KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES A.HE83116B Introduction HE83116B is a member of 8-bit Micro-controller series developed by King Billion Electronics Ltd. This IC build-in 128-dot LCD driver, and also have 16-bit I/O port. The built-in OP comparator can be used with (light voice temperature humility) sensor and used as battery low detection. And the 7-bit current-type D/A converter and PWM device provide the complete speech output mechanism. The 64K ROM Size can be used in the storage of speech (20 seconds at 3Kbytes per second), graphic, text etc. This IC is applicable to the small systems such as calculating machine, perpetual calendar, digital watch etc.. The instruction set of HE83116B are quite easy to learn and simple to use. Only about thirty instructions with four-type addressing mode are provided. Most of instructions take only 3 oscillator clocks (machine cycles). The processing power is enough to most of battery operation system. B.HE83116B Features Operation Voltage System Clock 2.4V – 5.5V DC ~ 8MHz @ 5.0V DC ~ 4MHz @ 2.4V Internal ROM 64K Bytes(64K Program ROM) Internal RAM 256 Bytes. Dual Clock System Normal (Fast) clock 32.768K ~ 8MHz Slow clock 32.768KHz Operation Mode DUAL FAST SLOW IDLE SLEEP Mode. With WDT (WATCH DOG TIMER) to prevent deadlock condition.. 16 bit Bi-directional I/O port. Mask Option can select PUSH-PULL or OPEN DRAIN output mode for each I/O pin. One built-in OP comparator. 128 dots LCD driver (A B TYPE selectable). One 7-bit current-type DAC output. PWM device. Two external interrupts and two internal timer interrupts. Two 16-bit timer. Instruction set 32 instructions, 4 addressing mode. 8-bit DATA POINTER for RAM and 16-bit TABLE POINTER for ROM. C. Internal Block Please always take in mind that ICE is different from IC. ICE is the whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource that real IC didn't have, especially RAM and register. KBIDS and compiler cannot prevent user to use some hardware resource that didn't exist. Please check the following table and refer the abbreviation in HE80000 user's manual. 1 V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES I.F.C. E.S.C. I.P.R PROM 64KB DAO OP PWM LCD — 128 DROM TP TP+1 RAM PP DP — 16-bit 256B — 8-bit COM*SEG Bias Rgr ChrgPmp LV2 4*32 1/3 — 1,3/2,3 I/O DTMF WDT Timer 16 — T1,T2 LR LVG REC S.R. — — — — D. Pin Description Pin # Pin name I/O 55 54 FXI, FXO B, O 58 57 SXI, SXO I, O 53 RSTP_N I 56 TSTP_P I 68..71 PRTC[7:0] 1..4 B 60..67 PRTD[7:0] B 39..42 COM[3:0] 7..38 SEG[31:0] 44 LC2 43 LC1 45 L V3 46 L V2 48 L V1 O O B B B B B 5 PWMP O Function Description External fast clock pin. Mask option setting Connecting to crystal or RC MO_FCK/SCKN= 00 Slow Clock only to generate 32.768 kHz ~ 01 Illegal 8MHz frequency. 10 Dual Clock 11 Fast Clock only MO_FOSCE = 0 Internal fast osc. External slow clock pin. = 1 External fast osc. Connecting with 32768 Hz MO_FXTAL= 0 RC osc. for fast clock crystal or resistor as slow = 1 X’tal osc. for fast clock clock and providing clock MO_SXTAL= 0 RC for 32768 Hz clock source for LCD display, = 1 X’tal for 32768 Hz clock TIMER1, Time-Base and Use OP1 and OP2 to switch among different operation other internal blocks. mode (NORMAL, SLOW, IDEL and SLEEP). In Dual Clock mode, the main system clock is still the Fast Clock. The 32768 Hz clock is for LCD and Timer 1 only. Level trigger, active low. Except for using this pin, using mask option (MO_PORE=1) could enable IC build-in power-on reset circuit. System Reset. Besides, MO_WDTE can set Watch Dog Timer MO_WDTE=0 Disable Watch Dog Timer =1 Enable Watch Dog Timer Please bond this pin and add a test point on PCB for Test Pin debugging. Leave this pin floating is OK. Mask options MO_CPP[7..0]=1 ~ Push-pull. 8-pin bi-directional I/O =0 ~ Open-drain. port. Output must be “1” before reading whenever use them as input (No tri-state structure). 8-pin bi-directional I/O Mask options port. PRTD[7..2] as MO_DPP[7..0]=1 ~ Push-pull. wake-up pin. =0 ~ Open-drain. PRTD[7..6] as external Output must be “1” before reading whenever use them as interrupt pin. input (No tri-state structure). LCD COMmon Output LCD Data filled from F0H, please refer the LCD RAM map. LCD SEGment Output Charge Pump Switch 2 Add one 0.1 µF capacitor between LC1 and LC2. Please refer the application circuit. Charge Pump Switch 1 Charge Pump V3 LV3< 9 Volts. Charge Pump V2 Please refer the application circuit. Charge Pump V1 The PWM positive output can drive speaker or buzzer Set the bit2 of VOC register as one to turn on PWM. directly. 2 V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES Pin # Pin name I/O 6 PWMN O 49 50 51 52 59 47 VO OPIN OPIP OPO VDD GND O I I O P P Function Description The PWM positive output can drive speaker or buzzer Set the bit2 of VOC register as one to turn on PWM. directly. D/A output. Bit 1 of VOC = ‘1’ , Turn on DA OPAMP negative input pin. Built-in OP comparator. OPAMP positive input pin. Set Bit 0 of VOC = ‘1’ , Turn on OP OPAMP output pin. Adding 0.1 µF capacitor as by-pass capacitor is between Positive Power Input VDD and GND is necessary. Power Ground Input E. LCD RAM Map Page 0: F0H F1H F2H F3H F4H F5H F6H F7H SEG1 COM[3:0] SEG3 COM[3:0] SEG5 COM[3:0] SEG7 COM[3:0] SEG9 COM[3:0] SEG11 COM[3:0] SEG13 COM[3:0] SEG15 COM[3:0] SEG0 COM[3:0] SEG2 COM[3:0] SEG4 COM[3:0] SEG6 COM[3:0] SEG8 COM[3:0] SEG10 COM[3:0] SEG12 COM[3:0] SEG14 COM[3:0] 3 F8H F9H FAH FBH FCH FDH FEH FFH SEG17 COM[3:0] SEG19 COM[3:0] SEG21 COM[3:0] SEG23 COM[3:0] SEG25 COM[3:0] SEG27 COM[3:0] SEG29 COM[3:0] SEG31 COM[3:0] SEG16 COM[3:0] SEG18 COM[3:0] SEG20 COM[3:0] SEG22 COM[3:0] SEG24 COM[3:0] SEG26 COM[3:0] SEG28 COM[3:0] SEG30 COM[3:0] V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES F. . Pin Diagram P P P P P P P P P P P P R R R R R R R R R R R R T T T T T T T T T T T T C C C C D D D D D D D D [4] [5] [6] [7] [0] [1] [2] [3] [4] [5] [6] [7] V D D S X I S X O T S T P | P F X I F X O Product Name PRTC[3] RSTP_N OPO PRTC[2] OPIP PRTC[1] OPIN PRTC[0] VO PWMP LV1 PWMN GND SEG[31] LV2 SEG[30] LV3 Die Size: 2695 µm * 2591 µm Substrate connect with GND SEG[29] SEG[28] LC2 LC1 SEG[27] COM[0] SEG[26] COM[1] SEG[25] COM[2] SEG[24] COM[3] SEG[23] SEG[0] SEG[22] SEG[1] SEG[21] SEG[2] S E G [20] S E G [19] S E G [18] S E G [17] S E G [16] S E G [15] S E G [14] S E G [13] S E G [12] S E G [11] 4 S E G [10] S S E E G G [9] [8] S E G [7] S E G [6] S E G [5] S E G [4] S E G [3] V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES G. Bonding Pad Location PIN Number PIN Name X Coordinate Y PIN Coordinate Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 PRTC[3] PRTC[2] PRTC[1] PRTC[0] PWMP PWMN SEG[31] SEG[30] SEG[29] SEG[28] SEG[27] SEG[26] SEG[25] SEG[24] SEG[23] SEG[22] SEG[21] SEG[20] SEG[19] SEG[18] SEG[17] SEG[16] SEG[15] SEG[14] SEG[13] SEG[12] SEG[11] SEG[10] SEG[9] SEG[8] SEG[7] SEG[6] SEG[5] SEG[4] SEG[3] -1154.77 -1154.77 -1154.77 -1154.77 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1154.78 -1049.98 -934.98 -819.98 -704.98 -589.98 -474.98 -359.98 -244.98 -129.98 -14.98 100.02 215.02 330.02 445.02 560.02 675.02 790.02 905.02 924.54 809.54 694.54 579.54 462.49 347.79 235.14 120.14 5.14 -109.86 -224.86 -339.86 -454.86 -569.86 -684.86 -799.86 -914.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 -1180.86 36 SEG[2] 1153.42 -1058.42 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 5 PIN Name SEG[1] SEG[0] COM[3] COM[2] COM[1] COM[0] LC1 LC2 LV3 LV2 GND LV1 VO OPIN OPIP OPO RSTP_N FXO FXI TSTP_P SXO SXI VDD PRTD[7] PRTD[6] PRTD[5] PRTD[4] PRTD[3] PRTD[2] PRTD[1] PRTD[0] PRTC[7] PRTC[6] PRTC[5] PRTC[4] X Coordinate 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 1153.42 988.66 873.66 758.66 643.66 528.66 413.66 298.66 183.66 68.66 -46.34 -161.34 -276.34 -391.34 -506.34 -621.35 -736.36 -851.37 -966.38 Y Coordinate -943.42 -828.42 -713.42 -598.42 -483.42 -368.42 -253.42 -138.42 -23.42 91.58 206.58 321.58 436.58 551.58 666.58 781.58 896.58 1179.60 1179.60 1179.60 1179.60 1179.60 1179.60 1179.59 1179.59 1179.59 1179.59 1179.59 1179.59 1179.59 1179.59 1179.60 1179.60 1179.60 1179.60 V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES H. DC/AC Characteristics Absolute Maximum Rating Item Supply Voltage Input Voltage Output Voltage Operating Temperature Storage Temperature Sym. Rating Vdd -0.5V ~ 8V Vin -0.5V ~ Vdd+0.5V Vo -0.5V ~ Vdd+0.5V Top 00C ~ 700C Tst -500C ~ 1000C Condition Recommended Operating Conditions Item Supply Voltage Input Voltage Operating Frequency Operating Temperature Storage Temperature Sym. Vdd Vih Vil Rating 2.4V ~ 5.5V 0.9 Vdd ~ Vdd 0.0V ~ 0.1Vdd 8MHz Fmax 4MHz Top 00C ~ 700C Tst -500C ~ 1000C 6 Condition Vdd =5.0V Vdd =2.4V V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES Test Condition: TEMP=25 , VDD=3V+/-10%, GND=0V CONDITION PARAMETER IFast NORMAL Mode Current System ISlow SLOW Mode Current System IIdle System IDLE Mode Current 2M ext. R/C 32.768K X’tal LCD Disable 32.769K X’tal LCD Disable LCD Enable ILCD Extra Current if LCD ON System System ISleep Sleep Mode Current IPWM PWM Output Current PWMP, PWMN IoVO DAC Output Current VO ViH Input High Voltage I/O pins ViL Input Low Voltage I/O pins Vhys Input Hysteresis Width I/O, RSTP_N IoH Output Drive Current IoL_1 Output Sink Current I/O pull-high*1 I/O pull-low*1 IiL_1 Input Low Current RSTP_N IiL_2 Input Low Current I/O Note: MIN TYP MAX UNIT *2 10 6 4 VDD=3V;VO=0~2V,Data=7F 2.5 0.8 VDD With 32 With 64 With 100 Loading Loading Loading Threshold=2/3VDD(input from low to high) Threshold=1/3VDD(input from high to low) VoL=2.0V VoL=0.4V ViL=GND, pull high Internally ViL=GND, if pull high Internally by user 0.75 1 mA 6 9 A 4 7 A 2 3 1 A A mA mA mA mA 14 8 5 3 V 0.2 VDD 1/3 VDD 50 1.0 V V A mA 20 A 100 A *1: Drive Current Spec. for Push-Pull I/O port only Sink Current Spec. for both Push-Pull and Open-Drain I/O port. *2: This Spec. base on one driver only. There are five build-in driver, so user just multiply the number of driver he used to one driver current to get the total amount of current. ( IPWM * N; N=0,1,2,3,4,5) 7 V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES I. Application Circuit Tripple Charge Pump is selected Tripple Charge Pump is selected Tripple Charge Pump is selected LCD Max. Voltage=LV3=3*VDD LCD Max. Voltage=LV3=3/2*VDD LCD Max. Voltage=LV3=VDD VDD 0.1uF C4 VDD LV1 LC1 0.1uF LC2 C4 VDD LV2 LC1 0.1uF LC2 VDD VDD 3V C1 C2 0.1uF 100uF R1 50K FXO RSTP_N C3 SW1 0.1uF RESET LC2 C5 0.1uF C6 0.1uF C7 0.1uF SXO LC1 No External Parts is necessary if user adopt Internal Fast RC Clock LC2 FXI External Fast Clock: Crystal osc. FXO SXI FXI SXO PRTD[7:0] GND LC1 SXI FXO 20P 2MHZ 20P PRTC[7:0] LC1 External Fast Clock: RC osc. LC2 LV1 COM[3:0] SEG[31:0] VDD LCD PANEL LV2 R > 8.2 KOhm LV3 < 9 Volt FXI OPIN OPIP OPO PWMP PWMN VO TSTP_P BATTERY 1 FXI C4 LV3 HE83116 Buzzer or Speaker Circuit C: Please Ref . AN016 External Slow Clock: Crystal osc. VDD Passive Bias & Q1 NPN Filter Circuit Please Refer AN022 for Speech Output Circuit SP1 SXI SPEAKER SXO 20P 32.768K 20P External Slow Clock: RC osc. SXI R: Please ref . AN016 SXO 8 V3.1E KING BILLION ELECTRONICS CO., LTD HE83116B HE80000 SERIES J. Important Note 2. Please bonds the TSTP_P, RSTP_N and PRTD[7:0] with test point on PCB (can be soldered and probed) as you can, then KB can do some IC testing job on PCB. Neither VDD nor GND connection is necessary for TSTP_P. K. Updated Record Version V3.1 Date Dec 17,2001 Section Original Content B, H 2.2V (VDD operation voltage) 9 2.4V New Content V3.1E