LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA62B-3/YG-3P DATA SHEET DOC. NO : QW0905-LA62B-3/YG-3P REV. : A DATE : 01 - Mar - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 PART NO. LA62B-3/YG-3P Package Dimensions 1.3±0.5 7.0 6.35 2.9 7.37 5.08 □0.5 TYP 3.5±0.5 2.54TYP 5.4±0.5 2.54TYP 2 1 G 3 Y 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE YELLOW 1 2 3 + - + LYG2692 2.9 3.1 3.3 4.3 6.45±0.5 1.5 MAX □0.5 TYP G Y 18.0MIN 1 2 1 2 3 3 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE YELLOW 2.0MIN 2.0MIN 2.54TYP 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LA62B-3/YG-3P Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Symbol Parameter UNIT Y G Forward Current IF 20 30 mA Peak Forward Current Duty 1/10@10KHz IFP 80 120 mA Power Dissipation PD 60 100 mW Reverse Current @5V Ir 10 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from Body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted Lens GaAsP/GaP Yellow LA62B-3/YG-3P Forward Peak Spectral voltage wave halfwidth length △λ nm @20mA(V) λPnm Luminous intensity @10mA(mcd) Min. Max. Min. Typ. Viewing angle 2θ 1/2 (deg) 585 35 1.7 2.6 8.0 17 50 565 30 1.7 2.6 12 26 50 White Diffused GaP Green Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 PART NO. LA62B-3/YG-3P Typical Electro-Optical Characteristics Curve Y CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 1000 Forward Current(mA) Forward Voltage(V) -40 100 700 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LA62B-3/YG-3P Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature(℃) Ambient Temperature(℃) Relative Intensity@20mA 1000 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA62B-3/YG-3P Page 5/6 Recommended Soldering Conditions 1. Wave Solder Soldering Soldering Iron:30W Max Temperature 300¢XC Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Temp(¢XC) 245¢XC 5sec Max 245 ¢X 120¢X Preheat 2¢X/sec max 2¢X/sec max 2¢X/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120¢XC Max Preheat time: 120 seconds Max Ramp-up:2¢XC/sec(max) Ramp-Down:2¢XC/sec(max) Solder Bath:245¢XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) 2. PB-Free Wave Solder Soldering Soldering Iron:30W Max Temperature:350 ¢XCMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) Temp(¢XC) 265¢XC 5sec Max 265¢X 120¢X Preheat 2¢X/sec max 2¢X/sec max 2¢X/sec max Time(sec) 120 Seconds Max Dip Soldering Preheat: 120¢XC Max Preheat time: 120seconds Max Ramp-up:2¢XC/sec(max) Ramp-Down:2¢XC/sec(max) Solder Bath:265¢XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA62B-3/YG-3P Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 PACKING SPECIFICATION PART NO. LA62B-3/YG-3P 1.500 PCS / BAG 2. 10 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s g k s kg H