74LVT240, 74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Features General Description ■ Input and output interface capability to systems at The LVT240 and LVTH240 are inverting octal buffers and line drivers designed to be employed as memory address drivers, clock drivers and bus oriented transmitters or receivers which provides improved PC board density. ■ ■ ■ ■ ■ ■ ■ 5V VCC Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH240), also available without bushold feature (74LVT240) Live insertion/extraction permitted Power Up/Down high impedance provides glitch-free bus loading Outputs source/sink –32mA/+64mA Functionally compatible with the 74 series 240 Latch-up performance exceeds 500mA ESD performance: – Human-body model > 2000V – Machine model > 200V – Charged-device model > 1000V The LVTH240 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These octal buffers and line drivers are designed for lowvoltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT240 and LVTH240 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation. Ordering Information Order Number Package Number Package Description 74LVT240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LVT240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT240MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LVT240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LVTH240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH240MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LVTH240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs January 2008 Logic Symbols IEEE/IEC Pin Descriptions Pin Names Description OE1, OE2 3-STATE Output Enable Inputs I0–I7 Inputs O0–O7 3-STATE Outputs Truth Tables Inputs OE1 In Outputs (Pins 12, 14, 16, 18) L L H L H L H X Z OE2 In Outputs (Pins 3, 5, 7, 9) L L H L H L H X Z Inputs H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 2 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Connection Diagrams Symbol VCC Parameter Rating Supply Voltage –0.5V to +4.6V VI DC Input Voltage –0.5V to +7.0V VO DC Output Voltage Output in 3-STATE –0.5V to +7.0V State(1) Output in HIGH or LOW –0.5V to +7.0V DC Input Diode Current, VI < GND –50mA IOK DC Output Diode Current, VO < GND –50mA IO DC Output Current, VO > VCC IIK Output at HIGH State 64mA Output at LOW State 128mA ICC DC Supply Current per Supply Pin ±64mA IGND DC Ground Current per Ground Pin ±128mA TSTG Storage Temperature –65°C to +150°C Note: 1. IO Absolute Maximum Rating must be observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Min Max Units Supply Voltage 2.7 3.6 V VI Input Voltage 0 5.5 V IOH HIGH-Level Output Current –32 mA IOL LOW-Level Output Current 64 mA TA Free-Air Operating Temperature –40 85 °C 0 10 ns/V VCC ∆t / ∆V Parameter Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 3 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter T A =–40°C to +85°C VCC (V) 2.7 Conditions II = –18mA VIK Input Clamp Diode Voltage VIH Input HIGH Voltage 2.7–3.6 VIL Input LOW Voltage 2.7–3.6 VO ≤ 0.1V or VO ≥ VCC – 0.1V VOH Output HIGH Voltage 2.7–3.6 IOH = –100µA Output LOW Voltage II(HOLD) II(OD)(3) II Max. Units –1.2 2.0 0.8 VCC–0.2 3.0 IOH = –32mA 2.0 IOL = 100µA 0.2 IOL = 24mA 0.5 IOL = 16mA 0.4 IOL = 32mA 0.5 IOL = 64mA 0.55 75 VI = 2.0V –75 Bushold Input Minimum Drive 3.0 Bushold Input Over-Drive Current to Change State 3.0 Input Current 3.6 VI = 5.5V 10 Control Pins 3.6 VI = 0V or VCC ±1 Data Pins 3.6 VI = 0V –5 VI = VCC 1 (4) 500 (5) –500 V V 2.7 VI = 0.8V V V 2.4 3.0 (3) Typ.(2) IOH = –8mA 2.7 VOL Min. V µA µA µA 0V ≤ VI or VO ≤ 5.5V ±100 µA VO = 0.5V to 3.0V, VI = GND or VCC ±100 µA VO = 0.5V –5 µA 3.6 VO = 3.0V 5 µA 3-STATE Output Leakage Current 3.6 VCC < VO ≤ 5.5V 10 µA ICCH Power Supply Current 3.6 Outputs HIGH 0.19 mA ICCL Power Supply Current 3.6 Outputs LOW 5 mA IOFF Power Off Leakage Current 0 IPU/PD Power up/down 3-STATE Output Current 0–1.5V IOZL 3-STATE Output Leakage Current 3.6 IOZH 3-STATE Output Leakage Current IOZH+ ICCZ Power Supply Current 3.6 Outputs Disabled 0.19 mA ICCZ+ Power Supply Current 3.6 VCC ≤ VO ≤ 5.5V, Outputs Disabled 0.19 mA ∆ICC Increase in Power Supply Current(6) 3.6 One Input at VCC – 0.6V, Other Inputs at VCC or GND 0.2 mA Notes: 2. All typical values are at VCC = 3.3V, TA = 25°C. 3. Applies to bushold versions only (74LVTH240). 4. An external driver must source at least the specified current to switch from LOW-to-HIGH. 5. An external driver must sink at least the specified current to switch from HIGH-to-LOW. 6. This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND. ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 4 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs DC Electrical Characteristics TA = 25°C Conditions Symbol Parameter VCC (V) CL = 50pF, RL = 500Ω VOLP Quiet Output Maximum Dynamic VOL 3.3 (8) VOLV Quiet Output Minimum Dynamic VOL 3.3 (8) Min. Typ. Max. Units 0.8 V –0.8 V Notes: 7. Characterized in SOIC package. Guaranteed parameter, but not tested. 8. Max number of outputs defined as (n). n–1 data inputs are driven 0V to 3V. Output under test held LOW. AC Electrical Characteristics TA = –40°C to +85°C CL = 50pF, RL = 500Ω VCC = 3.3V ±0.3V Symbol tPLH Parameter Min. Propagation Delay, Data to Output tPHL tPZH Output Enable Time tPZL tPHZ Output Disable Time tPLZ tOSHL, tOSLH Typ.(9) Max. VCC = 2.7V Min. Max. Units ns 1.1 3.8 1.1 4.6 1.3 4.0 1.3 4.2 1.1 4.6 1.1 5.6 1.4 4.4 1.4 5.1 2.0 4.5 2.0 4.7 1.8 4.3 1.8 4.3 Output to Output Skew(10) 1.0 ns ns 1.0 ns Notes: 9. All typical values are at VCC = 3.3V, TA = 25°C. 10. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Capacitance(11) Symbol CIN COUT Parameter Conditions Typical Units Input Capacitance VCC = 0V, VI = 0V or VCC 3 pF Output Capacitance VCC = 3.0V, VO = 0V or VCC 6 pF Note: 11. Capacitance is measured at frequency f = 1MHz, per MIL-STD-883, Method 3012. ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 5 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Dynamic Switching Characteristics(7) 13.00 12.60 A 11.43 20 11 B 9.50 10.65 7.60 10.00 7.40 2.25 1 10 0.51 0.35 PIN ONE INDICATOR 0.25 M 0.65 1.27 1.27 C B A LAND PATTERN RECOMMENDATION 2.65 MAX SEE DETAIL A 0.33 0.20 C 0.75 0.25 X 45° SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED (R0.10) GAGE PLANE (R0.10) 0.10 C 0.30 0.10 0.25 8° 0° A) THIS PACKAGE CONFORMS TO JEDEC MS-013, VARIATION AC, ISSUE E B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS. D) CONFORMS TO ASME Y14.5M-1994 1.27 0.40 SEATING PLANE E) LANDPATTERN STANDARD: SOIC127P1030X265-20L (1.40) DETAIL A F) DRAWING FILENAME: MKT-M20BREV3 SCALE: 2:1 Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 6 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Physical Dimensions 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Physical Dimensions (Continued) Figure 2. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 7 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Physical Dimensions (Continued) Figure 3. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 8 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Physical Dimensions (Continued) Figure 4. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 9 ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EZSWITCH™ * ™ PDP-SPM™ Power220® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 FPS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter® * ® SupreMOS™ SyncFET™ ® The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ * EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I33 ©1999 Fairchild Semiconductor Corporation 74LVT240, 74LVTH240 Rev. 1.5.0 www.fairchildsemi.com 10 74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.