LINER LTC2356-14

LTC2356-12/LTC2356-14
Serial 12-Bit/14-Bit, 3.5Msps
Sampling ADCs with Shutdown
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FEATURES
DESCRIPTIO
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The LTC®2356-12/LTC2356-14 are 12-bit/14-bit, 3.5Msps
serial ADCs with differential inputs. The devices draw
only 5.5mA from a single 3.3V supply and come in a tiny
10-lead MSOP package. A Sleep shutdown feature further
reduces power consumption to 13µW. The combination of
speed, low power and tiny package makes the LTC2356-12/
LTC2356-14 suitable for high speed, portable applications.
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3.5Msps Conversion Rate
74.1dB SINAD at 14-Bits, 71.1dB SINAD at 12-Bits
Low Power Dissipation: 18mW
3.3V Single Supply Operation
2.5V Internal Bandgap Reference can be Overdriven
3-Wire SPI-Compatible Serial Interface
Sleep (13µW) Shutdown Mode
Nap (4mW) Shutdown Mode
80dB Common Mode Rejection
±1.25V Bipolar Input Range
Tiny 10-Lead MSOP Package
The 80dB common mode rejection allows users to eliminate ground loops and common mode noise by measuring
signals differentially from the source.
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APPLICATIO S
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The devices convert –1.25V to 1.25V bipolar inputs differentially. The absolute voltage swing for AIN+ and
AIN– extends from ground to the supply voltage.
Communications
Data Acquisition Systems
Uninterrupted Power Supplies
Multiphase Motor Control
Multiplexed Data Acquisition
RFID
The serial interface sends out the conversion results during
the 16 clock cycles following a CONV rising edge for
compatibility with standard serial interfaces. If two additional clock cycles for acquisition time are allowed after the
data stream in between conversions, the full sampling rate
of 3.5Msps can be achieved with a 63MHz clock.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
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BLOCK DIAGRA
10µF 3.3V
7
LTC2356-14
THD, 2nd and 3rd vs Input Frequency
for Differential Input Signals
–50
VDD
+
14-BIT ADC
S&H
AIN–
2
–
THREESTATE
SERIAL
OUTPUT
PORT
–62
SDO
8
14
3
VREF
10
2.5V
REFERENCE
10µF
4
GND
5
11
SCK
2356 BD
EXPOSED PAD
–68
–74
THD
2nd
3rd
–80
–86
–92
9
6
CONV
TIMING
LOGIC
THD, 2nd, 3rd (dB)
1
14-BIT LATCH
–56
AIN+
–98
–104
0.1
1
10
FREQUENCY (MHz)
100
2356 G02
2356f
1
LTC2356-12/LTC2356-14
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AXI U
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ABSOLUTE
RATI GS
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PACKAGE/ORDER I FOR ATIO
(Notes 1, 2)
Supply Voltage (VDD) ................................................. 4V
Analog and VREF Input Voltages
(Note 3) ....................................–0.3V to (VDD + 0.3V)
Digital Input Voltages ................. – 0.3V to (VDD + 0.3V)
Digital Output Voltage .................. – 0.3V to (VDD + 0.3V)
Power Dissipation .............................................. 100mW
Operation Temperature Range
LTC2356C-12/LTC2356C-14 ................... 0°C to 70°C
LTC2356I-12/LTC2356I-14 ................ – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
ORDER PART
NUMBER
TOP VIEW
AIN+
AIN–
VREF
GND
GND
1
2
3
4
5
10
9
8
7
6
11
CONV
SCK
SDO
VDD
GND
MSE PACKAGE
10-LEAD PLASTIC MSOP
LTC2356CMSE-12
LTC2356IMSE-12
LTC2356CMSE-14
LTC2356IMSE-14
MSE PART MARKING
TJMAX = 125°C, θJA = 150°C/ W
EXPOSED PAD (PIN 11) IS GND
MUST BE SOLDERED TO PCB
LTCWN
LTCWN
LTCVF
LTCVF
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult factory for parts specified with wider operating temperature ranges.
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CO VERTER CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. With internal reference. VDD = 3.3V
PARAMETER
LTC2356-12
MIN TYP MAX
CONDITIONS
LTC2356-14
MIN TYP MAX
●
12
(Notes 4, 5, 18)
●
–2
±0.25
2
–4
Offset Error
(Notes 4, 18)
●
–10
±1
10
–30
Gain Error
(Note 4, 18)
●
–40
±5
40
–80
Gain Tempco
Internal Reference (Note 4)
External Reference
Resolution (No Missing Codes)
Integral Linearity Error
14
UNITS
Bits
±0.5
±15
±1
4
LSB
±2
30
LSB
±10
80
LSB
±15
±1
ppm/°C
ppm/°C
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A ALOG I PUT
The ● denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. With internal reference. VDD = 3.3V
SYMBOL PARAMETER
CONDITIONS
VIN
Analog Differential Input Range (Notes 3, 8, 9)
3.1V ≤ VDD ≤ 3.6V
VCM
Analog Common Mode + Differential
Input Range (Note 10)
IIN
Analog Input Leakage Current
CIN
Analog Input Capacitance
(Note 19)
tACQ
Sample-and-Hold Acquisition Time
(Note 6)
tAP
Sample-and-Hold Aperture Delay Time
tJITTER
Sample-and-Hold Aperture Delay Time Jitter
CMRR
Analog Input Common Mode Rejection Ratio
MIN
●
TYP
UNITS
–1.25 to 1.25
V
0 to VDD
V
●
1
13
●
µA
pF
39
1
fIN = 1MHz, VIN = 0V to 3V
fIN = 100MHz, VIN = 0V to 3V
MAX
ns
ns
0.3
ps
–60
–15
dB
dB
2356f
2
LTC2356-12/LTC2356-14
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DY A IC ACCURACY
The ● denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C with external reference = 2.55V. VDD = 3.3V. Single-ended AIN+ signal drive with AIN– = 1.5V
DC. Differential signal drive with VCM = 1.5V at AIN+ and AIN–
LTC2356-12
MIN TYP MAX
LTC2356-14
MIN TYP MAX
SYMBOL
PARAMETER
CONDITIONS
SINAD
Signal-to-Noise Plus
Distortion Ratio
100kHz Input Signal (Note 19)
1.4MHz Input Signal (Note 19)
●
Total Harmonic
Distortion
100kHz First 5 Harmonics (Note 19)
1.4MHz First 5 Harmonics (Note 19)
●
SFDR
Spurious Free
Dynamic Range
100kHz Input Signal (Note 19)
1.4MHz Input Signal (Note 19)
86
82
86
82
dB
dB
IMD
Intermodulation
Distortion
0.625VP-P 1.4MHz Summed with 0.625VP-P
1.56MHz into AIN+ and Inverted into AIN–
–82
–82
dB
Code-to-Code
Transition Noise
VREF = 2.5V (Note 18)
0.25
1
THD
68
71.1
71.1
–86
–82
UNITS
74.1
72.3
70
–86
–82
–76
dB
dB
dB
dB
–78
LSBRMS
Full Power Bandwidth
VIN = 2.5VP-P, SDO = 11585LSBP-P (Note 15)
50
50
MHz
Full Linear Bandwidth
S/(N + D) ≥ 68dB
5
5
MHz
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I TER AL REFERE CE CHARACTERISTICS
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. VDD = 3.3V
PARAMETER
CONDITIONS
MIN
VREF Output Voltage
IOUT = 0
2.5
V
15
ppm/°C
VREF Line Regulation
VDD = 3.1V to 3.6V, VREF = 2.5V
600
µV/V
VREF Output Resistance
Load Current = 0.5mA
0.2
Ω
VREF Settling Time
CREF = 10µF
VREF Output Tempco
TYP
MAX
UNITS
2
External VREF Input Range
2.55
ms
VDD
V
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DIGITAL I PUTS A D DIGITAL OUTPUTS
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. VDD = 3.3V
SYMBOL
PARAMETER
CONDITIONS
VIH
High Level Input Voltage
VDD = 3.6V
●
VIL
Low Level Input Voltage
VDD = 3.1V
●
0.6
V
IIN
Digital Input Current
VIN = 0V to VDD
●
±10
µA
CIN
Digital Input Capacitance
VOH
High Level Output Voltage
VDD = 3.3V, IOUT = – 200µA
VOL
Low Level Output Voltage
VDD = 3.1V, IOUT = 160µA
VDD = 3.1V, IOUT = 1.6mA
●
VOUT = 0V to VDD
●
IOZ
Hi-Z Output Leakage DOUT
COZ
Hi-Z Output Capacitance DOUT
ISOURCE
Output Short-Circuit Source Current
ISINK
Output Short-Circuit Sink Current
MIN
●
TYP
MAX
2.4
2.5
UNITS
V
5
pF
2.9
V
0.05
0.10
0.4
V
V
±10
µA
1
pF
VOUT = 0V, VDD = 3.3V
20
mA
VOUT = VDD = 3.3V
15
mA
2356f
3
LTC2356-12/LTC2356-14
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POWER REQUIRE E TS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 17)
SYMBOL
VDD
IDD
PARAMETER
Supply Voltage
Supply Current
PD
Power Dissipation
CONDITIONS
MIN
3.1
Active Mode
Nap Mode
Sleep Mode (LTC2356-12)
Sleep Mode (LTC2356-14)
Active Mode with SCK in Fixed State (Hi or Lo)
●
●
TYP
3.3
5.5
1.1
4
4
18
MAX
3.6
8
1.5
15
12
UNITS
V
mA
mA
µA
µA
mW
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TI I G CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. VDD = 3.3V
SYMBOL
fSAMPLE(MAX)
tTHROUGHPUT
tSCK
tCONV
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t12
PARAMETER
CONDITIONS
Maximum Sampling Rate per Channel
(Conversion Rate)
Minimum Sampling Period (Conversion + Acquisiton Period)
Clock Period
Conversion Time
Minimum High or Low SCLK Pulse Width
CONV to SCK Setup Time
Nearest SCK Edge Before CONV
Minimum High or Low CONV Pulse Width
SCK↑ to Sample Mode
CONV↑ to Hold Mode
16th SCK↑ to CONV≠ Interval (Affects Acquisition Period)
Delay from SCK to Valid Data
SCK↑ to Hi-Z at SDO
Previous SDO Bit Remains Valid After SCK
VREF Settling Time After Sleep-to-Wake Transition
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to GND.
Note 3: When these pins are taken below GND or above VDD, they will be
clamped by internal diodes. This product can handle input currents greater
than 100mA below GND or greater than VDD without latchup.
Note 4: Offset and full-gain specifications are measured for a single-ended
AIN+ input with AIN– grounded and using the internal 2.5V reference.
Note 5: Integral linearity is tested with an external 2.55V reference and is
defined as the deviation of a code from the straight line passing through
the actual endpoints of a transfer curve. The deviation is measured from
the center of quantization band.
Note 6: Guaranteed by design, not subject to test.
Note 7: Recommended operating conditions.
Note 8: The analog input range is defined for the voltage difference
between AIN+ and AIN–. Performance is specified with AIN– = 1.5V DC while
driving AIN+.
Note 9: The absolute voltage at AIN+ and AIN– must be within this range.
Note 10: If less than 3ns is allowed, the output data will appear one clock
cycle later. It is best for CONV to rise half a clock before SCK, when
running the clock at rated speed.
4
●
MIN
3.5
TYP
●
(Note 16)
(Note 6)
(Note 6)
(Notes 6, 10)
(Note 6)
(Note 6)
(Note 6)
(Notes 6, 11)
(Notes 6, 7, 13)
(Notes 6, 12)
(Notes 6, 12)
(Notes 6, 12)
(Note 14)
●
15.872
16
2
3
0
4
4
1.2
45
MAX
UNITS
MHz
286
10000
ns
ns
SCLK cycles
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
18
8
6
2
2
Note 11: Not the same as aperture delay. Aperture delay is smaller (1ns)
because the 2.2ns delay through the sample-and-hold is subtracted from
the CONV to Hold mode delay.
Note 12: The rising edge of SCK is guaranteed to catch the data coming
out into a storage latch.
Note 13: The time period for acquiring the input signal is started by the
16th rising clock and it is ended by the rising edge of convert.
Note 14: The internal reference settles in 2ms after it wakes up from Sleep
mode with one or more cycles at SCK and a 10µF capacitive load.
Note 15: The full power bandwidth is the frequency where the output code
swing drops to 3dB with a 2.5VP-P input sine wave.
Note 16: Maximum clock period guarantees analog performance during
conversion. Output data can be read with an arbitrarily long clock.
Note 17: VDD = 3.3V, fSAMPLE = 3.5Msps.
Note 18: The LTC2356-14 is measured and specified with 14-bit resolution
(1LSB = 152µV) and the LTC2356-12 is measured and specified with
12-bit resolution (1LSB = 610µV).
Note 19: The sampling capacitor at each input accounts for 4.1pF of the
input capacitance.
2356f
LTC2356-12/LTC2356-14
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TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C, VDD = 3.3V (LTC2356-14).
SINAD vs Input Frequency
THD, 2nd and 3rd vs Input Frequency
–50
74
–56
71
–62
THD, 2nd, 3rd (dB)
77
SINAD (dB)
68
65
62
59
56
THD
2nd
3rd
–68
–74
–80
–86
–92
53
–98
50
0.1
1
10
FREQUENCY (MHz)
–104
0.1
100
1
10
FREQUENCY (MHz)
100
2356 G01
2356 G02
SNR vs Input Frequency
SFDR vs Input Frequency
77
92
74
86
71
68
SNR (dB)
SFDR (dB)
80
74
68
65
62
59
62
56
56
53
50
0.1
1
10
FREQUENCY (MHz)
50
0.1
100
100kHz Sine Wave 8192 Point
FFT Plot
1.4MHz Sine Wave 8192 Point
FFT Plot
0
0
–10
–10
–20
–20
–30
–30
–40
MAGNITUDE (dB)
MAGNITUDE (dB)
100
2356 G04
2356 G03
–50
–60
–70
–80
–40
–50
–60
–70
–80
–90
–90
–100
–100
–110
–120
–110
–120
0
1
10
FREQUENCY (MHz)
250K 500K 750K 1M 1.25M 1.5M 1.75M
FREQUENCY (Hz)
2356 G05
0
250K 500K 750K 1M 1.25M 1.5M 1.75M
FREQUENCY (Hz)
2356 G06
2356f
5
LTC2356-12/LTC2356-14
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TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C, VDD = 3.3V (LTC2356-14).
Differential Linearity vs Output Code
Integral Linearity vs Output Code
1.0
4
3
0.6
INTEGRAL LINEARITY (LSB)
DIFFERENTIAL LINEARITY (LSB)
0.8
0.4
0.2
0
–0.2
–0.4
–0.6
2
1
0
–1
–2
–3
–0.8
–1.0
0
4096
12288
8192
OUTPUT CODE
–4
16384
0
8192
4096
16384
12288
OUTPUT CODE
2356 G07
2356 G08
Differential and Integral Linearity
vs Conversion Rate
SINAD vs Conversion Rate, Input
Frequency = 1.4MHz
4
75
3
74
MAX INL
1
SINAD (dB)
LINEARITY (LSB)
2
MAX DNL
MIN DNL
0
–1
MIN INL
73
72
–2
71
–3
–4
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
70
2
2.2 2.4 2.6 2.8
CONVERSION RATE (Msps)
3
3.2 3.4 3.6 3.8
4
CONVERSION RATE (Msps)
2356 G09
2356 G10
CMRR vs Frequency
2.5VP-P Power Bandwidth
0
12
6
–20
–40
–6
CMRR (dB)
AMPLITUDE (dB)
0
–12
–18
–60
–80
–24
–100
–30
–36
1M
10M
100M
FREQUENCY (Hz)
1G
2356 G11
–120
100
1k
10k
100k 1M
FREQUENCY (Hz)
10M
100M
2356 G12
2356f
6
LTC2356-12/LTC2356-14
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TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C, VDD = 3.3V (LTC2356-12 and LTC2356-14)
Internal Reference Voltage vs
Load Current
PSRR vs Frequency
–25
2.4902
–30
2.4900
–35
2.4898
VREF (V)
PSRR (dB)
–40
–45
2.4896
–50
–55
2.4894
–60
2.4892
–65
–70
1
100
1k
10k
FREQUENCY (Hz)
10
100k
1M
2.4890
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
LOAD CURRENT (mA)
2356 G13
2356 G14
Internal Reference Voltage vs VDD
VDD Supply Current vs Conversion Rate
2.4902
6
5.5
VDD SUPPLY CURRENT (mA)
2.4900
VREF (V)
2.4898
2.4896
2.4894
2.4892
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
2.4890
2.6
2.8
3.0
3.2
VDD (V)
3.4
3.6
0
0
0.5
1
1.5
2
2.5
3
3.5
4
CONVERSION RATE (Mps)
2356 G15
2356 G16
2356f
7
LTC2356-12/LTC2356-14
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PI FU CTIO S
AIN+ (Pin 1): Noninverting Analog Input. AIN+ operates
fully differentially with respect to AIN– with a –1.25V to
1.25V differential swing with respect to AIN– and a 0V to
VDD common mode swing.
a solid analog ground plane with a 10µF ceramic capacitor
(or 10µF tantalum in parallel with 0.1µF ceramic). Keep in
mind that internal analog currents and digital output signal
currents flow through this pin. Care should be taken to
place the 0.1µF bypass capacitor as close to Pins 6 and 7
as possible.
AIN– (Pin 2): Inverting Analog Input. AIN– operates fully
differentially with respect to AIN+ with a 1.25V to –1.25V
differential swing with respect to AIN+ and a 0V to VDD
common mode swing.
SDO (Pin 8): Three-State Serial Data Output. Each set of
output data words represents the difference between
AIN+ and AIN– analog inputs at the start of the previous
conversion. The output format is 2’s complement.
VREF (Pin 3): 2.5V Internal Reference. Bypass to GND and
to a solid analog ground plane with a 10µF ceramic
capacitor (or 10µF tantalum in parallel with 0.1µF ceramic). Can be overdriven by an external reference between 2.55V and VDD.
SCK (Pin 9): External Clock Input. Advances the conversion process and sequences the output data on the rising
edge. Responds to TTL (≤3.3V) and 3.3V CMOS levels.
One or more pulses wake from sleep.
GND (Pins 4, 5, 6, 11): Ground and Exposed Pad. These
ground pins and the exposed pad must be tied directly to
the solid ground plane under the part. Keep in mind that
analog signal currents and digital output signal currents
flow through these pins.
CONV (Pin 10): Convert Start. Holds the analog input
signal and starts the conversion on the rising edge.
Responds to TTL (≤3.3V) and 3.3V CMOS levels. Two
CONV pulses with SCK in fixed high or fixed low state start
Nap mode. Four or more CONV pulses with SCK in fixed
high or fixed low state start Sleep mode.
VDD (Pin 7): 3.3V Positive Supply. This single power pin
supplies 3.3V to the entire device. Bypass to GND and to
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BLOCK DIAGRA
10µF 3.3V
AIN+
1
+
14-BIT ADC
S&H
AIN–
2
VDD
–
14-BIT LATCH
7
LTC2356-14
THREESTATE
SERIAL
OUTPUT
PORT
8
SDO
10
CONV
9
SCK
14
3
VREF
2.5V
REFERENCE
10µF
4
GND
5
6
TIMING
LOGIC
11
2356 BD
EXPOSED PAD
2356f
8
LTC2356-12/LTC2356-14
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TI I G DIAGRA
LTC2356-12 Timing Diagram
t2
t3
17
18
t7
t1
1
2
3
4
5
6
7
8
9
10
11
12
13
15
14
16
17
18
1
SCK
t4
t5
CONV
t6
INTERNAL
S/H STATUS
tACQ
SAMPLE
HOLD
SAMPLE
t8
t8
HOLD
t9
SDO REPRESENTS THE ANALOG INPUT FROM THE PREVIOUS CONVERSION
Hi-Z
SDO
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X*
Hi-Z
X*
2356 TD01
14-BIT DATA WORD
tCONV
tTHROUGHPUT
*BITS MARKED "X" AFTER D0 SHOULD BE IGNORED.
LTC2356-14 Timing Diagram
t2
t3
17
18
t7
t1
1
2
3
4
5
6
7
8
9
10
11
12
13
15
14
16
17
18
1
SCK
t4
t5
CONV
t6
INTERNAL
S/H STATUS
tACQ
SAMPLE
HOLD
SAMPLE
t8
t8
HOLD
t9
SDO REPRESENTS THE ANALOG INPUT FROM THE PREVIOUS CONVERSION
SDO
Hi-Z
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Hi-Z
2356 TD01b
14-BIT DATA WORD
tCONV
tTHROUGHPUT
Nap Mode and Sleep Mode Waveforms
SCK
t1
t1
CONV
NAP
SLEEP
t12
VREF
2356 TD02
NOTE: NAP AND SLEEP ARE INTERNAL SIGNALS
SCK to SDO Delay
SCK
VIH
SCK
VIH
t8
t10
SDO
t9
VOH
90%
SDO
10%
VOL
2356 TD03
2356f
9
LTC2356-12/LTC2356-14
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APPLICATIO S I FOR ATIO
DRIVING THE ANALOG INPUT
The differential analog inputs of the LTC2356-12/LTC2356-14
may be driven differentially or as a single-ended input (i.e., the
AIN– input is set to VCM). Both differential analog inputs,
AIN+ and AIN–, are sampled at the same instant. Any
unwanted signal that is common to both inputs of each input
pair will be reduced by the common mode rejection of the
sample-and-hold circuit. The inputs draw only one small
current spike while charging the sample-and-hold capacitors
at the end of conversion. During conversion, the analog
inputs draw only a small leakage current. If the source
impedance of the driving circuit is low, then the LTC2356-12/
LTC2356-14 inputs can be driven directly. As source
impedance increases, so will acquisition time. For minimum
acquisition time with high source impedance, a buffer
amplifier must be used. The main requirement is that the
amplifier driving the analog input(s) must settle after the
small current spike before the next conversion starts (settling
time must be 39ns for full throughput rate). Also keep in mind
while choosing an input amplifier the amount of noise and
harmonic distortion added by the amplifier.
CHOOSING AN INPUT AMPLIFIER
Choosing an input amplifier is easy if a few requirements are
taken into consideration. First, to limit the magnitude of the
voltage spike seen by the amplifier from charging the sampling capacitor, choose an amplifier that has a low output
impedance (<100Ω) at the closed-loop bandwidth frequency.
For example, if an amplifier is used with a gain of 1 and has
a unity-gain bandwidth of 50MHz, then the output impedance
at 50MHz must be less than 100Ω. The second requirement
is that the closed-loop bandwidth must be greater than
40MHz to ensure adequate small-signal settling for full
throughput rate. If slower op amps are used, more time for
settling can be provided by increasing the time between
conversions. The best choice for an op amp to drive the
LTC2356-12/LTC2356-14 will depend on the application.
Generally, applications fall into two categories: AC applications where dynamic specifications are most critical and time
domain applications where DC accuracy and settling time are
most critical. The following list is a summary of the op amps
that are suitable for driving the LTC2356-12/LTC2356-14.
(More detailed information is available in the Linear Technology Databooks and our website at www.linear.com.)
LTC1566-1: Low Noise 2.3MHz Continuous Time Low-Pass
Filter.
LT®1630: Dual 30MHz Rail-to-Rail Voltage FB Amplifier.
2.7V to ±15V supplies. Very high AVOL, 500µV offset and
520ns settling to 0.5LSB for a 4V swing. THD and noise are
–93dB to 40kHz and below 1LSB to 320kHz (AV = 1, 2VP-P
into 1kΩ, VS = 5V), making the part excellent for AC
applications (to 1/3 Nyquist) where rail-to-rail performance
is desired. Quad version is available as LT1631.
LT1632: Dual 45MHz Rail-to-Rail Voltage FB Amplifier. 2.7V
to ±15V supplies. Very high AVOL, 1.5mV offset and 400ns
settling to 0.5LSB for a 4V swing. It is suitable for applications with a single 5V supply. THD and noise are
–93dB to 40kHz and below 1LSB to 800kHz (AV = 1,
2VP-P into 1kΩ, VS = 5V), making the part excellent for AC
applications where rail-to-rail performance is desired. Quad
version is available as LT1633.
LT1813: Dual 100MHz 750V/µs 3mA Voltage Feedback
Amplifier. 5V to ±5V supplies. Distortion is –86dB to 100kHz
and –77dB to 1MHz with ±5V supplies (2VP-P into 500Ω).
Excellent part for fast AC applications with ±5V supplies.
LT1801: 80MHz GBWP, –75dBc at 500kHz, 2mA/Amplifier,
8.5nV/√Hz.
LT1806/LT1807: 325MHz GBWP, –80dBc Distortion at 5MHz,
Unity-Gain Stable, R-R In and Out, 10mA/Amplifier, 3.5nV/√Hz.
LT1810: 180MHz GBWP, –90dBc Distortion at 5MHz,
Unity-Gain Stable, R-R In and Out, 15mA/Amplifier, 16nV/√Hz.
LT1818/LT1819: 400MHz, 2500V/µs,9mA, Single/Dual Voltage Mode Operational Amplifier.
LT6200: 165MHz GBWP, –85dBc Distortion at 1MHz, UnityGain Stable, R-R In and Out, 15mA/Amplifier,
0.95nV/√Hz.
LT6203: 100MHz GBWP, –80dBc Distortion at 1MHz,
Unity-Gain Stable, R-R In and Out, 3mA/Amplifier,
1.9nV/√Hz.
LT6600-10: Amplifier/Filter Differential In/Out with 10MHz
Cutoff.
2356f
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LTC2356-12/LTC2356-14
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APPLICATIO S I FOR ATIO
INPUT FILTERING AND SOURCE IMPEDANCE
The noise and the distortion of the input amplifier and
other circuitry must be considered since they will add to
the LTC2356-12/LTC2356-14 noise and distortion. The
small-signal bandwidth of the sample-and-hold circuit is
50MHz. Any noise or distortion products that are present
at the analog inputs will be summed over this entire
bandwidth. Noisy input circuitry should be filtered prior to
the analog inputs to minimize noise. A simple 1-pole RC
filter is sufficient for many applications. For example,
Figure 1 shows a 47pF capacitor from AIN+ to ground and
a 51Ω source resistor to limit the input bandwidth to
47MHz. The 47pF capacitor also acts as a charge reservoir
for the input sample-and-hold and isolates the ADC input
from sampling-glitch sensitive circuitry. High quality capacitors and resistors should be used since these components can add distortion. NPO and silvermica type dielectric
capacitors have excellent linearity. Carbon surface mount
resistors can generate distortion from self heating and
from damage that may occur during soldering. Metal film
surface mount resistors are much less susceptible to both
problems. When high amplitude unwanted signals are
close in frequency to the desired signal frequency, a
multiple pole filter is required. High external source resistance, combined with the 13pF of input capacitance, will
reduce the rated 50MHz bandwidth and increase acquisition time beyond 39ns.
51Ω
1
AIN+
47pF
2
VCM
1.5V DC
AIN–
LTC2356-12/
LTC2356-14
3
VREF
10µF
11
GND
2356 F01
inverting input. The ±1.25V range is also ideally suited for
AC-coupled signals in single supply applications. Figure 2
shows how to AC couple signals in a single supply system
without needing a mid-supply 1.5V external reference. The
DC common mode level is supplied by the previous stage
that is already bounded by the single supply voltage of the
system. The common mode range of the inputs extend
from ground to the supply voltage VDD. If the difference
between the AIN+ and AIN– inputs exceeds 1.25V, the
output code will stay fixed at zero and all ones and if this
difference goes below –1.25V, the output code will stay
fixed at one and all zeros.
C2
1µF
R3
51Ω
VIN
C3
56pF
R2
1.6k
R1
1.6k
C1
C4
1µF 10µF
+
LTC2356-12/
LTC2356-14
1
AIN+
2
AIN–
3
VREF
2356 F02
C1, C2: FILM TYPE
C3: COG TYPE
C4: CERAMIC BYPASS
Figure 2. AC Coupling of AC Signals with 1kHz
Low Cutoff Frequency
INTERNAL REFERENCE
The LTC2356-12/LTC2356-14 has an on-chip, temperature compensated, bandgap reference that is factory
trimmed to 2.5V to obtain a bipolar ±1.25V input span. The
reference amplifier output VREF, (Pin 3) must be bypassed
with a capacitor to ground. The reference amplifier is
stable with capacitors of 1µF or greater. For the best noise
performance, a 10µF ceramic or a 10µF tantalum in parallel
with a 0.1µF ceramic is recommended. The VREF pin can be
overdriven with an external reference as shown in
3.5V TO 18V
Figure 1. RC Input Filter
INPUT RANGE
The analog inputs of the LTC2356-12/LTC2356-14 may be
driven fully differentially with a single supply. Each input
may swing up to 2.5VP-P individually. When using the
internal reference, the non-inverting input should never be
more than 1.25V more positive or more negative than the
3V
LT1790-3
3
VREF
LTC2356-12/
LTC2356-14
10µF
11
GND
2356 F03
Figure 3. Overdriving VREF Pin with an External Reference
2356f
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LTC2356-12/LTC2356-14
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APPLICATIO S I FOR ATIO
INPUT SPAN VERSUS REFERENCE VOLTAGE
V
The differential input range has a bipolar ± REF
voltage
2
span that equals the difference between the voltage at
the reference buffer output VREF at Pin 3, and the voltage
at the ground (Exposed Pad Ground). The differential input
range of the ADC is ±1.25V when using the internal
reference. The internal ADC is referenced to these two
nodes. This relationship also holds true with an external
reference.
DIFFERENTIAL INPUTS
The LTC2356-12/LTC2356-14 have a unique differential
sample-and-hold circuit that measures input voltages
from ground to VDD. The ADC will always convert the
bipolar difference of AIN+ – AIN–, independent of the
common mode voltage at the inputs. The common mode
rejection holds up at extremely high frequencies, see
Figure 4. The only requirement is that both inputs not go
below ground or exceed VDD. Integral nonlinearity errors
(INL) and differential nonlinearity errors (DNL) are largely
independent of the common mode voltage. However, the
offset error will vary. The change in offset error is typically
less than 0.1% of the common mode voltage.
Figure 5 shows the ideal input/output characteristics for
the LTC2356-12/LTC2356-14. The code transitions occur
midway between successive integer LSB values (i.e.,
0.5LSB, 1.5LSB, 2.5LSB, FS – 1.5LSB). The output code
is straight binary with 1LSB = 2.5V/16384 = 153µV for the
LTC2356-14, and 1LSB = 2.5V/4096 = 610µV for the
LTC2356-12. The LTC2356-14 has 1LSB RMS of random
white noise. Figure 6a shows the LTC1819 converting a
single ended input signal to differential input signals for
optimum THD and SFDR performance as shown in the FFT
plot (Figure 6b).
011...111
2’S COMPLEMENT OUTPUT CODE
Figure 3. The voltage of the external reference must be
higher than the 2.5V output of the internal reference. The
recommended range for an external reference is 2.55V to
VDD. An external reference at 2.55V will see a DC quiescent
load of 0.75mA and as much as 3mA during conversion.
011...110
011...101
100...010
100...001
100...000
–FS
FS – 1LSB
INPUT VOLTAGE (V)
2356 F05
Figure 5. LTC2356-12/LTC2356-14 Transfer Characteristic
5V
C5
0.1µF
0
C3
1µF
–
–20
VIN
1.25VP-P
MAX
–40
CMRR (dB)
U1
1/2 LT1819
+
C6
0.1µF
R5
1k
–60
R4
499Ω
–80
–120
100
R3
499Ω –5V
–
–100
U2
1/2 LT1819
1k
10k
100k 1M
FREQUENCY (Hz)
10M
100M
R1
51Ω
+
1
C1
47pF TO
1000pF
1.5VCM
AIN+
LTC2356-14
R6
1k
C4
1µF
R2
51Ω
C2
47pF TO
1000pF
AIN–
2356 F06a
2356 F04
Figure 4. CMRR vs Frequency
Figure 6a. The LT1819 Driving the LTC2356-14 Differentially
2356f
12
LTC2356-12/LTC2356-14
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APPLICATIO S I FOR ATIO
VREF BYPASS 0805 SIZE
0
–10
MAGNITUDE (dB)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
0
185k
371k
556k
FREQUENCY (Hz)
741k
2356 F06b
Figure 6b. LTC2356-12 6MHz Sine Wave 4096 Point FFT Plot
with the LT1819 Driving the Inputs Differentially
Board Layout and Bypassing
Wire wrap boards are not recommended for high resolution and/or high speed A/D converters. To obtain the best
performance from the LTC2356-12/LTC2356-14, a printed
circuit board with ground plane is required. Layout for the
printed circuit board should ensure that digital and analog
signal lines are separated as much as possible. In particular, care should be taken not to run any digital track
alongside an analog signal track. If optimum phase match
between the inputs is desired, the length of the two input
wires should be kept matched.
High quality tantalum and ceramic bypass capacitors
should be used at the VDD and VREF pins as shown in the
Block Diagram on the first page of this data sheet. For
optimum performance, a 10µF surface mount Tantalum
capacitor with a 0.1µF ceramic is recommended for the
VDD and VREF pins. Alternatively, 10µF ceramic chip
capacitors such as Murata GRM219R60J106M may
be used. The capacitors must be located as close to the
pins as possible. The traces connecting the pins and the
bypass capacitors must be kept short and should be made
as wide as possible.
Figure 7 shows the recommended system ground connections. All analog circuitry grounds should be terminated at
the LTC2356-12/LTC2356-14 GND (Pins 4, 5, 6 and
exposed pad). The ground return from the LTC2356-12/
LTC2356-14 (Pins 4, 5, 6 and exposed pad) to the power
supply should be low impedance for noise free operation.
In applications where the ADC data outputs and control
OPTIONAL INPUT FILTERING
VDD BYPASS 0805 SIZE
Figure 7. Recommended Layout
signals are connected to a continuously active microprocessor bus, it is possible to get errors in the conversion
results. These errors are due to feedthrough from the
microprocessor to the successive approximation comparator. The problem can be eliminated by forcing the
microprocessor into a Wait state during conversion or by
using three-state buffers to isolate the ADC data bus.
2356 F07
POWER-DOWN MODES
Upon power-up, the LTC2356-12/LTC2356-14 is initialized to the active state and is ready for conversion. The Nap
and Sleep mode waveforms show the power-down modes
for the LTC2356-12/LTC2356-14. The SCK and CONV
inputs control the power-down modes (see Timing
Diagrams). Two rising edges at CONV, without any
intervening rising edges at SCK, put the LTC2356-12/
LTC2356-14 in Nap mode and the power consumption
drops from 18mW to 4mW. The internal reference
remains powered in Nap mode. One or more rising edges
at SCK wake up the LTC2356-12/LTC2356-14 very quickly,
and CONV can start an accurate conversion within a clock
cycle. Four rising edges at CONV, without any intervening
rising edges at SCK, put the LTC2356-12/LTC2356-14 in
Sleep mode and the power consumption drops from
18mW to 13µW. One or more rising edges at SCK wake up
the LTC2356-12/LTC2356-14 for operation. The internal
reference (VREF ) takes 2ms to slew and settle with a 10µF
load. Note that, using sleep mode more frequently than
every 2ms, compromises the settled accuracy of the
2356f
13
LTC2356-12/LTC2356-14
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APPLICATIO S I FOR ATIO
internal reference. Note that, for slower conversion rates,
the Nap and Sleep modes can be used for substantial
reductions in power consumption.
DIGITAL INTERFACE
The LTC2356-12/LTC2356-14 has a 3-wire SPI-compatible
(Serial Protocol Interface) interface. The SCK and CONV
inputs and SDO output implement this interface. The SCK
and CONV inputs accept swings from 3.3V logic and are
TTL compatible, if the logic swing does not exceed VDD. A
detailed description of the three serial port signals follows.
Conversion Start Input (CONV)
The rising edge of CONV starts a conversion, but subsequent rising edges at CONV are ignored by the LTC2356-12/
LTC2356-14 until the following 16 SCK rising edges have
occurred. It is necessary to have a minimum of 16 rising
edges of the clock input SCK between rising edges of
CONV. But to obtain maximum conversion speed (with a
63MHz SCK), it is necessary to allow two more clock
periods between conversions to allow 39ns of acquisition
time for the internal ADC sample-and-hold circuit. With 16
clock periods per conversion, the maximum conversion
rate is limited to 3.5Msps to allow 39ns for acquisition
time. In either case, the output data stream comes out
within the first 16 clock periods to ensure compatibility
with processor serial ports. The duty cycle of CONV can be
arbitrarily chosen to be used as a frame sync signal for the
processor serial port. A simple approach to generate
CONV is to create a pulse that is one SCK wide to drive the
LTC2356-12/LTC2356-14 and then buffer this signal with
the appropriate number of inverters to ensure the correct
delay driving the frame sync input of the processor
serial port. It is good practice to drive the LTC2356-12/
LTC2356-14 CONV input first to avoid digital noise interference during the sample-to-hold transition triggered by
CONV at the start of conversion. It is also good practice to
keep the width of the low portion of the CONV signal
greater than 15ns to avoid introducing glitches in the front
end of the ADC just before the sample-and-hold goes into
hold mode at the rising edge of CONV.
Minimizing Jitter on the CONV Input
In high speed applications where high amplitude sine
waves above 100kHz are sampled, the CONV signal must
have as little jitter as possible (10ps or less). The square
wave output of a common crystal clock module usually
meets this requirement . The challenge is to generate a
CONV signal from this crystal clock without jitter corruption from other digital circuits in the system. A clock
divider and any gates in the signal path from the crystal
clock to the CONV input should not share the same
integrated circuit with other parts of the system. As shown
in Figure 8, the SCK and CONV inputs should be driven
first, with digital buffers used to drive the serial port
interface. Also note that the master clock in the DSP may
already be corrupted with jitter, even if it comes directly
from the DSP crystal. Another problem with high speed
processor clocks is that they often use a low cost, low
speed crystal (i.e., 10MHz) to generate a fast, but jittery,
phase-locked-loop system clock (i.e., 40MHz). The jitter in
these PLL-generated high speed clocks can be several
nanoseconds. Note that if you choose to use the frame
sync signal generated by the DSP port, this signal will have
the same jitter of the DSP’s master clock.
The Typical Application Figure on page 16 shows a circuit
for level-shifting and squaring the output from an RF
signal generator or other low-jitter source. A single D-type
flip flop is used to generate the CONV signal to the
LTC2356-12/LTC2356-14. Re-timing the master clock
signal eliminates clock jitter introduced by the controlling
device (DSP, FPGA, etc.) Both the inverter and flip flop
must be treated as analog components and should be
powered from a clean analog supply.
Serial Clock Input (SCK)
The rising edge of SCK advances the conversion process
and also udpates each bit in the SDO data stream. After
CONV rises, the third rising edge of SCK starts clocking out
the 12/14 data bits with the MSB sent first. A simple
approach is to generate SCK to drive the LTC2356-12/
LTC2356-14 first and then buffer this signal with the
appropriate number of inverters to drive the serial clock
input of the processor serial port. Use the falling edge of
the clock to latch data from the Serial Data Output (SDO)
2356f
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LTC2356-12/LTC2356-14
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APPLICATIO S I FOR ATIO
into your processor serial port. The 14-bit serial data will
be received right justified, in a 16-bit word with 16 or more
clocks per frame sync. It is good practice to drive the
LTC2356-12/LTC2356-14 SCK input first to avoid digital
noise interference during the internal bit comparison
decision by the internal high speed comparator. Unlike the
CONV input, the SCK input is not sensitive to jitter because
the input signal is already sampled and held constant.
Serial Data Output (SDO)
Upon power-up, the SDO output is automatically reset to
the high impedance state. The SDO output remains in high
impedance until a new conversion is started. SDO sends
out 12/14 bits in 2’s complement format in the output data
stream beginning at the third rising edge of SCK after the
rising edge of CONV. SDO is always in high impedance
mode when it is not sending out data bits. Please note the
delay specification from SCK to a valid SDO. SDO is always
guaranteed to be valid by the next rising edge of SCK. The
16-bit output data stream is compatible with the 16-bit or
32-bit serial port of most processors.
Loading on the SDO line must be minimized. SDO can
directly drive most fast CMOS logic inputs directly. However, the general purpose I/O pins on many programmable
logic devices (FPGAs, CPLDs) and DSPs have excessive
capacitance. In these cases, a 100Ω resistor in series with
SDO can isolate the input capacitance of the receiving
device. If the receiving device has more than 10pF of input
capacitance or is located far from the LTC2356-12/
LTC2356-14, an NC7SVU04P5X inverter can be used to
provide more drive.
U
PACKAGE DESCRIPTIO
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
DETAIL “A”
1
2.06 ± 0.102
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
0° – 6° TYP
1 2 3 4 5
GAUGE PLANE
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
0.18
(.007)
0.497 ± 0.076
(.0196 ± .003)
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
4.90 ± 0.152
(.193 ± .006)
0.254
(.010)
BOTTOM VIEW OF
EXPOSED PAD OPTION
SEATING
PLANE
2.794 ± 0.102
(.110 ± .004)
0.86
(.034)
REF
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
10
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.127 ± 0.076
(.005 ± .003)
5.23
(.206)
MIN
0.889 ± 0.127
(.035 ± .005)
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
MSOP (MSE) 0603
0.50
0.305 ± 0.038
(.0197)
(.0120 ± .0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
2356f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC2356-12/LTC2356-14
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TYPICAL APPLICATIO
Low-Jitter Clock Timing with RF Sine Generator Using Clock
Squaring/Level Shifting Circuit and Re-Timing Flip-Flop
VCC
0.1µF
1k
NC7SVU04P5X
MASTER CLOCK
VCC
50Ω
1k
PRE
D
Q
CONV
Q
CLR
NL17SZ74
CONTROL
LOGIC
(FPGA, CPLD,
DSP, ETC.)
CONVERT ENABLE
CONV
LTC2356
SCK
NC7SVU04P5X
SDO
100Ω
2356 TA03
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
12-Bit, 2.2Msps Serial ADC
5V or ±5V Supply, 4.096V or ±2.5V Span
ADCs
LTC1402
LTC1403/LTC1403A
12-/14-Bit, 2.8Msps Serial ADC
3V, 15mW, Unipolar Inputs, MSOP Package
LTC1403-1/LTC1403A-1
12-/14-Bit, 2.8Msps Serial ADC
3V, 15mW, Bipolar Inputs, MSOP Package
LTC1405
12-Bit, 5Msps Parallel ADC
5V, Selectable Spans, 115mW
LTC1407/LTC1407A
12-/14-Bit, 3Msps Simultaneous Sampling ADC 3V, 2-Channel Differential, Unipolar Inputs, 14mW, MSOP Package
LTC1407-1/LTC1407A-1
12-/14-Bit, 3Msps Simultaneous Sampling ADC 3V, 2-Channel Differential, Bipolar Inputs, 14mW, MSOP Package
LTC1411
14-Bit, 2.5Msps Parallel ADC
5V, Selectable Spans, 80dB SINAD
LTC1412
12-Bit, 3Msps Parallel ADC
±5V Supply, ±2.5V Span, 72dB SINAD
LCT1414
14-Bit, 2.2Msps Parallel ADC
±5V Supply, ±2.5V Span, 78dB SINAD
LTC1420
12-Bit, 10Msps Parallel ADC
5V, Selectable Spans, 72dB SINAD
LTC1604
16-Bit, 333ksps Parallel ADC
±5V Supply, ±2.5V Span, 90dB SINAD
LTC1608
16-Bit, 500ksps Parallel ADC
±5V Supply, ±2.5V Span, 90dB SINAD
LTC1609
16-Bit, 250ksps Serial ADC
5V, Configurable Bipolar/Unipolar Inputs
LTC1864/LTC1865
16-Bit, 250ksps Serial ADCs
5V Supply, 1 and 2 Channel, 4.3mW, MSOP Package
LTC2355-12/LTC2355-14
12-/14-Bit, 3.5Msps Serial ADC
3.3V 14mW, 0V to 2.5V Span, MSOP Package
DACs
LTC1666/LTC1667/LTC1668
12-/14-/16-Bit, 50Msps DACs
87dB SFDR, 20ns Settling Time
LTC1592
16-Bit, Serial SoftSpanTM IOUT DAC
±1LSB INL/DNL, Software Selectable Spans
LT1790-2.5
Micropower Series Reference in SOT-23
0.05% Initial Accuracy, 10ppm Drift
LT1461-2.5
Precision Voltage Reference
0.04% Initial Accuracy, 3ppm Drift
LT1460-2.5
Micropower Series Voltage Reference
0.1% Initial Accuracy, 10ppm Drift
References
SoftSpan is a trademark of Linear Technology Corporation.
2356f
16 Linear Technology Corporation
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