2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 MMBF5484 MMBF5485 MMBF5486 2N5484 2N5485 2N5486 G S G S TO-92 SOT-23 D D Mark: 6B / 6M / 6H NOTE: Source & Drain are interchangeable N-Channel RF Amplifier This device is designed primarily for electronic switching applications such as low On Resistance analog switching. Sourced from Process 50. Absolute Maximum Ratings* Symbol TA = 25°C unless otherwise noted Parameter Value Units 25 V VDG Drain-Gate Voltage VGS Gate-Source Voltage - 25 V IGF Forward Gate Current 10 mA TJ ,Tstg Operating and Storage Junction Temperature Range -55 to +150 °C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics Symbol PD TA = 25°C unless otherwise noted Characteristic RθJC Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Case RθJA Thermal Resistance, Junction to Ambient *Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06." 1997 Fairchild Semiconductor Corporation Max Units 2N5484-5486 350 2.8 125 *MMBF5484-5486 225 1.8 357 556 mW mW/°C °C/W °C/W (continued) Electrical Characteristics Symbol TA = 25°C unless otherwise noted Parameter Test Conditions Min IG = - 1.0 µA, VDS = 0 VGS = - 20 V, VDS = 0 VGS= - 20 V, VDS= 0, TA= 100°C 5484 VDS = 15 V, ID = 10 nA 5485 5486 - 25 5484 5485 5486 Typ Max Units OFF CHARACTERISTICS V(BR)GSS Gate-Source Breakdown Voltage IGSS Gate Reverse Current VGS(off) Gate-Source Cutoff Voltage V - 0.3 - 0.5 - 2.0 - 1.0 - 0.2 - 3.0 - 4.0 - 6.0 nA µA V V V 1.0 4.0 8.0 5.0 10 20 mA mA mA 3000 3500 4000 6000 7000 8000 µmhos µmhos µmhos 100 µmhos 1000 µmhos 50 60 75 µmhos µmhos µmhos 75 µmhos 100 µmhos ON CHARACTERISTICS IDSS Zero-Gate Voltage Drain Current* VDS = 15 V, VGS = 0 SMALL SIGNAL CHARACTERISTICS Forward Transfer Conductance Ciss Input Capacitance VDS = 15 V, VGS = 0, f = 1.0 kHz 5484 5485 5486 VDS = 15 V, VGS = 0, f = 100 MHz 5484 VDS = 15 V, VGS = 0, f = 400 MHz 5485 / 5486 VDS = 15 V, VGS = 0, f = 1.0 kHz 5484 5485 5486 VDS = 15 V, VGS = 0, f = 100 MHz 5484 VDS = 15 V, VGS = 0, f = 400 MHz 5485 / 5486 VDS = 15 V, VGS = 0, f = 100 MHz 5484 VDS = 15 V, VGS = 0, f = 400 MHz 5485 5486 VDS = 15 V, VGS = 0, f = 1.0 MHz 5.0 µmhos µmhos pF Crss Reverse Transfer Capacitance VDS = 15 V, VGS = 0, f = 1.0 MHz 1.0 pF Coss NF Output Capacitance VDS = 15 V, VGS = 0, f = 1.0 MHz 2.0 pF Noise Figure VDS= 15 V, RG = 1.0 kΩ, 5484 f = 100 MHz VDS= 15 V, RG = 1.0 kΩ, 5484 f = 400 MHz VDS= 15 V , RG = 1.0 kΩ, 5485 / 5486 f = 100 MHz VDS= 15 V, RG = 1.0 kΩ, 5485 / 5486 f = 400 MHz 3.0 dB gfs Re(yis) gos Re(yos) Re(yfs) Input Conductance Output Conductance Output Conductance Forward Transconductance *Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2% 2500 µmhos 3000 3500 4.0 dB 2.0 dB 4.0 dB 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier 5 (continued) Typical Characteristics Transfer Characteristics Channel Resistance vs Temperature 1000 V DS = 15V ID - DRAIN CURRENT (mA) O TA = -55 C 16 O T A = +25 C T A = +125O C 12 O TA = -55 C O T A = +25 C 8 T A = +125O C 4 -2.5 V 0 0 -1 -2 -3 -4 VGS- GATE-SOURCE VOLTAGE(V) 500 V GS(OFF) = -1.0V 300 -2.5 V 200 -5.0V 100 -8.0 V 50 30 20 10 -5 -50 6 5 = 15V O T A = +25 C T A = +125O C 5 4 O TA = -55 C O T A = +25 C T A = +125O C 3 2 V GS(OFF) = -4.5V 1 0 DS -2.5 V I D -- DRAIN CURRENT (mA) V 0 -1 -2 -3 -4 VGS- GATE-SOURCE VOLTAGE(V) 4 TYP V GS(OFF) = -5.5V 10 DG = 5v 10 5.0V 5 10V 15V 20V 5 10 15 15 20 20 1 V 0.5 V 0.1 0.01 0.02 GS(OFF) GS(OFF) = -3.5V = -1.5V 0.05 0.1 0.2 0.5 1 2 I D -- DRAIN CURRENT (mA) = -5.0V = V -2.0V 0V -2.5V GS -3.0V 2 -3.5V 1 -4.0V 0 0.2 0.4 0.6 0.8 VDS - DRAIN-SOURCE VOLTAGE(V) 1 Transconductance Parameter Interactions 20 V GS(OFF) 3 -5 O V 150 5V .0V -0. -1 V -1.5 O Output Conductance vs Drain Current T A = +25 C f = 1.0 kHz GS 0 50 100 T A - AMBIENT TEMPERATURE (°C) T A = +25 C 0 r DS -- DRAIN "ON" RESISTANCE ( Ω ) gfs -- TRANSCONDUCTANCE (mmhos) gos -- OUTPUT CONDUCTANCE (u mhos) O TA = -55 C = 100mV =0V Common Drain-Source Characteristics Transconductance Characteristics 7 V DS V 5 10 gfs, I DSS @ V DS = 15 V, V r DS @ VDS= 100mV, V = 0 PULSE GS = 0 100 GS 50 30 20 10 5 20 10 -1 VGS(OFF) @ VGS = 15V, I D= 1nA -2 -3 -5 -7 V - GATE-SOURCE VOLTAGE(V) GS 3 2 1 - 10 gfs --- TRANSCONDUCTANCE ( mmhos ) I -- DRAIN CURRENT ( mA ) DSS V GS(OFF) = -4.5V r DS - DRAIN ON RESISTANCE ( Ω) 20 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Typical Characteristics (continued) 5 V GS(OFF) = - 1.5V O TA = -55 C O T A = +25 C O T A = +125 C O TA = -55 C 1 O 0.5 V GS(OFF) T A = +25 C T A = +125 O C = - 5V V DG = 15V f = 1.0 kHz 0.1 0.01 0.02 V DG = 15V BW = 6.0 Hz @ f = 10 Hz, 100 Hz = 0.2 f @ f > 1.0 kHz Hz ) 10 Noise Voltage vs Frequency e n- NOISE VOLTAGE ( nV/ gfs -- TRANSCONDUCTANCE (mmhos) Transconductance vs Drain Current 0.05 0.1 0.2 0.5 1 2 I D - DRAIN CURRENT (mA) 5 I D = 0.5 mA 10 5 I D = 3 mA 1 0.01 0.03 10 0.3 1 3 10 f -- FREQUENCY (kHz) 30 100 Noise Figure Frequency Capacitance vs Voltage 5 10 f = 0.1 - 1.0 MHz V DS NF -- NOISE FIGURE (dB) 5 C is ( V DS = 15 V) 1 C rs ( V DS = 0 V) C is( C rs ) -- CAPACITANCE (pF) 0.1 -5 -10 -15 VGS-- GATE-SOURCE VOLTAGE(V) 3 D = 15V = 5.0 mA R g = 1.0 k Ω O T A = +25 C 2 1 0 10 -20 20 30 50 100 200 300 f -- FREQUENCY (MHz) Power Dissipation vs. Ambient Temperature P D - POWER DISSIPATION (mW) 0 4 I 350 TO-92 300 SOT-23 250 200 150 100 50 0 0 25 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier 50 75 100 TEMPERATURE (ºC) 125 150 500 1000 5 (continued) Common Source Characteristics Output Admittance -- OUTPUT CONDUCTANCE (mmhos) V DS = 15V V GS = 0 5 (CS) 1 b iss 1 b OSS (x 10) g 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 (CS) 100 200 300 500 f -- FREQUENCY (MHz) +g fss -b fss 1 V DS = 15V V GS = 0 (CS) 100 200 300 500 f -- FREQUENCY (MHz) 700 700 1000 Reverse Transadmittance Y rss-- REVERSE TRANSFER (mmhos) Yfss -- FORWARD TRANSFER (mmhos) Forward Transadmittance 10 5 OSS V DS = 15V V GS = 0 OSS g iss Y Yiss -- INPUT ADMITTANCE (mmhos) Input Admittance 10 1000 10 5 - b rss 1 -g rss ( X 0.1) V DS = 15V V GS = 0 (CS) 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier (continued) Common Gate Characteristics Output Admittance V DS = 15V V GS = 0 (CG) 10 g igs 5 b igs 1 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 Y ogs-- OUTPUT CONDUCTANCE (mmhos) Yigs -- INPUT ADMITTANCE (mmhos) Input Admittance 1 b OgS (x 10) g V DS = 15V V GS = 0 (CG) 100 +g fgs -b fgs 1 V DS = 15V V GS = 0 (CG) 100 200 300 500 f -- FREQUENCY (MHz) 700 200 300 500 f -- FREQUENCY (MHz) 700 1000 Reverse Transadmittance Y rgs-- REVERSE TRANSFER (mmhos) Yfgs -- FORWARD TRANSFER (mmhos) Forward Transadmittance 10 5 Ogs 1000 1 V DS = 15V V GS = 0 (CG) g 2N5484 / 5485 / 5486 / MMBF5484 / 5485 / 5486 N-Channel RF Amplifier rgs - b rgs 5 100 200 300 500 f -- FREQUENCY (MHz) 700 1000 TO-92 Tape and Reel Data TO-92 Packaging Configuration: Figure 1.0 TAPE and REEL OPTION FSCINT Label sample See Fig 2.0 for various Reeling Styles FAIRCHILD SEMICONDUCTOR CORPORATION LOT: CBVK741B019 PN2222N NSID: D/C1: HTB:B QTY: 10000 SPEC: D9842 SPEC REV: FSCINT Label B2 QA REV: 5 Reels per Intermediate Box (FSCINT) Customized Label F63TNR Label sample LOT: CBVK741B019 FSID: PN222N D/C1: D9842 D/C2: F63TNR Label QTY: 2000 SPEC: QTY1: QTY2: SPEC REV: CPN: N/F: F Customized Label (F63TNR)3 375mm x 267mm x 375mm Intermediate Box TO-92 TNR/AMMO PACKING INFROMATION Packing Style Quantity EOL code Reel A 2,000 D26Z E 2,000 D27Z Ammo M 2,000 D74Z P 2,000 D75Z AMMO PACK OPTION See Fig 3.0 for 2 Ammo Pack Options FSCINT Label Unit weight = 0.22 gm Reel weight with components = 1.04 kg Ammo weight with components = 1.02 kg Max quantity per intermediate box = 10,000 units 327mm x 158mm x 135mm Immediate Box Customized Label (TO-92) BULK PACKING INFORMATION EOL CODE DESCRIPTION QUANTITY TO-18 OPTION STD NO LEAD CLIP 2.0 K / BOX J05Z TO-5 OPTION STD NO LEAD CLIP 1.5 K / BOX NO LEADCLIP 2.0 K / BOX NO LEADCLIP 2.0 K / BOX TO-92 STANDARD STRAIGHT FOR: PKG 92, 94 (NON PROELECTRON SERIES), 96 L34Z TO-92 STANDARD STRAIGHT FOR: PKG 94 (PROELECTRON SERIES BCXXX, BFXXX, BSRXXX), 97, 98 Customized Label F63TNR Label 333mm x 231mm x 183mm Intermediate Box BULK OPTION LEADCLIP DIMENSION J18Z NO EOL CODE 5 Ammo boxes per Intermediate Box See Bulk Packing Information table Anti-static Bubble Sheets FSCINT Label 2000 units per EO70 box for std option 114mm x 102mm x 51mm Immediate Box 5 EO70 boxes per intermediate Box 530mm x 130mm x 83mm Intermediate box Customized Label FSCINT Label 10,000 units maximum per intermediate box for std option ©2001 Fairchild Semiconductor Corporation March 2001, Rev. B1 TO-92 Tape and Reel Data, continued TO-92 Reeling Style Configuration: Figure 2.0 Machine Option “A” (H) Machine Option “E” (J) Style “A”, D26Z, D70Z (s/h) Style “E”, D27Z, D71Z (s/h) TO-92 Radial Ammo Packaging Configuration: Figure 3.0 FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP ORDER STYLE D74Z (M) FIRST WIRE OFF IS EMITTER (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D75Z (P) FIRST WIRE OFF IS COLLECTOR (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP September 1999, Rev. B TO-92 Tape and Reel Data, continued TO-92 Tape and Reel Taping Dimension Configuration: Figure 4.0 Hd P Pd b Ha W1 d L H1 HO L1 S WO t W2 W t1 P1 F1 DO P2 PO User Direction of Feed TO-92 Reel Configuration: Figure 5.0 ITEM DESCRIPTION SYMBOL DIMENSION Base of Package to Lead Bend b 0.098 (max) Component Height Ha 0.928 (+/- 0.025) Lead Clinch Height HO 0.630 (+/- 0.020) Component Base Height H1 0.748 (+/- 0.020) Component Alignment ( side/side ) Pd 0.040 (max) Component Alignment ( front/back ) Hd 0.031 (max) Component Pitch P 0.500 (+/- 0.020) Feed Hole Pitch PO 0.500 (+/- 0.008) Hole Center to First Lead P1 0.150 (+0.009, -0.010) Hole Center to Component Center P2 0.247 (+/- 0.007) Lead Spread F1/F2 0.104 (+/- 0 .010) Lead Thickness d 0.018 (+0.002, -0.003) Cut Lead Length L 0.429 (max) Taped Lead Length L1 0.209 (+0.051, -0.052) Taped Lead Thickness t 0.032 (+/- 0.006) Carrier Tape Thickness t1 0.021 (+/- 0.006) Carrier Tape Width W 0.708 (+0.020, -0.019) Hold - down Tape Width WO 0.236 (+/- 0.012) Hold - down Tape position W1 0.035 (max) Feed Hole Position W2 0.360 (+/- 0.025) Sprocket Hole Diameter DO 0.157 (+0.008, -0.007) Lead Spring Out S 0.004 (max) Note : All dimensions are in inches. ELECT ROSTATIC SEN SITIVE D EVICES D4 D1 D2 F63TNR Label ITEM DESCRIPTION SYSMBOL MINIMUM MAXIMUM Reel Diameter D1 13.975 14.025 Arbor Hole Diameter (Standard) D2 1.160 1.200 D2 0.650 0.700 Customized Label (Small Hole) W1 Core Diameter D3 3.100 3.300 Hub Recess Inner Diameter D4 2.700 3.100 Hub Recess Depth W1 0.370 0.570 Flange to Flange Inner Width W2 1.630 Hub to Hub Center Width W3 1.690 2.090 W3 W2 Note: All dimensions are inches D3 July 1999, Rev. A TO-92 Package Dimensions TO-92 (FS PKG Code 92, 94, 96) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1977 ©2000 Fairchild Semiconductor International January 2000, Rev. B SOT-23 Tape and Reel Data SOT-23 Packaging Configuration: Figure 1.0 Customized Label Packaging Description: SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and some other options are described in the Packaging Information table. Antistatic Cover Tape Human Readable Label These full reels are individually labeled and placed inside a standard intermediate made of recyclable corrugated brown paper with a Fairchil d logo printing. One pizza box contains eight reels maximum. And these intermediate boxes are placed inside a labeled shipping box which comes in different sizes depending on the number of parts shipped. Embossed Carrier Tape 3P 3P 3P 3P SOT-23 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Standard (no flow code) TNR 3,000 D87Z 7" Dia 13" 187x107x183 343x343x64 Max qty per Box 24,000 30,000 Weight per unit (gm) 0.0082 0.0082 Weight per Reel (kg) 0.1175 0.4006 Reel Size Box Dimension (mm) SOT-23 Unit Orientation TNR 10,000 343mm x 342mm x 64mm Intermediate box for L87Z Option Human Readable Label Note/Comments Human Readable Label sample H uman readable Label 187mm x 107mm x 183mm Intermediate Box for Standard Option SOT-23 Tape Leader and Trailer Configuration: Figure 2.0 Carrier Tape Cover Tape Components Trailer Tape 300mm minimum or 75 empt y poc kets ©2000 Fairchild Semiconductor International Leader Tape 500mm minimum or 125 empty pockets September 1999, Rev. C SOT-23 Tape and Reel Data, continued SOT-23 Embossed Carrier Tape Configuration: Figure 3.0 P0 P2 D1 D0 T E1 W F E2 Wc B0 Tc A0 P1 K0 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 SOT-23 (8mm) 3.15 +/-0.10 2.77 +/-0.10 W 8.0 +/-0.3 D0 D1 E1 E2 1.55 +/-0.05 1.125 +/-0.125 1.75 +/-0.10 F 6.25 min 3.50 +/-0.05 P1 P0 4.0 +/-0.1 4.0 +/-0.1 K0 T 1.30 +/-0.10 0.228 +/-0.013 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). Wc 0.06 +/-0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 5.2 +/-0.3 Tc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SOT-23 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max See detail AA Dim N 7" Diameter Option B Min Dim C See detail AA W3 13" Diameter Option Dim D min W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) 8mm 7" Dia 7.00 177.8 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 55 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 – 0.429 7.9 – 10.9 8mm 13" Dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 4.00 100 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 – 0.429 7.9 – 10.9 September 1999, Rev. C SOT-23 Package Dimensions SOT-23 (FS PKG Code 49) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0082 ©2000 Fairchild Semiconductor International September 1998, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ PowerTrench QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER SMART START™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G