SMSC USB2229_06

USB2229/USB2230
5th Generation Hi-Speed
USB Flash Media and IrDA
Controller with Integrated
Card Power FETs
PRODUCT FEATURES
Datasheet
IrDA Controller
„ IrDA v1.1 FIR and SIR Compliant Controller, with
9.6K, 19.2K, 38.4K, 57.6K, 115.2K, 0.576Mbps,
1.152Mpbs and 4Mbps data rate support.
Flash Media Controller
„ Complete System Solution for interfacing
SmartMediaTM (SM) or xD Picture CardTM (xD)1,
Memory StickTM (MS), High Speed Memory Stick
(HSMS), Memory Stick PRO (MSPRO), MS DuoTM,
Secure Digital (SD), High Speed SD, Mini-Secure
Digital (Mini-SD), TransFlash (SD),
MultiMediaCardTM (MMC), Reduced Size
MultiMediaCard (RS-MMC), NAND Flash, Compact
FlashTM (CF) and CF UltraTM I & II, and CF formfactor ATA hard drives to Hi-Speed USB
„
„
„
„
„
„
„
„
„
„
— 768 Bytes of internal SRAM for general purpose
scratchpad or program execution while re-flashing
external ROM
— Two, Double Buffered Bulk Endpoints
— Two, Bi-directional 512 Byte Buffers for Bulk Endpoints
— 64 Byte RX Control Endpoint Buffer
— 64 Byte TX Control Endpoint Buffer
„
— 76K Byte Internal Code Space or Optional 128K Byte
External Code Space using Flash, SRAM or EPROM
memory.
„
„
„
— Supports USB Bulk Only Mass Storage Compliant
Bootable BIOS
„
Support for simultaneous operation of all above
devices. (only one at a time of each of the following
groups supported: CF or ATA drive, SM or XD or
NAND, SD or MMC)
On-Chip 4-Bit High Speed Memory Stick and MS
PRO Hardware Circuitry
On-Chip firmware reads and writes High Speed
Memory Stick and MS PRO
1-bit ECC correction performed in hardware for
maximum efficiency
Hardware support for SD Security Command
Extensions
On-chip power FETs with short circuit protection for
supplying flash media card power
USB Bus Power Certified
3.3 Volt I/O with 5V input tolerance on VBUS/GPIO3
Complete USB Specification 2.0 Compatibility for Bus
Powered Operation
„
— Includes Hi-Speed USB Transceiver
— A Bi-directional Control and two Bi-directional Bulk
Endpoints are provided.
„
8051 8 bit microprocessor
„
— Provides low speed control functions
— 30 Mhz execution speed at 1 clock per instruction cycle
average
— 12K Bytes of internal SRAM for general purpose
scratchpad
Internal or External Program Memory Interface
„
On Board 24Mhz Crystal Driver Circuit
Can be clocked by 48MHz external source
On-Chip 1.8V Regulator for Low Power Core
Operation
Internal PLL for 480Mhz Hi-Speed USB Sampling,
Configurable MCU clock
Supports firmware upgrade via USB bus if “boot
block” Flash program memory is used
12 GPIOs for special function use: LED indicators,
button inputs, power control to memory devices, etc.
— Inputs capable of generating interrupts with either edge
sensitivity
„
Attribute bit controlled features:
—
—
—
—
—
—
—
—
—
—
—
—
„
Activity LED polarity/operation/blink rate
Full or Partial Card compliance checking
Bus or Self Powered
LUN configuration and assignment
Write Protect Polarity
SmartDetachTM - Detach from USB when no Card
Inserted for Notebook apps
Cover Switch operation for xD compliance
Inquiry Command operation
SD Write Protect operation
Older CF card support
Force USB 1.1 reporting
Internal or External Power FET operation
Compatible with Microsoft WinXP, WinME, Win2K
SP3, Apple OS10, Softconnex, and Linux Multi-LUN
Mass Storage Class Drivers
Win2K, Win98/98SE and Apple OS8.6 and OS9
Multi-LUN Mass Storage Class Drivers available from
SMSC
128 Pin TQFP Package (1.0mm height, 14mmx14mm
footprint); green, lead-free package also available
1.xD Picture Card not applicable to USB2229.
SMSC USB2229/USB2230
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
ORDER NUMBER(S):
USB2229/USB2230-NE-XX FOR 128 PIN, TQFP PACKAGE; USB2229/USB2230-NU-XX FOR 128 PIN, TQFP
PACKAGE (GREEN, LEAD-FREE) PACKAGE
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
Copyright © 2006 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently,
complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be
accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any
time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this
information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual
property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may
contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly
sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other
application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written
approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other
SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a
registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective
holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE,
AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE
LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA,
PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT;
NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY
OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
Revision 1.3 (02-13-06)
2
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table of Contents
Chapter 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chapter 3 Pin Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1
3.2
128-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
128-Pin List Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chapter 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Chapter 5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1
6.2
PIN Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chapter 7 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.1
7.2
7.3
Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Chapter 8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 9 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SMSC USB2229/USB2230
3
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
List of Figures
Figure 5.1 USB2229/USB2230 128-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8.1 USB2229/USB2230 128-Pin TQFP Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision 1.3 (02-13-06)
4
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
List of Tables
Table 3.1
Table 3.2
Table 6.1
Table 6.2
Table 8.1
Table 9.1
USB2229/USB2230 128-Pin Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
USB2229/USB2230 128-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
USB2229/USB2230 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
USB2229/USB2230 Buffer Type Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
USB2229/USB2230 128-Pin TQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
GPIO Usage (ROM Rev 0x00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SMSC USB2229/USB2230
5
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 1 General Description
The USB2229/USB2230 is a Hi-Speed USB IrDA and Bulk Only Mass Storage Class Peripheral
Controller. The Bulk Only Mass Storage Class Peripheral Controller supports CompactFlash (CF) in
True IDE Mode only, SmartMedia (SM), Memory Stick (MS) including both serial and parallel interface
and Secure Digital/MultiMediaCard (SD/MMC) flash memory devices. It provides a single chip solution
for the most popular flash memory cards in the market. In addition, the IrDA controller consists of the
SMSC IrCC block, which includes a Synchronous Communications Engine (SCE).
The IrCC SCE supports FIR and SIR IrDA. The IrCC offers flexible signal routing and programmable
output control through the Raw mode interface, General Purpose Data pins and Output Multiplexer.
Chip-level address decoding is required to access the IrCC register set.
The device consists of a USB2.0 PHY and SIE, buffers, Fast 8051 microprocessor with expanded
scratchpad, and program SRAM, and IrDA, CF, MS, SM and SD controllers. The SD controller supports
both SD and MMC devices.
Provisions for external Flash Memory up to 128K bytes for program storage is provided (note: when
Bank switching is enabled the upper 64K will map into the 8051 ROM space, otherwise, only the first
64K bytes is used).
12K bytes of scratchpad SRAM and 768Bytes of program SRAM are also provided.
Twelve GPIO pins are provided for indicators, external serial EEPROM for OEM ID and system
configuration information, and other special functions.
Internal power FETs are provided to directly supply power to the xD/SM, MMC/SD and MS/MSPro
cards.
The internal ROM program is capable of implementing any combination of single or multi-LUN
CF/SD/MMC/SM/MS reader functions with individual card power control and activity indication. SMSC
also provides licenses** for Win98 and Win2K drivers and setup utilities. Note: Please check with
SMSC for precise features and capabilities for the current ROM code release.
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made
the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other
intellectual property rights from or through various persons or entities, including without limitation media standard companies,
forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations
include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia
Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji
Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses
or technical information available; does not promise or represent that any such licenses or technical information will actually be
obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or
with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or
otherwise with respect to, any such technical information.
SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with
respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay
damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such
devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existing or future
patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any
purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has
obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk
and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses
under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject
of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of
the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise
under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no
obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State
Disk Patents.
SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER
VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES
AGAINST INFRINGEMENT AND THE LIKE.
No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask
work right, trade secret, or other intellectual property right.
**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of
these Software License Agreements may be obtained by contacting SMSC.
Revision 1.3 (02-13-06)
6
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 2 Acronyms
SM: SmartMedia
SMC: SmartMedia Controller
FM: Flash Media
FMC: Flash Media Controller
CF: Compact Flash
CFC: CompactFlash Controller
SD: Secure Digital
SDC: Secure Digital Controller
MMC: MultiMediaCard
MS: Memory Stick
MSC: Memory Stick Controller
TPC: Transport Protocol Code.
ECC: Error Checking and Correcting
CRC: Cyclic Redundancy Checking
SMSC USB2229/USB2230
7
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 3 Pin Table
3.1
128-Pin Package
Table 3.1 USB2229/USB2230 128-Pin Package
CompactFlashINTERFACE (28 Pins)
CF_D0
CF_D1
CF_D2
CF_D3
CF_D4
CF_D5
CF_D6
CF_D7
CF_D8
CF_D9
CF_D10
CF_D11
CF_D12
CF_D13
CF_D14
CF_D15
CF_nIOR
CF_nIOW
CF_IRQ
CF_nRESET
CF_IORDY
CF_nCS0
CF_nCS1
CF_SA0
CF_SA1
CF_SA2
CF_nCD1
CF_nCD2
SmartMedia INTERFACE (17 Pins)
SM_D0
SM_D1
SM_D2
SM_D3
SM_D4
SM_D5
SM_D6
SM_D7
SM_ALE
SM_CLE
SM_nRE
SM_nWE
SM_nWP
SM_nB/R
SM_nCE
SM_nCD
SM_nWPS
Memory Stick INTERFACE (7 Pins)
MS_BS
MS_SDIO/MS_D0
MS_SCLK
MS_D1
MS_D2
MS_D3
MS_INS
SD INTERFACE (7 Pins)
SD_CMD
SD_CLK
SD_DAT0
SD_DAT2
SD_DAT3
SD_nWP
SD_DAT1
USB INTERFACE (10 Pins)
USBDP
USBDM
ATEST
RBIAS
VDD18PLL
VSSPLL
VDDA33
VSSA
XTAL1/CLKIN
XTAL2
Revision 1.3 (02-13-06)
8
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 3.1 USB2229/USB2230 128-Pin Package (continued)
MEMORY/IO INTERFACE (27 Pins)
MA0/CLK_SEL0
MA1/CLK_SEL1
MA2/SEL_CLKDRV
MA3/TX_POL
MA4
MA5
MA6
MA7
MA8
MA9
MA10
MA11
MA12
MA13
MA14
MA15
MD0
MD1
MD2
MD3
MD4
MD5
MD6
MD7
nMRD
nMWR
nMCE
MISC (15 Pins)
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6/ROMEN/MA16
GPIO7
GPIO8/
CRD_PWR0
GPIO9
GPIO10/
CRD_PWR1
GPIO11/
CRD_PWR2
GPIO12
nTEST0
nTEST1
nRESET
IrDA (3 PINS)
IR_TXD/TX
IR_RXD/RX
IR_MODE
DIGITAL, POWER, GROUND & NC (14 Pins)
(5)VDD33
(2)VDD18
(7)VSS
Total 128
3.2
128-Pin List Table
Table 3.2 USB2229/USB2230 128-Pin TQFP
PIN
#
NAME
MA
PIN
#
NAME
MA
PIN
#
NAME
MA
PIN
#
NAME
MA
1
MA13
8
33
CF_D1
8
65
SM_D0
8
97
VSS
-
2
MA14
8
34
CF_D2
8
66
SM_D1
8
98
RBIAS
-
3
VDD33
-
35
CF_D3
8
67
SM_D2
8
99
ATEST
-
4
MA15
8
36
CF_D4
8
68
SM_D3
8
100
VDD33
-
5
MD0
8
37
CF_D5
8
69
SM_D4
8
101
VDD18PLL
-
6
MD1
8
38
CF_D6
8
70
SM_D5
8
102
XTAL1/
CLKIN
-
7
MD2
8
39
CF_D7
8
71
SM_D6
8
103
XTAL2
-
8
MD3
8
40
CF_D8
8
72
SM_D7
8
104
VSSPLL
-
SMSC USB2229/USB2230
9
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 3.2 USB2229/USB2230 128-Pin TQFP (continued)
PIN
#
NAME
MA
PIN
#
NAME
MA
PIN
#
NAME
MA
PIN
#
NAME
MA
9
MD4
8
41
CF_D9
8
73
SM_ALE
8
105
GPIO9
8
10
MD5
8
42
GPIO8/
CRD_PWR0
8
74
SM_nWP
8
106
VDD18
-
11
MD6
8
43
VDD33
-
75
SM_CLE
8
107
GPIO7
8
12
MD7
8
44
GPIO11/
CRD_PWR2
8
76
SM_nWPS
-
108
VDD33
-
13
nMRD
8
45
CF_D10
8
77
SM_nB/R
-
109
GPIO6/
ROMEN/
MA16
8
14
nMWR
8
46
CF_D11
8
78
SM_nCD
-
110
GPIO5
8
15
VSS
-
47
VSS
-
79
GPIO10/
CRD_PWR1
8
111
GPIO4
8
16
VSS
-
48
CF_D12
8
80
VDD33
-
112
VSS
-
17
nMCE
8
49
VDD18
-
81
SM_nRE
8
113
nRESET
8
18
MS_INS
-
50
CF_D13
8
82
SM_nWE
8
114
GPIO2
8
19
MS_D0/
MS_SDIO
8
51
CF_D14
8
83
SM_nCE
8
115
GPIO1
-
20
MS_D1
8
52
CF_D15
8
84
VSS
-
116
MA0/
CLK_SEL0
8
21
MS_D2
8
53
CF_nCD1
-
85
VSS
-
117
MA1/
CLK_SEL1
8
22
MS_D3
8
54
CF_nCD2
-
86
VSSA
-
118
MA2/
SEL_
CLKDRV
8
23
MS_
SCLK
8
55
CF_IRQ
8
87
USBDM
-
119
MA3/
TX_POL
8
24
MS_BS
8
56
CF_IORDY
8
88
USBDP
-
120
MA4
8
25
SD_nWP
-
57
CF_nIOR
8
89
VDDA33
-
121
MA5
8
26
SD_DAT0
8
58
CF_nIOW
8
90
IR_MODE
8
122
MA6
8
27
SD_DAT1
8
59
CF_nRESET
8
91
IR_RXD/RX
8
123
MA7
8
28
SD_DAT2
8
60
CF_nCS0
8
92
IR_TXD/TX
8
124
MA8
8
29
SD_DAT3
8
61
CF_nCS1
8
93
GPIO12
8
125
MA9
8
30
SD_CMD
8
62
CF_SA0
8
94
GPIO3
8
126
MA10
8
31
SD_CLK
-
63
CF_SA1
8
95
nTEST1
-
127
MA11
8
32
CF_D0
8
64
CF_SA2
-
96
nTEST0
-
128
MA12
8
Revision 1.3 (02-13-06)
10
DATASHEET
SMSC USB2229/USB2230
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5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Revision 1.3 (02-13-06)
Chapter 4 Block Diagram
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
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Revision 1.3 (02-13-06)
12
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 6 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional
groups according to their associated interface.
The “n” symbol in the signal name indicates that the active, or asserted state occurs when the signal
is at a low voltage level. When “n” is not present before the signal name, the signal is asserted when
at the high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working
with a mixture of “active low” and “active high” signal. The term assert, or assertion indicates that a
signal is active, independent of whether that level is represented by a high or low voltage. The term
negate, or negation indicates that a signal is inactive.
6.1
PIN Descriptions
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
BUFFER
TYPE
DESCRIPTION
CompactFlash (In True IDE mode) INTERFACE
CF Chip Select 1
CF_nCS1
O8PU
This pin is the active low chip select 1 signal for the CF
ATA device
CF Chip Select 0
CF_nCS0
O8PU
This pin is the active low chip select 0 signal for the task
file registers of CF ATA device in the True IDE mode.
CF Register
Address 2
CF_SA2
O8
This pin is the register select address bit 2 for the CF
ATA device.
CF Register
Address 1
CF_SA1
O8
This pin is the register select address bit 1 for the CF
ATA device
CF Register
Address 0
CF_SA0
O8
This pin is the register select address bit 0 for the CF
ATA device.
CF Interrupt
CF_IRQ
IPD
This is the active high interrupt request signal from the
CF device.
CF
Data 15-8
CF_D[15:8]
I/O8PD
The bi-directional data signals CF_D15-CF_D8 in True
IDE mode data transfer.
In the True IDE Mode, all of task file register operation
occur on the CF_D[7:0], while the data transfer is on
CF_D[15:0].
The bi-directional data signal has an internal weak pulldown resistor.
CF
Data7-0
CF_D[7:0]
I/O8PD
The bi-directional data signals CF_D7-CF_D0 in the
True IDE mode data transfer.
In the True IDE Mode, all of task file register operation
occur on the CF_D[7:0], while the data transfer is on
CF_D[15:0].
The bi-directional data signal has an internal weak pulldown resistor.
IO Ready
CF_IORDY
IPU
This pin is active high input signal.
This pin has an internally controlled weak pull-up
resistor.
SMSC USB2229/USB2230
13
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
BUFFER
TYPE
CF
Card Detection2
CF_nCD2
IPU
DESCRIPTION
This card detection pin is connected to the ground on
the CF device, when the CF device is inserted.
This pin has an internally controlled weak pull-up
resistor.
CF
Card Detection1
CF_nCD1
IPU
This card detection pin is connected to ground on the
CF device, when the CF device is inserted.
This pin has an internally controlled weak pull-up
resistor.
CF
Hardware Reset
CF_nRESET
O8
This pin is an active low hardware reset signal to CF
device.
CF
IO Read
CF_nIOR
O8
This pin is an active low read strobe signal for CF
device.
CF
IO Write Strobe
CF_nIOW
O8
This pin is an active low write strobe signal for CF
device.
SmartMedia INTERFACE
SM
Write Protect
SM_nWP
O8PD
This pin is an active low write protect signal for the SM
device.
This pin has a weak pull-down resistor that is
permanently enabled
SM
Address Strobe
SM_ALE
O8PD
This pin is an active high Address Latch Enable signal
for the SM device.
This pin has a weak pull-down resistor that is
permanently enabled
SM
Command Strobe
SM_CLE
O8PD
This pin is an active high Command Latch Enable signal
for the SM device.
This pin has a weak pull-down resistor that is
permanently enabled
SM
Data7-0
SM_D[7:0]
I/O8PD
These pins are the bi-directional data signal SM_D7SM_D0.
The bi-directional data signal has an internal weak pulldown resistor.
SM
Read Enable
SM_nRE
08PU
This pin is an active low read strobe signal for SM
device.
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08
Revision 1.3 (02-13-06)
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pullups must be used, and should be connected to the
applicable Card Power Supply).
14
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
BUFFER
TYPE
SM
Write Enable
SM_nWE
O8PU
DESCRIPTION
This pin is an active low write strobe signal for SM
device.
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
SM
Write Protect Switch
SM_nWPS
SM
Busy or Data Ready
SM_nB/R
08
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pullups must be used, and should be connected to the
applicable Card Power Supply).
IPU
A write-protect seal is detected, when this pin is low.
This pin has an internally controlled weak pull-up
resistor.
I
This pin is connected to the BSY/RDY pin of the SM
device.
An external pull-up resistor is required on this signal.
The pull-up resistor must be pulled up to the same
power source that powers the SM/NAND flash device.
SM
Chip Enable
SM_nCE
O8PU
This pin is the active low chip enable signal to the SM
device.
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
SM
Card Detection
SM_nCD
08
If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pullups must be used, and should be connected to the
applicable Card Power Supply).
IPU
This is the card detection signal from SM device to
indicate if the device is inserted.
This pin has an internally controlled weak pull-up
resistor.
MEMORY STICK INTERFACE
MS
Bus State
MS_BS
MS
System
Data In/Out
MS_SDIO/MS_
D0
O8
This pin is connected to the BS pin of the MS device.
It is used to control the Bus States 0, 1, 2 and 3 (BS0,
BS1, BS2 and BS3) of the MS device.
I/O8PD
This pin is a bi-directional data signal for the MS device.
Most significant bit (MSB) of each byte is transmitted
first by either MSC or MS device.
The bi-directional data signal has an internal weak pulldown resistor.
MS
System
Data In/Out
SMSC USB2229/USB2230
MS_D[3:1]
I/O8PD
This pin is a bi-directional data signal for the MS device.
The bi-directional data signals have internal weak pulldown resistors.
15
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
BUFFER
TYPE
MS
Card Insertion
MS_INS
IPU
DESCRIPTION
This pin is the card detection signal from the MS device
to indicate, if the device is inserted.
This pin has an internally controlled weak pull-up
resistor.
MS
System CLK
MS_SCLK
O8
This pin is an output clock signal to the MS device.
The clock frequency is software configurable.
SD INTERFACE
SD
Data3-0
SD_DAT[3:0]
SD Clock
SD_CLK
I/O8PU
These are bi-directional data signals.
These pins have internally controlled weak pull-up
resistors.
O8
This is an output clock signal to SD/MMC device.
The clock frequency is software configurable.
SD Command
SD_CMD
I/O8PU
This is a bi-directional signal that connects to the CMD
signal of SD/MMC device.
This pin has an internally controlled weak pull-up
resistor.
SD
Write Protected
SD_nWP
IPD
This pin is an input signal with an internal weak pulldown.
This pin has an internally controlled weak pull-down
resistor.
USB INTERFACE
USB Bus Data
USBDM
USBDP
IO-U
These pins connect to the USB bus data signals.
USB Transceiver
Bias
RBIAS
I
A 12.0kΩ, ± 1.0% resistor is attached from VSSA to this
pin, in order to set the transceiver’s internal bias
currents.
Analog Test
ATEST
AIO
This signal is used for testing the analog section of the
chip and should be connected to VDDA33 for normal
operation.
1.8v PLL Power
VDD18PLL
PLL Ground
Reference
VSSPLL
Ground Reference for 1.8v PLL power
3.3v Analog Power
VDDA33
3.3v Analog Power
Analog Ground
Reference
VSSA
Crystal
Input/External Clock
Input
XTAL1/
CLKIN
1.8v Power for the PLL
Analog Ground Reference for 3.3v Analog Power.
ICLKx
24Mhz Crystal or external 24/48 MHz clock input.
This pin can be connected to one terminal of the crystal
or can be connected to an external 24/48Mhz clock
when a crystal is not used.
Note:
Revision 1.3 (02-13-06)
16
DATASHEET
The ‘MA[2:0] pins will be sampled while
nRESET is asserted, and the value will be
latched upon nRESET negation. This will
determine the clock source and value.
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
BUFFER
TYPE
Crystal Output
XTAL2
OCLKx
DESCRIPTION
24Mhz Crystal
This is the other terminal of the crystal, or left open
when an external clock source is used to drive
XTAL1/CLKIN. It may not be used to drive any external
circuitry other than the crystal circuit.
MEMORY/IO INTERFACE
Memory Data Bus
MD[7:0]
IO8
When ROMEN bit of GPIO_IN1 register = 0, these
signals are used to transfer data between the internal
CPU and the external program memory.
These pins have internally controlled weak pull-up
resistors.
Memory Address
Bus
MA[15:3]
O8
Memory Address
Bus
MA3/
TX_POL
I/O8PU
These signals address memory locations within the
external memory.
MA3 Addresses memory locations within the external
memory.
During nRESET assertion, TX_POL will select the
operating polarity of the IR LED (active high or active
low) and the weak pull-up resistor will be enabled.
When nRESET is negated, the value on this pin will be
internally latched and this pin will revert to MA3
functionality, the internal pull-up will be disabled.
Memory Address
Bus
MA2/
SEL_CLKDRV
I/O8PD
MA2 Addresses memory locations within the external
memory.
SEL_CLKDRV. During nRESET assertion, this pins will
select the operating clock mode (crystal or externally
driven clock source), and a weak pull-down resistor is
enabled. When nRESET is negated, the value will be
internally latched and this pin will revert to MA2
functionality, the internal pull-down will be disabled.
‘0’ = Crystal operation (24MHz only)
‘1’ = Externally driven clock source (24MHz or 48MHz)
Note:
If the latched value is ‘1’, then the MA2 pin is
tri-stated when the following conditions are
true:
1. IDLE bit (PCON.0) is 1.
2. INT2 is negated
3. SLEEP bit of CLOCK_SEL is 1.
If the latched value is ‘0’, then the MA2 pin will function
identically to the MA[15:3] pins at all times (other than
during nRESET assertion).
SMSC USB2229/USB2230
17
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
Memory Address
Bus
MA[1:0]/CLK_S
EL[1:0]
BUFFER
TYPE
I/O8PD
DESCRIPTION
MA[1:0], These signals address memory locations
within the external memory.
SEL[1:0]. During nRESET assertion, these pins will
select the operating frequency of the external clock, and
the corresponding weak pull-down resistors are
enabled. When nRESET is negated, the value on these
pins will be internal latched and these pins will revert to
MA[1:0] functionality, the internal pull-downs will be
disabled.
SEL[1:0]
SEL[1:0]
SEL[1:0]
SEL[1:0]
=
=
=
=
‘00’. 24MHz
‘01’. RESERVED
‘10’. RESERVED
‘11’. 48MHz
Note:
If the latched value is ‘1’, then the
corresponding MA pin is tri-stated when the
following conditions are true:
1. IDLE bit (PCON.0) is 1.
2. INT2 is negated
3. SLEEP bit of CLOCK_SEL is 1.
If the latched value is ‘0’, then the corresponding MA pin
will function identically to the MA[15:3] pins at all times
(other than during nRESET assertion).
Memory Write
Strobe
nMWR
O8
Program Memory Write; active low
Memory Read
Strobe
nMRD
O8
Program Memory Read; active low
Memory Chip
Enable
nMCE
O8
Program Memory Chip Enable; active low.
This signal is asserted, when any of the following
conditions are no longer met:
1. IDLE bit (PCON.0) is 1.
2. INT2 is negated
3. SLEEP bit of CLOCK_SEL is 1.
Note:
This signal is held to a logic ‘high’ while
nRESET is asserted.
MISC
General Purpose
I/O
GPIO1
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
GPIO2
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
GPIO3
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
GPIO4
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
GPIO5
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
Revision 1.3 (02-13-06)
18
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
GPIO6, ROMEN,
Memory Address 16
GPIO6/ROMEN
/MA16
BUFFER
TYPE
IPU
DESCRIPTION
This pin has an internal weak pull-up resistor that is
enabled or disabled by the state of nRESET.
The pull-up is enabled when nRESET is active.
The pull-up is disabled, when the nRESET is inactive
(some clock cycles later, after the rising edge of
nRESET).
The state of this pin is latched internally on the rising
edge of nRESET to determine if internal or external
program memory is used.
The state latched is stored in ROMEN bit of GPIO_IN1
register.
I/O8
After the rising edge of nRESET, this pin may be used
as GPIO6 or RXD.
When pulled low via an external weak pull-down
resistor, an external program memory should be
connected to the memory data bus. The
USB2229/USB2230 uses this external bus for program
execution.
When this pin is left unconnected or pulled high by a
weak pull-up resistor, the USB2229/USB2230 uses the
internal ROM for program execution.
I/O8
For Bank Switching support, MA16 addresses the
external 128k memory above the standard 64k range
(the upper 64k is mapped into the 64k addressable
ROM space)
General Purpose
I/O
GPIO7
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
Or
Card Power
GPIO8/
CRD_PWR0
I/O8
GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
General Purpose
I/O
GPIO9
I/O8
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
Or
Card Power
GPIO10/
CRD_PWR1
I/O8
GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
General Purpose
I/O
Or
Card Power
GPIO11/
CRD_PWR2
General Purpose
I/O
GPIO12
I/O8
RESET input
nRESET
IS
This active low signal is used by the system to reset the
chip. The active low pulse should be at least 1μs wide.
TEST Input
nTEST[1:0]
I
These signals are used for testing the chip. User should
normally tie them high externally, if the test function is
not used.
SMSC USB2229/USB2230
CRD_PWR: Card Power drive of 3.3V @ 100mA.
CRD_PWR: Card Power drive of 3.3V @ 100mA.
I/O8
GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
CRD_PWR: Card Power drive of 3.3V @ 200mA.
These pins may be used either as input, or output.
19
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.1 USB2229/USB2230 Pin Descriptions
NAME
SYMBOL
BUFFER
TYPE
DESCRIPTION
IrDA
IR MODE
IR_MODE
O8
IR_MODE, declares the operating speed of the IR link.
IR Receive Data or
UART RX
IR_RXD/RX
I
IR_RXD, can be used as IR receiver or as the UART
RX line.
IR Transmit Data or
UART TX
IR_TXD/TX
O8
IR_TXD, can be used as IR transmitter or as the UART
TX line.
DIGITAL POWER, GROUNDS, and NO CONNECTS
1.8v Digital Core
Power
VDD18
3.3v Power & &
Voltage Regulator
Input
VDD33
Ground
VSS
+1.8V Core power
All VDD18 pins must be connected together on the
circuit board.
3.3V Power & Regulator Input.
Pins 100 & 108 supply 3.3V power to the internal 1.8V
regulators.
Ground Reference
Notes:
„
Hot-insertion capable card connectors are required for all flash media. It is required for SD
connector to have Write Protect switch. This allows the chip to detect MMC card.
„
nMCE is normally asserted except when the 8051 is in standby mode.
6.2
Buffer Type Descriptions
Table 6.2 USB2229/USB2230 Buffer Type Descriptions
BUFFER
I
DESCRIPTION
Input
IPU
Input with internal weak pull-up resistor.
IPD
Input with internal weak pull-down resistor.
IS
I/O8
Input with Schmitt trigger
Input/Output buffer with 8mA sink and 8mA source.
I/O8PU
Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor.
I/O8PD
Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-down
resistor.
O8
Output buffer with 8mA sink and 8mA source.
O8PU
Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor.
O8PD
Output buffer with 8mA sink and 8mA source, with an internal weak pull-down resistor.
ICLKx
XTAL clock input
Revision 1.3 (02-13-06)
20
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Table 6.2 USB2229/USB2230 Buffer Type Descriptions (continued)
BUFFER
OCLKx
I/O-U
AIO
SMSC USB2229/USB2230
DESCRIPTION
XTAL clock output
Analog Input/Output Defined in USB specification
Analog Input/Output
21
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 7 DC Parameters
7.1
Maximum Guaranteed Ratings
Operating Temperature Range ............................................................................................0oC to +70oC
Storage Temperature Range............................................................................................. -55o to +150oC
Lead Temperature Range (soldering, 10 seconds) ...................................................................... +325oC
Positive Voltage on GPIO3, with respect to Ground......................................................................... 5.5V
Positive Voltage on any signal pin, with respect to Ground ............................................................. 4.6V
Positive Voltage on XTAL1, with respect to Ground ......................................................................... 4.0V
Positive Voltage on XTAL2, with respect to Ground ......................................................................... 2.5V
Negative Voltage on GPIO8, 10 & 11, with respect to Ground (see Note 7.2)............................... -0.5V
Negative Voltage on any pin, with respect to Ground ..................................................................... -0.5V
Maximum VDD18, VDD18PLL .............................................................................................................. +2.5V
Maximum VDD33, VDDA33 ................................................................................................................. +4.6V
*Stresses above the specified parameters could cause permanent damage to the device. This is a
stress rating only and functional operation of the device at any other condition above those indicated
in the operation sections of this specification is not implied.
7.2
Note 7.1
When powering this device from laboratory or system power supplies, it is important that
the Absolute Maximum Ratings not be exceeded or device failure can result. Some power
supplies exhibit voltage spikes on their outputs when the AC power is switched on or off.
In addition, voltage transients on the AC power line may appear on the DC output. When
this possibility exists, it is suggested that a clamp circuit be used.
Note 7.2
When internal power FET operation of these pins is enabled, these pins may be
simultaneously shorted to ground or any voltage up to 3.63V indefinitely, without damage
to the device as long as VDD33 and VDDA33 are less than 3.63V and TA is less than 70°C.
DC Electrical Characteristics
(TA = 0°C - 70°C, VDD33, VDDA33 = +3.3 V ± 0.3 V, VDD18, VDD18PLL = +1.8 V ± 10%,)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
0.8
V
COMMENTS
I,IPU & IPD Type Input Buffer
Low Input Level
VILI
High Input Level
VIHI
Pull Down
PD
72
μA
Pull Up
PU
58
μA
Revision 1.3 (02-13-06)
2.0
22
TTL Levels
V
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
0.8
V
COMMENTS
IS Type Input Buffer
Low Input Level
VILI
High Input Level
VIHI
Hysteresis
2.0
VHYSI
TTL Levels
V
500
mV
ICLK Input Buffer
Low Input Level
VILCK
High Input Level
VIHCK
2.2
Low Input Leakage
IIL
-10
+10
μA
VIN = 0
High Input Leakage
IIH
-10
+10
mA
VIN = VDD33
0.4
V
IOL = 8 mA @
VDD33= 3.3V
V
IOH = -8mA @
VDD33= 3.3V
μA
VIN = 0 to VDD33
(Note 7.3)
0.4
V
V
Input Leakage
(All I and IS buffers)
O8. O8PU & 08PD Type
Buffer
Low Output Level
VOL
High Output Level
VOH
VDD33
- 0.4
Output Leakage
IOL
-10
Pull Down
PD
72
μA
Pull Up
PU
58
μA
+10
I/O8, I/O8PU & I/O8PD Type
Buffer
V
IOL = 8 mA @
VDD33= 3.3V
V
IOH = -8 mA @
VDD33= 3.3V
µA
VIN = 0 to VDD33
(Note 7.3)
Low Output Level
VOL
High Output Level
VOH
VDD33
– 0.4
Output Leakage
IOL
-10
Pull Down
PD
72
µA
Pull Up
PU
58
µA
SMSC USB2229/USB2230
0.4
23
+10
DATASHEET
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
PARAMETER
SYMBOL
MIN
Output Current
IOUT
100
Short Circuit Current Limit
ISC
On Resistance
Output Voltage Rise Time
TYP
MAX
UNITS
COMMENTS
IO-U
(Note 7.4)
Integrated Power FET for
GPIO8 & GPIO10
mA
GPIO8 or 10;
VdropFET = 0.23V
140
mA
GPIO8 or 10;
VoutFET = 0V
RDSON
2.1
Ω
GPIO8 or 10;
IFET = 70mA
tDSON
800
μs
GPIO8 or 10;
CLOAD = 10μF
mA
GPIO11;
VdropFET = 0.46V
Integrated Power FET for
GPIO11)
Output Current
IOUT
Short Circuit Current Limit
ISC
181
mA
GPIO11;
VoutFET = 0V
On Resistance
RDSON
2.1
Ω
GPIO11;
IFET = 70mA
Output Voltage Rise Time
tDSON
800
μs
GPIO11;
CLOAD = 10μF
Supply Current Unconfigured
ICCINIT
45
60
mA
@ VDD18, VDD18PLL =
1.8V
10
20
mA
@ VDD33, VDDA33 =
3.3V
35
60
mA
@ VDD18, VDD18PLL =
1.8V
15
30
mA
@ VDD33, VDDA33 =
3.3V
45
70
mA
@ VDD18, VDD18PLL =
1.8V
15
30
mA
@ VDD33, VDDA33 =
3.3V
160
180
µA
@ VDD18, VDD18PLL =
1.8V
215
240
µA
@ VDD33, VDDA33 =
3.3V
Supply Current Active
(Full Speed)
Supply Current Active
(High Speed)
Supply Current Standby
200
ICC
ICC
ICSBY
Note 7.3
Output leakage is measured with the current pins in high impedance.
Note 7.4
See Appendix A for USB DC electrical characteristics.
Note 7.5
The Maximum power dissipation parameters of the package should not be exceeded
Revision 1.3 (02-13-06)
24
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Note 7.6
7.3
The assignment of each Integrated Card Power FET to a designated Card Connector is
controlled by both firmware and the specific board implementation. Firmware will default to
the settings listed in Table 9.1, “GPIO Usage (ROM Rev 0x00),” on page 27
Capacitance
TA = 25°C; fc = 1MHz; VDD18, VDD18PLL = 1.8V
LIMITS
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
Clock Input Capacitance
CIN
20
pF
Input Capacitance
CIN
10
pF
COUT
20
pF
Output Capacitance
SMSC USB2229/USB2230
25
DATASHEET
TEST CONDITION
All pins except USB pins
(and pins under test tied to
AC ground)
Revision 1.3 (02-13-06)
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 8 Packaging
Figure 8.1 USB2229/USB2230 128-Pin TQFP Package Outline
Table 8.1 USB2229/USB2230 128-Pin TQFP Package Parameters
A
MIN
NOMINAL
MAX
REMARKS
~
~
1.20
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
0.95
~
1.05
Body Thickness
D
15.80
~
16.20
X Span
D1
13.80
~
14.20
X body Size
E
15.80
~
16.20
Y Span
E1
13.80
~
14.20
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00
~
Lead Length
e
0.40 Basic
q
0o
W
0.13
Lead Pitch
~
7o
Lead Foot Angle
0.18
0.23
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
3. Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.3 (02-13-06)
26
DATASHEET
SMSC USB2229/USB2230
5th Generation Hi-Speed USB Flash Media and IrDA Controller with Integrated Card Power FETs
Datasheet
Chapter 9 GPIO Usage
Table 9.1 GPIO Usage (ROM Rev 0x00)
NAME
ACTIVE
LEVEL
GPIO1
H
Flash Media Activity LED/
xD_Door
Indicates media activity. Media or USB
cable must not be removed with LED lit.
Also may be used for xD Door
functionality
GPIO2
H
EE_CS
Serial EE PROM chip select
GPIO3
H
V_BUS
USB V bus detect
GPIO4
H
EE_DIN/EE_DOUT/xDID
Serial EE PROM input/output and xD
Identify
GPIO5
H
HS_IND/SD_CD
HS Indicator LED or SD Card Detect
Switch input
GPIO6
H
A16/ROMEN
A16 address line connect for DFU or
debug LED indicator optional.
GPIO7
H
EE_CLK/
UNCONF_LED
Serial EE PROM clock output or
Unconfigured LED.
GPIO8
L
MS_PWR_CTRL/
CRD_PWR0
Memory Stick Card Power Control, or
Internal Power FET0.
GPIO9
L
CF_PWR_CTRL
CompactFlash Card Power Control
GPIO10
L
SM_PWR_CTRL/
CRD_PWR1
SmartMedia Card Power Control, or
Internal Power FET1.
GPIO11
L
SD/MMC_PWR_CTRL/
CRD_PWR2
SD/MMC Card Power Control, or
Internal Power FET2.
GPIO12
H
MS_ACT_IND/
Media Activity
Memory Stick Activity Indicator, or
Media Activity LED.
SMSC USB2229/USB2230
SYMBOL
27
DATASHEET
DESCRIPTION AND NOTE
Revision 1.3 (02-13-06)