ESMT M13S64322A

ESMT
M13S64322A
Preliminary
Revision History
Revision 0.5 (May 03, 2007)
- Delete BGA ball name of packing dimensions
Revision 0.4 (May 14,2002)
- Change AC Parameters
Revision
Rev. 0.3
Rev. 0.4
Version
-4
-5
-4
-5
tRC
13 tCK
11 tCK
14 tCK
12 tCK
tRP
4 tCK
3 tCK
20 ns
20 ns
Revision 0.3 (December 13,2001)
- The Max / Min value of D, D1, E, E1 (LQFP 100L PKG outline dimension) are added.
Revision 0.2 (Agu 31,2001)
- Changed DC Current
Revision
Rev. 0.1
Rev. 0.2
Version
-4
-5
-4
-5
IDD4R
330
-
385
-
IDD5
305
260
350
285
Revision
IDD6
Rev. 0.1
CKE ≦0.2
Rev. 0.2
CKE≦0.2, tCK =∞
2.5mA
CKE≦0.2, tCK = tCK (min)
7mA
2.5mA
- Added 144 Ball FBGA Pin arrangement.
- Added BGA 144B Package Outline.
Revision 0.1 (April 11,2001)
- Original
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
1/49
ESMT
M13S64322A
Preliminary
DDR SDRAM
512K x 32 Bit x 4 Banks
Double Data Rate
Synchronous DRAM
Features
z
JEDEC Standard
z
Internal pipelined double-data-rate architecture, two data access per clock cycle
z
Bidirectional data strobe(DQS)
z
On-chip DLL
z
Differential clock inputs (CLK and CLK )
z
DLL aligns DQ and DQS transition with CLK transition
z
Quad bank operation
z
CAS Latency : 2, 3, 4
z
Burst Type : Sequential and Interleave
z
Burst Length : 2, 4, 8
z
All inputs except data & DM are sampled at the rising edge of the system clock(CLK)
z
Data I/O transitions on both edges of data strobe (DQS)
z
DQS is edge-aligned with data for reads; center-aligned with data for WRITE
z
DM0~DM3 for write masking only
z
VDD = 2.5V ± 5%, VDDQ = 2.5V ± 5%
z
Auto & Self refresh
z
15.6us refresh interval (2K / 32ms refresh)
z
1 DQS for QFP (4 DQS for FBGA)
z
SSTL-2 I/O interface
z
100pin LQFP or QFP package (optional FBGA package, 144 balls, 0.5mm ball size, 0.8mm pitch)
Operating Frequencies:
CAS
Latency
3
Maximum Operating Frequency
-4
-5
250MHz
200MHz
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
2/49
ESMT
M13S64322A
Preliminary
CLK
CLK
CKE
N. C
A8/AP
55
54
53
52
51
DQ11
DM 3
VDD
64
DM 1
VSS
65
56
VDDQ
66
VREF
DQ12
67
58
DQ13
68
57
VSSQ
69
DQ 8
DQ14
70
VDDQ
DQ15
71
59
VDDQ
72
DQ 9
DQ24
73
61
DQ25
74
60
VSSQ
75
DQ10
DQ26
76
VSSQ
DQ27
77
62
VDDQ
78
63
DQ28
80
79
Pin Arrangement
DQ29
VSSQ
DQ30
81
50
A7
82
49
48
A6
DQ31
84
A4
VSS
VDDQ
85
86
47
46
45
N. C
87
N. C
88
N. C
89
N. C
90
N. C
VSSQ
91
92
RF U
83
100 Pin LQFP
Forward Type
20 x 14 mm
0.65 mmpin Pitch
A5
VSS
44
A9
N. C
43
N. C
42
N. C
N. C
41
29
30
BA1
26
CAS
BA0
25
WE
28
24
DM 2
CS
23
DM 0
27
22
VDDQ
RAS
20
21
DQ23
19
VSSQ
DQ22
18
17
DQ20
DQ21
16
VSS
14
VDDQ
15
13
DQ19
VDD
12
DQ18
11
A0
VSSQ
31
10
100
DQ17
A1
DQ 2
9
32
DQ16
99
8
A2
VSSQ
VDDQ
33
7
A3
98
DQ 7
34
DQ 1
6
35
97
DQ 6
96
5
VDD
DQ 0
A10
VDD
VSSQ
36
4
N. C
95
DQ 5
37
3
94
DQ 4
N. C
DQS
VDDQ
1
38
2
93
DQ 3
N. C
VDDQ
40
39
N. C
144 Ball FBGA
1
2
3
4
5
6
7
8
9
10
A
DQS0
DM0
VSSQ
DQ3
DQ2
DQ0
DQ31
DQ29
DQ28
VSSQ
11
DM3
DQS3
B
DQ4
VDDQ
NC
VDDQ
DQ1
VDDQ
VDDQ
DQ30
VDDQ
NC
VDDQ
DQ27
C
DQ6
DQ5
VSSQ
VSSQ
VSSQ
VDD
VDD
VSSQ
VSSQ
VSSQ
DQ26
DQ25
D
DQ7
VDDQ
VDD
VSS
VSSQ
VSS
VSS
VSSQ
VSS
VDD
VDDQ
DQ24
E
DQ17
DQ16
VDDQ
VSSQ
VSS
VSS
Thermal
Thermal
VSS
Thermal
VSS
Thermal
VSSQ
VDDQ
DQ15
DQ14
F
DQ19
DQ18
VDDQ
VSSQ
VSS
Thermal
VSS
Thermal
VSSQ
VDDQ
DQ13
DQ12
VSS
Thermal
VSS
Thermal
VSSQ
NC
DM1
DQS1
VSS
Thermal
VSSQ
VDDQ
DQ11
DQ10
G
DQS2
DM2
NC
VSSQ
VSS
VSS
Thermal
Thermal
VSS
VSS
Thermal
Thermal
VSS
VSS
12
H
DQ21
DQ20
VDDQ
VSSQ
Thermal
Thermal
VSS
Thermal
J
DQ22
DQ23
VDDQ
VSSQ
VSS
VSS
VSS
VSS
VSSQ
VDDQ
DQ9
DQ8
K
CAS
WE
VDD
VSS
A10
VDD
VDD
NC
VSS
VDD
NC
NC
L
RAS
NC
NC
BA1
A2
NC
A9
A5
NC
CLK
CLK
NC
M
CS
NC
BA0
A0
A1
A3
A4
A6
A7
A8/AP
CKE
VREF
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
3/49
ESMT
M13S64322A
Preliminary
Pin Description
(M13S64322A)
Pin Name
A0~A10,
BA0,BA1
DQ0~DQ31
Function
Pin Name
Function
Address inputs
-Row address
A0~A10
-Column address A0~A7
A8/AP : AUTO Precharge
BA0, BA1 : Bank selects (4 Banks)
DM0~DM3
DQ Mask enable in write cycle
Data-in/Data-out
CLK, CLK
Clock input
RAS
Row address strobe
CAS
Column address strobe
WE
Write enable
VDDQ
Supply Voltage for DQ
VSS
Ground
VSSQ
Ground for DQ
VDD
Power (=2.5V)
VREF
Reference Voltage for SSTL-2
DQS
Bi-directional Data Strobe (LQFP)
NC
No connection
DQS0~DQS3
Bi-directional Data Strobe (FBGA)
Elite Semiconductor Memory Technology Inc.
CKE
CS
Clock enable
Chip select
Publication Date : May. 2007
Revision : 0.5
4/49
ESMT
M13S64322A
Preliminary
Absolute Maximum Rating
Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD supply relative to VSS
VDD, VDDQ
-1.0 ~ 3.6
V
Voltage on VDDQ supply relative to VSS
VDDQ
-0.5 ~ 3.6
V
Storage temperature
TSTG
-55 ~ +150
°C
Power dissipation
PD
1
W
Short circuit current
IOS
50
mA
Note :
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommend operation condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC Operation Condition & Specifications
DC Operation Condition
Recommended operating conditions (Voltage reference to VSS = 0V, TA = 0 to 70 °C )
Parameter
Symbol
Min
Max
Unit
Supply voltage
VDD
2.375
2.625
V
I/O Supply voltage
VDDQ
2.375
2.625
V
I/O Reference voltage
VREF
0.49*VDDQ
0.51*VDDQ
V
1
I/O Termination voltage (system)
VTT
VREF - 0.04
VREF + 0.04
V
2
Input logic high voltage
VIH (DC)
VREF + 0.15
VDDQ + 0.3
V
Input logic low voltage
VIL (DC)
-0.3
VREF - 0.15
V
Input Voltage Level, CLK and CLK inputs
VIN (DC)
-0.3
VDDQ + 0.3
V
Input Differential Voltage, CLK and CLK inputs
VID (DC)
0.36
VDDQ + 0.6
V
II
-5
5
μA
Output leakage current
IOZ
-5
5
μA
Output High Voltage (IOH=-15.2mA))
VOH
VTT+0.76
Output Low Voltage (IOL=+15.2mA)
VOL
Input leakage current
Note
3
V
VTT-0.76
V
Notes 1. VREF is expected to be equal to 0.5* VDDQ of the transmitting device, and to track variations in the DC level of the same.
Peak-to-peak noise on VREF may not exceed 2% of the DC value.
2. VTT is not applied directly to the device. VTT is system supply for signal termination resistors, is expected to be set equal
to VREF, and must track variations in the DC level of VREF .
3. VID is the magnitude of the difference between the input level on CLK and the input level on CLK .
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
5/49
ESMT
M13S64322A
Preliminary
DC Specifications
Parameter
Symbol
Version
Test Condition
-4
-5
Unit Note
Operation Current
(One Bank Active)
IDD0
tRC = tRC (min), tCK = tCK (min)
Active - Precharge
205
175
mA
Operation Current
(One Bank Active)
IDD1
Burst = 2, tRC = tRC (min), CL=3, IOUT = 0mA,
Active-Read-Precharge
265
225
mA
Precharge Power-down Standby
Current
IDD2P
CKE ≤ VIL(max), tCK = tCK (min), All banks idle
35
35
mA
Idle Standby Current
IDD2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = tCK
(min)
155
135
mA
Active Power-down Standby
Current
IDD3P
All banks ACT, CKE ≤ VIL(max), tCK = tCK (min)
55
55
mA
Active Standby Current
IDD3N
One bank; Active-Precharge, tRC = tRAS(max),
tCK = tCK (min)
155
135
mA
Operation Current (Read)
IDD4R
Burst=2, CL=3, tCK = tCK (min), IOUT = 0mA
385
330
mA
Operation Current (Write)
IDD4W
Burst=2, CL=3, tCK = tCK (min)
370
330
mA
tRC (min)
350
285
mA
CKE ≤ 0.2V, tCK = ∞
2.5
2.5
7
7
Auto Refresh Current
IDD5
Self Refresh Current
IDD6
mA
CKE ≤ 0.2V, tCK = tCK (min)
1
Note 1. Enable on-chip refresh and address counters.
AC Operation Conditions & Timing Specification
AC Operation Conditions
Parameter
Symbol
Min
Input High (Logic 1) Voltage, DQ, DQS and DM signals
VIH(AC)
VREF + 0.35
Input Low (Logic 0) Voltage, DQ, DQS and DM signals
VIL(AC)
Input Different Voltage, CLK and CLK inputs
VID(AC)
Input Crossing Point Voltage, CLK and CLK inputs
VIX(AC)
Max
Unit
Note
V
VREF - 0.35
V
0.7
VDDQ+0.6
V
1
0.5*VDDQ-0.2
0.5*VDDQ+0.2
V
2
Note: 1. VID is the magnitude of the difference between the input level on CLK and the input on CLK .
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the
same.
Input / Output Capacitance
(VDD = 2.5V±5%, VDDQ =2.5V±5%, TA = 25 °C , f = 1MHz)
Parameter
Symbol
Min
Max
Unit
CIN1
2.5
3.5
pF
Input capacitance (CLK, CLK )
CIN2
2.5
3.5
pF
Data & DQS input/output capacitance (DQ0~DQ31)
COUT
4.0
5.5
pF
Input capacitance (DM0~DM3)
CIN3
4.0
5.5
pF
Input capacitance
(A0~A10, BA0~BA1, CKE, CS , RAS , CAS , WE )
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
6/49
ESMT
M13S64322A
Preliminary
AC Operating Test Conditions
Parameter
Value
Unit
0.5*VDDQ
V
Input signal maximum peak swing
1.5
V
Input signal minimum slew rate
1.0
V/ns
VREF+0.35/VREF-0.35
V
Input timing measurement reference level
VREF
V
Output timing reference level
VTT
V
Input reference voltage for clock (VREF)
Input levels (VIH/VIL)
AC Timing Parameter & Specifications
(VDD = 2.5V±5%, VDDQ=2.5V±5%, TA =0 °C to 70 °C )(Note)
Parameter
Clock Period (CL3)
Symbol
tCK
(CL4)
-4
-5
MIN
MAX
MIN
MAX
4
10
5
10
ns
-
-
-
-
ns
Access time from CLK/ CLK
tAC
-0.5
0.5
-0.75
0.75
ns
CLK high-level width
tCH
0.45
0.55
0.45
0.55
tCK
CLK low-level width
tCL
0.45
0.55
0.45
0.55
tCK
Data strobe edge to clock edge
tDQSCK
-0.5
0.5
-0.75
0.75
ns
Clock to first rising edge of DQS delay
tDQSS
0.75
1.25
0.75
1.25
tCK
Data-in setup time (to DQS)
tDS
0.4
0.4
ns
Data-in hold time (to DQS)
tDH
0.4
0.4
ns
DM setup time (to DQS)
tDQMS
0.4
0.4
ns
DM hold time (to DQS)
tDQMH
0.4
0.4
ns
Input setup time
tIS
0.75
1.1
ns
Input hold time
tIH
0.75
1.1
ns
DQS input high pulse width
tDQSH
0.4
0.6
0.4
0.6
tCK
DQS input low pulse width
tDQSL
0.4
0.6
0.4
0.6
tCK
Clock to DQS write preamble setup time
tWPRES
0
0.5
0
0.5
tCK
Clock to DQS write preamble hold time
tWPREH
0.25
1.25
0.25
1.25
tCK
Write postamble
tWPST
0.25
Data strobe edge to output data edge
tDQSQ
-0.35
Half Clock Period
tHP
tCLmin or
tCHmin
tCLmin or
tCHmin
ns
DQ-DQS output hold time
tQH
tHP-0.35
tHP-0.5
ns
tHZ
-0.5
0.5
-0.75
0.75
ns
tLZ
-0.5
0.5
-0.75
0.75
ns
Data-out high-impedance windows from
CLK/ CLK
Data-out low-impedance windows from
CLK/ CLK
Elite Semiconductor Memory Technology Inc.
0.25
0.35
tCK
-0.5
0.5
ns
Publication Date : May. 2007
Revision : 0.5
7/49
ESMT
M13S64322A
Preliminary
AC Timing Parameter & Specifications-continued
Parameter
Symbol
-4
-5
MIN
MAX
MIN
MAX
120,000
8tCK
120,000
ACTIVE to PRECHARGE command
tRAS
9tCK
AUTO REFRESH, ACTIVE command
period
tRC
14tCK
12tCK
ns
RAS to CAS delay for Read
tRCDRD
4tCK
3tCK
ns
RAS to CAS delay for Write
tRCDWR
2tCK
2tCK
ns
PRECHARGE command period
tRP
20
20
ns
ACTIVE bank A to ACTIVE bank B
command
tRRD
3
3
tCK
Write recovery time
tWR
2
2
tCK
Write data in to Read command delay
tWTR
1
1
tCK
Load Mode Register / Extended Mode
register cycle time
tLMRD
1
1
tCK
DQS read preamble
tRPRE
0.9
1.1
0.9
1.1
tCK
DQS read postamble
tRPST
0.4
0.6
0.4
0.6
tCK
DQS valid window
tDQSV
0.35
Power down entry time
tPDENT
tIS+1 tCK
tIS+2 tCK
tIS+1 tCK
tIS+2 tCK
ns
Power down exit time
tPDEX
tIS+1 tCK
tIS+2 tCK
tIS+1 tCK
tIS+2 tCK
ns
Exit self refresh to READ command
tXSR
200
200
tCK
Exit self refresh to non-READ command
tXSA
12
12
tCK
Average periodic refresh interval
tREFI
Elite Semiconductor Memory Technology Inc.
0.35
15.6
ns
tCK
15.6
us
Publication Date : May. 2007
Revision : 0.5
8/49
ESMT
M13S64322A
Preliminary
Command Truth Table
COMMAND
CKEn-1 CKEn CS
RAS
CAS
WE
DM
BA0,1
A8/AP
A10~A9,
A7~A0
Note
Register
Extended MRS
H
X
L
L
L
L
X
OP CODE
1,2
Register
Mode Register Set
H
X
L
L
L
L
X
OP CODE
1,2
L
L
L
H
X
X
L
H
H
H
H
X
X
X
X
X
Auto Refresh
Refresh
Entry
Self
Refresh
Read &
Column
Address
Auto Precharge Disable
Write &
Column
Address
Auto Precharge Disable
H
3
L
H
H
X
L
L
H
H
X
V
H
X
L
H
L
H
X
V
H
L
H
X
L
H
L
L
X
V
Auto Precharge Enable
Bank Selection
All Banks
Active Power Down
H
H
X
L
H
H
L
X
H
X
L
L
H
L
X
H
X
X
X
L
V
V
V
Entry
H
L
Exit
L
H
Entry
H
L
Precharge Power Down
Mode
Exit
L
DM
H
No Operation Command
H
H
X
X
X
X
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
X
X
H
X
X
X
L
H
H
H
X
3
3
Row Address
L
Auto Precharge Enable
Burst Stop
3
L
Exit
Bank Active & Row Addr.
Precharge
H
Column
Address
(A0~A7)
Column
Address
(A0~A7)
X
V
L
X
H
4
4
4
4,6
7
X
5
X
X
X
X
X
V
X
X
X
8
(V = Valid, X = Don’t Care, H = Logic High, L = Logic Low)
1. OP Code: Operand Code. A0~A10 & BA0~BA1: Program keys. (@EMRS/MRS)
2. EMRS/MRS can be issued only at all banks precharge state.
A new command can be issued 1 clock cycles after EMRS or MRS.
3. Auto refresh functions are same as the CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by “Auto”..
Auto/self refresh can be issued only at all banks precharge state.
4. BA0~BA1 : Bank select addresses.
If both BA0 and BA1 are “Low” at read, write, row active and precharge, bank A is selected.
If BA0 is “High” and BA1 is “Low” at read, write, row active and precharge, bank B is selected.
If BA0 is “Low” and BA1 is “High” at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are “High” at read, write, row active and precharge, bank D is selected.
5. If A8/AP is “High” at row precharge, BA0 and BA1 are ignored and all banks are selected.
6. During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after end of burst.
7. Burst stop command is valid at every burst length.
8. DM sampling at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
9/49
ESMT
M13S64322A
Preliminary
Basic Functionality
Power-Up and Initialization Sequence
The following sequence is required for POWER UP and Initialization.
1. Apply power and attempt to maintain CKE at a low state (all other inputs may be undefined.)
- Apply VDD before or at the same time as VDDQ.
- Apply VDDQ before or at the same time as VTT & VREF).
2. Start clock and maintain stable condition for a minimun of 200us.
3. The minimun of 200us after stable power and clock (CLK, CLK ), apply NOP & take CKE high.
*1
*1
*2
4. Issue precharge commands for all banks of the device.
5. Issue EMRS to enable DLL.
6. Issue a mode register set command for “DLL reset”. The additional 200 cycles of clock input is required to lock the DLL.
7. Issue precharge commands for all banks of the device.
8. Issue 2 or more auto-refresh commands.
9. Issue a mode register set command with low to A8 to initialize device operation.
*1 Every “DLL enable” command resets DLL. Therefore sequence 6 can be skipped during power up. Instead of it, the additional
200 cycles of clock input is required to lock the DLL after enabling DLL.
*2 Sequence of 6 & 7 is regardless of the order.
P o we r u p & I n i t i a l i z a t i o n S e q u e n c e
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
CLK
tRP
Command
p re c ha rg e
A ll B ank s
tRC
tRP
E MRS
MRS
D ll Reset
p r e c ha r g e
A ll B a nks
1st A uto
Re f re s h
tRC
2nd A uto
Re f re s h
Mode
Register Set
Any
C omma nd
min . 200 Cy cl e
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
10/49
ESMT
M13S64322A
Preliminary
Mode Register Definition
Mode Register Set (MRS)
The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency,
addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for variety
of different applications. The default value of the register is not defined, therefore the mode register must be written after EMRS
setting for proper DDR SDRAM operation. The mode register is written by asserting low on CS , RAS , CAS , WE , BA0 and
BA1 (The DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the mode register). The state of
address pins A0~A10 in the same cycle as CS , RAS , CAS , WE , BA0 and BA1 going low is written in the mode register. One
clock cycles are requested to complete the write operation in the mode register. The mode register contents can be changed using
the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is
divided into various fields depending on functionality. The burst length uses A0~A2, addressing mode uses A3, CAS latency (read
latency from column address) uses A4~A6. A7~A10 specify operating mode. A7 must be set to low for normal MRS operation.
Refer to the table for specific codes for various burst length, addressing modes and CAS latencies.
BA1
BA0
A10
A9
A8
A7
0
0
0
0
DLL
TM
A6
A5
A4
CAS Latency
A3
BT
A2
A1
A0
Address Bus
Mode Register
Burst Length
A8
DLL Reset
A7
Mode
A3
Burst Type
0
No
0
Normal
0
Sequential
1
Yes
1
Test
1
Interleave
Burst Length
CAS Latency
BA1 BA0
0
0
0
1
Operating Mode
MRS Cycle
EMRS Cycle
A6
0
0
0
0
1
1
1
1
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A5
0
0
1
1
0
0
1
1
A4
0
1
0
1
0
1
0
1
Latency
Reserve
Reserve
2
3
4
Reserve
Reserve
Reserve
A2
A1
A0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Latency
Sequential Interleave
Reserve
Reserve
2
2
4
4
8
8
Reserve
Reserve
Reserve
Reserve
Reserve
Reserve
Reserve
Reserve
Publication Date : May. 2007
Revision : 0.5
11/49
ESMT
M13S64322A
Preliminary
Burst Address Ordering for Burst Length
Burst
Length
Starting
Address (A2, A1,A0)
xx0
xx1
x00
x01
x10
x11
000
001
010
011
100
101
110
111
2
4
8
Sequential Mode
Interleave Mode
0, 1
1, 0
0, 1, 2, 3
1, 2, 3, 0
2, 3, 0, 1
3, 0, 1, 2
0, 1, 2, 3, 4, 5, 6, 7
1, 2, 3, 4, 5, 6, 7, 0
2, 3, 4, 5, 6, 7, 0, 1
3, 4, 5, 6, 7, 0, 1, 2
4, 5, 6, 7, 0, 1, 2, 3
5, 6, 7, 0, 1, 2, 3, 4
6, 7, 0, 1, 2, 3, 4, 5
7, 0, 1, 2, 3, 4, 5, 6
0, 1
1, 0
0, 1, 2, 3
1, 0, 3, 2
2, 3, 0, 1
3, 2, 1, 0
0, 1, 2, 3, 4, 5, 6, 7
1, 0, 3, 2, 5, 4, 7, 6
2, 3, 0, 1, 6, 7, 4, 5
3, 2, 1, 0, 7, 6, 5, 4
4, 5, 6, 7, 0, 1, 2, 3
5, 4, 7, 6, 1, 0, 3, 2
6, 7, 4, 5, 2, 3, 0, 1
7, 6, 5, 4, 3, 2, 1, 0
DLL Enable / Disable
The DLL must be enabled for normal operation. DLL enable is required during power-up initialization, and upon returning to
normal operation after having disabled the DLL for the purpose of debug or evaluation (upon exiting Self Refresh Mode, the DLL is
enable automatically). Any time the DLL is enabled, 200 clock cycles must occur before a READ command can be issued.
Output Drive Strength
The normal drive strength for all outputs is specified to be SSTL_2, Class II. M13S64322A also support the option of weak drive
strength or match mode drive strength, intended for lighter load and/or point-to-point environments.
Mode Register Set
0
1
2
3
4
5
6
7
8
CLK
CLK
*1
Mod e
Register Set
Precharg e
Al l Ba n k s
COMMAND
tCK
An y
Com m an d
t R P* 2
*1 : MRS can be issued only at all banks precharge state.
*2 : Minimum tRP is required to issue MRS command.
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ESMT
M13S64322A
Preliminary
Extended Mode Register Set (EMRS)
The extended mode register stores the data enabling or disabling DLL. The default value of the extended mode register is not
defined, therefore the extended mode register must be written after power up for enabling or disabling DLL. The extended mode
register is written by asserting low on CS , RAS , CAS , WE and high on BA0 (The DDR SDRAM should be in all bank
precharge with CKE already high prior to writing into the extended mode register). The state of address pins A0, A2~A5, A7~A10
and BA1 in the same cycle as CS , RAS , CAS and WE going low are written in the extended mode register. A1 and A6 are
used for setting driver strength to weak or matched impedance. The mode register contents can be changed using the same
command and clock cycle requirements during operation as long as all banks are in the idle state. A0 is used for DLL enable or
disable. “High” on BA0 is used for EMRS. All the other address pins except A0, A1, A6 and BA0 must be set to low for proper
EMRS operation. Refer to the table for specific codes.
BA1
BA0
0
1
A10
A9
A8
A7
RFU: Must be set “0”
BA1
BA0
Operating Mode
0
0
MRS Cycle
0
1
EMRS Cycle
A6
D.I.C
A5
A4
A3
A2
RFU: Must be set “0”
A1
A0
D.I.C
DLL
Address Bus
Extended Mode Register
A6
A1
Output Driver Impedance Control
A0
DLL Enable
0
0
Normal
0
Enable
0
1
Weak
1
Disable
1
0
RFU
1
1
Matched Impedance 60Ω
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Publication Date : May. 2007
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ESMT
Preliminary
M13S64322A
Precharge
The precharge command is used to precharge or close a bank that has activated. The precharge command is issued when CS ,
RAS and WE are low and CAS is high at the rising edge of the clock. The precharge command can be used to precharge
each bank respectively or all banks simultaneously. The bank select addresses (BA0, BA1) are used to define which bank is
precharged when the command is initiated. For write cycle, tWR(min.) must be satisfied until the precharge command can be issued.
After tRP from the precharge, an active command to the same bank can be initiated.
Burst Selection for Precharge by Bank address bits
A8/AP
BA1
BA0
Precharge
0
0
0
Bank A Only
0
0
1
Bank B Only
0
1
0
Bank C Only
0
1
1
Bank D Only
1
X
X
All Banks
NOP & Device Deselect
The device should be deselected by deactivating the CS signal. In this mode DDR SDRAM should ignore all the control inputs.
The DDR SDRAMs are put in NOP mode when CS is active and by deactivating RAS , CAS and WE . For both Deselect and
NOP the device should finish the current operation when this command is issued.
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ESMT
M13S64322A
Preliminary
Row Active
The Bank Activation command is issued by holding CAS and WE high with CS and RAS low at the rising edge of the
clock(CLK). The DDR SDRAM has four independent banks, so two Bank Select addresses (BA0, BA1) are required. The Bank
Activation command to the first read or write command must meet or exceed the minimum of RAS to CAS delay time (tRCD min).
Once a bank has been activated, it must be precharged before another Bank Activation command can be applied to the same bank.
The minimum time interval between interleaved Bank Activation command (Bank A to Bank B and vice versa) is the Bank to Bank
delay time(tRRD min).
Bank Activation Command Cycle ( CAS Latency = 2)
0
1
2
CLK
CLK
Addr ess
Ban k A
Ro w Ad d r .
Ban k A
Col. Add r .
RAS-CAS d el ay (tRCD)
Command
Ban k A
Activate
NOP
Write A
wi th Au t o
Precharg e
Ban k A
Ro w . Ad d r .
Bank B
Ro w Ad d r .
RAS-RAS d el ay (tRRD)
Bank B
Act ivat e
NOP
Bank A
Act ivat e
ROW Cycle Time (tRC)
: Don't Care
Read Bank
This command is used after the row activate command to initiate the burst read of data. The read command is initiated by
activating CS , CAS , and deasserting WE at the same clock sampling (rising) edge as described in the command truth table.
The length of the burst and the CAS latency time will be determined by the values programmed during the MRS command.
Write Bank
This command is used after the row activate command to initiate the burst write of data. The write command is initiated by
activating CS , CAS , and WE at the same clock sampling (rising) edge as describe in the command truth table. The length of
the burst will be determined by the values programmed during the MRS command.
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ESMT
M13S64322A
Preliminary
Essential Functionality for DDR SDRAM
Burst Read Operation
Burst Read operation in DDR SDRAM is in the same manner as the current SDRAM such that the Burst read command is
issued by asserting CS and CAS low while holding RAS and WE high at the rising edge of the clock (CLK) after tRCD from
the bank activation. The address inputs (A0~A7) determine the starting address for the Burst, The Mode Register sets type of burst
(Sequential or interleave) and burst length (2, 4, 8). The first output data is available after the CAS Latency from the READ
command, and the consecutive data are presented on the falling and rising edge of Data Strobe (DQS) adopted by DDR SDRAM
until the burst length is completed.
<Burst Length = 4, CAS Latency = 2, 3, 4>
0
1
2
3
4
5
6
7
8
CLK
CLK
CO MMAND
READ A
NOP
DQS
NOP
tRPRE
NOP
NO P
NO P
NOP
NOP
NOP
tRPST
CAS Latency= 2
DQ's
Dout 0 Dout 1 Dout 2 Dout 3
DQS
CAS Latency= 3
DQ's
Dout 0 Dout 1 Dout 2 Dout 3
DQS
CAS Latency= 4
DQ's
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Dout 0 Dout 1 Dout 2 Dout 3
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ESMT
M13S64322A
Preliminary
Burst Write Operation
The Burst Write command is issued by having CS , CAS and WE low while holding RAS high at the rising edge of the
clock (CLK). The address inputs determine the starting column address. There is no write latency relative to DQS required for burst
write cycle. The first data of a burst write cycle must be applied on the DQ pins tDS (Data-in setup time) prior to data strobe edge
enabled after tDQSS from the rising edge of the clock (CLK) that the write command is issued. The remaining data inputs must be
supplied on each subsequent falling and rising edge of Data Strobe until the burst length is completed. When the burst has been
finished, any additional data supplied to the DQ pins will be ignored.
<Burst Length = 4>
0
1
2
3
4
5
6
7
8
CLK
CLK
COMM AND
NOP
W RITE
NOP
NO P
tDQSS
NOP
NO P
NO P
NOP
NOP
tW PST
DQ S
tWPRES
DQ's
Din0
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Din1
Din2
Din3
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ESMT
M13S64322A
Preliminary
Read Interrupted by a Read
A Burst Read can be interrupted before completion of the burst by new Read command of any bank. When the previous burst is
interrupted, the remaining addresses are overridden by the new address with the full burst length. The data from the first Read
command continues to appear on the outputs until the CAS latency from the interrupting Read command is satisfied. At this point
the data from the interrupting Read command appears. Read to Read interval is minimum 1 Clock.
<Burst Length = 4, CAS Latency = 3>
0
1
2
3
4
5
6
7
8
CLK
CLK
COMMAND
READ A
READ B
NOP
NO P
NOP
NOP
NOP
NOP
NOP
DQS
CAS Latency= 3
Dou t A 0 Dou t A 1 Dou t B 0 Dou t B 1 Dou t B 2 Dou t B 3
DQ's
Read Interrupted by a Write & Burst Stop
To interrupt a burst read with a write command, Burst Stop command must be asserted to avoid data contention on the I/O bus
by placing the DQ’s (Output drivers) in a high impedance state. To insure the DQ’s are tri-stated one cycle before the beginning the
write operation, Burt stop command must be applied at least CAS Latency clock cycles before the Write command.
<Burst Length = 4, CAS Latency = 3>
0
1
2
3
4
5
6
7
8
CLK
CLK
COMMAND
READ
Bu r st S t op
NOP
NO P
W RITE
NO P
NOP
NOP
NOP
DQS
CAS Latency= 3
DQ's
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Dou t 0 Dou t 1
Din 0
Din 1 Din 2
Din 3
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ESMT
M13S64322A
Preliminary
Read Interrupted by a Precharge
A Burst Read operation can be interrupted by precharge of the same bank. The minimum 1 clock is required for the read to
precharge intervals. A precharge command to output disable latency is equivalent to the CAS latency.
<Burst Length = 8, CAS Latency = 3>
0
1
2
3
4
5
6
7
8
CLK
CLK
1tCK
COMMAND
READ
Prech arg e
NOP
NOP
NO P
NO P
NOP
NOP
NOP
DQS
CAS Latency= 3
DQ's
Dou t 0 Dou t 1 Dou t 2 Dou t 3 Dou t 4 Dou t 5 Dou t 6 Dou t 7
Int err upt ed by precharg e
When a burst Read command is issued to a DDR SDRAM, a Precharge command may be issued to the same bank before the
Read burst is complete. The following functionality determines when a Precharge command may be given during a Read burst and
when a new Bank Activate command may be issued to the same bank.
1. For the earliest possible Precharge command without interrupting a Read burst, the Precharge command may be given on the
rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency. A new Bank
Activate command may be issued to the same bank after tRP (RAS precharge time).
2. When a Precharge command interrupts a Read burst operation, the Precharge command may be given on the rising clock edge
which is CL clock cycles before the last data from the interrupted Read burst where CL is the CAS Latency. Once the last
data word has been output, the output buffers are tristated. A new Bank Activate command may be issued to the same bank
after tRP.
3. For a Read with autoprecharge command, a new Bank Activate command may be issued to the same bank after tRP where tRP
begins on the rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency.
During Read with autoprecharge, the initiation of the internal precharge occurs at the same time as the earliest possible
external Precharge command would initiate a precharge operation without interrupting the Read burst as described in 1 above.
In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge time] has been
satisfied. This includes Read with autoprecharge commands where tRAS(min) must still be satisfied such that a Read with
autoprecharge command has the same timing as a Read command followed by the earliest possible Precharge command which
does not interrupt the burst.
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ESMT
M13S64322A
Preliminary
Write Interrupted by a Write
A Burst Write can be interrupted before completion of the burst by a new Write command, with the only restriction that the
interval that separates the commands must be at least one clock cycle. When the previous burst is interrupted, the remaining
addresses are overridden by the new address and data will be written into the device until the programmed burst length is satisfied.
<Burst Length = 4>
0
1
2
3
4
5
6
7
8
CLK
CLK
1tCK
COMM AND
NO P
WRITE A
NO P
NO P
WRITE B
NO P
NO P
NOP
NOP
DQ S
DQ's
Din A 0
Din A 1
Din B 0
Din B 1
Din B 2
Din B 3
The following functionality establishes how a Write command may interrupt a Read burst.
1. For Write commands interrupting a Read burst, a Read burst, a Burst Terminate command is required to stop the read burst and
tristate the DQ bus prior to valid input write data. Once the Burst Terminate command has been issued, the minimum delay to a
Write command = CAS Latency clock cycles.
2. It is illegal for a Write command to interrupt a Read with autoprecharge command.
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ESMT
M13S64322A
Preliminary
Write Interrupted by a Read & DM
A burst write can be interrupted by a read command of any bank. The DQ’s must be in the high impedance state at least one
clock cycle before the interrupting read data appear on the outputs to avoid data contention. When the read command is registered,
any residual data from the burst write cycle must be masked by DM. The delay from the last data to read command (tWTR) is
required to avoid the data contention DRAM inside. Data that are presented on the DQ pins before the read command is initiated
will actually be written to the memory. Read command interrupting write can not be issued at the next clock edge of that of write
command.
<Burst Length = 8, CAS Latency = 3>
0
1
2
3
4
5
6
7
8
CLK
CLK
COMMAND
NOP
W RITE
NO P
NOP
Read
NOP
NOP
NOP
NOP
tWTR
tDQSSmax
DQS
tWPRES
CAS Latency= 3
Din 0 Din 1 Din 2 Din 3 Din 4 Din 5 Din 6 Din 7
DQ's
tDQSSmin
Dou t 0 Dou t 1
tWTR
DQS
tWPRES
CAS Latency= 3
DQ's
Din 0 Din 1 Din 2
Din 3 Din 4 Din 5 Din 6 Din 7
Dou t 0 Dou t 1
DM
The following functionality established how a Read command may interrupt a Write burst and which input data is not written into
the memory.
1. For Read commands interrupting a Write burst, the minimum Write to Read command delay is 2 clock cycles. The case where
the Write to Read delay is 1 clock cycle is disallowed.
2. For read commands interrupting a Write burst, the DM pin must be used to mask the input data words which immediately
precede the interrupting Read operation and the input data word which immediately follows the interrupting Read operation.
3. For all cases of a Read interrupting a Write, the DQ and DQS buses must be released by the driving chip (i.e., the memory
controller) in time to allow the buses to turn around before the DDR SDRAM drives them during a read operation.
4. If input Write data is masked by the Read command, the DQS inputs is ignored by the DDR SDRAM.
5. It is illegal for a Read command interrupt a Write with autoprecharge command.
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ESMT
M13S64322A
Preliminary
Write Interrupted by a Precharge & DM
A burst write operation can be interrupted before completion of the burst by a precharge of the same bank. Random column
access is allowed. A write recovery time(tWR) is required from the last data to precharge command. When precharge command is
asserted, any residual data from the burst write cycle must be masked by DM.
<Burst Length = 8>
0
1
2
3
4
5
6
7
8
CLK
CLK
COMMAND
NOP
WRITE A
NOP
NOP
NOP
NOP
Precharge
WRITE B
NOP
tDQSSmax
DQS
tWR
Di n a 0 D i n a 1 Di n a 2 D i n a 3Di n a 4 Di n a 5 D i n a 6 Di n a 7
DQ's
Dinb0
tDQSSmin
DQS
tWR
DQ's
Dina0 Dina1 Dina2 Dina3 Dina4 Dina5 Dina6 Dina7
Dinb0 Dinb1
DM
Precharge timing for Write operations in DRAMs requires enough time to allow “Write recovery” which is the time required by a
DRAM core to properly store a full “0” or “1” level before a Precharge operation. For DDR SDRAM, a timing parameter, tWR, is used
to indicate the required of time between the last valid write operation and a Precharge command to the same bank.
The precharge timing for writes is a complex definition since the write data is sampled by the data strobe and the address is
sampled by the input clock. Inside the DDR SDRAM, the data path is eventually synchronizes with the address path by switching
clock domains from the data strobe clock domain to the input clock domain.
This makes the definition of when a precharge operation can be initiated after a write very complex since the write recovery
parameter must reference only the clock domain that is used to time the internal write operation i.e., the input clock domain.
tWR starts on the rising clock edge after the last possible DQS edge that strobed in the last valid and ends on the rising clock
edge that strobes in the precharge command.
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ESMT
M13S64322A
Preliminary
1. For the earliest possible Precharge command following a Write burst without interrupting the burst, the minimum time for write
recovery is defined by tWR.
2. When a precharge command interrupts a Write burst operation, the data mask pin, DQ, is used to mask input data during the
time between the last valid write data and the rising clock edge in which the Precharge command is given. During this time, the
DQS input is still required to strobe in the state of DM.
The minimum time for write recovery is defined by tWR.
3. For a Write with autoprecharge command, a new Bank Activate command may be issued to the same bank after tWR + tRP where
tWR + tRP starts on the falling DQS edge that strobed in the last valid data and ends on the rising clock edge that strobes in the
Bank Activate commands. During write with autoprecharge, the initiation of the internal precharge occurs at the same time as
the earliest possible external Precharge command without interrupting the Write burst as described in 1 above.
4. In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge time] has been
satisfied. This includes Write with autoprecharge commands where tRAS(min) must still be satisfied such that a Write with
autoprecharge command has the same timing as a Write command followed by the earliest possible Precharge command
which does not interrupt the burst.
Burst Stop
The burst stop command is initiated by having RAS and CAS high with CS and WE low at the rising edge of the clock
(CLK). The burst stop command has the fewest restriction making it the easiest method to use when terminating a burst read
operation before it has been completed. When the burst stop command is issued during a burst read cycle, the pair of data and
DQS (Data Strobe) go to a high impedance state after a delay which is equal to the CAS latency set in the mode register. The
burst stop command, however, is not supported during a write burst operation.
<Burst Length = 4, CAS Latency = 2, 3, 4 >
0
1
2
3
4
5
6
7
8
CLK
CLK
COMMAND
READ A
Burst Stop
NOP
NOP
NOP
NOP
NO P
NOP
NO P
DQS
CAS Latency= 2
The burst ends after a delay equal to the CAS latency.
DQ's
Dout 0 Dout 1
DQS
CAS Latency= 3
DQ's
Dout 0 Dout 1
DQS
CAS Latency= 4
DQ's
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ESMT
M13S64322A
Preliminary
The Burst Stop command is a mandatory feature for DDR SDRAMs. The following functionality is required.
1.
2.
3.
4.
5.
6.
The BST command may only be issued on the rising edge of the input clock, CLK.
BST is only a valid command during Read burst.
BST during a Write burst is undefined and shall not be used.
BST applies to all burst lengths.
BST is an undefined command during Read with autoprecharge and shall not be used.
When terminating a burst Read command, the BST command must be issued LBST ( “BST Latency”) clock cycles before the
clock edge at which the output buffers are tristated, where LBST equals the CAS latency for read operations.
7. When the burst terminates, the DQ and DQS pins are tristated.
The BST command is not byte controllable and applies to all bits in the DQ data word and the(all) DQS pin(s).
DM masking
The DDR SDRAM has a data mask function that can be used in conjunction with data write cycle. Not read cycle. When the
data mask is activated (DM high) during write operation, DDR SDRAM does not accept the corresponding data. (DM to data-mask
latency is zero) DM must be issued at the rising or falling edge of data strobe.
<Burst Length = 8>
0
1
2
3
4
5
6
7
8
CLK
CLK
CO MM AND
DQS
DQ's
W RITE
NOP
NOP
NOP
NOP
Din 4 Din 5
Din 6 Din 7
NOP
NOP
NOP
NOP
tDQSS
Din 0
Din 1
Din 2
Din 3
DM
masked by DM = H
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ESMT
M13S64322A
Preliminary
Read With Auto Precharge
If a read with auto-precharge command is initiated, the DDR SDRAM automatically enters the precharge operation BL/2 clock
later from a read with auto-precharge command when tRAS(min) is satisfied. If not, the start point of precharge operation will be
delayed until tRAS(min) is satisfied. Once the precharge operation has started the bank cannot be reactivated and the new
command can not be asserted until the precharge time (tRP) has been satisfied
<Burst Length = 4, CAS Latency = 2, 3, 4>
CLK
0
1
2
3
4
5
6
7
8
CLK
COMMAND
Ban k A
ACTIVE
Re a d A
Auto Pr ec har g e
NOP
NO P
NO P
NOP
NOP
NOP
NOP
tRAS( min. )
DQS
CAS Latency= 2
Dout 0 Dout 1 Dout 2 Dout 3
DQ's
tRP
Bank can b e react ivated at t h e
comp letion of p rech arg e
DQS
CAS Latency= 3
Dout 0 Dout 1 Dout 2 Dout 3
DQ's
DQS
RAS Latency= 4
Dout 0 Dout 1 Dout 2 Dout 3
DQ's
Begin Auto-Prech arg e
At burst read / write with auto precharge, CAS interrupt of the same bank is illegal.
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
25/49
ESMT
M13S64322A
Preliminary
Write with Auto Precharge
If A8 is high when write command is issued, the write with auto-precharge function is performed. Any new command to the same
bank should not be issued until the internal precharge is completed. The internal precharge begins after keeping tWR(min).
<Burst Length = 4>
0
1
2
3
4
5
6
7
8
CLK
CLK
COMM AND
Ban k A
ACTIVE
W r i te A
Auto Pr ec har g e
NO P
NOP
NO P
NO P
NO P
NOP
NOP
DQ S
*B an k c an be reac t ivat ed at
com p let ion of t RP
Dout 0 Dout 1 Dout 2 Dout 3
DQ's
tWR
tRP
In te rn al p re ch ar g e s tar t
Auto Refresh & Self Refresh
Auto Refresh
An auto refresh command is issued by having CS , RAS and CAS held low with CKE and WE high at the rising edge of
the clock (CLK). All banks must be precharged and idle for tRP(min) before the auto refresh command is applied. No control of the
external address pins is requires once this cycle has started because of the internal address counter. When the refresh cycle has
completed, all banks will be in the idle state. A delay between the auto refresh command and the next activate command or
subsequent auto refresh command must be greater than or equal to the tRC(min).
CLK
CLK
COMMAND
Au t o
Ref resh
PR E
CMD
CKE = High
tRP
Elite Semiconductor Memory Technology Inc.
tRC
Publication Date : May. 2007
Revision : 0.5
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ESMT
M13S64322A
Preliminary
Self Refresh
A self refresh command is defines by having CS , RAS , CAS and CKE held low with WE high at the rising edge of the
clock (CLK). Once the self refresh command is initiated, CKE must be held low to keep the device in self refresh mode. During the
self refresh operation, all inputs except CKE are ignored. The clock is internally disabled during self refresh operation to reduce
power consumption. The self refresh is exited by supplying stable clock input before returning CKE high, asserting deselect or NOP
command and then asserting CKE high for longer than tXSR for locking of DLL.
CLK
CLK
COMMAND
Sel f
Ref resh
Au t o
Ref resh
Rea d
CKE
tXSA
tXSR
Power down
The power down mode is entered when CKE is low and exited when CKE is high. Once the power down mode is initiated, all of
the receiver circuits except clock, CKE and DLL circuit tree are gated off to reduce power consumption. All the banks should be in
idle state prior to entering the precharge power down mode and CKE should be set high at least 1tCK+1tIS prior to row active remain
command. During power down, refresh operations cannot be performed, therefore the device cannot remain in power down mode
longer than the refresh period (tREFI) of the device.
CLK
CLK
CO MM AN D
Precharge
Prec harge
power
d ow n
Ent ry
Pr ec harge
power
d ow n
Exit
Active
Act i ve
power
d ow n
Entry
Act ive
power
down
Exit
Rea d
CKE
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
27/49
ESMT
M13S64322A
Preliminary
Functional Truth Table.
Current
IDLE
ROW ACTIVE
Address
Command
Action
CS
RAS
CAS
WE
H
X
X
X
X
DESEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
BA
Burst Stop
ILLEGAL*2
L
H
L
X
BA, CA, A8
READ / WRITE
ILLEGAL*2
L
L
H
H
BA, RA
Active
Bank Active, Latch RA
L
L
H
L
BA, A8
PRE / PREA
NOP*4
L
L
L
H
X
Refresh
AUTO-Refresh*5
L
L
L
L
Op-Code Mode-Add
MRS
Mode Register Set*5
H
X
X
X
X
DESEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
BA
Burst Stop
NOP
L
H
L
H
BA, CA, A8
READ / READA
Begin Read, Latch CA,
Determine Auto -precharge
L
H
L
L
BA, CA, A8
WRITE / WRITEA
Begin Write, Latch CA,
Determine Auto -precharge
L
L
H
H
BA, RA
Active
Bank Active/ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
Precharge/Precharge All
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
H
X
X
X
X
DESEL
NOP (Continue Burst to END)
L
H
H
H
X
NOP
NOP (Continue Burst to END)
L
H
H
L
BA
Burst Stop
Terminate Burst
L
H
L
H
BA, CA, A8
READ / READA
Terminate Burst, Latch CA,
Begin New Read, Determine
Auto-Precharge*3
L
H
L
L
BA, CA, A8
WRITE / WRITEA
ILLEGAL
L
L
H
H
BA, RA
Active
Bank Active/ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
Terminate Burst, Precharge
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
READ
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Publication Date : May. 2007
Revision : 0.5
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ESMT
Current State
WRITE
READ with
AUTO
PRECHARGE
READ
M13S64322A
Preliminary
Address
Command
Action
CS
RAS
CAS
WE
H
X
X
X
X
DESEL
NOP (Continue Burst to end)
L
H
H
H
X
NOP
NOP (Continue Burst to end)
L
H
H
L
BA
Burst Stop
ILLEGAL
L
H
L
H
BA, CA, A8
READ/READA
Terminate Burst With DM=High,
Latch CA, Begin Read, Determine
Auto-Precharge*3
L
H
L
L
BA, CA, A8
WRITE/WRITEA
Terminate Burst, Latch CA,
Begin new Write, Determine
Auto-Precharge*3
L
L
H
H
BA, RA
Active
Bank Active/ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
Terminal Burst With DM= High,
Precharge
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
H
X
X
X
X
DESEL
NOP (Continue Burst to end)
L
H
H
H
X
NOP
NOP (Continue Burst to end)
L
H
H
L
BA
Burst Stop
ILLEGAL
L
H
L
H
BA, CA, A8
READ
READ*7
L
H
L
L
BA, CA, A8
WRITE
ILLEGAL
L
L
H
H
BA, RA
Active
Bank Active/ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
ILLEGAL*2
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
H
X
X
X
X
DESEL
NOP (Continue Burst to END)
L
H
H
H
X
NOP
NOP (Continue Burst to END)
L
H
H
L
BA
Burst Stop
ILLEGAL
L
H
L
H
BA, CA, A8
READ
ILLEGAL
L
H
L
L
BA, CA, A8
WRITE
Write
L
L
H
H
BA, RA
Active
Bank Active/ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
ILLEGAL*2
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
29/49
ESMT
Current State
PRE-CHARGIN
G
ROW
ACTIVATING
WRITE
RECOVERING
M13S64322A
Preliminary
Address
Command
Action
CS
RAS
CAS
WE
H
X
X
X
X
DESEL
NOP (Idle after tRP)
L
H
H
H
X
NOP
NOP (Idle after tRP)
L
H
H
L
BA
Burst Stop
ILLEGAL*2
L
H
L
X
BA, CA, A8
READ/WRITE
ILLEGAL*2
L
L
H
H
BA, RA
Active
ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
NOP*4 (Idle after tRP)
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
H
X
X
X
X
DESEL
NOP (ROW Active after tRCD)
L
H
H
H
X
NOP
NOP (ROW Active after tRCD)
L
H
H
L
BA
Burst Stop
ILLEGAL*2
L
H
L
X
BA, CA, A8
READ / WRITE
ILLEGAL*2
L
L
H
H
BA, RA
Active
ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
ILLEGAL*2
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
H
X
X
X
X
DESEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
BA
Burst Stop
ILLEGAL*2
L
H
L
H
BA, CA, A8
READ
ILLEGAL*2
L
H
L
L
BA, CA, A8
WRITE
WRITE
L
L
H
H
BA, RA
Active
ILLEGAL*2
L
L
H
L
BA, A8
PRE / PREA
ILLEGAL*2
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
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ESMT
Current State
RE-FRESHING
MODE
REGISTER
SETTING
Preliminary
Address
M13S64322A
Command
Action
CS
RAS
CAS
WE
H
X
X
X
X
DESEL
NOP (Idle after tRP)
L
H
H
H
X
NOP
NOP (Idle after tRP)
L
H
H
L
BA
Burst Stop
ILLEGAL
L
H
L
X
BA, CA, A8
READ/WRITE
ILLEGAL
L
L
H
H
BA, RA
Active
ILLEGAL
L
L
H
L
BA, A8
PRE / PREA
ILLEGAL
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
H
X
X
X
X
DESEL
NOP (Idle after tRP)
L
H
H
H
X
NOP
NOP (Idle after tRP)
L
H
H
L
BA
Burst Stop
ILLEGAL
L
H
L
X
BA, CA, A8
READ / WRITE
ILLEGAL
L
L
H
H
BA, RA
Active
ILLEGAL
L
L
H
L
BA, A8
PRE / PREA
ILLEGAL
L
L
L
H
X
Refresh
ILLEGAL
L
L
L
L
Op-Code Mode-Add
MRS
ILLEGAL
ABBREVIATIONS :
H = High Level, L = Low level, V = Valid, X = Don’t Care
BA = Bank Address, RA =Row Address, CA = Column Address, NOP = No Operation
Note :
1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of the
bank.
3. Must satisfy bus contention, bus turn around and write recovery requirements.
4. NOP to bank precharging or in idle state. May precharge bank indicated by BA.
5. ILLEGAL of any bank is not idle.
6. Same bank’s previous auto precharg will not be performed. But if the bank is different, previous auto precharge will be
performed.
7. Refer to “Read with Auto Precharge: for more detailed information.
ILLEGAL = Device operation and / or data integrity are not guaranteed.
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
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ESMT
Current State
SELF-REFRESHING*
1
POWER DOWN
ALL BANKS IDLE*2
M13S64322A
Preliminary
CKE
n-1
CKE
n
CS
RAS
CAS
WE
Add
H
X
X
X
X
X
X
INVALID
L
H
H
X
X
X
X
Exit Self-Refresh
L
H
L
H
H
H
X
Exit Self-Refresh
L
H
L
H
H
L
X
ILLEGAL
L
H
L
H
L
X
X
ILLEGAL
L
H
L
L
X
X
X
ILLEGAL
L
L
X
X
X
X
H
X
X
X
X
X
X
INVALID
L
H
X
X
X
X
X
Exit Power Down (Idle after tPDEX)
L
L
X
X
X
X
X
NOP (Maintain Power Down)
H
H
X
X
X
X
X
Refer to Function True Table
H
L
L
L
L
H
X
Enter Self-Refresh
H
L
H
X
X
X
X
Exit Power Down
H
L
L
H
H
H
X
Exit Power Down
H
L
L
H
H
L
X
ILLEGAL
H
L
L
H
L
X
X
ILLEGAL
H
L
L
L
X
X
X
ILLEGAL
L
L
L
X
X
X
X
Refer to Current State = Power Down
H
H
X
X
X
X
X
Refer to Function True Table
X
Action
NOP (Maintain Self-Refresh)
ANY STATE other
than listed above
ABBREVIATIONS :
H = High Level, L = Low level, V = Valid, X = Don’t Care
Note :
1. CKE Low to High transition will re-enable CLK, CLK and other inputs asynchronously. A minimum setup time must be
satisfied before issuing any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from All Bank Idle state.
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Publication Date : May. 2007
Revision : 0.5
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ESMT
M13S64322A
Preliminary
Basic Timing (Setup, Hold and Access Time @ BL=4, CL=3)
tCH tCL
tCK
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
tHP
Note1
HIGH
CKE
tIS
CS
tIH
RAS
CAS
BA0,BA1
BAa
BAb
BAa
Cb
A8/ AP
WE
tDQSCK
tRPRE
tDQSCK
tRPST
DQS
tDQSQ
tAC
tLZ
DQ
tDQSS
tWPREH
tDQSL
tDQSH
tWPRES
tDS tDH tDS tDH
Hi-Z
Da0
Da1
Da2
Da3
tHZ
Hi-Z
Db0
Db1 Db2
tWPST
Db3
Hi-Z
Hi-Z
tQH
DM
COMM AND
READ
WRITE
Note1
tHP is lesser of tCL or tCH clock transition collectively when a bank is active.
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Publication Date : May. 2007
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ESMT
M13S64322A
Preliminary
Multi Bank Interleaving READ (@BL=4, CL=3)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAb
A8/ AP
Ra
Rb
ADDR
(A0~A7, A9~A10 )
Ra
BAb
BAa
tRCDRD
tRRD
Rb
Ca
Cb
WE
DQS
DQ
Q a0
Qa1
Q a2
Q a3
Q b0
Q b1
Q b2
Q b3
DM
tRCDRD
COMM AN D
ACTIVE
Elite Semiconductor Memory Technology Inc.
ACTIVE
READ
READ
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ESMT
M13S64322A
Preliminary
Multi Bank Interleaving WRITE (@BL=4)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAb
A8/ AP
Ra
Rb
ADDR
(A0~A7, A9~A10 )
Ra
BAa
BAb
tRCDW R
tRRD
Rb
Ca
Cb
WE
DQS
Q a0
DQ
Q a1
Qa2
Q a3
Q b0
Qb
1
Q b2
Q b3
DM
tRCDW R
COMMAND
ACTIVE
Elite Semiconductor Memory Technology Inc.
ACTIVE
WRITE
WRITE
Publication Date : May. 2007
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ESMT
M13S64322A
Preliminary
Read with Auto Precharge (@BL=8)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0, BA1
BAa
BAa
A8/ AP
AD D R
(A0~A7, A9~A10 )
Ra
Ra
Ca
WE
Au t o p r e ch ar g e s t a r t
tRP
Note1
DQS(CL=3)
Q a0
DQ(CL=3)
Qa1
Qa2
Qa3
Q a4
Q a5
Q a6
Q a7
DM
CO MM AND
Note 1.
READ
ACTIVE
The row active command of the precharge bank can be issued after tRP from this point.
The new read/write command of another activated bank can be issued from this point.
At burst read/write with auto precharge, CAS interrupt of the same bank is illegal.
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ESMT
M13S64322A
Preliminary
Write with Auto Precharge (@BL=4)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0, BA1
BAa
BAa
A8/ AP
ADDR
(A0~A7, A9~A10 )
Ra
Ca
Ra
WE
Au t o p r e ch ar g e s t a r t
tWR
Note1
tRP
DQ S
DQ
Q a0
Qa1
Qa2
Qa3
DM
COMMAND
Note 1.
ACTIVE
WRITE
The row active command of the precharge bank can be issued after tRP from this point.
The new read/write command of another activated bank can be issued from this point.
At burst read/write with auto precharge, CAS interrupt of the same/another bank is illegal.
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ESMT
M13S64322A
Preliminary
Read Interrupted by Precharge (@BL=8)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAb
A8/ AP
ADDR
(A0~A7, A9~A10 )
Ca
WE
DQS(CL=3)
Q a0
DQ(CL=3)
Q a1
Q a2
Q a3
Q a4
Qa5
DM
COMM AND
READ
Elite Semiconductor Memory Technology Inc.
PRE
CHARGE
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ESMT
M13S64322A
Preliminary
Read Interrupted by a Read (@BL=8, CL=3)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAb
A8 / AP
ADDR
(A0~A7, A9~A10 )
Ca
Cb
WE
DQS
DQ
Q a0
Qa1
Qb0
Qb1
Q b2
Q b3
Qb4
Q b5
Q b6
Qb7
DM
COMM AND
READ
READ
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ESMT
M13S64322A
Preliminary
Read Interrupted by a Write & Burst stop (@BL=8, CL=3)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAb
Ca
Cb
A8/ AP
ADDR
(A0~A7, A9~A10 )
WE
DQS
DQ
Qa0
Qb0
Qa1
Qb1
Qb2
Qb3
Qb4
Qb5
Qb6
Qb7
DM
COMMAND
READ
Burst
Stop
Elite Semiconductor Memory Technology Inc.
WRITE
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ESMT
M13S64322A
Preliminary
Write followed by Precharge (@BL=4)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAa
A8/ AP
ADDR
(A0~A7, A9~A10 )
Ca
WE
tWR
DQS
Da0
DQ
Da1
Da2
Da3
DM
COMMAND
WRITE
Elite Semiconductor Memory Technology Inc.
PRE
CHARGE
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ESMT
M13S64322A
Preliminary
Write Interrupted by Precharge & DM (@BL=8)
0
1
2
3
4
0
1
2
3
4
5
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAa
BAb
BAc
Cb
Cc
A8 / AP
ADDR
(A0~A7, A9~A10 )
Ca
WE
DQS
Da0
DQ
Da1
Da2
Da3
Da4
Da5
Da6
Da7
Db0
Db1
Dc0
Dc1
Dc2
Dc 3
DM
tWR
CO MM AND
WRITE
Elite Semiconductor Memory Technology Inc.
PRE
CHARGE
WRITE
WRITE
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ESMT
M13S64322A
Preliminary
Write Interrupted by a Read (@BL=8, CL=3)
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
BAb
Ca
Cb
A8 / AP
ADDR
(A0~A7, A9~A10 )
WE
DQ S
Da0
DQ
Da1
Da2
Da3
Da4
Da5
Q b0
Qb1
Q b2
Qb3
Qb4
Ma s k ec d b y D M
DM
tWTR
COMMAND
WRITE
Elite Semiconductor Memory Technology Inc.
READ
Publication Date : May. 2007
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Qb5
ESMT
M13S64322A
Preliminary
DM Function (@BL=8) only for write
0
1
2
3
4
5
6
7
8
9
10
CLK
CLK
HIGH
CKE
CS
RAS
CAS
BA0,BA1
BAa
A8/ AP
ADDR
(A0~A7, A9~A10 )
Ca
WE
DQS(CL=3)
DQ(CL=3)
Qa0
Qa1
Qa2
Qa3
Qa4
Qa5
Qa6
Qa7
DM
CO MM AND
WRITE
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
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ESMT
M13S64322A
Preliminary
Power up & Initialization Sequence
0
1
2
3
4
5
6
8
7
9
11
10
12
13
14
15
16
17
18
19
CLK
CLK
Hi gh l evel i s r equ i r ed
CKE
CS
RAS
CAS
WE
BA0
BA1 ,A 9, A1 0
A8 /AP
A7
ADDRESS KEY
A1 ~ A6
A0
Minimum 200 Cycle
High-Z
DQ
tRP
tRP
tRC
tRC
M i n i m u m o f 2 R ef r es h Cyc les ar e r equ ir e d
High-Z
DQ S
Precharge
All B an k
MRS
Dll Reset
Any
Com mand
Precharge
All Ban k
Power & Cl ock m us t be
stable f or 200us
EMRS
DLL Enable
Elite Semiconductor Memory Technology Inc.
1st Auto Ref res h
2nd Auto Ref resh
M ode R es i st er S et
: Don't Car e
Publication Date : May. 2007
Revision : 0.5
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ESMT
M13S64322A
Preliminary
Mode Register Set
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
CLK
tCK
CKE
CS
RAS
CAS
WE
BA0,BA1
A8/ AP
AD DR ES S KE Y
ADD R
(A0~A7, A9~A10 )
DM
tRP
High-Z
DQ
High- Z
DQS
Precharge
Com man d
All B an k
Any
Command
Mode R egis ter Set
Command
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
46/49
ESMT
M13S64322A
Preliminary
PACKING
DIMENSIONS
100-LEAD
LQFP
DDR SDRAM(14x20mm)
D
b
D1
80
b1
51
50
81
WITH PLATING
C C1
BASE METAL
E1
F
F
100
31
e
b
30
B
GAGE PLANE
A2
1
SEC : F-F
B
L
L1
SEATING PLANE
A1
A
E
SEC : B-B
Symbol
A
A1
A2
b
b1
c
c1
D
D1
E
E1
e
L
L1
θ°
Dimension in inch
Min
Norm
Max
0.063
0.002
0.006
0.053
0.055
0.057
0.009
0.013
0.015
0.009
0.012
0.013
0.004
0.008
0.004
0.006
0.860
0.866
0.872
0.783
0.787
0.791
0.624
0.630
0.636
0.547
0.551
0.555
0.026BSC
0.018
0.024
0.030
0.039 REF
00
3.50
70
Elite Semiconductor Memory Technology Inc.
Dimension in mm
Min
Norm
Max
1.60
0.05
0.15
1.35
1.40
1.45
0.22
0.32
0.38
0.22
0.30
0.33
0.09
0.20
0.09
0.16
21.85
22.00
22.15
19.90
20.00
20.10
15.85
16.00
16.15
13.90
14.00
14.10
0.65 BSC
0.45
0.60
0.75
1.00 REF
00
3.50
70
Publication Date : May. 2007
Revision : 0.5
47/49
ESMT
M13S64322A
Preliminary
PACKING
DIMENSIONS
144-BALL
FBGA DDR DRAM (12x12mm)
Symbol
A
A1
Φb
D
E
D1
E1
e
aaa
bbb
ddd
eee
fff
MD/ME
Dimension in mm
Min
Norm
Max
1.14
1.40
0.30
0.35
0.40
0.40
0.45
0.50
11.90
12.00
12.10
11.90
12.00
12.10
8.80
8.80
0.80
0.10
0.10
0.12
0.15
0.08
12/12
Elite Semiconductor Memory Technology Inc.
Dimension in inch
Min
Norm
Max
0.049
0.055
0.012
0.014
0.016
0.016
0.018
0.020
0.469
0.472
0.476
0.469
0.472
0.476
0.346
0.346
0.031
0.004
0.004
0.005
0.004
0.006
12/12
Publication Date : May. 2007
Revision : 0.5
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ESMT
Preliminary
M13S64322A
Important Notice
All rights reserved.
No part of this document may be reproduced or duplicated in any form or by any
means without the prior permission of ESMT.
The contents contained in this document are believed to be accurate at the time
of publication. ESMT assumes no responsibility for any error in this document,
and reserves the right to change the products or specification in this document
without notice.
The information contained herein is presented only as a guide or examples for
the application of our products. No responsibility is assumed by ESMT for any
infringement of patents, copyrights, or other intellectual property rights of third
parties which may result from its use. No license, either express , implied or
otherwise, is granted under any patents, copyrights or other intellectual property
rights of ESMT or others.
Any semiconductor devices may have inherently a certain rate of failure. To
minimize risks associated with customer's application, adequate design and
operating safeguards against injury, damage, or loss from such failure, should be
provided by the customer when making application designs.
ESMT's products are not authorized for use in critical applications such as, but
not limited to, life support devices or system, where failure or abnormal operation
may directly affect human lives or cause physical injury or property damage. If
products described here are to be used for such kinds of application, purchaser
must do its own quality assurance testing appropriate to such applications.
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 0.5
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