Application VOUT VIN FPF2000 - FPF2007 Battery 1.8V-5.5V OFF ON ON LOAD R1 = 100KΩ R2 = 499Ω FLAGB C2 = 0.1µF GND C1 = 10µF Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 0.1µF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground. For the FPF2000, FPF2001, FPF2004 and FPF2005, the power dissipation will scale by the Auto-Restart Time, tRESTART, and the Over Current Blanking Time, tBLANK, so that the maximum power dissipated is, Output Capacitor t BLANK P ( max ) = -------------------------------------------------- x ( V IN ( max ) )xI LIM ( max ) = t RESTART + t BLANK A 0.1µF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2000-FPF2002 and the FPF2004-FPF2006, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula, 10 = ------------------- × 5.5 × 0.2 = 1.22mW 80 + 10 (3) Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. When using the FPF2002 and FPF2006 attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. For the FPF2003 and FPF2007, a short on the output will cause the part to operate in a constant current state dissipating a worst case power as calculated in (3) until the thermal shutdown activates. It will then cycle in and out of thermal shutdown so long as the ON pin is active and the short is present. Power Dissipation Board Layout During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be, For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. I LIM ( max ) × t BLANK ( min ) C OUT = ------------------------------------------------------------------V IN 2 2 P = ( I LIM ) × R DS = ( 0.2 ) × 0.7 = 28mW FPF2000-FPF2007 Rev. E (1) (2) 10 www.fairchildsemi.com FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Application Information FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Dimensional Outline and Pad Layout FPF2000-FPF2007 Rev. E 11 www.fairchildsemi.com TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ® ACEx Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ ® EcoSPARK FACT Quiet Series™ ® FACT ® FAST FastvCore™ FPS™ ® FRFET SM Global Power Resource Green FPS™ ® POWEREDGE Power-SPM™ ® PowerTrench Programmable Active Droop™ ® QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ ® SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ Motion-SPM™ ® OPTOLOGIC ® OPTOPLANAR PDP-SPM™ ® Power220 ® Power247 SuperSOT™-8 SyncFET™ ® The Power Franchise ™ TinyBoost™ TinyBuck™ ® TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ μSerDes™ ® UHC UniFET™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Definition Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I29 © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com