CY7C1347D 128K x 36 Synchronous-Pipelined Cache SRAM Features Functional Description • Fast access times: 2.5 and 3.5 ns This Cypress Synchronous Burst SRAM employs high-speed, low-power CMOS designs using advanced triple-layer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high-valued resistors. • Fast clock speed: 250, 225, 200, and 166 MHz • 1.5-ns set-up time and 0.5-ns hold time • Fast OE access times: 2.5 ns and 3.5 ns • Optimal for depth expansion (one cycle chip deselect to eliminate bus contention) • 3.3V –5% and +10% power supply • 3.3V or 2.5V I/O supply • 5V tolerant inputs except I/Os • Clamp diodes to VSS at all inputs and outputs • Common data inputs and data outputs • Byte Write Enable and Global Write control • Three chip enables for depth expansion and address pipeline • Address, data, and control registers • Internally self-timed Write Cycle • Burst control pins (interleaved or linear burst sequence) • Automatic power-down for portable applications • JTAG boundary scan • JEDEC standard pinout • Low profile 119-lead, 14-mm x 22-mm BGA (Ball Grid Array) and 100-pin TQFP packages The CY7C1347D SRAM integrate 131,072 x 36 SRAM cells with advanced synchronous peripheral circuitry and a 2-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE), depth-expansion Chip Enables (CE2 and CE2), Burst Control Inputs (ADSC, ADSP, and ADV), Write Enables (BWa, BWb, BWc, BWd, and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and Burst Mode Control (MODE). The data outputs (Q), enabled by OE, are also asynchronous. Addresses and chip enables are registered with either Address Status Processor (ADSP) or Address Status Controller (ADSC) input pins. Subsequent burst addresses can be internally generated as controlled by the Burst Advance pin (ADV). Address, data inputs, and write controls are registered on-chip to initiate self-timed Write cycle. Write cycles can be one to four bytes wide as controlled by the write control inputs. Individual byte write allows individual byte to be written. BWa controls DQa. BWb controls DQb. BWc controls DQc. BWd controls DQd. BWa, BWb, BWc, and BWd can be active only with BWE being LOW. GW being LOW causes all bytes to be written. Four pins are used to implement JTAG test capabilities: Test Mode Select (TMS), Test Data-in (TDI), Test Clock (TCK), and Test Data-out (TDO). The JTAG circuitry is used to serially shift data to and from the device. JTAG inputs use LVTTL/LVCMOS levels to shift data during this testing mode of operation. The CY7C1347D operates from a +3.3V power supply. All inputs and outputs are LVTTL-compatible Selection Guide CY7C1347D-250 CY7C1347D-225 CY7C1347D-200 CY7C1347D-166 Maximum Access Time (ns) 2.5 2.5 2.5 3.5 Maximum Operating Current (mA) 450 400 360 300 Maximum CMOS Standby Current (mA) 10 10 10 10 Cypress Semiconductor Corporation Document #: 38-05022 Rev. *D • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised March 30, 2004 CY7C1347D Functional Block Diagram—CY7C1347D[1] BYTE a WRITE BWa# BWE# D Q CLK BYTE b WRITE BWb# D Q GW# BYTE c WRITE BWc# D Q BYTE d WRITE ENABLE D CE2 Q D Q byte b write byte a write CE# Q byte c write D byte d write BWd# CE2# OE# Power Down Logic Input Register ADSP# 15 Address Register ADSC# CLR ADV# A1-A0 MODE Binary Counter & Logic OUTPUT REGISTER D Q Output Buffers A 128K x 9 x 4 SRAM Array ZZ DQa,DQb DQc,DQd Note: 1. The functional block diagram illustrates simplified device operation. See Truth Table, pin descriptions and timing diagrams for detailed information. Document #: 38-05022 Rev. *D Page 2 of 21 CY7C1347D Pin Configurations 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE CE2 BWd BWc BWb BWa CE2 VCC VSS CLK GW BWE OE ADSC ADSP ADV A A 100-Pin TQFP Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 CY7C1347D 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 DQb DQb DQb VCCQ VSS DQb DQb DQb DQb VSS VCCQ DQb DQb VSS NC VCC ZZ DQa DQa VCCQ VSS DQa DQa DQa DQa VSS VCCQ DQa DQa DQa MODE A A A A A1 A0 TMS TDI VSS VCC TDO TCK A A A A A A A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 DQc DQc DQc VCCQ VSS DQc DQc DQc DQc VSS VCCQ DQc DQc NC VCC NC VSS DQd DQd VCCQ VSS DQd DQd DQd DQd VSS VCCQ DQd DQd DQd Document #: 38-05022 Rev. *D Page 3 of 21 CY7C1347D Pin Configurations (continued) 119-Ball BGA Top View 1 2 3 4 5 6 7 A VCCQ A A ADSP A A VCCQ B NC CE2 A ADSC A CE2 NC C NC A A VCC A A NC D DQc DQc VSS NC VSS DQb DQb E DQc DQc VSS CE VSS DQb DQb F VCCQ DQc VSS OE VSS DQb VCCQ G DQc DQc BWc ADV BWb DQb DQb H DQc DQc VSS GW VSS DQb DQb J VCCQ VCC NC VCC NC VCC VCCQ K DQd DQd VSS CLK VSS DQa DQa L DQd DQd BWd NC BWa DQa DQa M VCCQ DQd VSS BWE VSS DQa VCCQ N DQd DQd VSS A1 VSS DQa DQa P DQd DQd VSS A0 VSS DQa DQa R NC A MODE VCC NC A NC T NC NC A A A NC ZZ U VCCQ TMS TDI TCK TDO NC VCCQ CY7C1347D Pin Descriptions BGA Pins QFP Pins Name Type Description 4P 4N 2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C, 2R, 6R, 3T, 4T, 5T 37 36 35, 34, 33, 32, 100, 99, 82, 81, 44, 45, 46, 47, 48, 49, 50 A0 A1 A InputSynchronous Addresses: These inputs are registered and must meet the set-up and hold times around the rising edge of CLK. The burst counter generates internal addresses associated with A0 and A1, during burst cycle and wait cycle. 5L 5G 3G 3L 93 94 95 96 BWa BWb BWc BWd InputSynchronous Byte Write: A byte write is LOW for a Write cycle and HIGH for a Read cycle. BWa controls DQa. BWb controls DQb. BWc controls DQc. BWd controls DQd. Data I/O are high impedance if either of these inputs are LOW, conditioned by BWE being LOW. 4M 87 BWE InputSynchronous Write Enable: This active LOW input gates byte write operations and must meet the set-up and hold times around the rising edge of CLK. 4H 88 GW InputSynchronous Global Write: This active LOW input allows a full 36-bit Write to occur independent of the BWE and BWn lines and must meet the set-up and hold times around the rising edge of CLK. 4K 89 CLK InputSynchronous Clock: This signal registers the addresses, data, chip enables, write control and burst control inputs on its rising edge. All synchronous inputs must meet set-up and hold times around the clock’s rising edge. 4E 98 CE InputSynchronous Chip Enable: This active LOW input is used to enable the device and to gate ADSP. 6B 92 CE2 InputSynchronous Chip Enable: This active LOW input is used to enable the device. 2U 38 TMS Input Document #: 38-05022 Rev. *D IEEE 1149.1 test inputs. LVTTL-level inputs. If JTAG feature is not utilized, this pin can be disconnected or connected to VSS. Page 4 of 21 CY7C1347D CY7C1347D Pin Descriptions (continued) BGA Pins QFP Pins Name Type Description 2U 39 TDI Input IEEE 1149.1 test inputs. LVTTL-level inputs. If JTAG feature is not utilized, this pin can be disconnected or connected to VCC. 3U 43 TCK Input IEEE 1149.1 test inputs. LVTTL-level inputs. If JTAG feature is not utilized, this pin can be disconnected or connected to VSS or VCC. 5U 42 TDO Output IEEE 1149.1 test output. LVTTL-level output. If JTAG feature is not utilized, this pin should be disconnected. 1B, 7B, 1C, 7C, 4D, 3J, 5J, 4L, 1R, 5R, 7R, 1T, 2T, 6T, 6U 14, 16, 66 NC – No Connect: These signals are not internally connected. Burst Address Table (MODE = NC/VCC) First Address (external) Second Address (internal) Third Address (internal) A...A00 A...A01 A...A01 A...A00 A...A10 A...A11 A...A11 A...A10 Burst Address Table (MODE = GND) Fourth Address (internal) First Address (external) Second Address (internal) Third Address (internal) Fourth Address (internal) A...A10 A...A11 A...A00 A...A01 A...A10 A...A11 A...A11 A...A10 A...A01 A...A10 A...A11 A...A00 A...A00 A...A01 A...A10 A...A11 A...A00 A...A01 A...A01 A...A00 A...A11 A...A00 A...A01 A...A10 Truth Table [2, 3, 4, 5, 6, 7] Operation Address Used CE Deselected Cycle, Power-down None H X X X L X X X L-H High-Z Deselected Cycle, Power-down None L X L L X X X X L-H High-Z Deselected Cycle, Power-down None L H X L X X X X L-H High-Z Deselected Cycle, Power-down None L X L H L X X X L-H High-Z Deselected Cycle, Power-down CE2 CE2 ADSP ADSC ADV Write OE CLK DQ None L H X H L X X X L-H High-Z Read Cycle, Begin Burst External L L H L X X X L L-H Q Read Cycle, Begin Burst External L L H L X X X H L-H High-Z Write Cycle, Begin Burst External L L H H L X L X L-H D Read Cycle, Begin Burst External L L H H L X H L L-H Q Read Cycle, Begin Burst External L L H H L X H H L-H High-Z Read Cycle, Continue Burst Next X X X H H L H L L-H Q Read Cycle, Continue Burst Next X X X H H L H H L-H High-Z Read Cycle, Continue Burst Next H X X X H L H L L-H Q Read Cycle, Continue Burst Next H X X X H L H H L-H High-Z Write Cycle, Continue Burst Next X X X H H L L X L-H D Write Cycle, Continue Burst Next H X X X H L L X L-H D Read Cycle, Suspend Burst Current X X X H H H H L L-H Q Read Cycle, Suspend Burst Current X X X H H H H H L-H High-Z Notes: 2. X means “Don’t Care.” H means logic HIGH. L means logic LOW. Write = L means [BWE + BWa*BWb*BWc*BWd]*GW equals LOW. Write = H means [BWE + BWa*BWb*BWc*BWd]*GW equals HIGH. BWa enables write to DQa. BWb enables write to DQb. BWc enables write to DQc. BWd enables write to DQd. 3. All inputs except OE must meet set-up and hold times around the rising edge (LOW to HIGH) of CLK. 4. Suspending burst generates wait cycle. 5. For a write operation following a read operation, OE must be HIGH before the input data required set-up time plus High-Z time for OE and staying HIGH throughout the input data hold time. 6. This device contains circuitry that will ensure the outputs will be in High-Z during power-up. 7. ADSP LOW along with chip being selected always initiates a Read cycle at the L-H edge of CLK. A Write cycle can be performed by setting Write LOW for the CLK L-H edge of the subsequent wait cycle. Refer to Write timing diagram for clarification. Document #: 38-05022 Rev. *D Page 5 of 21 CY7C1347D Truth Table (continued)[2, 3, 4, 5, 6, 7] Address Used CE Read Cycle, Suspend Burst Current H X X Read Cycle, Suspend Burst Current H X X Write Cycle, Suspend Burst Current X X X H H H L X L-H D Write Cycle, Suspend Burst Current H X X X H H L X L-H D Operation CE2 CE2 ADSP ADSC ADV Write OE CLK X H H X H H DQ H L L-H Q H H L-H High-Z Partial Truth Table for Read/Write FUNCTION GW BWE BWa BWb BWc BWd Read H H X X X X Read H L H H H H Write one byte H L L H H H Write all bytes H L L L L L Write all bytes L X X X X X IEEE 1149.1 Serial Boundary Scan (JTAG) Overview This device incorporates a serial boundary scan access port (TAP). This port is designed to operate in a manner consistent with IEEE Standard 1149.1-1990 (commonly referred to as JTAG), but does not implement all of the functions required for IEEE 1149.1 compliance. Certain functions have been modified or eliminated because their implementation places extra delays in the critical speed path of the device. Nevertheless, the device supports the standard TAP controller architecture (the TAP controller is the state machine that controls the TAPs operation) and can be expected to function in a manner that does not conflict with the operation of devices with IEEE Standard 1149.1-compliant TAPs. The TAP operates using LVTTL/LVCMOS logic level signaling. Disabling the JTAG Feature It is possible to use this device without using the JTAG feature. To disable the TAP controller without interfering with normal operation of the device, TCK should be tied LOW (VSS) to prevent clocking the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be pulled up to VCC through a resistor. TDO should be left unconnected. Upon power-up the device will come up in a reset state which will not interfere with the operation of the device. Test Access Port (TAP) TCK –Test Clock (INPUT) Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS – Test Mode Select (INPUT) The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. Document #: 38-05022 Rev. *D TDI –Test Data In (INPUT) The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP controller state machine and the instruction that is currently loaded in the TAP instruction register (refer to Figure 1). It is allowable to leave this pin unconnected if it is not used in an application. The pin is pulled up internally, resulting in a logic HIGH level. TDI is connected to the most significant bit (MSB) of any register (see Figure 2). TDO – Test Data Out (OUTPUT) The TDO output pin is used to serially clock data-out from the registers. The output that is active depending on the state of the TAP state machine (refer to Figure 1). Output changes in response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. TDO is connected to the least significant bit (LSB) of any register (see Figure 2). Performing a TAP Reset The TAP circuitry does not have a reset pin (TRST, which is optional in the IEEE 1149.1 specification). A RESET can be performed for the TAP controller by forcing TMS HIGH (VCC) for five rising edges of TCK and pre-loads the instruction register with the IDCODE command. This type of reset does not affect the operation of the system logic. The reset affects test logic only. At power-up, the TAP is reset internally to ensure that TDO is in a High-Z state. Test Access Port (TAP) Registers Overview The various TAP registers are selected (one at a time) via the sequences of ones and zeros input to the TMS pin as the TCK is strobed. Each of the TAPs registers are serial shift registers that capture serial input data on the rising edge of TCK and push serial data out on subsequent falling edge of TCK. When a register is selected, it is connected between the TDI and TDO pins. Page 6 of 21 CY7C1347D Instruction Register The instruction register holds the instructions that are executed by the TAP controller when it is moved into the run test/idle or the various data register states. The instructions are three bits long. The register can be loaded when it is placed between the TDI and TDO pins. The parallel outputs of the instruction register are automatically preloaded with the IDCODE instruction upon power-up or whenever the controller is placed in the test-logic reset state. When the TAP controller is in the Capture-IR state, the two least significant bits of the serial instruction register are loaded with a binary “01” pattern to allow for fault isolation of the board-level serial test data path. Bypass Register The bypass register is a single-bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the device TAP to another device in the scan chain with minimum delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The Boundary scan register is connected to all the input and bidirectional I/O pins (not counting the TAP pins) on the device. This also includes a number of NC pins that are reserved for future needs. There are a total of 70 bits for x36 device and 51 bits for x18 device. The boundary scan register, under the control of the TAP controller, is loaded with the contents of the device I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. The EXTEST, SAMPLE/ PRELOAD and SAMPLE-Z instructions can be used to capture the contents of the I/O ring. The Boundary Scan Order table describes the order in which the bits are connected. The first column defines the bit’s position in the boundary scan register. The MSB of the register is connected to TDI, and LSB is connected to TDO. The second column is the signal name and the third column is the bump number. The third column is the TQFP pin number and the fourth column is the BGA bump number. The TAP on this device may be used to monitor all input and I/O pads, but can not be used to load address, data, or control signals into the device or to preload the I/O buffers. In other words, the device will not perform IEEE 1149.1 EXTEST, INTEST, or the preload portion of the SAMPLE/PRELOAD command. When the TAP controller is placed in Capture-IR state, the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction sets for this device are listed in the following tables. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all 0s. EXTEST is not implemented in this device. The TAP controller does recognize an all-0 instruction. When an EXTEST instruction is loaded into the instruction register, the device responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between two instructions. Unlike SAMPLE/PRELOAD instruction, EXTEST places the device outputs in a High-Z state. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in the instruction upon power-up and at any time the TAP controller is placed in the test-logic reset state. SAMPLE-Z If the High-Z instruction is loaded in the instruction register, all output pins are forced to a High-Z state and the boundary scan register is connected between TDI and TDO pins when the TAP controller is in a Shift-DR state. Identification (ID) Register SAMPLE/PRELOAD The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the instruction register. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the device as described in the Identification Register Definitions table. SAMPLE/PRELOAD is an IEEE 1149.1 mandatory instruction. The PRELOAD portion of the command is not implemented in this device, so the device TAP controller is not fully IEEE 1149.1-compliant. TAP Controller Instruction Set Overview There are two classes of instructions defined in the IEEE Standard 1149.1-1990; the standard (public) instructions and device specific (private) instructions. Some public instructions are mandatory for IEEE 1149.1 compliance. Optional public instructions must be implemented in prescribed ways. Although the TAP controller in this device follows the IEEE 1149.1 conventions, it is not IEEE 1149.1 compliant because some of the mandatory instructions are not fully implemented. Document #: 38-05022 Rev. *D When the SAMPLE/PRELOAD instruction is loaded in the instruction register and the TAP controller is in the Capture-DR state, a snap shot of the data in the device’s input and I/O buffers is loaded into the boundary scan register. Because the device system clock(s) are independent from the TAP clock (TCK), it is possible for the TAP to attempt to capture the input and I/O ring contents while the buffers are in transition (i.e., in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results can not be expected. To guarantee that the boundary scan register will capture the correct value of a signal, the device input signals must be stabilized long enough to meet the TAP controller’s capture setup plus hold time (tCS plus tCH). The device clock input(s) need not be paused for any other TAP operation except capturing the input and I/O ring contents into the boundary scan register. Page 7 of 21 CY7C1347D Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. Because the PRELOAD portion of the command is not implemented in this device, moving the controller to the Update-DR state with the SAMPLE/PRELOAD instruction loaded in the instruction register has the same effect as the Pause-DR command. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP controller is in the Shift-DR state, the bypass register is placed between TDI and TDO. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. Reserved Do not use these instructions. They are reserved for future use. 1 TEST-LOGIC RESET 0 0 REUN-TEST/ IDLE 1 1 SELECT DR-SCAN SELECT IR-SCAN 0 1 0 1 CAPTURE-DR CAPTURE-IR 0 0 0 SHIFT-DR 1 1 EXIT1-DR 1 EXIT1-IR 0 0 PAUSE-DR 0 0 PAUSE-IR 1 1 0 EXIT2-DR EXIT2-IR 1 1 UPDATE-DR 1 0 SHIFT-IR 1 0 1 0 UPDATE-IR 1 0 Figure 1. TAP Controller State Diagram[8] Note: 8. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05022 Rev. *D Page 8 of 21 CY7C1347D 0 Bypass Register Selection Circuitry 2 TDI 1 0 1 0 1 0 Selection Circuitry TDO Instruction Register 31 30 29 . . 2 Identification Register x . . . . 2 Boundary Scan Register [9] TDI TAP Controller TDI Figure 2. TAP Controller Block Diagram TAP DC Electrical Characteristics (20°C < Tj < 110°C; VCC = 3.3V –0.2V and +0.3V unless otherwise noted) Parameter VIH Description Input High (Logic 1) Voltage: Inputs[10, 11] Input High (Logic 1) Voltage: Data[10, 11] VIL Test Conditions Min. Max. Unit VCCQ = 3.3 V 2.0 4.6 V VCCQ = 2.5V 1.7 4.6 V V VCCQ = 3.3 V 2.0 VCCQ + 0.3 VCCQ = 2.5V 1.7 VCCQ + 0.3 Input Low (Logic 0) Voltage: Inputs and VCCQ = 3.3 V Data[10, 11] VCCQ = 2.5V –0.5 0.8 V –0.3 0.7 V ILI Input Leakage Current 0V < VIN < VCC –5.0 5.0 µA ILI TMS and TDI Input Leakage Current 0V < VIN < VCC –30 30 µA ILO Output Leakage Current Output disabled, 0V < VIN < VCCQ –5.0 5.0 µA VOLC LVCMOS Output Low Voltage[10, 12] IOLC = 100 µA 0.2 V VOHC LVCMOS Output High Voltage[10, 12] IOHC = 100 µA VCCQ – 0.2 V Notes: 9. X = 69. 10. All Voltage referenced to VSS (GND). 11. Overshoot: VIH(AC)<VCC+1.5V for t<tKHKH/2, Undershoot: VIL(AC)<–0.5V for t<tKHKH/2, Power-up: VIH<3.6V and VCC<3.135V and VCCQ<1.4V for t<200 ms. During normal operation, VCCQ must not exceed 3.6V. Control input signals (such as R/W, ADV/LD, etc.) may not have pulse widths less than tKHKL (min.). 12. This parameter is sampled. Document #: 38-05022 Rev. *D Page 9 of 21 CY7C1347D TAP DC Electrical Characteristics (20°C < Tj < 110°C; VCC = 3.3V –0.2V and +0.3V unless otherwise noted) (continued) Parameter VOLT VOHT Description LVTTL Output Low Voltage[10] LVTTL Output High Voltage[10] Max. Unit VCC = Min. VCCQ = 3.3 V, IOLT = 8.0 mA Test Conditions Min. 0.4 V VCC = Min. VCCQ = 2.5V, IOLT = 2.0 mA 0.7 V VCC = Min. VCCQ = 2.5V, IOLT = 1.0 mA 0.4 V VCC = Min. VCCQ = 3.3 V, IOH = –4.0 mA 2.4 V VCC = Min, VCCQ = 2.5V, IOH = –2.0 mA 2.0 V TAP AC Switching Characteristics Over the Operating Range[13, 14] Parameter Description Min. Max Unit Clock tTHTH Clock Cycle Time fTF Clock Frequency tTHTL Clock HIGH Time 8 ns tTLTH Clock LOW Time 8 ns tTLQX TCK LOW to TDO Unknown 0 tTLQV TCK LOW to TDO Valid tDVTH TDI Valid to TCK HIGH 5 ns tTHDX TCK HIGH to TDI Invalid 5 ns tMVTH TMS Set-up 5 ns tCS Capture Set-up 5 ns tTHMX TMS Hold 5 ns tCH Capture Hold 5 ns 20 ns 50 MHz Output Times ns 10 ns Set-up Times Hold Times Notes: 13. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 14. Test conditions are specified using the load in TAP AC Test Conditions. Document #: 38-05022 Rev. *D Page 10 of 21 CY7C1347D TAP Timing and Test Conditions ALL INPUT PULSES 3.3V / 2.5V TDO Z0 = 50 Ω 50 Ω 20 pF 1.5V VSS Vt = 1.5V for 3.3V VCCQ or (a) 1.5 ns 1.5 ns VCCQ/2 for 2.5V VCCQ t tTHTH t THTL TLTH TEST CLOCK (TCK) tMVTH tTHMX tDVTH t TEST MODE SELECT (TMS) THDX TEST DATA IN (TDI) t TLQV tTLQX TEST DATA OUT (TDO) Identification Register Definitions Instruction Field 128K x 36 Revision Number (31:28) XXXX Description Reserved for revision number. Device Depth (27:23) 00111 Defines depth of words. Device Width (22:18) 00011 Defines width of bits. Reserved (17:12) Cypress Jedec Id Code (11:1) XXXXXX 00011100100 ID Register Presence Indicator (0) 1 Reserved for future use. Allows unique identification of DEVICE vendor. Indicates the presence of an ID register. Scan Register Sizes Register Name Instruction Bit Size (x36) 3 Bypass 1 ID 32 Boundary Scan 51 Document #: 38-05022 Rev. *D Page 11 of 21 CY7C1347D Instruction Codes Code Description EXTEST Instruction 000 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all device outputs to High-Z state. This instruction is not IEEE 1149.1-compliant. IDCODE 001 Preloads ID register with vendor ID code and places it between TDI and TDO. This instruction does not affect device operations. SAMPLE-Z 010 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all device outputs to High-Z state. RESERVED 011 Do not use these instructions; they are reserved for future use. SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. This instruction does not affect device operations. This instruction does not implement IEEE 1149.1 PRELOAD function and is therefore not 1149.1-compliant. RESERVED 101 Do not use these instructions; they are reserved for future use. RESERVED 110 Do not use these instructions; they are reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This instruction does not affect device operations. Boundary Scan Order Boundary Scan Order (continued) Bit# Signal Name TQFP Bump ID Bit# Signal Name TQFP Bump ID 1 A 44 2R 2 A 45 3T 30 ADSP 84 4A 31 ADSC 85 4B 3 A 46 4T 4 A 47 5T 32 OE 86 64F 33 BWE 87 4M 5 A 48 6R 34 6 A 49 3B 35 GW 88 4H CLK 89 4K 7 A 50 5B 36 CE2 92 6B 8 DQa 51 6P 37 BWa 93 5L 9 DQa 52 7N 38 BWb 94 5G 10 DQa 53 6M 39 BWc 95 3G 11 DQa 56 7L 40 BWd 96 3L 12 DQa 57 6K 41 CE2 97 2B 13 DQa 58 7P 42 CE 98 4E 14 DQa 59 6N 43 A 99 3A 15 DQa 62 6L 44 A 100 2A 16 DQa 63 7K 45 DQc 1 2D 17 ZZ 64 7T 46 DQc 2 1E 18 DQb 68 6H 47 DQc 3 2F 19 DQb 69 7G 48 DQc 6 1G 20 DQb 72 6F 49 DQc 7 2H 21 DQb 73 7E 50 DQc 8 1D 22 DQb 74 6D 51 DQc 9 2E 23 DQb 75 7H 52 DQc 12 2G 24 DQb 78 6G 53 DQc 13 1H 25 DQb 79 6E 54 NC 14 5R 26 DQb 80 7D 55 DQd 18 2K 27 A 81 6A 56 DQd 19 1L 28 A 82 5A 57 DQd 22 2M 29 ADV 83 4G 58 DQd 23 1N Document #: 38-05022 Rev. *D Page 12 of 21 CY7C1347D Boundary Scan Order (continued) Bit# Signal Name TQFP Bump ID 59 DQd 24 2P 60 DQd 25 1K 61 DQd 28 2L 62 DQd 29 2N 63 DQd 30 1P 64 MODE 31 3R 65 A 32 2C 66 A 33 3C 67 A 34 5C 68 A 35 6C 69 A1 36 4N 70 A0 37 4P Document #: 38-05022 Rev. *D Page 13 of 21 CY7C1347D Maximum Ratings Power Dissipation.......................................................... 1.0W Short Circuit Output Current ........................................ 50 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Operating Range Voltage on VCC Supply Relative to VSS ......... –0.5V to +4.6V VIN ...........................................................–0.5V to VCC+0.5V Range Storage Temperature (plastic) ...................... –55°C to +150° Ambient Temperature[15] VCC 0°C to +70°C 3.3V −5%/+10% Com’l Junction Temperature ..................................................+150° Electrical Characteristics Over the Operating Range Parameter VIH Min. Max. Unit Input High (Logic 1) Voltage: Inputs[10, 11] Description VCCQ = 3.3 V Test Conditions 2.0 4.6 V VCCQ = 2.5V 1.7 4.6 V Input High (Logic 1) Voltage: Data[10, 11] VCCQ = 3.3 V 2.0 VCCQ + 0.3 V VCCQ = 2.5V 1.7 VCCQ + 0.3 VIL Input Low (Logic 0) Voltage: Inputs VCCQ = 3.3 V and Data[10, 11] VCCQ = 2.5V –0.5 0.8 –0.3 0.7 V ILI Input Leakage Current 0V < VIN < VCC –5 5 µA ILI MODE and ZZ Input Leakage Current[17] 0V < VIN < VCC –30 30 µA 5 µA ILO Output Leakage Current Output(s) disabled, 0V < VOUT < VCC –5 VOH Output High Voltage[10] VCC = Min, VCCQ = 3.3 V, IOH = –4.0 mA 2.4 VCC = Min, VCCQ = 2.5V, IOH = –2.0 mA 2.0 VOL Output Low Voltage[10] Supply VCCQ I/O Supply Voltage[10] Parameter Description V V VCC = Min, VCCQ = 3.3V, IOL = 8.0 mA 0.4 V VCC = Min, VCCQ = 2.5V, IOH = 2.0 mA 0.7 V VCC = Min, VCCQ = 2.5V, IOH = 1.0 mA 0.4 V Voltage[10] VCC V 3.135 3.6 V 3.3 V Range 3.135 3.6 V 2.5 V Range 2.375 2.9 V Conditions Typ. -4 -4.4 -5 -6 Unit 150 450 400 360 300 mA CMOS Standby[19, 20] Device deselected; VCC = Max.; all inputs < VSS + 0.2 or >VCC – 0.2; all inputs static; CLK frequency = 0 5 10 10 10 10 mA ISB3 TTL Standby[19, 20] Device deselected; all inputs < VIL or > VIH; all inputs static; VCC = Max.; CLK frequency = 0 10 20 20 20 20 mA ISB4 Clock Running[19, 20] Device deselected; all inputs < VIL or > VIH; VCC = Max.; CLK cycle time > tKC min. 40 140 125 110 90 mA ICC Power Supply Current: Device selected; all inputs < VILor > VIH; Operating[18, 19, 20] cycle time > tKC min.; VCC = Max.; outputs open ISB2 Notes: 15. TA is the case temperature. 16. Overshoot: VIH ≤ +6.0V for t ≤ tKC /2. Undershoot:VIL ≤ –2.0V for t ≤ tKC /2. 17. Output loading is specified with CL = 5 pF as in AC Test Loads. 18. ICC is given with no output current. ICC increases with greater output loading and faster cycle times. 19. “Device Deselected” means the device is in Power-Down mode as defined in the truth table. “Device Selected” means the device is active. 20. Typical values are measured at 3.3V, 25°C, and 20-ns cycle time. Document #: 38-05022 Rev. *D Page 14 of 21 CY7C1347D Capacitance[12] Parameter Description Test Conditions CI Input Capacitance CO Input/Output Capacitance (DQ) Typ. TA = 25°C, f = 1 MHz, VCC = 3.3V Max. Unit 5 7 pF 7 8 pF Thermal Resistance Parameter Description ΘJA Test Conditions TQFP Typ. BGA Typ. Unit 25 50 °C/W 9 8 °C/W Thermal Resistance (Junction to Ambient) Still Air, soldered on a 4.25 x 1.125 inch, 4-layer PCB Thermal Resistance (Junction to Case) ΘJC AC Test Loads and Waveforms[21] 317Ω / 225Ω 3.3V / 2.5V DQ DQ Z0 =50Ω 50Ω 5 pF 351Ω / 225Ω V = 1.5Vfor 3.3V VCCQ or VCCQ/2 for 2.5V VCCQ t (a) ALL INPUT PULSES 3.3V / 2.5V 0V 10% 90% 10% 90% ≤ 1.5 ns ≤ 1.5 ns (c) (b) Switching Characteristics Over the Operating Range[22] 250 MHz Parameter Description Min. Max. 225 MHz Min. Max. 200 MHz Min. Max. 166 MHz Min. Max. Unit Clock tKC Clock Cycle Time 4.0 4.4 5.0 6.0 ns tKH Clock HIGH Time 1.6 1.7 2.0 2.4 ns tKL Clock LOW Time 1.6 1.7 2.0 2.4 ns Output Times tKQ Clock to Output Valid tKQX Clock to Output Invalid tKQLZ Clock to Output in Low-Z[12, 17, 23] tKQHZ Clock to Output in High-Z[12, 17, 23] tOEQ OE to Output Valid[24] Low-Z[12, 17, 23] tOELZ OE to Output in tOEHZ OE to Output in High-Z[12, 17, 23] 2.4 2.5 3.0 3.5 ns 1.25 1.25 1.25 1.25 ns 0 0 0 0 ns 1.25 3.0 1.25 2.5 0 3.0 1.25 2.5 0 2.5 3.0 1.25 2.5 0 2.5 4.0 ns 3.5 ns 3.5 ns 0 2.5 ns Set-up Times tS Address, Controls, and Data In[25] 1.5 1.5 1.5 1.5 ns Address, Controls, and Data In[25] 0.5 0.5 0.5 0.5 ns Hold Times tH Notes: 21. Overshoot: VIH(AC) < VDD + 1.5V for t < tTCYC/2; undershoot: VIL(AC) < 0.5V for t < tTCYC/2; power-up: VIH < 2.6V and VDD < 2.4V and VDDQ < 1.4V for t < 200 ms. 22. Test conditions as specified with the output loading as shown in part (a) of AC Test Loads unless otherwise noted. 23. At any given temperature and voltage condition, tKQHZ is less than tKQLZ and tOEHZ is less than tOELZ. 24. OE is a “Don’t Care” when a byte write enable is sampled LOW. 25. This is a synchronous device. All synchronous inputs must meet specified set-up and hold time, except for “don’t care” as defined in the truth table. Document #: 38-05022 Rev. *D Page 15 of 21 CY7C1347D Typical Output Buffer Characteristics Output High Voltage Pull-Up Current Output Low Voltage Pull-Down Current IOL (mA) Min. IOL(mA) Max. 0 0 VOH (V) IOH (mA) Min. IOH (mA) Max. VOL (V) –0.5 –38 –105 –0.5 0 –38 –105 0 0 0 0.8 –38 –105 0.4 10 20 1.25 –26 –83 0.8 20 40 1.5 –20 –70 1.25 31 63 2.3 0 –30 1.6 40 80 2.7 0 –10 2.8 40 80 2.9 0 0 3.2 40 80 3.4 0 0 3.4 40 80 Switching Waveforms Read Timing[26, 27] tKC tKL CLK tKH tS ADSP# tH ADSC# tS ADDRESS BWa#, BWb#, BWc#, BWd#, BWE#, GW# A1 A2 tH tS CE# tS ADV# tH OE# DQ tKQLZ tKQ tOELZ Q(A1) tOEQ tKQ Q(A2) Q(A2+1) SINGLE READ Q(A2+2) Q(A2+3) Q(A2) Q(A2+1) BURST READ Notes: 26. CE active in this timing diagram means that all chip enables CE, CE2, and CE2 are active. 27. For X18 product, there are only BWa and BWb for byte write control. Document #: 38-05022 Rev. *D Page 16 of 21 CY7C1347D Switching Waveforms (continued) Write Timing[26, 27] CLK tS ADSP# tH ADSC# tS A1 ADDRESS A2 A3 tH BWa#, BWb#, BWc#, BWd#, BWE#, GW# GW# CE# tS ADV# tH OE# tKQX DQ Q tOEHZ D(A1) SINGLE WRITE Document #: 38-05022 Rev. *D D(A2) D(A2+1) D(A2+1) D(A2+2) BURST WRITE D(A2+3) D(A3) D(A3+1) D(A3+2) BURST WRITE Page 17 of 21 CY7C1347D Switching Waveforms (continued) Read/Write Timing[26, 27] CLK tS ADSP# tH ADSC# tS ADDRESS A1 A2 BWa#, BWb#, BWc#, BWd#, BWE#, GW# A3 A4 A5 tH CE# ADV# OE# DQ Q(A1) Q(A2) Single Reads D(A3) Single Write Q(A4) Q(A4+1) Q(A4+2) D(A5) Burst Read D(A5+1) Burst Write Ordering Information Speed (MHz) Ordering Code Package Name Package Type Operating Range A101 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack Commercial 250 CY7C1347D-250AC CY7C1347D-250BGC BG119 119-Lead FBGA (14 x 22 x 2.4 mm) 225 CY7C1347D-225BGC BG119 119-Lead FBGA (14 x 22 x 2.4 mm) 200 CY7C1347D-200AC A101 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 166 CY7C1347D-166AC A101 100-Lead 14 x 20 x 1.4 mm Thin Quad Flat Pack Document #: 38-05022 Rev. *D Page 18 of 21 CY7C1347D Package Diagrams 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101 51-85050-*A Document #: 38-05022 Rev. *D Page 19 of 21 CY7C1347D Package Diagrams (continued) 119-Lead FBGA (14 x 22 x 2.4 mm) BG119 51-85115-*B All product and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-05022 Rev. *D Page 20 of 21 © Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY7C1347D Document History Page Document Title: CY7C1347D: 128K x 36 Synchronous-Pipelined Cache SRAM Document Number: 38-05022 Rev. ECN No. Issue Date Orig. of Change ** 106740 05/07/01 RCS New Data Sheet *A 107485 06/06/01 RCS Added Minimum and Maximum values for 2.5V VCCQ and all other subsequent parameters. Defined alternate options for non-utilized JTAG pins. Description of Change *B 121064 11/13/02 DSG Updated package drawing 51-85115 (BG119) to rev. *B *C 122474 01/18/03 RBI Added power up requirements to AC test loads and waveforms information *D 212291 See ECN VBL Corrected Ordering Info section : delete 166BGA, 200BGA, 225AC Document #: 38-05022 Rev. *D Page 21 of 21