INFINEON XC886888LM

8-Bit
XC886/888CLM
8-Bit Single Chip Microcontroller
Data Sheet
V1.2 2009-07
Micr o co n t ro l l e rs
Edition 2009-07
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
8-Bit
XC886/888CLM
8-Bit Single Chip Microcontroller
Data Sheet
V1.2 2009-07
Micr o co n t ro l l e rs
XC886/888CLM
XC886/888 Data Sheet
Revision History: V1.2 2009-07
Previous Versions: V1.0, V1.1
Page
Subjects (major changes since last revision)
Changes from V1.1 2009-01 to V1.2 2009-07
89
Note on LIN baud rate detection is added.
92
RXD slave line in SSC block diagram is updated.
108
Electrical parameters are now valid for all variants, previous note on
exclusion of ROM variants is removed.
116
Symbol for ADC error parameters are updated.
120
Power supply current parameters for ROM variants are updated.
128
Test condition for the on-chip oscillator short term deviation is updated.
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Data Sheet
V1.2, 2009-07
XC886/888CLM
Table of Contents
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
2.1
2.2
2.3
2.4
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5
6
7
9
3
3.1
3.2
3.2.1
3.2.1.1
3.2.2
3.2.2.1
3.2.2.2
3.2.3
3.2.3.1
3.2.4
3.2.4.1
3.2.4.2
3.2.4.3
3.2.4.4
3.2.4.5
3.2.4.6
3.2.4.7
3.2.4.8
3.2.4.9
3.2.4.10
3.2.4.11
3.2.4.12
3.2.4.13
3.2.4.14
3.3
3.3.1
3.3.2
3.3.3
3.4
3.4.1
3.4.2
3.4.3
3.5
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Processor Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Special Function Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Address Extension by Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Address Extension by Paging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bit Protection Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Password Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XC886/888 Register Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MDU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CORDIC Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WDT Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Port Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timer 2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timer 21 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CCU6 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UART1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SSC Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCDS Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Bank Sectorization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Read Access of P-Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming Width . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Source and Vector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19
19
20
21
21
23
23
25
29
30
31
31
32
33
34
36
37
39
43
43
44
48
49
49
50
52
53
54
55
56
56
62
64
65
Data Sheet
I-1
V1.2, 2009-07
XC886/888CLM
Table of Contents
3.6
3.7
3.7.1
3.7.2
3.8
3.8.1
3.8.2
3.9
3.10
3.11
3.12
3.13
3.13.1
3.13.2
3.14
3.15
3.15.1
3.16
3.17
3.18
3.19
3.20
3.21
3.21.1
3.21.2
3.22
3.22.1
3.23
Power Supply System with Embedded Voltage Regulator . . . . . . . . . . . . 68
Reset Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Module Reset Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Booting Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Clock Generation Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Recommended External Oscillator Circuits . . . . . . . . . . . . . . . . . . . . . . 75
Clock Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Power Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Multiplication/Division Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
CORDIC Coprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
UART and UART1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Baud-Rate Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Baud Rate Generation using Timer 1 . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Normal Divider Mode (8-bit Auto-reload Timer) . . . . . . . . . . . . . . . . . . . . . 88
LIN Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
LIN Header Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
High-Speed Synchronous Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . 91
Timer 0 and Timer 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Timer 2 and Timer 21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Capture/Compare Unit 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Controller Area Network (MultiCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Analog-to-Digital Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
ADC Clocking Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
ADC Conversion Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
JTAG ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Chip Identification Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
4
4.1
4.1.1
4.1.2
4.1.3
4.2
4.2.1
4.2.2
4.2.3
4.2.3.1
4.2.4
4.3
4.3.1
4.3.2
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Threshold Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC Conversion Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Sheet
I-2
108
108
108
109
110
111
111
115
116
119
120
124
124
125
V1.2, 2009-07
XC886/888CLM
Table of Contents
4.3.3
4.3.4
4.3.5
4.3.6
4.3.7
5
5.1
5.2
5.3
Data Sheet
Power-on Reset and PLL Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Clock Drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JTAG Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SSC Master Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
126
128
129
130
132
Package and Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
133
133
134
136
I-3
V1.2, 2009-07
8-Bit Single Chip Microcontroller
1
XC886/888CLM
Summary of Features
The XC886/888 has the following features:
• High-performance XC800 Core
– compatible with standard 8051 processor
– two clocks per machine cycle architecture (for memory access without wait state)
– two data pointers
• On-chip memory
– 12 Kbytes of Boot ROM
– 256 bytes of RAM
– 1.5 Kbytes of XRAM
– 24/32 Kbytes of Flash; or
24/32 Kbytes of ROM, with additional 4 Kbytes of Flash
(includes memory protection strategy)
• I/O port supply at 3.3 V or 5.0 V and core logic supply at 2.5 V (generated by
embedded voltage regulator)
(more features on next page)
Flash or ROM1)
24K/32K x 8
On-Chip Debug Support
Boot ROM
12K x 8
UART
SSC
Port 0
8-bit Digital I/O
Capture/Compare Unit
16-bit
Port 1
8-bit Digital I/O
Compare Unit
16-bit
Port 2
8-bit Digital/
Analog Input
XC800 Core
XRAM
1.5K x 8
RAM
256 x 8
Timer 0
16-bit
Timer 1
16-bit
Timer 2
16-bit
Watchdog
Timer
ADC
10-bit
8-channel
Port 3
8-bit Digital I/O
MDU
CORDIC
MultiCAN
Timer 21
16-bit
UART1
Port 5
Port 4
8-bit Digital I/O
1) All ROM devices come with an additional 4K x 8 Flash
Figure 1
Data Sheet
.
8-bit Digital I/O
XC886/888 Functional Units
1
V1.2, 2009-07
XC886/888CLM
Summary of Features
Features: (continued)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Power-on reset generation
Brownout detection for core logic supply
On-chip OSC and PLL for clock generation
– PLL loss-of-lock detection
Power saving modes
– slow-down mode
– idle mode
– power-down mode with wake-up capability via RXD or EXINT0
– clock gating control to each peripheral
Programmable 16-bit Watchdog Timer (WDT)
Six ports
– Up to 48 pins as digital I/O
– 8 pins as digital/analog input
8-channel, 10-bit ADC
Four 16-bit timers
– Timer 0 and Timer 1 (T0 and T1)
– Timer 2 and Timer 21 (T2 and T21)
Multiplication/Division Unit for arithmetic operations (MDU)
Software libraries to support floating point and MDU calculations
CORDIC Coprocessor for computation of trigonometric, hyperbolic and linear
functions
MultiCAN with 2 nodes, 32 message objects
Capture/compare unit for PWM signal generation (CCU6)
Two full-duplex serial interfaces (UART and UART1)
Synchronous serial channel (SSC)
On-chip debug support
– 1 Kbyte of monitor ROM (part of the 12-Kbyte Boot ROM)
– 64 bytes of monitor RAM
Packages:
– PG-TQFP-48
– PG-TQFP-64
Temperature range TA:
– SAF (-40 to 85 °C)
– SAK (-40 to 125 °C)
Data Sheet
2
V1.2, 2009-07
XC886/888CLM
Summary of Features
XC886/888 Variant Devices
The XC886/888 product family features devices with different configurations, program
memory sizes, package options, power supply voltage, temperature and quality profiles
(Automotive or Industrial), to offer cost-effective solutions for different application
requirements.
The list of XC886/888 device configurations are summarized in Table 1. For each
configuration, 2 types of packages are available:
•
•
PG-TQFP-48, which is denoted by XC886 and;
PG-TQFP-64, which is denoted by XC888.
Table 1
Device Configuration
Device Name
CAN
Module
LIN BSL
Support
MDU
Module
XC886/888
No
No
No
XC886/888C
Yes
No
No
XC886/888CM
Yes
No
Yes
XC886/888LM
No
Yes
Yes
XC886/888CLM
Yes
Yes
Yes
Note: For variants with LIN BSL support, only LIN BSL is available regardless of the
availability of the CAN module.
From these 10 different combinations of configuration and package type, each are
further made available in many sales types, which are grouped according to device type,
program memory sizes, power supply voltage, temperature and quality profile
(Automotive or Industrial), as shown in Table 2.
Table 2
Device Profile
Sales Type
Device Program
Type
Memory
(Kbytes)
Power TempSupply erature
(V)
(°C)
Quality
Profile
SAK-XC886*/888*-8FFA 5V
Flash
32
5.0
-40 to 125
Automotive
SAK-XC886*/888*-6FFA 5V
Flash
24
5.0
-40 to 125
Automotive
SAF-XC886*/888*-8FFA 5V
Flash
32
5.0
-40 to 85
Automotive
SAF-XC886*/888*-6FFA 5V
Flash
24
5.0
-40 to 85
Automotive
SAF-XC886*/888*-8FFI 5V
Flash
32
5.0
-40 to 85
Industrial
SAF-XC886*/888*-6FFI 5V
Flash
24
5.0
-40 to 85
Industrial
Data Sheet
3
V1.2, 2009-07
XC886/888CLM
Summary of Features
Table 2
Device Profile (cont’d)
Sales Type
Device Program
Type
Memory
(Kbytes)
Power TempSupply erature
(V)
(°C)
Quality
Profile
SAK-XC886*/888*-8FFA 3V3 Flash
32
3.3
-40 to 125
Automotive
SAK-XC886*/888*-6FFA 3V3 Flash
24
3.3
-40 to 125
Automotive
SAF-XC886*/888*-8FFA 3V3 Flash
32
3.3
-40 to 85
Automotive
SAF-XC886*/888*-6FFA 3V3 Flash
24
3.3
-40 to 85
Automotive
SAF-XC886*/888*-8FFI 3V3
Flash
32
3.3
-40 to 85
Industrial
SAF-XC886*/888*-6FFI 3V3
Flash
24
3.3
-40 to 85
Industrial
Note: The asterisk (*) above denotes the device configuration letters from Table 1.
Corresponding ROM derivatives will be available on request.
Note: For variants with LIN BSL support, only LIN BSL is available regardless of the
availability of the CAN module.
As this document refers to all the derivatives, some description may not apply to a
specific product. For simplicity, all versions are referred to by the term XC886/888
throughout this document.
Ordering Information
The ordering code for Infineon Technologies microcontrollers provides an exact
reference to the required product. This ordering code identifies:
•
•
The derivative itself, i.e. its function set, the temperature range, and the supply
voltage
The package and the type of delivery
For the available ordering codes for the XC886/888, please refer to your responsible
sales representative or your local distributor.
Note: The ordering codes for the Mask-ROM versions are defined for each product after
verification of the respective ROM code.
Data Sheet
4
V1.2, 2009-07
XC886/888CLM
General Device Information
2
General Device Information
Chapter 2 contains the block diagram, pin configurations, definitions and functions of the
XC886/888.
2.1
Block Diagram
The block diagram of the XC886/888 is shown in Figure 2.
XC800 Core
TMS
MBC
RESET
VDDP
VSSP
VDDC
VSSC
256-byte RAM
+
64-byte monitor
RAM
T0 & T1
UART
CORDIC
UART1
MDU
SSC
WDT
Timer 2
1.5-Kbyte XRAM
24/32-Kbyte
Flash or ROM 2)
Port 0
Internal Bus
P0.0 - P0.7
Port 1
12-Kbyte
Boot ROM1)
P1.0 - P1.7
Port 2
XC886/888
P2.0 - P2.7
ADC
OCDS
Timer 21
CCU6
PLL
Port 3
9.6 MHz
On-chip OSC
P3.0 - P3.7
Port 4
Clock Generator
P4.0 - P4.7
Port 5
XTAL1
XTAL2
VAREF
VAGND
P5.0 - P5.7
MultiCAN
1) Includes 1-Kbyte monitor ROM
2) The 24/32-Kbyte ROM has an additional 4-Kbyte Flash
Figure 2
Data Sheet
XC886/888 Block Diagram
5
V1.2, 2009-07
XC886/888CLM
General Device Information
2.2
Logic Symbol
The logic symbols of the XC886/888 are shown in Figure 3.
VDDP
VDDP
VSSP
VSSP
Port 0 8-Bit
VAREF
VAREF
Port 0 7-Bit
VAGND
Port 1 8-Bit
VAGND
Port 1 8-Bit
RESET
XC886
MBC
TMS
Port 2 8-Bit
RESET
Port 2 8-Bit
Port 4 8-Bit
XTAL1
Port 4 3-Bit
XTAL2
VDDC
Data Sheet
Port 3 8-Bit
TMS
Port 3 8-Bit
XTAL1
Figure 3
XC888
MBC
XTAL2
VSSC
Port 5 8-Bit
VDDC
VSSC
XC886/888 Logic Symbol
6
V1.2, 2009-07
XC886/888CLM
General Device Information
2.3
Pin Configuration
P2.7
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P4.3
P3.6
P3.7
P3.0
P3.1
The pin configuration of the XC886, which is based on the PG-TQFP-48 package, is
shown in Figure 4, while that of the XC888, which is based on the PG-TQFP-64
package, is shown in Figure 5.
36 35 34 33 32 31 30 29 28 27 26 25
P3.2
37
24
V AREF
P3.3
38
23
V AGND
P3.4
39
22
P2.6
P3.5
40
21
P2.5
RESET
41
20
P2.4
V SSP
42
19
P2.3
V DDP
43
18
V SSP
MBC
44
17
V DDP
P4.0
45
16
P2.2
P4.1
46
15
P2.1
P0.7
47
14
P2.0
P0.3
48
13
P0.1
XTAL1
VSSC
VDDC
8
9
10 11 12
P0.2
XTAL2
7
P0.0
6
TMS
5
P1.7
4
P1.6
3
VDDP
2
P0.5
Data Sheet
1
P0.4
Figure 4
XC886
XC886 Pin Configuration, PG-TQFP-48 Package (top view)
7
V1.2, 2009-07
XC886/888CLM
P2.7
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P4.3
P3.6
P3.7
P3.0
P3.1
P4.4
P4.5
P4.6
P4.7
General Device Information
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P3.2
49
32
V AREF
P3.3
50
31
V AGND
P3.4
51
30
P2.6
P3.5
52
29
P2.5
RESET
53
28
P2.4
V SSP
54
27
P2.3
V DDP
55
26
V SSP
NC
56
25
V DDP
NC
57
24
P2.2
MBC
58
23
P2.1
P4.0
59
22
P2.0
P4.1
60
21
P0.1
P4.2
61
20
P5.7
P0.7
62
19
P5.6
P0.3
63
18
P0.2
P0.4
64
17
P0.0
XC888
P0.5
P0.6
XTAL2
XTAL1
VSSC
VDDC
VDDP
P5.0
9
10 11 12 13 14 15 16
TMS
8
P5.5
7
P5.4
6
P5.3
5
P5.2
4
P1.7
3
P1.6
2
P5.1
1
Note: The pins shaded in blue are not available in the PG-TQFP-48 package.
Figure 5
Data Sheet
XC888 Pin Configuration, PG-TQFP-64 Package (top view)
8
V1.2, 2009-07
XC886/888CLM
General Device Information
2.4
Pin Definitions and Functions
The functions and default states of the XC886/888 external pins are provided in Table 3.
Table 3
Pin Definitions and Functions
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P0
I/O
Port 0
Port 0 is an 8-bit bidirectional general purpose
I/O port. It can be used as alternate functions
for the JTAG, CCU6, UART, UART1, Timer 2,
Timer 21, MultiCAN and SSC.
P0.0
11/17
Hi-Z
TCK_0
T12HR_1
JTAG Clock Input
CCU6 Timer 12 Hardware Run
Input
CC61_1
Input/Output of
Capture/Compare channel 1
CLKOUT_0 Clock Output
RXDO_1
UART Transmit Data Output
P0.1
13/21
Hi-Z
TDI_0
T13HR_1
RXD_1
RXDC1_0
COUT61_1
EXF2_1
P0.2
12/18
PU
CTRAP_2
TDO_0
TXD_1
TXDC1_0
P0.3
48/63
Hi-Z
SCK_1
COUT63_1
RXDO1_0
Data Sheet
9
JTAG Serial Data Input
CCU6 Timer 13 Hardware Run
Input
UART Receive Data Input
MultiCAN Node 1 Receiver Input
Output of Capture/Compare
channel 1
Timer 2 External Flag Output
CCU6 Trap Input
JTAG Serial Data Output
UART Transmit Data
Output/Clock Output
MultiCAN Node 1 Transmitter
Output
SSC Clock Input/Output
Output of Capture/Compare
channel 3
UART1 Transmit Data Output
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P0.4
1/64
Hi-Z
MTSR_1
CC62_1
TXD1_0
P0.5
2/1
Hi-Z
MRST_1
EXINT0_0
T2EX1_1
RXD1_0
COUT62_1
SSC Master Transmit Output/
Slave Receive Input
Input/Output of
Capture/Compare channel 2
UART1 Transmit Data
Output/Clock Output
SSC Master Receive Input/Slave
Transmit Output
External Interrupt Input 0
Timer 21 External Trigger Input
UART1 Receive Data Input
Output of Capture/Compare
channel 2
P0.6
–/2
PU
GPIO
P0.7
47/62
PU
CLKOUT_1 Clock Output
Data Sheet
10
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P1
I/O
Port 1
Port 1 is an 8-bit bidirectional general purpose
I/O port. It can be used as alternate functions
for the JTAG, CCU6, UART, Timer 0, Timer 1,
Timer 2, Timer 21, MultiCAN and SSC.
P1.0
26/34
PU
RXD_0
T2EX
RXDC0_0
UART Receive Data Input
Timer 2 External Trigger Input
MultiCAN Node 0 Receiver Input
P1.1
27/35
PU
EXINT3
T0_1
TDO_1
TXD_0
External Interrupt Input 3
Timer 0 Input
JTAG Serial Data Output
UART Transmit Data
Output/Clock Output
MultiCAN Node 0 Transmitter
Output
TXDC0_0
P1.2
28/36
PU
SCK_0
SSC Clock Input/Output
P1.3
29/37
PU
MTSR_0
SSC Master Transmit
Output/Slave Receive Input
MultiCAN Node 1 Transmitter
Output
TXDC1_3
P1.4
P1.5
30/38
31/39
Data Sheet
PU
PU
MRST_0
EXINT0_1
RXDC1_3
SSC Master Receive Input/
Slave Transmit Output
External Interrupt Input 0
MultiCAN Node 1 Receiver Input
CCPOS0_1
EXINT5
T1_1
EXF2_0
RXDO_0
CCU6 Hall Input 0
External Interrupt Input 5
Timer 1 Input
Timer 2 External Flag Output
UART Transmit Data Output
11
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P1.6
8/10
PU
CCPOS1_1 CCU6 Hall Input 1
T12HR_0
CCU6 Timer 12 Hardware Run
Input
EXINT6_0 External Interrupt Input 6
RXDC0_2
MultiCAN Node 0 Receiver Input
T21_1
Timer 21 Input
P1.7
9/11
PU
CCPOS2_1 CCU6 Hall Input 2
T13HR_0
CCU6 Timer 13 Hardware Run
Input
T2_1
Timer 2 Input
TXDC0_2
MultiCAN Node 0 Transmitter
Output
P1.5 and P1.6 can be used as a software chip
select output for the SSC.
Data Sheet
12
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P2
I
Port 2
Port 2 is an 8-bit general purpose input-only
port. It can be used as alternate functions for
the digital inputs of the JTAG and CCU6. It is
also used as the analog inputs for the ADC.
P2.0
14/22
Hi-Z
CCPOS0_0 CCU6 Hall Input 0
EXINT1_0 External Interrupt Input 1
T12HR_2
CCU6 Timer 12 Hardware Run
Input
TCK_1
JTAG Clock Input
CC61_3
Input of Capture/Compare
channel 1
AN0
Analog Input 0
P2.1
15/23
Hi-Z
CCPOS1_0 CCU6 Hall Input 1
EXINT2_0 External Interrupt Input 2
T13HR_2
CCU6 Timer 13 Hardware Run
Input
TDI_1
JTAG Serial Data Input
CC62_3
Input of Capture/Compare
channel 2
AN1
Analog Input 1
P2.2
16/24
Hi-Z
CCPOS2_0 CCU6 Hall Input 2
CTRAP_1
CCU6 Trap Input
CC60_3
Input of Capture/Compare
channel 0
AN2
Analog Input 2
P2.3
19/27
Hi-Z
AN3
Analog Input 3
P2.4
20/28
Hi-Z
AN4
Analog Input 4
P2.5
21/29
Hi-Z
AN5
Analog Input 5
P2.6
22/30
Hi-Z
AN6
Analog Input 6
P2.7
25/33
Hi-Z
AN7
Analog Input 7
Data Sheet
13
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P3
I/O
Port 3
Port 3 is an 8-bit bidirectional general purpose
I/O port. It can be used as alternate functions
for CCU6, UART1, Timer 21 and MultiCAN.
P3.0
35/43
Hi-Z
CCPOS1_2 CCU6 Hall Input 1
CC60_0
Input/Output of
Capture/Compare channel 0
RXDO1_1
UART1 Transmit Data Output
P3.1
36/44
Hi-Z
CCPOS0_2 CCU6 Hall Input 0
CC61_2
Input/Output of
Capture/Compare channel 1
COUT60_0 Output of Capture/Compare
channel 0
TXD1_1
UART1 Transmit Data
Output/Clock Output
P3.2
37/49
Hi-Z
CCPOS2_2
RXDC1_1
RXD1_1
CC61_0
CCU6 Hall Input 2
MultiCAN Node 1 Receiver Input
UART1 Receive Data Input
Input/Output of
Capture/Compare channel 1
P3.3
38/50
Hi-Z
COUT61_0
Output of Capture/Compare
channel 1
MultiCAN Node 1 Transmitter
Output
TXDC1_1
P3.4
39/51
Hi-Z
CC62_0
RXDC0_1
T2EX1_0
P3.5
40/52
Hi-Z
COUT62_0
EXF21_0
TXDC0_1
P3.6
33/41
Data Sheet
PD
CTRAP_0
14
Input/Output of
Capture/Compare channel 2
MultiCAN Node 0 Receiver Input
Timer 21 External Trigger Input
Output of Capture/Compare
channel 2
Timer 21 External Flag Output
MultiCAN Node 0 Transmitter
Output
CCU6 Trap Input
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P3.7
34/42
Data Sheet
Hi-Z
EXINT4
COUT63_0
15
External Interrupt Input 4
Output of Capture/Compare
channel 3
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P4
I/O
Port 4
Port 4 is an 8-bit bidirectional general purpose
I/O port. It can be used as alternate functions
for CCU6, Timer 0, Timer 1, Timer 21 and
MultiCAN.
P4.0
45/59
Hi-Z
RXDC0_3
CC60_1
MultiCAN Node 0 Receiver Input
Output of Capture/Compare
channel 0
P4.1
46/60
Hi-Z
TXDC0_3
MultiCAN Node 0 Transmitter
Output
Output of Capture/Compare
channel 0
COUT60_1
P4.2
–/61
PU
EXINT6_1
T21_0
External Interrupt Input 6
Timer 21 Input
P4.3
32/40
Hi-Z
EXF21_1
COUT63_2
Timer 21 External Flag Output
Output of Capture/Compare
channel 3
P4.4
–/45
Hi-Z
CCPOS0_3 CCU6 Hall Input 0
T0_0
Timer 0 Input
CC61_4
Output of Capture/Compare
channel 1
P4.5
–/46
Hi-Z
CCPOS1_3 CCU6 Hall Input 1
T1_0
Timer 1 Input
COUT61_2 Output of Capture/Compare
channel 1
P4.6
–/47
Hi-Z
CCPOS2_3 CCU6 Hall Input 2
T2_0
Timer 2 Input
CC62_2
Output of Capture/Compare
channel 2
P4.7
–/48
Hi-Z
CTRAP_3
COUT62_2
Data Sheet
16
CCU6 Trap Input
Output of Capture/Compare
channel 2
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
P5
I/O
Port 5
Port 5 is an 8-bit bidirectional general purpose
I/O port. It can be used as alternate functions
for UART, UART1 and JTAG.
P5.0
–/8
PU
EXINT1_1
External Interrupt Input 1
P5.1
–/9
PU
EXINT2_1
External Interrupt Input 2
P5.2
–/12
PU
RXD_2
UART Receive Data Input
P5.3
–/13
PU
TXD_2
UART Transmit Data
Output/Clock Output
P5.4
–/14
PU
RXDO_2
UART Transmit Data Output
P5.5
–/15
PU
TDO_2
TXD1_2
JTAG Serial Data Output
UART1 Transmit Data Output/
Clock Output
P5.6
–/19
PU
TCK_2
RXDO1_2
JTAG Clock Input
UART1 Transmit Data Output
P5.7
–/20
PU
TDI_2
RXD1_2
JTAG Serial Data Input
UART1 Receive Data Input
Data Sheet
17
V1.2, 2009-07
XC886/888CLM
General Device Information
Table 3
Pin Definitions and Functions (cont’d)
Symbol Pin Number Type Reset Function
(TQFP-48/64)
State
VDDP
7, 17, 43/
7, 25, 55
–
–
I/O Port Supply (3.3 or 5.0 V)
Also used by EVR and analog modules. All
pins must be connected.
VSSP
18, 42/26, 54 –
–
I/O Port Ground
All pins must be connected.
VDDC
VSSC
VAREF
VAGND
6/6
–
–
Core Supply Monitor (2.5 V)
5/5
–
–
Core Supply Ground
24/32
–
–
ADC Reference Voltage
23/31
–
–
ADC Reference Ground
XTAL1
4/4
I
Hi-Z
External Oscillator Input
(backup for on-chip OSC, normally NC)
XTAL2
3/3
O
Hi-Z
External Oscillator Output
(backup for on-chip OSC, normally NC)
TMS
10/16
I
PD
Test Mode Select
RESET 41/53
I
PU
Reset Input
MBC1)
44/58
I
PU
Monitor & BootStrap Loader Control
NC
–/56, 57
–
–
No Connection
1) An external pull-up device in the range of 4.7 kΩ to 100 kΩ. is required to enter user mode. Alternatively MBC
can be tied to high if alternate functions (for debugging) of the pin are not utilized.
Data Sheet
18
V1.2, 2009-07
XC886/888CLM
Functional Description
3
Functional Description
Chapter 3 provides an overview of the XC886/888 functional description.
3.1
Processor Architecture
The XC886/888 is based on a high-performance 8-bit Central Processing Unit (CPU)
that is compatible with the standard 8051 processor. While the standard 8051 processor
is designed around a 12-clock machine cycle, the XC886/888 CPU uses a 2-clock
machine cycle. This allows fast access to ROM or RAM memories without wait state.
Access to the Flash memory, however, requires an additional wait state (one machine
cycle). The instruction set consists of 45% one-byte, 41% two-byte and 14% three-byte
instructions.
The XC886/888 CPU provides a range of debugging features, including basic stop/start,
single-step execution, breakpoint support and read/write access to the data memory,
program memory and Special Function Registers (SFRs).
Figure 6 shows the CPU functional blocks.
Internal Data
Memory
Core SFRs
Register Interface
External Data
Memory
Program Memory
fCCLK
Memory Wait
Reset
Legacy External Interrupts (IEN0, IEN1)
External Interrupts
Non-Maskable Interrupt
Figure 6
Data Sheet
External SFRs
16-bit Registers &
Memory Interface
ALU
Opcode &
Immediate
Registers
Multiplier / Divider
Opcode Decoder
Timer 0 / Timer 1
State Machine &
Power Saving
UART
Interrupt
Controller
CPU Block Diagram
19
V1.2, 2009-07
XC886/888CLM
Functional Description
3.2
Memory Organization
The XC886/888 CPU operates in the following five address spaces:
•
•
•
•
•
12 Kbytes of Boot ROM program memory
256 bytes of internal RAM data memory
1.5 Kbytes of XRAM memory
(XRAM can be read/written as program memory or external data memory)
A 128-byte Special Function Register area
24/32 Kbytes of Flash program memory (Flash devices); or
24/32 Kbytes of ROM program memory, with additional 4 Kbytes of Flash
(ROM devices)
Figure 7 illustrates the memory address spaces of the 32-Kbyte Flash devices. For the
24-Kbyte Flash devices, the shaded banks are not available.
FFFFH
FFFF H
F600H
F600H
1)
XRAM
1.5 Kbytes
F000H
XRAM
1.5 Kbytes
In 24-Kbyte Flash devices, the upper 2Kbyte of Banks 4 and 5 are not available.
F000H
Boot ROM
12 Kbytes
C000H
D-Flash Bank 1
4 Kbytes
B000H
D-Flash Bank 0
4 Kbytes
A000H
8000H
D-Flash Bank 0
4 Kbytes
7000H
D-Flash Bank 1
4 Kbytes
6000H
P-Flash Banks 4 and 5
2 x 4 Kbytes 1)
5000H
4000H
P-Flash Banks 2 and 3
2 x 4 Kbytes
Indirect
Address
Direct
Address
Internal RAM
Special Function
Registers
FF H
80H
2000H
7FH
P-Flash Banks 0 and 1
2 x 4 Kbytes
Internal RAM
0000H
Program Space
Figure 7
0000H
00H
External Data Space
Internal Data Space
Memory Map of XC886/888 Flash Device
For both 24-Kbyte and 32-Kbyte ROM devices, the last four bytes of the ROM from
7FFCH to 7FFFH are reserved for the ROM signature and cannot be used to store user
Data Sheet
20
V1.2, 2009-07
XC886/888CLM
Functional Description
code or data. Therefore, even though the ROM device contains either a 24-Kbyte or 32Kbyte ROM, the maximum size of code that can be placed in the ROM is the given size
less four bytes.
3.2.1
Memory Protection Strategy
The XC886/888 memory protection strategy includes:
•
•
Read-out protection: The user is able to protect the contents in the Flash (for Flash
devices) and ROM (for ROM devices) memory from being read
– Flash protection is enabled by programming a valid password (8-bit non-zero
value) via BSL mode 6.
– ROM protection is fixed with the ROM mask and is always enabled.
Flash program and erase protection: This feature is available only for Flash devices.
3.2.1.1
Flash Memory Protection
As long as a valid password is available, all external access to the device, including the
Flash, will be blocked.
For additional security, the Flash hardware protection can be enabled to implement a
second layer of read-out protection, as well as to enable program and erase protection.
Flash hardware protection is available only for Flash devices and comes in two modes:
•
•
Mode 0: Only the P-Flash is protected; the D-Flash is unprotected
Mode 1: Both the P-Flash and D-Flash are protected
The selection of each protection mode and the restrictions imposed are summarized in
Table 4.
Table 4
Flash Protection Modes
Flash Protection Without hardware
protection
With hardware protection
Hardware
Protection Mode
0
1
Activation
Program a valid password via BSL mode 6
Selection
Bit 4 of password = 0 Bit 4 of password = 1 Bit 4 of password = 1
MSB of password = 0 MSB of password = 1
P-Flash
Read instructions in Read instructions in
contents can be any program memory the P-Flash
read by
Read instructions in
the P-Flash or DFlash
External access
to P-Flash
Not possible
Data Sheet
Not possible
Not possible
21
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 4
Flash Protection Modes (cont’d)
Flash Protection Without hardware
protection
With hardware protection
P-Flash program Possible
and erase
Not possible
Not possible
D-Flash
Read instructions in Read instructions in Read instructions in
contents can be any program memory any program memory the P-Flash or Dread by
Flash
External access
to D-Flash
Not possible
Not possible
Not possible
D-Flash
program
Possible
Possible
Not possible
D-Flash erase
Possible
Possible, on
Not possible
condition that bit
DFLASHEN in
register MISC_CON
is set to 1 prior to
each erase operation
BSL mode 6, which is used for enabling Flash protection, can also be used for disabling
Flash protection. Here, the programmed password must be provided by the user. A
password match triggers an automatic erase of the protected P-Flash and D-Flash
contents, including the programmed password. The Flash protection is then disabled
upon the next reset.
For the ROM device, the ROM is protected at all times and BSL mode 6 is used only to
block external access to the device. However, unlike the Flash device, it is not possible
to disable the memory protection of the ROM device. Here, entering BSL mode 6 will
result in a protection error.
Note: If ROM read-out protection is enabled, only read instructions in the ROM memory
can target the ROM contents.
Although no protection scheme can be considered infallible, the XC886/888 memory
protection strategy provides a very high level of protection for a general purpose
microcontroller.
Data Sheet
22
V1.2, 2009-07
XC886/888CLM
Functional Description
3.2.2
Special Function Register
The Special Function Registers (SFRs) occupy direct internal data memory space in the
range 80H to FFH. All registers, except the program counter, reside in the SFR area. The
SFRs include pointers and registers that provide an interface between the CPU and the
on-chip peripherals. As the 128-SFR range is less than the total number of registers
required, address extension mechanisms are required to increase the number of
addressable SFRs. The address extension mechanisms include:
•
•
Mapping
Paging
3.2.2.1
Address Extension by Mapping
Address extension is performed at the system level by mapping. The SFR area is
extended into two portions: the standard (non-mapped) SFR area and the mapped SFR
area. Each portion supports the same address range 80H to FFH, bringing the number of
addressable SFRs to 256. The extended address range is not directly controlled by the
CPU instruction itself, but is derived from bit RMAP in the system control register
SYSCON0 at address 8FH. To access SFRs in the mapped area, bit RMAP in SFR
SYSCON0 must be set. Alternatively, the SFRs in the standard area can be accessed
by clearing bit RMAP. The SFR area can be selected as shown in Figure 8.
As long as bit RMAP is set, the mapped SFR area can be accessed. This bit is not
cleared automatically by hardware. Thus, before standard/mapped registers are
accessed, bit RMAP must be cleared/set, respectively, by software.
Data Sheet
23
V1.2, 2009-07
XC886/888CLM
Functional Description
Standard Area (RMAP = 0)
FF H
Module 1 SFRs
SYSCON0.RMAP
Module 2 SFRs
rw
…...
Module n SFRs
80 H
SFR Data
(to/from CPU)
Mapped Area (RMAP = 1)
FF H
Module (n+1) SFRs
Module (n+2) SFRs
…...
Module m SFRs
80 H
Direct
Internal Data
Memory Address
Figure 8
Data Sheet
Address Extension by Mapping
24
V1.2, 2009-07
XC886/888CLM
Functional Description
SYSCON0
System Control Register 0
7
6
5
Reset Value: 04H
4
3
2
1
0
0
IMODE
0
1
0
RMAP
r
rw
r
r
r
rw
Field
Bits
Type Description
RMAP
0
rw
Interrupt Node XINTR0 Enable
0
The access to the standard SFR area is
enabled
1
The access to the mapped SFR area is
enabled
1
2
r
Reserved
Returns 1 if read; should be written with 1.
0
[7:5],
3,1
r
Reserved
Returns 0 if read; should be written with 0.
Note: The RMAP bit should be cleared/set by ANL or ORL instructions.
3.2.2.2
Address Extension by Paging
Address extension is further performed at the module level by paging. With the address
extension by mapping, the XC886/888 has a 256-SFR address range. However, this is
still less than the total number of SFRs needed by the on-chip peripherals. To meet this
requirement, some peripherals have a built-in local address extension mechanism for
increasing the number of addressable SFRs. The extended address range is not directly
controlled by the CPU instruction itself, but is derived from bit field PAGE in the module
page register MOD_PAGE. Hence, the bit field PAGE must be programmed before
accessing the SFR of the target module. Each module may contain a different number
of pages and a different number of SFRs per page, depending on the specific
requirement. Besides setting the correct RMAP bit value to select the SFR area, the user
must also ensure that a valid PAGE is selected to target the desired SFR. A page inside
the extended address range can be selected as shown in Figure 9.
Data Sheet
25
V1.2, 2009-07
XC886/888CLM
Functional Description
SFR Address
(from CPU)
PAGE 0
MOD_PAGE.PAGE
SFR0
rw
SFR1
…...
SFRx
PAGE 1
SFR0
SFR Data
(to/from CPU)
SFR1
…...
SFRy
…...
PAGE q
SFR0
SFR1
…...
SFRz
Module
Figure 9
Address Extension by Paging
In order to access a register located in a page different from the actual one, the current
page must be exited. This is done by reprogramming the bit field PAGE in the page
register. Only then can the desired access be performed.
If an interrupt routine is initiated between the page register access and the module
register access, and the interrupt needs to access a register located in another page, the
current page setting can be saved, the new one programmed and the old page setting
restored. This is possible with the storage fields STx (x = 0 - 3) for the save and restore
action of the current page setting. By indicating which storage bit field should be used in
parallel with the new page value, a single write operation can:
•
Save the contents of PAGE in STx before overwriting with the new value
(this is done in the beginning of the interrupt routine to save the current page setting
and program the new page number); or
Data Sheet
26
V1.2, 2009-07
XC886/888CLM
Functional Description
•
Overwrite the contents of PAGE with the contents of STx, ignoring the value written
to the bit positions of PAGE
(this is done at the end of the interrupt routine to restore the previous page setting
before the interrupt occurred)
ST3
ST2
ST1
ST0
STNR
PAGE
value update
from CPU
Figure 10
Storage Elements for Paging
With this mechanism, a certain number of interrupt routines (or other routines) can
perform page changes without reading and storing the previously used page information.
The use of only write operations makes the system simpler and faster. Consequently,
this mechanism significantly improves the performance of short interrupt routines.
The XC886/888 supports local address extension for:
•
•
•
•
Parallel Ports
Analog-to-Digital Converter (ADC)
Capture/Compare Unit 6 (CCU6)
System Control Registers
Data Sheet
27
V1.2, 2009-07
XC886/888CLM
Functional Description
The page register has the following definition:
MOD_PAGE
Page Register for module MOD
7
6
Reset Value: 00H
5
4
3
2
1
OP
STNR
0
PAGE
w
w
r
rw
0
Field
Bits
Type Description
PAGE
[2:0]
rw
Page Bits
When written, the value indicates the new page.
When read, the value indicates the currently active
page.
STNR
[5:4]
w
Storage Number
This number indicates which storage bit field is the
target of the operation defined by bit field OP.
If OP = 10B,
the contents of PAGE are saved in STx before being
overwritten with the new value.
If OP = 11B,
the contents of PAGE are overwritten by the
contents of STx. The value written to the bit positions
of PAGE is ignored.
00
01
10
11
Data Sheet
ST0 is selected.
ST1 is selected.
ST2 is selected.
ST3 is selected.
28
V1.2, 2009-07
XC886/888CLM
Functional Description
Field
Bits
Type Description
OP
[7:6]
w
Operation
0X Manual page mode. The value of STNR is
ignored and PAGE is directly written.
10
New page programming with automatic page
saving. The value written to the bit positions of
PAGE is stored. In parallel, the previous
contents of PAGE are saved in the storage bit
field STx indicated by STNR.
11
Automatic restore page action. The value
written to the bit positions PAGE is ignored
and instead, PAGE is overwritten by the
contents of the storage bit field STx indicated
by STNR.
0
3
r
Reserved
Returns 0 if read; should be written with 0.
3.2.3
Bit Protection Scheme
The bit protection scheme prevents direct software writing of selected bits (i.e., protected
bits) using the PASSWD register. When the bit field MODE is 11B, writing 10011B to the
bit field PASS opens access to writing of all protected bits, and writing 10101B to the bit
field PASS closes access to writing of all protected bits. In both cases, the value of the
bit field MODE is not changed even if PASSWD register is written with 98H or A8H. It can
only be changed when bit field PASS is written with 11000B, for example, writing D0H to
PASSWD register disables the bit protection scheme.
Note that access is opened for maximum 32 CCLKs if the “close access” password is not
written. If “open access” password is written again before the end of 32 CCLK cycles,
there will be a recount of 32 CCLK cycles. The protected bits include the N- and KDivider bits, NDIV and KDIV; the Watchdog Timer enable bit, WDTEN; and the powerdown and slow-down enable bits, PD and SD.
Data Sheet
29
V1.2, 2009-07
XC886/888CLM
Functional Description
3.2.3.1
Password Register
PASSWD
Password Register
7
6
Reset Value: 07H
5
4
3
2
1
0
PASS
PROTECT
_S
MODE
wh
rh
rw
Field
Bits
Type Description
MODE
[1:0]
rw
Bit Protection Scheme Control Bits
00
Scheme disabled - direct access to the
protected bits is allowed.
11
Scheme enabled - the bit field PASS has to be
written with the passwords to open and close
the access to protected bits. (default)
Others:Scheme Enabled.
These two bits cannot be written directly. To change
the value between 11B and 00B, the bit field PASS
must be written with 11000B; only then, will the
MODE[1:0] be registered.
PROTECT_S
2
rh
Bit Protection Signal Status Bit
This bit shows the status of the protection.
0
Software is able to write to all protected bits.
1
Software is unable to write to any protected
bits.
PASS
[7:3]
wh
Password Bits
The Bit Protection Scheme only recognizes three
patterns.
11000B Enables writing of the bit field MODE.
10011B Opens access to writing of all protected bits.
10101B Closes access to writing of all protected bits
Data Sheet
30
V1.2, 2009-07
XC886/888CLM
Functional Description
3.2.4
XC886/888 Register Overview
The SFRs of the XC886/888 are organized into groups according to their functional units.
The contents (bits) of the SFRs are summarized in Chapter 3.2.4.1 to Chapter 3.2.4.14.
Note: The addresses of the bitaddressable SFRs appear in bold typeface.
3.2.4.1
CPU Registers
The CPU SFRs can be accessed in both the standard and mapped memory areas
(RMAP = 0 or 1).
Table 5
CPU Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
RMAP = 0 or 1
81H
SP
Reset: 07H
Stack Pointer Register
Bit Field
82H
DPL
Reset: 00H
Data Pointer Register Low
Bit Field
DPH
Reset: 00H
Data Pointer Register High
Bit Field
PCON
Reset: 00H
Power Control Register
Bit Field
TCON
Reset: 00H
Timer Control Register
Bit Field
TF1
TR1
TF0
Type
rwh
rw
rwh
TMOD
Reset: 00H
Timer Mode Register
Bit Field
GATE
1
T1S
rw
rw
83H
87H
88H
89H
Type
Type
Type
Type
Type
8AH
8BH
8CH
8DH
98H
99H
A2H
SP
rw
DPL7
DPL6
DPL5
DPL4
DPL3
DPL2
DPL1
DPL0
rw
rw
rw
rw
rw
rw
rw
rw
DPH7
DPH6
DPH5
DPH4
DPH3
DPH2
DPH1
DPH0
rw
rw
rw
rw
rw
rw
rw
rw
SMOD
0
GF1
GF0
0
IDLE
rw
r
rw
rw
r
rw
TR0
IE1
IT1
IE0
IT0
rw
rwh
rw
rwh
rw
T1M
GATE
0
T0S
T0M
rw
rw
rw
rw
TL0
Reset: 00H
Timer 0 Register Low
Bit Field
VAL
Type
rwh
TL1
Reset: 00H
Timer 1 Register Low
Bit Field
VAL
Type
rwh
TH0
Reset: 00H
Timer 0 Register High
Bit Field
VAL
Type
rwh
TH1
Reset: 00H
Timer 1 Register High
Bit Field
VAL
Type
rwh
SCON
Reset: 00H
Serial Channel Control Register
Bit Field
SBUF
Reset: 00H
Serial Data Buffer Register
Bit Field
VAL
Type
rwh
EO
Reset: 00H
Extended Operation Register
Bit Field
0
TRAP_
EN
0
DPSE
L0
Type
r
rw
r
rw
Data Sheet
Type
SM0
SM1
SM2
REN
TB8
RB8
TI
RI
rw
rw
rw
rw
rw
rwh
rwh
rwh
31
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 5
CPU Register Overview (cont’d)
Addr Register Name
Bit
7
6
5
4
3
2
1
0
A8H
IEN0
Reset: 00H
Interrupt Enable Register 0
Bit Field
EA
0
ET2
ES
ET1
EX1
ET0
EX0
Type
rw
r
rw
rw
rw
rw
rw
rw
IP
Reset: 00H
Interrupt Priority Register
Bit Field
0
PT2
PS
PT1
PX1
PT0
PX0
Type
r
rw
rw
rw
rw
rw
rw
IPH
Reset: 00H
Interrupt Priority High Register
Bit Field
0
PT2H
PSH
PT1H
PX1H
PT0H
PX0H
Type
r
rw
rw
rw
rw
rw
rw
B8H
B9H
D0H
E0H
E8H
F0H
F8H
PSW
Reset: 00H
Program Status Word Register
Bit Field
CY
AC
F0
RS1
RS0
OV
F1
P
Type
rwh
rwh
rw
rw
rw
rwh
rw
rh
ACC
Reset: 00H
Accumulator Register
Bit Field
ACC7
ACC6
ACC5
ACC4
ACC3
ACC2
ACC1
ACC0
rw
rw
rw
rw
rw
rw
rw
rw
IEN1
Reset: 00H
Interrupt Enable Register 1
Bit Field
ECCIP
3
ECCIP
2
ECCIP
1
ECCIP
0
EXM
EX2
ESSC
EADC
Type
rw
rw
rw
rw
rw
rw
rw
rw
Bit Field
B7
B6
B5
B4
B3
B2
B1
B0
Type
rw
rw
rw
rw
rw
rw
rw
rw
PCCIP
3
PCCIP
2
PCCIP
1
PCCIP
0
PXM
PX2
PSSC
PADC
rw
rw
rw
rw
rw
rw
rw
rw
PCCIP
3H
PCCIP
2H
PCCIP
1H
PCCIP
0H
PXMH
PX2H
PSSC
H
PADC
H
rw
rw
rw
rw
rw
rw
rw
rw
2
1
0
B
B Register
Reset: 00H
IP1
Reset: 00H
Interrupt Priority 1 Register
Type
Bit Field
Type
F9H
IPH1
Reset: 00H Bit Field
Interrupt Priority 1 High Register
Type
3.2.4.2
MDU Registers
The MDU SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 6
MDU Register Overview
Addr Register Name
Bit
7
6
5
4
3
RMAP = 1
B0H
B1H
B2H
B2H
B3H
MDUSTAT
Reset: 00H
MDU Status Register
Bit Field
0
BSY
IERR
IRDY
Type
r
rh
rwh
rwh
MDUCON
Reset: 00H
MDU Control Register
Bit Field
IE
IR
RSEL
STAR
T
OPCODE
Type
rw
rw
rw
rwh
rw
MD0
Reset: 00H
MDU Operand Register 0
Bit Field
MR0
Reset: 00H
MDU Result Register 0
Bit Field
MD1
Reset: 00H
MDU Operand Register 1
Bit Field
Data Sheet
DATA
Type
rw
DATA
Type
rh
DATA
Type
rw
32
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 6
MDU Register Overview (cont’d)
Addr Register Name
Bit
B3H
MR1
Reset: 00H
MDU Result Register 1
Bit Field
MD2
Reset: 00H
MDU Operand Register 2
Bit Field
MR2
Reset: 00H
MDU Result Register 2
Bit Field
MD3
Reset: 00H
MDU Operand Register 3
Bit Field
MR3
Reset: 00H
MDU Result Register 3
Bit Field
MD4
Reset: 00H
MDU Operand Register 4
Bit Field
MR4
Reset: 00H
MDU Result Register 4
Bit Field
MD5
Reset: 00H
MDU Operand Register 5
Bit Field
MR5
Reset: 00H
MDU Result Register 5
Bit Field
B4H
B4H
B5H
B5H
B6H
B6H
B7H
B7H
3.2.4.3
7
6
5
4
3
2
1
0
DATA
Type
rh
DATA
Type
rw
DATA
Type
rh
DATA
Type
rw
DATA
Type
rh
DATA
Type
rw
DATA
Type
rh
DATA
Type
rw
DATA
Type
rh
CORDIC Registers
The CORDIC SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 7
CORDIC Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
RMAP = 1
9AH
9BH
9CH
9DH
9EH
9FH
CD_CORDXL
Reset: 00H
CORDIC X Data Low Byte
Bit Field
CD_CORDXH
Reset: 00H
CORDIC X Data High Byte
Bit Field
CD_CORDYL
Reset: 00H
CORDIC Y Data Low Byte
Bit Field
CD_CORDYH
Reset: 00H
CORDIC Y Data High Byte
Bit Field
CD_CORDZL
Reset: 00H
CORDIC Z Data Low Byte
Bit Field
CD_CORDZH
Reset: 00H
CORDIC Z Data High Byte
Bit Field
Data Sheet
DATAL
Type
rw
DATAH
Type
rw
DATAL
Type
rw
DATAH
Type
rw
DATAL
Type
rw
DATAH
Type
rw
33
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 7
CORDIC Register Overview (cont’d)
Addr Register Name
Bit
A0H
CD_STATC
Reset: 00H
CORDIC Status and Data
Control Register
Bit Field
CD_CON
Reset: 00H
CORDIC Control Register
Bit Field
A1H
Type
7
6
5
4
3
2
1
0
KEEP
Z
KEEP
Y
KEEP
X
DMAP
INT_E
N
EOC
ERRO
R
BSY
rw
rw
rw
rw
rw
rwh
rh
rh
MPS
X_USI
GN
ST_M
ODE
ROTV
EC
MODE
ST
rw
rw
rw
rw
rw
rwh
Type
3.2.4.4
System Control Registers
The system control SFRs can be accessed in the mapped memory area (RMAP = 0).
Table 8
SCU Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
RMAP = 0 or 1
8FH
SYSCON0
Reset: 04H
System Control Register 0
Bit Field
0
IMOD
E
0
1
0
RMAP
Type
r
rw
r
r
r
rw
RMAP = 0
BFH
SCU_PAGE
Page Register
Reset: 00H
Bit Field
Type
OP
STNR
0
PAGE
w
w
r
rw
RMAP = 0, PAGE 0
B3H
B4H
B5H
B6H
B7H
BAH
BBH
MODPISEL
Reset: 00H
Peripheral Input Select Register
IRCON0
Reset: 00H
Interrupt Request Register 0
IRCON1
Reset: 00H
Interrupt Request Register 1
IRCON2
Reset: 00H
Interrupt Request Register 2
Bit Field
0
URRIS
H
JTAGT
DIS
JTAGT
CKS
EXINT
2IS
EXINT
1IS
EXINT
0IS
URRIS
Type
r
rw
rw
rw
rw
rw
rw
rw
Bit Field
0
EXINT
6
EXINT
5
EXINT
4
EXINT
3
EXINT
2
EXINT
1
EXINT
0
Type
r
rwh
rwh
rwh
rwh
rwh
rwh
rwh
Bit Field
0
CANS
RC2
CANS
RC1
ADCS
R1
ADCS
R0
RIR
TIR
EIR
Type
r
rwh
rwh
rwh
rwh
rwh
rwh
rwh
Bit Field
0
CANS
RC3
0
CANS
RC0
Type
r
rwh
r
rwh
EXICON0
Reset: F0H
External Interrupt Control
Register 0
Bit Field
EXINT3
EXINT2
EXINT1
EXINT0
Type
rw
rw
rw
rw
EXICON1
Reset: 3FH
External Interrupt Control
Register 1
Bit Field
0
EXINT6
EXINT5
EXINT4
Type
r
rw
rw
rw
NMICON
Reset: 00H
NMI Control Register
Bit Field
0
NMI
ECC
NMI
VDDP
NMI
VDD
NMI
OCDS
NMI
FLASH
NMI
PLL
NMI
WDT
Type
r
rw
rw
rw
rw
rw
rw
rw
Data Sheet
34
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 8
SCU Register Overview (cont’d)
Addr Register Name
Bit
7
6
5
4
3
2
1
0
BCH
Bit Field
0
FNMI
ECC
FNMI
VDDP
FNMI
VDD
FNMI
OCDS
FNMI
FLASH
FNMI
PLL
FNMI
WDT
Type
r
rwh
rwh
rwh
rwh
rwh
rwh
rwh
BGSEL
0
BRDIS
BRPRE
R
rw
r
rw
rw
rw
NMISR
Reset: 00H
NMI Status Register
BCON
Reset: 00H
Baud Rate Control Register
Bit Field
BG
Reset: 00H
Baud Rate Timer/Reload
Register
Bit Field
E9H
FDCON
Reset: 00H
Fractional Divider Control
Register
Bit Field
EAH
FDSTEP
Reset: 00H
Fractional Divider Reload
Register
Bit Field
FDRES
Reset: 00H
Fractional Divider Result
Register
Bit Field
BDH
BEH
EBH
Type
BR_VALUE
Type
Type
rwh
BGS
SYNE
N
ERRS
YN
EOFS
YN
BRK
NDOV
FDM
FDEN
rw
rw
rwh
rwh
rwh
rwh
rw
rw
STEP
Type
rw
RESULT
Type
rh
RMAP = 0, PAGE 1
B3H
B4H
B5H
B6H
B7H
ID
Identity Register
Reset: UUH
PMCON0
Reset: 00H
Power Mode Control Register 0
PMCON1
Reset: 00H
Power Mode Control Register 1
OSC_CON
Reset: 08H
OSC Control Register
PLL_CON
Reset: 90H
PLL Control Register
Bit Field
CMCON
Reset: 10H
Clock Control Register
PASSWD
Reset: 07H
Password Register
BDH
WDT
RST
WKRS
WK
SEL
SD
PD
WS
Type
r
rwh
rwh
rw
rw
rwh
rw
Bit Field
0
CDC_
DIS
CAN_
DIS
MDU_
DIS
T2_
DIS
CCU_
DIS
SSC_
DIS
ADC_
DIS
Type
r
rw
rw
rw
rw
rw
rw
rw
Bit Field
0
OSC
PD
XPD
OSC
SS
ORD
RES
OSCR
Type
r
rw
rw
rw
rwh
rh
NDIV
VCO
BYP
OSC
DISC
RESL
D
LOCK
rw
rw
rw
rwh
rh
Bit Field
Bit Field
VCO
SEL
KDIV
0
FCCF
G
CLKREL
rw
rw
r
rw
rw
Bit Field
FEAL
Reset: 00H
Flash Error Address Register
Low
Bit Field
FEAH
Reset: 00H
Flash Error Address Register
High
Bit Field
Data Sheet
r
0
Type
BCH
r
Bit Field
Type
BBH
VERID
Type
Type
BAH
PRODID
PASS
PROT
ECT_S
MODE
wh
rh
rw
ECCERRADDR
Type
rh
ECCERRADDR
Type
rh
35
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 8
SCU Register Overview (cont’d)
Addr Register Name
Bit
BEH
Bit Field
Type
E9H
COCON
Reset: 00H
Clock Output Control Register
MISC_CON
Reset: 00H
Miscellaneous Control Register
7
6
5
4
3
2
1
0
TLEN
COUT
S
COREL
r
rw
rw
rw
0
Bit Field
0
DFLAS
HEN
Type
r
rwh
RMAP = 0, PAGE 3
B3H
B4H
B5H
B7H
BAH
BBH
BDH
XADDRH
Reset: F0H
On-chip XRAM Address Higher
Order
Bit Field
IRCON3
Reset: 00H
Interrupt Request Register 3
Bit Field
0
CANS
RC5
CCU6
SR1
0
CANS
RC4
CCU6
SR0
Type
r
rwh
rwh
r
rwh
rwh
Bit Field
0
CANS
RC7
CCU6
SR3
0
CANS
RC6
CCU6
SR2
Type
r
rwh
rwh
r
rwh
rwh
IRCON4
Reset: 00H
Interrupt Request Register 4
MODPISEL1
Reset: 00H
Peripheral Input Select Register
1
MODPISEL2
Reset: 00H
Peripheral Input Select Register
2
PMCON2
Reset: 00H
Power Mode Control Register 2
MODSUSP
Reset: 01H
Module Suspend Control
Register
3.2.4.5
ADDRH
Type
Bit Field
Type
rw
EXINT
6IS
0
UR1RIS
T21EX
IS
JTAGT
DIS1
JTAGT
CKS1
rw
r
rw
rw
rw
rw
Bit Field
0
T21IS
T2IS
T1IS
T0IS
Type
r
rw
rw
rw
rw
Bit Field
0
UART
1_DIS
T21_D
IS
Type
r
rw
rw
Bit Field
0
T21SU
SP
T2SUS
P
T13SU
SP
T12SU
SP
WDTS
USP
Type
r
rw
rw
rw
rw
rw
WDT Registers
The WDT SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 9
WDT Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
RMAP = 1
BBH
BCH
BDH
WDTCON
Reset: 00H
Watchdog Timer Control
Register
Bit Field
0
WINB
EN
WDTP
R
0
WDTE
N
WDTR
S
WDTI
N
Type
r
rw
rh
r
rw
rwh
rw
WDTREL
Reset: 00H
Watchdog Timer Reload
Register
Bit Field
WDTWINB
Reset: 00H
Watchdog Window-Boundary
Count Register
Bit Field
Data Sheet
WDTREL
Type
rw
WDTWINB
Type
rw
36
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 9
WDT Register Overview (cont’d)
Addr Register Name
Bit
BEH
WDTL
Reset: 00H
Watchdog Timer Register Low
Bit Field
WDTH
Reset: 00H
Watchdog Timer Register High
Bit Field
BFH
3.2.4.6
7
6
5
4
3
2
1
0
1
0
WDT
Type
rh
WDT
Type
rh
Port Registers
The Port SFRs can be accessed in the standard memory area (RMAP = 0).
Table 10
Port Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
RMAP = 0
B2H
PORT_PAGE
Page Register
Reset: 00H
Bit Field
Type
OP
STNR
0
PAGE
w
w
r
rw
RMAP = 0, PAGE 0
P0_DATA
Reset: 00H
P0 Data Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P0_DIR
Reset: 00H
P0 Direction Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P1_DATA
Reset: 00H
P1 Data Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P1_DIR
Reset: 00H
P1 Direction Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P5_DATA
Reset: 00H
P5 Data Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P5_DIR
Reset: 00H
P5 Direction Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P2_DATA
Reset: 00H
P2 Data Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
A1H
P2_DIR
Reset: 00H
P2 Direction Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
B0H
P3_DATA
Reset: 00H
P3 Data Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P3_DIR
Reset: 00H
P3 Direction Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_DATA
Reset: 00H
P4 Data Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_DIR
Reset: 00H
P4 Direction Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
80H
86H
90H
91H
92H
93H
A0H
B1H
C8H
C9H
Data Sheet
37
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 10
Port Register Overview (cont’d)
Addr Register Name
Bit
7
6
5
4
3
2
1
0
P0_PUDSEL
Reset: FFH
P0 Pull-Up/Pull-Down Select
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P0_PUDEN
Reset: C4H
P0 Pull-Up/Pull-Down Enable
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P1_PUDSEL
Reset: FFH
P1 Pull-Up/Pull-Down Select
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P1_PUDEN
Reset: FFH
P1 Pull-Up/Pull-Down Enable
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P5_PUDSEL
Reset: FFH
P5 Pull-Up/Pull-Down Select
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P5_PUDEN
Reset: FFH
P5 Pull-Up/Pull-Down Enable
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P2_PUDSEL
Reset: FFH
P2 Pull-Up/Pull-Down Select
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P2_PUDEN
Reset: 00H
P2 Pull-Up/Pull-Down Enable
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P3_PUDSEL
Reset: BFH
P3 Pull-Up/Pull-Down Select
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P3_PUDEN
Reset: 40H
P3 Pull-Up/Pull-Down Enable
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_PUDSEL
Reset: FFH
P4 Pull-Up/Pull-Down Select
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_PUDEN
Reset: 04H
P4 Pull-Up/Pull-Down Enable
Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P0_ALTSEL0
Reset: 00H
P0 Alternate Select 0 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P0_ALTSEL1
Reset: 00H
P0 Alternate Select 1 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P1_ALTSEL0
Reset: 00H
P1 Alternate Select 0 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P1_ALTSEL1
Reset: 00H
P1 Alternate Select 1 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P5_ALTSEL0
Reset: 00H
P5 Alternate Select 0 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
RMAP = 0, PAGE 1
80H
86H
90H
91H
92H
93H
A0H
A1H
B0H
B1H
C8H
C9H
RMAP = 0, PAGE 2
80H
86H
90H
91H
92H
Data Sheet
38
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 10
Port Register Overview (cont’d)
Addr Register Name
Bit
7
6
5
4
3
2
1
0
93H
P5_ALTSEL1
Reset: 00H
P5 Alternate Select 1 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P3_ALTSEL0
Reset: 00H
P3 Alternate Select 0 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P3_ALTSEL1
Reset: 00H
P3 Alternate Select 1 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_ALTSEL0
Reset: 00H
P4 Alternate Select 0 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_ALTSEL1
Reset: 00H
P4 Alternate Select 1 Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P7
P6
P5
P4
P3
P2
P1
P0
B0H
B1H
C8H
C9H
RMAP = 0, PAGE 3
80H
P0_OD
Reset: 00H
P0 Open Drain Control Register
Bit Field
Type
rw
rw
rw
rw
rw
rw
rw
rw
90H
P1_OD
Reset: 00H
P1 Open Drain Control Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P5_OD
Reset: 00H
P5 Open Drain Control Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P3_OD
Reset: 00H
P3 Open Drain Control Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
P4_OD
Reset: 00H
P4 Open Drain Control Register
Bit Field
P7
P6
P5
P4
P3
P2
P1
P0
Type
rw
rw
rw
rw
rw
rw
rw
rw
1
0
92H
B0H
C8H
3.2.4.7
ADC Registers
The ADC SFRs can be accessed in the standard memory area (RMAP = 0).
Table 11
ADC Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
RMAP = 0
D1H
ADC_PAGE
Page Register
Reset: 00H
Bit Field
OP
STNR
0
PAGE
w
w
r
rw
Type
RMAP = 0, PAGE 0
CAH
CBH
CCH
ADC_GLOBCTR Reset: 30H
Global Control Register
Bit Field
ADC_GLOBSTR Reset: 00H
Global Status Register
Bit Field
0
CHNR
0
SAMP
LE
BUSY
Type
r
rh
r
rh
rh
ADC_PRAR
Reset: 00H
Priority and Arbitration Register
Type
Bit Field
Type
Data Sheet
ANON
DW
CTC
0
rw
rw
rw
r
ASEN
1
ASEN
0
0
ARBM
CSM1
PRIO1
CSM0
PRIO0
rw
rw
r
rw
rw
rw
rw
rw
39
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 11
ADC Register Overview (cont’d)
Addr Register Name
CDH
CEH
ADC_LCBR
Reset: B7H
Limit Check Boundary Register
Bit
7
6
Bit Field
Bit Field
ADC_ETRCR
Reset: 00H
External Trigger Control
Register
Bit Field
4
3
2
1
BOUND1
BOUND0
rw
rw
Type
ADC_INPCR0
Reset: 00H
Input Class 0 Register
5
0
STC
Type
rw
SYNE
N1
SYNE
N0
ETRSEL1
ETRSEL0
Type
rw
rw
rw
rw
ADC_CHCTR0
Reset: 00H
Channel Control Register 0
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
ADC_CHCTR1
Reset: 00H
Channel Control Register 1
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
ADC_CHCTR2
Reset: 00H
Channel Control Register 2
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
ADC_CHCTR3
Reset: 00H
Channel Control Register 3
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
CEH
ADC_CHCTR4
Reset: 00H
Channel Control Register 4
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
CFH
ADC_CHCTR5
Reset: 00H
Channel Control Register 5
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
ADC_CHCTR6
Reset: 00H
Channel Control Register 6
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
ADC_CHCTR7
Reset: 00H
Channel Control Register 7
Bit Field
0
LCC
0
RESRSEL
Type
r
rw
r
rw
CFH
RMAP = 0, PAGE 1
CAH
CBH
CCH
CDH
D2H
D3H
RMAP = 0, PAGE 2
CAH
ADC_RESR0L
Reset: 00H
Result Register 0 Low
Bit Field
CBH
ADC_RESR0H
Reset: 00H
Result Register 0 High
Bit Field
CCH
ADC_RESR1L
Reset: 00H
Result Register 1 Low
Bit Field
ADC_RESR1H
Reset: 00H
Result Register 1 High
Bit Field
ADC_RESR2L
Reset: 00H
Result Register 2 Low
Bit Field
ADC_RESR2H
Reset: 00H
Result Register 2 High
Bit Field
ADC_RESR3L
Reset: 00H
Result Register 3 Low
Bit Field
CDH
CEH
CFH
D2H
Data Sheet
Type
RESULT
0
VF
DRC
CHNR
rh
r
rh
rh
rh
RESULT
Type
Type
rh
RESULT
0
VF
DRC
CHNR
rh
r
rh
rh
rh
RESULT
Type
Type
rh
RESULT
0
VF
DRC
CHNR
rh
r
rh
rh
rh
RESULT
Type
Type
rh
RESULT
0
VF
DRC
CHNR
rh
r
rh
rh
rh
40
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 11
ADC Register Overview (cont’d)
Addr Register Name
Bit
D3H
Bit Field
ADC_RESR3H
Reset: 00H
Result Register 3 High
7
6
5
4
3
2
1
0
RESULT
Type
rh
RMAP = 0, PAGE 3
ADC_RESRA0L Reset: 00H
Result Register 0, View A Low
Bit Field
ADC_RESRA0H Reset: 00H
Result Register 0, View A High
Bit Field
ADC_RESRA1L Reset: 00H
Result Register 1, View A Low
Bit Field
ADC_RESRA1H Reset: 00H
Result Register 1, View A High
Bit Field
CEH
ADC_RESRA2L Reset: 00H
Result Register 2, View A Low
Bit Field
CFH
ADC_RESRA2H Reset: 00H
Result Register 2, View A High
Bit Field
ADC_RESRA3L Reset: 00H
Result Register 3, View A Low
Bit Field
ADC_RESRA3H Reset: 00H
Result Register 3, View A High
Bit Field
CAH
CBH
CCH
CDH
D2H
D3H
RESULT
VF
DRC
CHNR
rh
rh
rh
rh
Type
RESULT
Type
rh
RESULT
VF
DRC
CHNR
rh
rh
rh
rh
Type
RESULT
Type
rh
RESULT
VF
DRC
CHNR
rh
rh
rh
rh
Type
RESULT
Type
rh
RESULT
VF
DRC
CHNR
rh
rh
rh
rh
Type
RESULT
Type
rh
RMAP = 0, PAGE 4
CAH
ADC_RCR0
Reset: 00H
Result Control Register 0
Bit Field
Type
CBH
ADC_RCR1
Reset: 00H
Result Control Register 1
Bit Field
Type
CCH
ADC_RCR2
Reset: 00H
Result Control Register 2
Bit Field
Type
CDH
ADC_RCR3
Reset: 00H
Result Control Register 3
Bit Field
Type
CEH
ADC_VFCR
Reset: 00H
Valid Flag Clear Register
VFCT
R
WFR
0
IEN
0
DRCT
R
rw
rw
r
rw
r
rw
VFCT
R
WFR
0
IEN
0
DRCT
R
rw
rw
r
rw
r
rw
VFCT
R
WFR
0
IEN
0
DRCT
R
rw
rw
r
rw
r
rw
VFCT
R
WFR
0
IEN
0
DRCT
R
rw
rw
r
rw
r
rw
Bit Field
0
VFC3
VFC2
VFC1
VFC0
Type
r
w
w
w
w
RMAP = 0, PAGE 5
CAH
ADC_CHINFR
Reset: 00H
Channel Interrupt Flag Register
Bit Field
Type
CBH
ADC_CHINCR
Reset: 00H
Channel Interrupt Clear Register
Bit Field
Type
Data Sheet
CHINF
7
CHINF
6
CHINF
5
CHINF
4
CHINF
3
CHINF
2
CHINF
1
CHINF
0
rh
rh
rh
rh
rh
rh
rh
rh
CHINC
7
CHINC
6
CHINC
5
CHINC
4
CHINC
3
CHINC
2
CHINC
1
CHINC
0
w
w
w
w
w
w
w
w
41
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 11
ADC Register Overview (cont’d)
Addr Register Name
Bit
CCH
Bit Field
ADC_CHINSR
Reset: 00H
Channel Interrupt Set Register
Type
CDH
CEH
ADC_CHINPR
Reset: 00H
Channel Interrupt Node Pointer
Register
Bit Field
ADC_EVINFR
Reset: 00H
Event Interrupt Flag Register
Bit Field
Type
Type
CFH
D2H
ADC_EVINCR
Reset: 00H
Event Interrupt Clear Flag
Register
Bit Field
Type
Bit Field
ADC_EVINSR
Reset: 00H
Event Interrupt Set Flag Register
Type
D3H
ADC_EVINPR
Reset: 00H
Event Interrupt Node Pointer
Register
Bit Field
Type
7
6
5
4
3
2
1
0
CHINS
7
CHINS
6
CHINS
5
CHINS
4
CHINS
3
CHINS
2
CHINS
1
CHINS
0
w
w
w
w
w
w
w
w
CHINP
7
CHINP
6
CHINP
5
CHINP
4
CHINP
3
CHINP
2
CHINP
1
CHINP
0
rw
rw
rw
rw
rw
rw
rw
rw
EVINF
7
EVINF
6
EVINF
5
EVINF
4
0
EVINF
1
EVINF
0
rh
rh
rh
rh
r
rh
rh
EVINC
7
EVINC
6
EVINC
5
EVINC
4
0
EVINC
1
EVINC
0
w
w
w
w
r
w
w
EVINS
7
EVINS
6
EVINS
5
EVINS
4
0
EVINS
1
EVINS
0
w
w
w
w
r
w
w
EVINP
7
EVINP
6
EVINP
5
EVINP
4
0
EVINP
1
EVINP
0
rw
rw
rw
rw
r
rw
rw
RMAP = 0, PAGE 6
ADC_CRCR1
Reset: 00H
Conversion Request Control
Register 1
Bit Field
CH7
CH6
CH5
CH4
0
Type
rwh
rwh
rwh
rwh
r
ADC_CRPR1
Reset: 00H
Conversion Request Pending
Register 1
Bit Field
CHP7
CHP6
CHP5
CHP4
0
Type
rwh
rwh
rwh
rwh
r
ADC_CRMR1
Reset: 00H
Conversion Request Mode
Register 1
Bit Field
Rsv
LDEV
CLRP
ND
SCAN
ENSI
ENTR
0
ENGT
r
w
w
rw
rw
rw
r
rw
CDH
ADC_QMR0
Reset: 00H
Queue Mode Register 0
Bit Field
CEV
TREV
FLUS
H
CLRV
0
ENTR
0
ENGT
r
rw
r
CEH
ADC_QSR0
Reset: 20H
Queue Status Register 0
Bit Field
CAH
CBH
CCH
Type
Type
Type
CFH
ADC_Q0R0
Reset: 00H
Queue 0 Register 0
Bit Field
D2H
ADC_QBUR0
Reset: 00H
Queue Backup Register 0
Bit Field
ADC_QINR0
Reset: 00H
Queue Input Register 0
Bit Field
D2H
Data Sheet
Type
Type
Type
w
w
w
w
Rsv
0
EMPT
Y
EV
0
FILL
r
r
rh
rh
r
rh
EXTR
ENSI
RF
V
0
rw
REQCHNR
rh
rh
rh
rh
r
rh
EXTR
ENSI
RF
V
0
REQCHNR
rh
rh
rh
rh
r
rh
EXTR
ENSI
RF
0
REQCHNR
w
w
w
r
w
42
V1.2, 2009-07
XC886/888CLM
Functional Description
3.2.4.8
Timer 2 Registers
The Timer 2 SFRs can be accessed in the standard memory area (RMAP = 0).
Table 12
T2 Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
Bit Field
TF2
EXF2
0
EXEN
2
TR2
C/T2
CP/
RL2
Type
rwh
rwh
r
rw
rwh
rw
rw
T2RE
GS
T2RH
EN
EDGE
SEL
PREN
rw
rw
rw
rw
RMAP = 0
C0H
C1H
T2_T2CON
Reset: 00H
Timer 2 Control Register
T2_T2MOD
Reset: 00H
Timer 2 Mode Register
Bit Field
Type
C2H
C3H
C4H
C5H
T2PRE
rw
T2_RC2L
Reset: 00H
Timer 2 Reload/Capture
Register Low
Bit Field
RC2
Type
rwh
T2_RC2H
Reset: 00H
Timer 2 Reload/Capture
Register High
Bit Field
RC2
Type
rwh
T2_T2L
Reset: 00H
Timer 2 Register Low
Bit Field
T2_T2H
Reset: 00H
Timer 2 Register High
Bit Field
3.2.4.9
rw
DCEN
rw
rw
THL2
Type
rwh
THL2
Type
rwh
Timer 21 Registers
The Timer 21 SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 13
T21 Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
Bit Field
TF2
EXF2
0
EXEN
2
TR2
C/T2
CP/
RL2
Type
rwh
rwh
r
rw
rwh
rw
rw
T2RE
GS
T2RH
EN
EDGE
SEL
PREN
rw
rw
rw
rw
RMAP = 1
C0H
C1H
T21_T2CON
Reset: 00H
Timer 2 Control Register
T21_T2MOD
Reset: 00H
Timer 2 Mode Register
Bit Field
Type
C2H
C3H
C4H
rw
T21_RC2L
Reset: 00H
Timer 2 Reload/Capture
Register Low
Bit Field
RC2
Type
rwh
T21_RC2H
Reset: 00H
Timer 2 Reload/Capture
Register High
Bit Field
RC2
Type
rwh
T21_T2L
Reset: 00H
Timer 2 Register Low
Bit Field
Data Sheet
T2PRE
rw
DCEN
rw
rw
THL2
Type
rwh
43
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 13
T21 Register Overview (cont’d)
Addr Register Name
Bit
C5H
Bit Field
T21_T2H
Reset: 00H
Timer 2 Register High
7
6
5
4
3
2
1
0
THL2
Type
rwh
3.2.4.10 CCU6 Registers
The CCU6 SFRs can be accessed in the standard memory area (RMAP = 0).
Table 14
CCU6 Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
RMAP = 0
A3H
CCU6_PAGE
Page Register
Reset: 00H
Bit Field
OP
STNR
0
PAGE
w
w
r
rw
Type
RMAP = 0, PAGE 0
9AH
9BH
9CH
CCU6_CC63SRL
Reset: 00H
Capture/Compare Shadow Register
for Channel CC63 Low
Bit Field
CCU6_CC63SRH
Reset: 00H
Capture/Compare Shadow Register
for Channel CC63 High
Bit Field
CCU6_TCTR4L
Reset: 00H
Timer Control Register 4 Low
Bit Field
Type
CCU6_TCTR4H
Reset: 00H
Timer Control Register 4 High
Bit Field
Type
9EH
9FH
A4H
A5H
A6H
A7H
rw
CC63SH
Type
Type
9DH
CC63SL
rw
T12
STD
T12
STR
0
DT
RES
T12
RES
T12R
S
T12R
R
w
w
r
w
w
w
w
T13
STD
T13
STR
0
T13
RES
T13R
S
T13R
R
w
w
r
w
w
w
STRM
CM
0
MCMPS
w
r
rw
STRH
P
0
CURHS
EXPHS
w
r
rw
rw
RT12
PM
RT12
OM
RCC6
2F
RCC6
2R
RCC6
1F
RCC6
1R
RCC6
0F
RCC6
0R
w
w
w
w
w
w
w
w
RSTR
RIDLE
RWH
E
RCHE
0
RTRP
F
RT13
PM
RT13
CM
w
w
r
w
w
w
CCU6_MCMOUTSL
Reset: 00H
Multi-Channel Mode Output Shadow
Register Low
Bit Field
CCU6_MCMOUTSH
Reset: 00H
Multi-Channel Mode Output Shadow
Register High
Bit Field
CCU6_ISRL
Reset: 00H
Capture/Compare Interrupt Status
Reset Register Low
Bit Field
CCU6_ISRH
Reset: 00H
Capture/Compare Interrupt Status
Reset Register High
Bit Field
Type
w
w
CCU6_CMPMODIFL
Reset: 00H
Compare State Modification Register
Low
Bit Field
0
MCC6
3S
0
MCC6
2S
MCC6
1S
MCC6
0S
Type
r
w
r
w
w
w
CCU6_CMPMODIFH Reset: 00H
Compare State Modification Register
High
Bit Field
0
MCC6
3R
0
MCC6
2R
MCC6
1R
MCC6
0R
Type
r
w
r
w
w
w
Data Sheet
Type
Type
Type
44
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 14
CCU6 Register Overview (cont’d)
Addr Register Name
Bit
FAH
CCU6_CC60SRL
Reset: 00H
Capture/Compare Shadow Register
for Channel CC60 Low
Bit Field
CCU6_CC60SRH
Reset: 00H
Capture/Compare Shadow Register
for Channel CC60 High
Bit Field
CCU6_CC61SRL
Reset: 00H
Capture/Compare Shadow Register
for Channel CC61 Low
Bit Field
CCU6_CC61SRH
Reset: 00H
Capture/Compare Shadow Register
for Channel CC61 High
Bit Field
CCU6_CC62SRL
Reset: 00H
Capture/Compare Shadow Register
for Channel CC62 Low
Bit Field
CCU6_CC62SRH
Reset: 00H
Capture/Compare Shadow Register
for Channel CC62 High
Bit Field
FBH
FCH
FDH
FEH
FFH
7
6
5
4
3
2
1
0
CC60SL
Type
rwh
CC60SH
Type
rwh
CC61SL
Type
rwh
CC61SH
Type
rwh
CC62SL
Type
rwh
CC62SH
Type
rwh
RMAP = 0, PAGE 1
CCU6_CC63RL
Reset: 00H
Capture/Compare Register for
Channel CC63 Low
Bit Field
CCU6_CC63RH
Reset: 00H
Capture/Compare Register for
Channel CC63 High
Bit Field
CCU6_T12PRL
Reset: 00H
Timer T12 Period Register Low
Bit Field
9DH
CCU6_T12PRH
Reset: 00H
Timer T12 Period Register High
Bit Field
9EH
CCU6_T13PRL
Reset: 00H
Timer T13 Period Register Low
Bit Field
CCU6_T13PRH
Reset: 00H
Timer T13 Period Register High
Bit Field
Type
rwh
CCU6_T12DTCL
Reset: 00H
Dead-Time Control Register for
Timer T12 Low
Bit Field
DTM
CCU6_T12DTCH
Reset: 00H
Dead-Time Control Register for
Timer T12 High
Bit Field
0
DTR2
DTR1
DTR0
0
DTE2
DTE1
DTE0
Type
r
rh
rh
rh
r
rw
rw
rw
CCU6_TCTR0L
Reset: 00H
Timer Control Register 0 Low
Bit Field
CTM
CDIR
STE1
2
T12R
T12
PRE
T12CLK
rw
rh
rh
rh
rw
rw
9AH
9BH
9CH
9FH
A4H
A5H
A6H
FAH
CCU6_TCTR0H
Reset: 00H
Timer Control Register 0 High
CCU6_CC60RL
Reset: 00H
Capture/Compare Register for
Channel CC60 Low
Data Sheet
rh
CC63VH
Type
rh
T12PVL
Type
rwh
T12PVH
Type
rwh
T13PVL
Type
rwh
T13PVH
Type
Type
A7H
CC63VL
Type
rw
Bit Field
0
STE1
3
T13R
T13
PRE
T13CLK
Type
r
rh
rh
rw
rw
CC60VL
Bit Field
Type
rh
45
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 14
CCU6 Register Overview (cont’d)
Addr Register Name
Bit
FBH
CCU6_CC60RH
Reset: 00H
Capture/Compare Register for
Channel CC60 High
Bit Field
CCU6_CC61RL
Reset: 00H
Capture/Compare Register for
Channel CC61 Low
Bit Field
CCU6_CC61RH
Reset: 00H
Capture/Compare Register for
Channel CC61 High
Bit Field
CCU6_CC62RL
Reset: 00H
Capture/Compare Register for
Channel CC62 Low
Bit Field
CCU6_CC62RH
Reset: 00H
Capture/Compare Register for
Channel CC62 High
Bit Field
FCH
FDH
FEH
FFH
7
6
5
4
3
2
1
0
CC60VH
Type
rh
CC61VL
Type
rh
CC61VH
Type
rh
CC62VL
Type
rh
CC62VH
Type
rh
RMAP = 0, PAGE 2
9AH
9BH
9CH
CCU6_T12MSELL
Reset: 00H
T12 Capture/Compare Mode Select
Register Low
Bit Field
CCU6_T12MSELH
Reset: 00H
T12 Capture/Compare Mode Select
Register High
Bit Field
CCU6_IENL
Reset: 00H
Capture/Compare Interrupt Enable
Register Low
Bit Field
9EH
9FH
A4H
A5H
A6H
A7H
FAH
MSEL60
rw
rw
Type
Type
Type
9DH
MSEL61
CCU6_IENH
Reset: 00H
Capture/Compare Interrupt Enable
Register High
Bit Field
CCU6_INPL
Reset: 40H
Capture/Compare Interrupt Node
Pointer Register Low
Bit Field
Type
DBYP
HSYNC
MSEL62
rw
rw
rw
ENT1
2
PM
ENT1
2
OM
ENCC
62F
ENCC
62R
ENCC
61F
ENCC
61R
ENCC
60F
ENCC
60R
rw
rw
rw
rw
rw
rw
rw
rw
EN
STR
EN
IDLE
EN
WHE
EN
CHE
0
EN
TRPF
ENT1
3PM
ENT1
3CM
rw
rw
rw
rw
r
rw
rw
rw
INPCHE
INPCC62
INPCC61
INPCC60
Type
rw
rw
rw
rw
CCU6_INPH
Reset: 39H
Capture/Compare Interrupt Node
Pointer Register High
Bit Field
0
INPT13
INPT12
INPERR
Type
r
rw
rw
rw
CCU6_ISSL
Reset: 00H
Capture/Compare Interrupt Status
Set Register Low
Bit Field
CCU6_ISSH
Reset: 00H
Capture/Compare Interrupt Status
Set Register High
Bit Field
CCU6_PSLR
Reset: 00H
Passive State Level Register
Bit Field
Type
Type
Type
ST12
PM
ST12
OM
SCC6
2F
SCC6
2R
SCC6
1F
SCC6
1R
SCC6
0F
SCC6
0R
w
w
w
w
w
w
w
w
SSTR
SIDLE
SWHE
SCHE
SWH
C
STRP
F
ST13
PM
ST13
CM
w
w
w
w
w
w
w
w
PSL63
0
PSL
rwh
r
rwh
CCU6_MCMCTR
Reset: 00H Bit Field
Multi-Channel Mode Control Register
Type
CCU6_TCTR2L
Reset: 00H
Timer Control Register 2 Low
Data Sheet
0
SWSYN
0
SWSEL
r
rw
r
rw
Bit Field
0
T13TED
T13TEC
T13
SSC
T12
SSC
Type
r
rw
rw
rw
rw
46
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 14
CCU6 Register Overview (cont’d)
Addr Register Name
FBH
FCH
CCU6_TCTR2H
Reset: 00H
Timer Control Register 2 High
CCU6_MODCTRL
Reset: 00H
Modulation Control Register Low
Bit
CCU6_MODCTRH
Reset: 00H
Modulation Control Register High
FFH
CCU6_TRPCTRL
Reset: 00H
Trap Control Register Low
CCU6_TRPCTRH
Reset: 00H
Trap Control Register High
5
4
3
2
1
0
Bit Field
0
T13RSEL
T12RSEL
r
rw
rw
Bit Field
Bit Field
Type
FEH
6
Type
Type
FDH
7
MCM
EN
0
T12MODEN
rw
r
rw
ECT1
3O
0
T13MODEN
rw
r
rw
Bit Field
0
TRPM
2
TRPM
1
TRPM
0
Type
r
rw
rw
rw
TRPP
EN
TRPE
N13
TRPEN
Type
rw
rw
rw
CCU6_MCMOUTL
Reset: 00H
Multi-Channel Mode Output Register
Low
Bit Field
0
R
MCMP
Type
r
rh
rh
CCU6_MCMOUTH
Reset: 00H
Multi-Channel Mode Output Register
High
Bit Field
0
CURH
EXPH
Type
r
rh
rh
CCU6_ISL
Reset: 00H
Capture/Compare Interrupt Status
Register Low
Bit Field
CCU6_ISH
Reset: 00H
Capture/Compare Interrupt Status
Register High
Bit Field
CCU6_PISEL0L
Reset: 00H
Port Input Select Register 0 Low
Bit Field
CCU6_PISEL0H
Reset: 00H
Port Input Select Register 0 High
Bit Field
CCU6_PISEL2
Reset: 00H
Port Input Select Register 2
Bit Field
0
IST13HR
Type
r
rw
CCU6_T12L
Reset: 00H
Timer T12 Counter Register Low
Bit Field
CCU6_T12H
Reset: 00H
Timer T12 Counter Register High
Bit Field
CCU6_T13L
Reset: 00H
Timer T13 Counter Register Low
Bit Field
CCU6_T13H
Reset: 00H
Timer T13 Counter Register High
Bit Field
Bit Field
RMAP = 0, PAGE 3
9AH
9BH
9CH
9DH
9EH
9FH
A4H
FAH
FBH
FCH
FDH
Data Sheet
Type
Type
Type
Type
T12
PM
T12
OM
ICC62
F
ICC62
R
ICC61
F
ICC61
R
ICC60
F
ICC60
R
rh
rh
rh
rh
rh
rh
rh
rh
STR
IDLE
WHE
CHE
TRPS
TRPF
T13
PM
T13
CM
rh
rh
rh
rh
rh
rh
rh
rh
ISTRP
ISCC62
ISCC61
ISCC60
rw
rw
rw
rw
IST12HR
ISPOS2
ISPOS1
ISPOS0
rw
rw
rw
rw
T12CVL
Type
rwh
T12CVH
Type
rwh
T13CVL
Type
rwh
T13CVH
Type
rwh
47
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 14
CCU6 Register Overview (cont’d)
Addr Register Name
Bit
7
6
5
4
3
2
1
0
FEH
Bit Field
0
CC63
ST
CC
POS2
CC
POS1
CC
POS0
CC62
ST
CC61
ST
CC60
ST
Type
r
rh
rh
rh
rh
rh
rh
rh
T13IM
COUT
63PS
COUT
62PS
CC62
PS
COUT
61PS
CC61
PS
COUT
60PS
CC60
PS
rwh
rwh
rwh
rwh
rwh
rwh
rwh
rwh
FFH
CCU6_CMPSTATL
Reset: 00H
Compare State Register Low
CCU6_CMPSTATH
Reset: 00H
Compare State Register High
Bit Field
Type
3.2.4.11 UART1 Registers
The UART1 SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 15
UART1 Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
SM0
SM1
SM2
REN
TB8
RB8
TI
RI
rw
rw
rw
rw
rw
rwh
rwh
rwh
RMAP = 1
C8H
C9H
CAH
CBH
CCH
CDH
CEH
SCON
Reset: 00H
Serial Channel Control Register
Bit Field
SBUF
Reset: 00H
Serial Data Buffer Register
Bit Field
VAL
Type
rwh
BCON
Reset: 00H
Baud Rate Control Register
Bit Field
0
BRPRE
R
Type
r
rw
rw
BG
Reset: 00H
Baud Rate Timer/Reload
Register
Bit Field
FDCON
Reset: 00H
Fractional Divider Control
Register
Bit Field
0
NDOV
FDM
FDEN
Type
r
rwh
rw
rw
FDSTEP
Reset: 00H
Fractional Divider Reload
Register
Bit Field
FDRES
Reset: 00H
Fractional Divider Result
Register
Bit Field
Data Sheet
Type
BR_VALUE
Type
rwh
STEP
Type
rw
RESULT
Type
rh
48
V1.2, 2009-07
XC886/888CLM
Functional Description
3.2.4.12 SSC Registers
The SSC SFRs can be accessed in the standard memory area (RMAP = 0).
Table 16
SSC Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
RMAP = 0
A9H
AAH
AAH
ABH
ABH
ACH
ADH
AEH
AFH
SSC_PISEL
Reset: 00H
Port Input Select Register
Bit Field
0
CIS
SIS
MIS
Type
r
rw
rw
rw
SSC_CONL
Reset: 00H
Control Register Low
Programming Mode
Bit Field
LB
PO
PH
HB
BM
Type
rw
rw
rw
rw
rw
SSC_CONL
Reset: 00H
Control Register Low
Operating Mode
Bit Field
0
BC
Type
r
rh
SSC_CONH
Reset: 00H
Control Register High
Programming Mode
Bit Field
EN
MS
0
AREN
BEN
PEN
REN
TEN
Type
rw
rw
r
rw
rw
rw
rw
rw
SSC_CONH
Reset: 00H
Control Register High
Operating Mode
Bit Field
EN
MS
0
BSY
BE
PE
RE
TE
Type
rw
rw
r
rh
rwh
rwh
rwh
rwh
SSC_TBL
Reset: 00H
Transmitter Buffer Register Low
Bit Field
SSC_RBL
Reset: 00H
Receiver Buffer Register Low
Bit Field
SSC_BRL
Reset: 00H
Baud Rate Timer Reload
Register Low
Bit Field
SSC_BRH
Reset: 00H
Baud Rate Timer Reload
Register High
Bit Field
TB_VALUE
Type
rw
RB_VALUE
Type
rh
BR_VALUE
Type
rw
BR_VALUE
Type
rw
3.2.4.13 MultiCAN Registers
The MultiCAN SFRs can be accessed in the standard memory area (RMAP = 0).
Table 17
CAN Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
ADCON
Reset: 00H
CAN Address/Data Control
Register
Bit Field
V3
V2
V1
V0
AUAD
BSY
RWEN
Type
rw
rw
rw
rw
rw
rh
rw
ADL
Reset: 00H
CAN Address Register Low
Bit Field
CA9
CA8
CA7
CA6
CA5
CA4
CA3
CA2
Type
rwh
rwh
rwh
rwh
rwh
rwh
rwh
rwh
ADH
Reset: 00H
CAN Address Register High
Bit Field
0
CA13
CA12
CA11
CA10
Type
r
rwh
rwh
rwh
rwh
RMAP = 0
D8H
D9H
DAH
Data Sheet
49
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 17
CAN Register Overview (cont’d)
Addr Register Name
Bit
DBH
DATA0
Reset: 00H
CAN Data Register 0
Bit Field
CD
Type
rwh
DATA1
Reset: 00H
CAN Data Register 1
Bit Field
CD
Type
rwh
DATA2
Reset: 00H
CAN Data Register 2
Bit Field
CD
Type
rwh
DATA3
Reset: 00H
CAN Data Register 3
Bit Field
CD
Type
rwh
DCH
DDH
DEH
7
6
5
4
3
2
1
0
3.2.4.14 OCDS Registers
The OCDS SFRs can be accessed in the mapped memory area (RMAP = 1).
Table 18
OCDS Register Overview
Addr Register Name
Bit
7
6
5
4
3
2
1
0
STMO
DE
EXBC
DSUS
P
MBCO
N
ALTDI
MMEP
MMOD
E
JENA
rw
rw
rw
rwh
rw
rwh
rh
rh
MEXIT
_P
MEXIT
0
MSTE
P
MRAM
S_P
MRAM
S
TRF
RRF
w
rwh
r
rw
w
rwh
rh
rh
MBCA
M
MBCIN
EXBF
SWBF
HWB3
F
HWB2
F
HWB1
F
HWB0
F
rw
rwh
rwh
rwh
rwh
rwh
rwh
rwh
RMAP = 1
E9H
F1H
MMCR2
Reset: 1UH
Monitor Mode Control 2
Register
MMCR
Reset: 00H
Monitor Mode Control Register
Bit Field
Type
Bit Field
Type
F2H
MMSR
Reset: 00H
Monitor Mode Status Register
Bit Field
Type
F3H
MMBPCR
Reset: 00H
Breakpoints Control Register
Bit Field
Type
F4H
F5H
F6H
F7H
EBH
SWBC
HWB3C
HWB2C
HWB1
C
HWB0C
rw
rw
rw
rw
rw
MMICR
Reset: 00H
Monitor Mode Interrupt Control
Register
Bit Field
MMDR
Reset: 00H
Monitor Mode Data Transfer
Register
Receive
Bit Field
HWBPSR
Reset: 00H
Hardware Breakpoints Select
Register
Bit Field
0
BPSEL
_P
BPSEL
Type
r
w
rw
HWBPDR
Reset: 00H
Hardware Breakpoints Data
Register
Bit Field
MMWR1
Reset: 00H
Monitor Work Register 1
Bit Field
Data Sheet
Type
DVEC
T
DRET
R
COMR
ST
MSTS
EL
MMUI
E_P
MMUI
E
RRIE_
P
RRIE
rwh
rwh
rwh
rh
w
rw
w
rw
MMRR
Type
rh
HWBPxx
Type
rw
MMWR1
Type
rw
50
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 18
OCDS Register Overview (cont’d)
Addr Register Name
Bit
ECH
Bit Field
MMWR2
Reset: 00H
Monitor Work Register 2
Data Sheet
7
6
5
4
3
2
1
0
MMWR2
Type
rw
51
V1.2, 2009-07
XC886/888CLM
Functional Description
3.3
Flash Memory
The Flash memory provides an embedded user-programmable non-volatile memory,
allowing fast and reliable storage of user code and data. It is operated from a single 2.5 V
supply from the Embedded Voltage Regulator (EVR) and does not require additional
programming or erasing voltage. The sectorization of the Flash memory allows each
sector to be erased independently.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
In-System Programming (ISP) via UART
In-Application Programming (IAP)
Error Correction Code (ECC) for dynamic correction of single-bit errors
Background program and erase operations for CPU load minimization
Support for aborting erase operation
Minimum program width1) of 32-byte for D-Flash and 64-byte for P-Flash
1-sector minimum erase width
1-byte read access
Flash is delivered in erased state (read all zeros)
Operating supply voltage: 2.5 V ± 7.5 %
Read access time: 3 × tCCLK = 125 ns2)
Program time: 248256 / fSYS = 2.6 ms3)
Erase time: 9807360 / fSYS = 102 ms3)
1) P-Flash: 64-byte wordline can only be programmed once, i.e., one gate disturb allowed.
D-Flash: 32-byte wordline can be programmed twice, i.e., two gate disturbs allowed.
2) Values shown here are typical values. fsys = 96 MHz ± 7.5% (fCCLK = 24 MHz ± 7.5 %) is the maximum
frequency range for Flash read access.
3) Values shown here are typical values. fsys = 96 MHz ± 7.5% is the only frequency range for Flash
programming and erasing. fsysmin is used for obtaining the worst case timing.
Data Sheet
52
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 19 shows the Flash data retention and endurance targets.
Table 19
Flash Data Retention and Endurance (Operating Conditions apply)
Endurance1)
Size
Remarks
20 years
1,000 cycles
up to 32 Kbytes2)
for 32-Kbyte Variant
20 years
1,000 cycles
up to 24 Kbytes2)
for 24-Kbyte Variant
20 years
1,000 cycles
4 Kbytes
5 years
10,000 cycles
1 Kbyte
2 years
70,000 cycles
512 bytes
2 years
100,000 cycles
128 bytes
Retention
Program Flash
Data Flash
1) One cycle refers to the programming of all wordlines in a sector and erasing of sector. The Flash endurance
data specified in Table 19 is valid only if the following conditions are fulfilled:
- the maximum number of erase cycles per Flash sector must not exceed 100,000 cycles.
- the maximum number of erase cycles per Flash bank must not exceed 300,000 cycles.
- the maximum number of program cycles per Flash bank must not exceed 2,500,000 cycles.
2) If no Flash is used for data, the Program Flash size can be up to the maximum Flash size available in the
device variant. Having more Data Flash will mean less Flash is available for Program Flash.
3.3.1
Flash Bank Sectorization
The XC886/888 product family offers Flash devices with either 24 Kbytes or 32 Kbytes
of embedded Flash memory. Each Flash device consists of Program Flash (P-Flash)
and Data Flash (D-Flash) bank(s) with different sectorization shown in Figure 11. Both
types can be used for code and data storage. The label “Data” neither implies that the
D-Flash is mapped to the data memory region, nor that it can only be used for data
storage. It is used to distinguish the different Flash bank sectorizations.
The 32-Kbyte Flash device consists of 6 P-Flash and 2 D-Flash banks, while the 24Kbyte Flash device consists of also of 6 P-Flash banks but with the upper 2 banks only
2 Kbytes each, and only 1 D-Flash bank. The XC886/888 ROM devices offer a single 4Kbyte D-Flash bank.
The P-Flash banks are always grouped in pairs. As such, the P-Flash banks are also
sometimes referred to as P-Flash bank pair. Each sector in a P-Flash bank is grouped
with the corresponding sector from the other bank within a bank pair to form a P-Flash
bank pair sector.
Data Sheet
53
V1.2, 2009-07
XC886/888CLM
Functional Description
Sector 2: 128-byte
Sector 1: 128-byte
Sector
Sector
Sector
Sector
9:
8:
7:
6:
128-byte
128-byte
128-byte
128-byte
Sector 5: 256-byte
Sector 4: 256-byte
Sector 3: 512-byte
Sector 0: 3.75-Kbyte
Sector 2: 512-byte
Sector 1: 1-Kbyte
Sector 0: 1-Kbyte
P-Flash
Figure 11
D-Flash
Flash Bank Sectorization
The internal structure of each Flash bank represents a sector architecture for flexible
erase capability. The minimum erase width is always a complete sector, and sectors can
be erased separately or in parallel. Contrary to standard EPROMs, erased Flash
memory cells contain 0s.
The D-Flash bank is divided into more physical sectors for extended erasing and
reprogramming capability; even numbers for each sector size are provided to allow
greater flexibility and the ability to adapt to a wide range of application requirements.
3.3.2
Parallel Read Access of P-Flash
To enhance system performance, the P-Flash banks are configured for parallel read to
allow two bytes of linear code to be read in 4 x CCLK cycles, compared to 6 x CCLK
cycles if serial read is performed. This is achieved by reading two bytes in parallel from
a P-Flash bank pair within the 3 x CCLK cycles access time and storing them in a cache.
Subsequent read from the cache by the CPU does not require a wait state and can be
completed within 1 x CCLK cycle. The result is the average instruction fetch time from
the P-Flash banks is reduced and thus, the MIPS (Mega Instruction Per Second) of the
system is increased.
However, if the parallel read feature is not desired due to certain timing constraints, it can
be disabled by calling the parallel read disable subroutine.
Data Sheet
54
V1.2, 2009-07
XC886/888CLM
Functional Description
3.3.3
Flash Programming Width
For the P-Flash banks, a programmed wordline (WL) must be erased before it can be
reprogrammed as the Flash cells can only withstand one gate disturb. This means that
the entire sector containing the WL must be erased since it is impossible to erase a
single WL.
For the D-Flash bank, the same WL can be programmed twice before erasing is required
as the Flash cells are able to withstand two gate disturbs. This means if the number of
data bytes that needs to be written is smaller than the 32-byte minimum programming
width, the user can opt to program this number of data bytes (x; where x can be any
integer from 1 to 31) first and program the remaining bytes (32 - x) later. Hence, it is
possible to program the same WL, for example, with 16 bytes of data two times (see
Figure 12)
32 bytes (1 WL)
16 bytes
16 bytes
0000 ….. 0000 H
0000 ….. 0000 H
Program 1
0000 ….. 0000 H
1111 ….. 1111 H
0000 ….. 0000 H
1111 ….. 1111 H
Program 2
1111 ….. 0000 H
0000 ….. 0000 H
1111 ….. 0000 H
1111 ….. 1111 H
Note: A Flash memory cell can be programmed
from 0 to 1, but not from 1 to 0.
Flash memory cells
Figure 12
32-byte write buffers
D-Flash Programming
Note: When programming a D-Flash WL the second time, the previously programmed
Flash memory cells (whether 0s or 1s) should be reprogrammed with 0s to retain
its original contents and to prevent “over-programming”.
Data Sheet
55
V1.2, 2009-07
XC886/888CLM
Functional Description
3.4
Interrupt System
The XC800 Core supports one non-maskable interrupt (NMI) and 14 maskable interrupt
requests. In addition to the standard interrupt functions supported by the core, e.g.,
configurable interrupt priority and interrupt masking, the XC886/888 interrupt system
provides extended interrupt support capabilities such as the mapping of each interrupt
vector to several interrupt sources to increase the number of interrupt sources
supported, and additional status registers for detecting and determining the interrupt
source.
3.4.1
Interrupt Source
Figure 13 to Figure 17 give a general overview of the interrupt sources and nodes, and
their corresponding control and status flags.
WDT Overflow
FNMIWDT
NMIISR.0
NMIWDT
NMICON.0
PLL Loss of Lock
FNMIPLL
NMIISR.1
NMIPLL
NMICON.1
Flash Operation
Complete
FNMIFLASH
NMIISR.2
NMIFLASH
>=1
VDD Pre-Warning
0073
FNMIVDD
NMIISR.4
H
Non
Maskable
Interrupt
NMIVDD
NMICON.4
VDDP Pre-Warning
FNMIVDDP
NMIISR.5
NMIVDDP
NMICON.5
Flash ECC Error
FNMIECC
NMIISR.6
NMIECC
NMICON.6
Figure 13
Data Sheet
Non-Maskable Interrupt Request Sources
56
V1.2, 2009-07
XC886/888CLM
Functional Description
Highest
Timer 0
Overflow
TF0
TCON.5
ET0
000B
H
IEN0.1
Timer 1
Overflow
Lowest
Priority Level
IP.1/
IPH.1
TF1
TCON.7
ET1
001B
H
IEN0.3
UART
Receive
IP.3/
IPH.3
RI
SCON.0
UART
Transmit
>=1
TI
ES
SCON.1
IEN0.4
0023
H
IP.4/
IPH.4
IE0
EINT0
P
o
l
l
i
n
g
TCON.1
IT0
EX0
0003
H
IEN0.0
TCON.0
S
e
q
u
e
n
c
e
IP.0/
IPH.0
EXINT0
EXICON0.0/1
IE1
EINT1
TCON.3
IT1
EX1
0013
H
IEN0.2
TCON.2
EXINT1
IP.2/
IPH.2
EA
EXICON0.2/3
IEN0.7
Bit-addressable
Request flag is cleared by hardware
Figure 14
Data Sheet
Interrupt Request Sources (Part 1)
57
V1.2, 2009-07
XC886/888CLM
Functional Description
Highest
Timer 2
Overflow
TF2
Lowest
Priority Level
T2_T2CON.7
>=1
T2EX
EXF2
EXEN2
EDGES
EL
T2_T2MOD.5
T2_T2CON.6
T2_T2CON.3
Normal Divider
Overflow
NDOV
FDCON.2
End of
Synch Byte
Synch Byte
Error
>=1
EOFSYN
FDCON.4
ET2
>=1
002B
H
IEN0.5
ERRSYN
IP.5/
IPH.5
SYNEN
FDCON.5
MultiCAN_0
CANSRC0
IRCON2.0
ADC_0
ADCSR0
IRCON1.3
ADC_1
ADCSR1
IRCON1.4
MultiCAN_1
>=1
CANSRC1
EADC
IRCON1.5
MultiCAN_2
0033
H
IEN1.0
CANSRC2
IP1.0/
IPH1.0
P
o
l
l
i
n
g
S
e
q
u
e
n
c
e
EA
IEN0.7
IRCON1.6
Bit-addressable
Request flag is cleared by hardware
Figure 15
Data Sheet
Interrupt Request Sources (Part 2)
58
V1.2, 2009-07
XC886/888CLM
Functional Description
Highest
SSC_EIR
Lowest
Priority Level
EIR
IRCON1.0
SSC_TIR
TIR
>=1
IRCON1.1
SSC_RIR
ESSC
RIR
003B
H
IEN1.1
IP1.1/
IPH1.1
IRCON1.2
P
o
l
l
i
n
g
EXINT2
EINT2
IRCON0.2
EXINT2
EXICON0.4/5
RI
UART1_SCON.0
UART1
>=1
TI
UART1_SCON.1
Timer 21
Overflow
TF2
>=1
T21_T2CON.7
T21EX
>=1
EX2
0043
H
IEN1.2
EXF2
IP1.2/
IPH1.2
S
e
q
u
e
n
c
e
EXEN2 T21_T2CON.6
EDGES
EL
T21_T2MOD.5
T21_T2CON.3
Normal Divider
Overflow
NDOV
UART1_FDCON.2
Cordic
EOC
CDSTATC.2
MDU_0
IRDY
MDUSTAT.0
MDU_1
EA
IERR
MDUSTAT.1
IEN0.7
Bit-addressable
Request flag is cleared by hardware
Figure 16
Data Sheet
Interrupt Request Sources (Part 3)
59
V1.2, 2009-07
XC886/888CLM
Functional Description
Highest
Lowest
Priority Level
EXINT3
EINT3
IRCON0.3
EXINT3
EXICON0.6/7
EXINT4
EINT4
P
o
l
l
i
n
g
IRCON0.4
EXINT3
EXICON1.0/1
>=1
EXINT5
EINT5
IRCON0.5
EXM
004B
H
IEN1.3
EXINT5
EXICON1.2/3
EXINT6
EINT6
IRCON0.6
IP1.3/
IPH1.3
S
e
q
u
e
n
c
e
EXINT6
EXICON1.4/5
MultiCAN_3
CANSRC3
EA
IEN0.7
IRCON2.4
Bit-addressable
Request flag is cleared by hardware
Figure 17
Data Sheet
Interrupt Request Sources (Part 4)
60
V1.2, 2009-07
XC886/888CLM
Functional Description
Highest
Lowest
CCU6 interrupt node 0
IRCON3.0
MultiCAN_4
Priority Level
CCU6SR0
>=1
CANSRC4
ECCIP0
IRCON3.1
CCU6 interrupt node 1
IEN1.4
ECCIP1
IRCON3.5
>=1
ECCIP2
0063
H
IEN1.6
IRCON4.1
IP1.5/
IPH1.5
IP1.6/
IPH1.6
P
o
l
l
i
n
g
S
e
q
u
e
n
c
e
CCU6SRC3
IRCON4.4
MultiCAN_7
H
IEN1.5
CANSRC6
CCU6 interrupt node 3
005B
CCU6SR2
IRCON4.0
MutliCAN_6
IP1.4/
IPH1.4
>=1
CANSRC5
CCU6 interrupt node 2
H
CCU6SR1
IRCON3.4
MultiCAN_5
0053
>=1
CANSRC7
IRCON4.5
ECCIP3
006B
H
IEN1.7
IP1.7/
IPH1.7
EA
IEN0.7
Bit-addressable
Request flag is cleared by hardware
Figure 18
Data Sheet
Interrupt Request Sources (Part 5)
61
V1.2, 2009-07
XC886/888CLM
Functional Description
3.4.2
Interrupt Source and Vector
Each interrupt event source has an associated interrupt vector address for the interrupt
node it belongs to. This vector is accessed to service the corresponding interrupt node
request. The interrupt service of each interrupt source can be individually enabled or
disabled via an enable bit. The assignment of the XC886/888 interrupt sources to the
interrupt vector address and the corresponding interrupt node enable bits are
summarized in Table 20.
Table 20
Interrupt
Source
NMI
Interrupt Vector Addresses
Vector
Address
Assignment for
XC886/888
Enable Bit
SFR
0073H
Watchdog Timer NMI
NMIWDT
NMICON
PLL NMI
NMIPLL
Flash NMI
NMIFLASH
VDDC Prewarning NMI
NMIVDD
VDDP Prewarning NMI
NMIVDDP
Flash ECC NMI
NMIECC
XINTR0
0003H
External Interrupt 0
EX0
XINTR1
000BH
Timer 0
ET0
XINTR2
0013H
External Interrupt 1
EX1
XINTR3
001BH
Timer 1
ET1
XINTR4
0023H
UART
ES
XINTR5
002BH
T2
ET2
IEN0
UART Fractional Divider
(Normal Divider Overflow)
MultiCAN Node 0
LIN
Data Sheet
62
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 20
Interrupt
Source
XINTR6
Interrupt Vector Addresses (cont’d)
Vector
Address
Assignment for
XC886/888
Enable Bit
SFR
0033H
MultiCAN Nodes 1 and 2
EADC
IEN1
ADC[1:0]
XINTR7
003BH
SSC
ESSC
XINTR8
0043H
External Interrupt 2
EX2
T21
CORDIC
UART1
UART1 Fractional Divider
(Normal Divider Overflow)
MDU[1:0]
XINTR9
004BH
External Interrupt 3
EXM
External Interrupt 4
External Interrupt 5
External Interrupt 6
MultiCAN Node 3
XINTR10
0053H
CCU6 INP0
ECCIP0
MultiCAN Node 4
XINTR11
005BH
CCU6 INP1
ECCIP1
MultiCAN Node 5
XINTR12
0063H
CCU6 INP2
ECCIP2
MultiCAN Node 6
XINTR13
006BH
CCU6 INP3
ECCIP3
MultiCAN Node 7
Data Sheet
63
V1.2, 2009-07
XC886/888CLM
Functional Description
3.4.3
Interrupt Priority
An interrupt that is currently being serviced can only be interrupted by a higher-priority
interrupt, but not by another interrupt of the same or lower priority. Hence, an interrupt of
the highest priority cannot be interrupted by any other interrupt request.
If two or more requests of different priority levels are received simultaneously, the
request of the highest priority is serviced first. If requests of the same priority are
received simultaneously, then an internal polling sequence determines which request is
serviced first. Thus, within each priority level, there is a second priority structure
determined by the polling sequence shown in Table 21.
Table 21
Priority Structure within Interrupt Level
Source
Level
Non-Maskable Interrupt (NMI)
(highest)
External Interrupt 0
1
Timer 0 Interrupt
2
External Interrupt 1
3
Timer 1 Interrupt
4
UART Interrupt
5
Timer 2,UART Normal Divider Overflow,
MultiCAN, LIN Interrupt
6
ADC, MultiCAN Interrupt
7
SSC Interrupt
8
External Interrupt 2, Timer 21, UART1, UART1
9
Normal Divider Overflow, MDU, CORDIC Interrupt
External Interrupt [6:3], MultiCAN Interrupt
10
CCU6 Interrupt Node Pointer 0, MultiCAN interrupt 11
CCU6 Interrupt Node Pointer 1, MultiCAN Interrupt 12
CCU6 Interrupt Node Pointer 2, MultiCAN Interrupt 13
CCU6 Interrupt Node Pointer 3, MultiCAN Interrupt 14
Data Sheet
64
V1.2, 2009-07
XC886/888CLM
Functional Description
3.5
Parallel Ports
The XC886 has 34 port pins organized into five parallel ports, Port 0 (P0) to Port 4 (P4),
while the XC888 has 48 port pins organized into six parallel ports, Port 0 (P0) to Port 5
(P5). Each pin has a pair of internal pull-up and pull-down devices that can be individually
enabled or disabled. Ports P0, P1, P3, P4 and P5 are bidirectional and can be used as
general purpose input/output (GPIO) or to perform alternate input/output functions for the
on-chip peripherals. When configured as an output, the open drain mode can be
selected. Port P2 is an input-only port, providing general purpose input functions,
alternate input functions for the on-chip peripherals, and also analog inputs for the
Analog-to-Digital Converter (ADC).
Bidirectional Port Features
•
•
•
•
•
Configurable pin direction
Configurable pull-up/pull-down devices
Configurable open drain mode
Transfer of data through digital inputs and outputs (general purpose I/O)
Alternate input/output for on-chip peripherals
Input Port Features
•
•
•
•
•
Configurable input driver
Configurable pull-up/pull-down devices
Receive of data through digital input (general purpose input)
Alternate input for on-chip peripherals
Analog input for ADC module
Data Sheet
65
V1.2, 2009-07
XC886/888CLM
Functional Description
Figure 19 shows the structure of a bidirectional port pin.
Internal Bus
Px_PUDSEL
Pull-up/Pull-down
Select Register
Px_PUDEN
Pull-up/Pull-down
Enable Register
Px_OD
Open Drain
Control Register
Px_DIR
Direction Register
Px_ALTSEL0
Alternate Select
Register 0
VDDP
Px_ALTSEL1
Alternate Select
Register 1
enable
AltDataOut 3
AltDataOut 2
AltDataOut1
enable
11
10
Pull
Up
Device
Output
Driver
Pin
01
00
Px_Data
Data Register
enable
Out
In
Input
Driver
Schmitt Trigger
AltDataIn
enable
Pull
Down
Device
Pad
Figure 19
Data Sheet
General Structure of Bidirectional Port
66
V1.2, 2009-07
XC886/888CLM
Functional Description
Figure 20 shows the structure of an input-only port pin.
Internal Bus
Px_PUDSEL
Pull-up/Pull-down
Select Register
Px_PUDEN
Pull-up/Pull-down
Enable Register
Px_DIR
Direction Register
VDDP
enable
enable
Px_DATA
Data Register
In
Input
Driver
Pull
Up
Device
Pin
Schmitt Trigger
AltDataIn
AnalogIn
enable
Pull
Down
Device
Pad
Figure 20
Data Sheet
General Structure of Input Port
67
V1.2, 2009-07
XC886/888CLM
Functional Description
3.6
Power Supply System with Embedded Voltage Regulator
The XC886/888 microcontroller requires two different levels of power supply:
•
•
3.3 V or 5.0 V for the Embedded Voltage Regulator (EVR) and Ports
2.5 V for the core, memory, on-chip oscillator, and peripherals
Figure 21 shows the XC886/888 power supply system. A power supply of 3.3 V or 5.0 V
must be provided from the external power supply pin. The 2.5 V power supply for the
logic is generated by the EVR. The EVR helps to reduce the power consumption of the
whole chip and the complexity of the application board design.
The EVR consists of a main voltage regulator and a low power voltage regulator. In
active mode, both voltage regulators are enabled. In power-down mode, the main
voltage regulator is switched off, while the low power voltage regulator continues to
function and provide power supply to the system with low power consumption.
CPU &
Memory
On-chip
OSC
Peripheral
logic
ADC
V DDC (2.5V)
FLASH
PLL
GPIO Ports
(P0-P5)
XTAL1&
XTAL2
EVR
VDDP (3.3V/5.0V)
VSSP
Figure 21
XC886/888 Power Supply System
EVR Features
•
•
•
•
•
Input voltage (VDDP): 3.3 V/5.0 V
Output voltage (VDDC): 2.5 V ± 7.5%
Low power voltage regulator provided in power-down mode
VDDC and VDDP prewarning detection
VDDC brownout detection
Data Sheet
68
V1.2, 2009-07
XC886/888CLM
Functional Description
3.7
Reset Control
The XC886/888 has five types of reset: power-on reset, hardware reset, watchdog timer
reset, power-down wake-up reset, and brownout reset.
When the XC886/888 is first powered up, the status of certain pins (see Table 23) must
be defined to ensure proper start operation of the device. At the end of a reset sequence,
the sampled values are latched to select the desired boot option, which cannot be
modified until the next power-on reset or hardware reset. This guarantees stable
conditions during the normal operation of the device.
In order to power up the system properly, the external reset pin RESET must be asserted
until VDDC reaches 0.9*VDDC. The delay of external reset can be realized by an external
capacitor at RESET pin. This capacitor value must be selected so that VRESET reaches
0.4 V, but not before VDDC reaches 0.9* VDDC.
A typical application example is shown in Figure 22. The VDDP capacitor value is 100 nF
while the VDDC capacitor value is 220 nF. The capacitor connected to RESET pin is
100 nF.
Typically, the time taken for VDDC to reach 0.9*VDDC is less than 50 µs once VDDP reaches
2.3V. Hence, based on the condition that 10% to 90% VDDP (slew rate) is less than
500 µs, the RESET pin should be held low for 500 µs typically. See Figure 23.
VIN
VR
3.3 / 5V
220nF
100nF
V DDP
VSSP
typ.
100nF
VDDC
VSSC
RESET
EVR
30k
XC886/888
Figure 22
Data Sheet
Reset Circuitry
69
V1.2, 2009-07
XC886/888CLM
Functional Description
Voltage
5V
VDDP
2.5V
2.3V
0.9*VDDC
VDDC
Time
Voltage
RESET with
capacitor
5V
< 0.4V
0V
Time
typ. < 50µs
Figure 23
VDDP, VDDC and VRESET during Power-on Reset
The second type of reset in XC886/888 is the hardware reset. This reset function can be
used during normal operation or when the chip is in power-down mode. A reset input pin
RESET is provided for the hardware reset.
The Watchdog Timer (WDT) module is also capable of resetting the device if it detects
a malfunction in the system.
Another type of reset that needs to be detected is a reset while the device is in
power-down mode (wake-up reset). While the contents of the static RAM are undefined
after a power-on reset, they are well defined after a wake-up reset from power-down
mode.
Data Sheet
70
V1.2, 2009-07
XC886/888CLM
Functional Description
3.7.1
Module Reset Behavior
Table 22 lists the functions of the XC886/888 and the various reset types that affect
these functions. The symbol “■” signifies that the particular function is reset to its default
state.
Table 22
Effect of Reset on Device Functions
Module/
Function
Wake-Up
Reset
Watchdog
Reset
Hardware
Reset
Power-On
Reset
Brownout
Reset
CPU Core
■
■
■
■
■
Peripherals
■
■
■
■
■
On-Chip
Static RAM
Not affected, Not affected, Not affected, Affected, un- Affected, unReliable
Reliable
Reliable
reliable
reliable
Oscillator,
PLL
■
Not affected ■
■
■
Port Pins
■
■
■
■
■
EVR
The voltage
regulator is
switched on
Not affected ■
■
■
FLASH
■
■
■
■
■
NMI
Disabled
Disabled
■
■
■
3.7.2
Booting Scheme
When the XC886/888 is reset, it must identify the type of configuration with which to start
the different modes once the reset sequence is complete. Thus, boot configuration
information that is required for activation of special modes and conditions needs to be
applied by the external world through input pins. After power-on reset or hardware reset,
the pins MBC, TMS and P0.0 collectively select the different boot options. Table 23
shows the available boot options in the XC886/888.
Table 23
MBC
XC886/888 Boot Selection
TMS
P0.0
Type of Mode
1
0
X
User Mode1); on-chip OSC/PLL non-bypassed 0000H
0
0
X
BSL Mode; on-chip OSC/PLL non-bypassed2) 0000H
0
1
0
OCDS Mode; on-chip OSC/PLL nonbypassed
0000H
1
1
0
User (JTAG) Mode3); on-chip OSC/PLL nonbypassed (normal)
0000H
Data Sheet
PC Start Value
71
V1.2, 2009-07
XC886/888CLM
Functional Description
1) BSL mode is automatically entered if no valid password is installed and data at memory address 0000H equals
zero.
2) OSC is bypassed in MultiCAN BSL mode
3) Normal user mode with standard JTAG (TCK,TDI,TDO) pins for hot-attach purpose.
Note: The boot options are valid only with the default set of UART and JTAG pins.
3.8
Clock Generation Unit
The Clock Generation Unit (CGU) allows great flexibility in the clock generation for the
XC886/888. The power consumption is indirectly proportional to the frequency, whereas
the performance of the microcontroller is directly proportional to the frequency. During
user program execution, the frequency can be programmed for an optimal ratio between
performance and power consumption. Therefore the power consumption can be
adapted to the actual application state.
Features
•
•
•
•
•
Phase-Locked Loop (PLL) for multiplying clock source by different factors
PLL Base Mode
Prescaler Mode
PLL Mode
Power-down mode support
The CGU consists of an oscillator circuit and a PLL. In the XC886/888, the oscillator can
be from either of these two sources: the on-chip oscillator (9.6 MHz) or the external
oscillator (4 MHz to 12 MHz). The term “oscillator” is used to refer to both on-chip
oscillator and external oscillator, unless otherwise stated. After the reset, the on-chip
oscillator will be used by default.The external oscillator can be selected via software. In
addition, the PLL provides a fail-safe logic to perform oscillator run and loss-of-lock
detection. This allows emergency routines to be executed for system recovery or to
perform system shut down.
Data Sheet
72
V1.2, 2009-07
XC886/888CLM
Functional Description
OSC
fosc
osc fail
detect
OSCR
lock
detect
LOCK
P:1
PLL
core
fp
fn
N:1
OSCDISC
Figure 24
fsys
K:1
fvco
PLLBYP
VCOBYP
NDIV
CGU Block Diagram
PLL Base Mode
When the oscillator is disconnected from the PLL, the system clock is derived from the
VCO base (free running) frequency clock (Table 25) divided by the K factor.
1
f SYS = f VCObase × ---K
(3.1)
Prescaler Mode (VCO Bypass Operation)
In VCO bypass operation, the system clock is derived from the oscillator clock, divided
by the P and K factors.
1
f SYS = f OSC × ------------P×K
(3.2)
Data Sheet
73
V1.2, 2009-07
XC886/888CLM
Functional Description
PLL Mode
The system clock is derived from the oscillator clock, multiplied by the N factor, and
divided by the P and K factors. Both VCO bypass and PLL bypass must be inactive for
this PLL mode. The PLL mode is used during normal system operation.
N
f SYS = f OSC × ------------P×K
(3.3)
System Frequency Selection
For the XC886/888, the value of P is fixed to 1. In order to obtain the required fsys, the
value of N and K can be selected by bits NDIV and KDIV respectively for different
oscillator inputs. The output frequency must always be configured for 96 MHz. Table 24
provides examples on how fsys = 96 MHz can be obtained for the different oscillator
sources.
Table 24
System frequency (fsys = 96 MHz)
Oscillator
Fosc
N
P
K
Fsys
On-chip
9.6 MHz
20
1
2
96 MHz
External
8 MHz
24
1
2
96 MHz
6 MHz
32
1
2
96 MHz
4 MHz
48
1
2
96 MHz
Data Sheet
74
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 25 shows the VCO range for the XC886/888.
Table 25
VCO Range
fVCOmin
fVCOmax
fVCOFREEmin
fVCOFREEmax
Unit
150
200
20
80
MHz
100
150
10
80
MHz
3.8.1
Recommended External Oscillator Circuits
The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal
oscillator or an external stable clock source. It basically consists of an inverting amplifier
and a feedback element with XTAL1 as input, and XTAL2 as output.
When using a crystal, a proper external oscillator circuitry must be connected to both
pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz
to 12 MHz. Additionally, it is necessary to have two load capacitances CX1 and CX2, and
depending on the crystal type, a series resistor RX2, to limit the current. A test resistor RQ
may be temporarily inserted to measure the oscillation allowance (negative resistance)
of the oscillator circuitry. RQ values are typically specified by the crystal vendor. The CX1
and CX2 values shown in Figure 25 can be used as starting points for the negative
resistance evaluation and for non-productive systems. The exact values and related
operating range are dependent on the crystal frequency and have to be determined and
optimized together with the crystal vendor using the negative resistance method.
Oscillation measurement with the final target system is strongly recommended to verify
the input amplitude at XTAL1 and to determine the actual oscillation allowance (margin
negative resistance) for the oscillator-crystal system.
When using an external clock signal, the signal must be connected to XTAL1. XTAL2 is
left open (unconnected).
The oscillator can also be used in combination with a ceramic resonator. The final
circuitry must also be verified by the resonator vendor. Figure 25 shows the
recommended external oscillator circuitries for both operating modes, external crystal
mode and external input clock mode.
Data Sheet
75
V1.2, 2009-07
XC886/888CLM
Functional Description
f OSC
XTAL1
4 - 12
MHz
RQ
CX1
XC886/888
Oscillator
R X2
XTAL2
CX2
V SS
VSS
Crystal Frequency CX1, CX2
33
18
15
12
1)
pF
pF
pF
pF
RX2
1)
0
0
0
0
Clock_EXOSC
1) Note that these are evaluation start values!
Figure 25
fOSC
XTAL1
XC886/888
Oscillator
XTAL2
Fundamental
Mode Crystal
4 MHz
8 MHz
10 MHz
12 MHz
External Clock
Signal
External Oscillator Circuitry
Note: For crystal operation, it is strongly recommended to measure the negative
resistance in the final target system (layout) to determine the optimum parameters
for the oscillator operation. Please refer to the minimum and maximum values of
the negative resistance specified by the crystal supplier.
Data Sheet
76
V1.2, 2009-07
XC886/888CLM
Functional Description
3.8.2
Clock Management
The CGU generates all clock signals required within the microcontroller from a single
clock, fsys. During normal system operation, the typical frequencies of the different
modules are as follow:
•
•
•
•
CPU clock: CCLK, SCLK = 24 MHz
Fast clock (used by MultiCAN): FCLK = 24 or 48 MHz
Peripheral clock: PCLK = 24 MHz
Flash Interface clock: CCLK2 = 48 MHz and CCLK = 24 MHz
In addition, different clock frequencies can be output to pin CLKOUT (P0.0 or P0.7). The
clock output frequency, which is derived from the clock output divider (bit COREL), can
further be divided by 2 using toggle latch (bit TLEN is set to 1). The resulting output
frequency has a 50% duty cycle. Figure 26 shows the clock distribution of the
XC886/888.
FCCFG
FCLK
CLKREL
MultiCAN
SD
PCLK
1
OSC
fosc
PLL
Peripherals
SCLK
fsys=
96MHz
/2
0
CCLK
CORE
/2
CCLK2
COREL
N,P,K
FLASH
Interface
TLEN
Toggle
Latch
CLKOUT
COUTS
Figure 26
Data Sheet
Clock Generation from fsys
77
V1.2, 2009-07
XC886/888CLM
Functional Description
For power saving purposes, the clocks may be disabled or slowed down according to
Table 26.
Table 26
System frequency (fsys = 96 MHz)
Power Saving Mode
Action
Idle
Clock to the CPU is disabled.
Slow-down
Clocks to the CPU and all the peripherals are divided by a
common programmable factor defined by bit field
CMCON.CLKREL.
Power-down
Oscillator and PLL are switched off.
Data Sheet
78
V1.2, 2009-07
XC886/888CLM
Functional Description
3.9
Power Saving Modes
The power saving modes of the XC886/888 provide flexible power consumption through
a combination of techniques, including:
•
•
•
•
Stopping the CPU clock
Stopping the clocks of individual system components
Reducing clock speed of some peripheral components
Power-down of the entire system with fast restart capability
After a reset, the active mode (normal operating mode) is selected by default (see
Figure 27) and the system runs in the main system clock frequency. From active mode,
different power saving modes can be selected by software. They are:
•
•
•
Idle mode
Slow-down mode
Power-down mode
ACTIVE
any interrupt
& SD=0
set PD
bit
set IDLE
bit
set SD
bit
IDLE
EXINT0/RXD pin
& SD=0
clear SD
bit
set IDLE
bit
any interrupt
& SD=1
Figure 27
Data Sheet
POWER-DOWN
set PD
bit
SLOW-DOWN
EXINT0/RXD pin
& SD=1
Transition between Power Saving Modes
79
V1.2, 2009-07
XC886/888CLM
Functional Description
3.10
Watchdog Timer
The Watchdog Timer (WDT) provides a highly reliable and secure way to detect and
recover from software or hardware failures. The WDT is reset at a regular interval that is
predefined by the user. The CPU must service the WDT within this interval to prevent the
WDT from causing an XC886/888 system reset. Hence, routine service of the WDT
confirms that the system is functioning properly. This ensures that an accidental
malfunction of the XC886/888 will be aborted in a user-specified time period.
In debug mode, the WDT is default suspended and stops counting. Therefore, there is
no need to refresh the WDT during debugging.
Features
•
•
•
•
•
16-bit Watchdog Timer
Programmable reload value for upper 8 bits of timer
Programmable window boundary
Selectable input frequency of fPCLK/2 or fPCLK/128
Time-out detection with NMI generation and reset prewarning activation (after which
a system reset will be performed)
The WDT is a 16-bit timer incremented by a count rate of fPCLK/2 or fPCLK/128. This 16-bit
timer is realized as two concatenated 8-bit timers. The upper 8 bits of the WDT can be
preset to a user-programmable value via a watchdog service access in order to modify
the watchdog expire time period. The lower 8 bits are reset on each service access.
Figure 28 shows the block diagram of the WDT unit.
WDT
Control
Clear
1:2
MUX
f PCLK
WDTREL
WDT Low Byte
WDT High Byte
1:128
Overflow/Time-out Control &
Window-boundary control
WDTIN
ENWDT
FNMIWDT
.
WDTRST
Logic
ENWDT_P
Figure 28
Data Sheet
WDTWINB
WDT Block Diagram
80
V1.2, 2009-07
XC886/888CLM
Functional Description
If the WDT is not serviced before the timer overflow, a system malfunction is assumed.
As a result, the WDT NMI is triggered (assert FNMIWDT) and the reset prewarning is
entered. The prewarning period lasts for 30H count, after which the system is reset
(assert WDTRST).
The WDT has a “programmable window boundary” which disallows any refresh during
the WDT’s count-up. A refresh during this window boundary constitutes an invalid
access to the WDT, causing the reset prewarning to be entered but without triggering the
WDT NMI. The system will still be reset after the prewarning period is over. The window
boundary is from 0000H to the value obtained from the concatenation of WDTWINB and
00H.
After being serviced, the WDT continues counting up from the value (<WDTREL> * 28).
The time period for an overflow of the WDT is programmable in two ways:
•
•
The input frequency to the WDT can be selected to be either fPCLK/2 or fPCLK/128
The reload value WDTREL for the high byte of WDT can be programmed in register
WDTREL
The period, PWDT, between servicing the WDT and the next overflow can be determined
by the following formula:
2 ( 1 + WDTIN × 6 ) × ( 2 16 – WDTREL × 2 8 )
P WDT = --------------------------------------------------------------------------------------------------------f PCLK
(3.4)
If the Window-Boundary Refresh feature of the WDT is enabled, the period PWDT
between servicing the WDT and the next overflow is shortened if WDTWINB is greater
than WDTREL, see Figure 29. This period can be calculated using the same formula by
replacing WDTREL with WDTWINB. For this feature to be useful, WDTWINB cannot be
smaller than WDTREL.
Data Sheet
81
V1.2, 2009-07
XC886/888CLM
Functional Description
Count
FFFFH
WDTWINB
WDTREL
time
No refresh
allowed
Figure 29
Refresh allowed
WDT Timing Diagram
Table 27 lists the possible watchdog time ranges that can be achieved using a certain
module clock. Some numbers are rounded to 3 significant digits.
Table 27
Reload value
In WDTREL
Watchdog Time Ranges
Prescaler for fPCLK
2 (WDTIN = 0)
128 (WDTIN = 1)
24 MHz
24 MHz
FFH
21.3 µs
1.37 ms
7FH
2.75 ms
176 ms
00H
5.46 ms
350 ms
Data Sheet
82
V1.2, 2009-07
XC886/888CLM
Functional Description
3.11
Multiplication/Division Unit
The Multiplication/Division Unit (MDU) provides fast 16-bit multiplication, 16-bit and
32-bit division as well as shift and normalize features. It has been integrated to support
the XC886/888 Core in real-time control applications, which require fast mathematical
computations.
Features
•
•
•
•
Fast signed/unsigned 16-bit multiplication
Fast signed/unsigned 32-bit divide by 16-bit and 16-bit divide by 16-bit operations
32-bit unsigned normalize operation
32-bit arithmetic/logical shift operations
Table 28 specifies the number of clock cycles used for calculation in various operations.
Table 28
MDU Operation Characteristics
Operation
Result
Remainder
Signed 32-bit/16-bit
32-bit
16-bit
33
Signed 16-bit/16bit
16-bit
16-bit
17
Signed 16-bit x 16-bit
32-bit
-
16
Unsigned 32-bit/16-bit
32-bit
16-bit
32
Unsigned 16-bit/16-bit
16-bit
16-bit
16
Unsigned 16-bit x 16-bit
32-bit
-
16
32-bit normalize
-
-
No. of shifts + 1 (Max. 32)
32-bit shift L/R
-
-
No. of shifts + 1 (Max. 32)
Data Sheet
83
No. of Clock Cycles
used for calculation
V1.2, 2009-07
XC886/888CLM
Functional Description
3.12
CORDIC Coprocessor
The CORDIC Coprocessor provides CPU with hardware support for the solving of
circular (trigonometric), linear (multiply-add, divide-add) and hyperbolic functions.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Modes of operation
– Supports all CORDIC operating modes for solving circular (trigonometric), linear
(multiply-add, divide-add) and hyperbolic functions
– Integrated look-up tables (LUTs) for all operating modes
Circular vectoring mode: Extended support for values of initial X and Y data up to full
range of [-215,(215-1)] for solving angle and magnitude
Circular rotation mode: Extended support for values of initial Z data up to full range
of [-215,(215-1)], representing angles in the range [-π,((215-1)/215)π] for solving
trigonometry
Implementation-dependent operational frequency of up to 80 MHz
Gated clock input to support disabling of module
16-bit accessible data width
– 24-bit kernel data width plus 2 overflow bits for X and Y each
– 20-bit kernel data width plus 1 overflow bit for Z
– With KEEP bit to retain the last value in the kernel register for a new calculation
16 iterations per calculation: Approximately 41 clock-cycles or less, from set of start
(ST) bit to set of end-of-calculation flag, excluding time taken for write and read
access of data bytes.
Twos complement data processing
– Only exception: X result data with user selectable option for unsigned result
X and Y data generally accepted as integer or rational number; X and Y must be of
the same data form
Entries of LUTs are 20-bit signed integers
– Entries of atan and atanh LUTs are integer representations (S19) of angles with
the scaling such that [-215,(215-1)] represents the range [-π,((215-1)/215)π]
– Accessible Z result data for circular and hyperbolic functions is integer in data form
of S15
Emulated LUT for linear function
– Data form is 1 integer bit and 15-bit fractional part (1.15)
– Accessible Z result data for linear function is rational number with fixed data form
of S4.11 (signed 4Q16)
Truncation Error
– The result of a CORDIC calculation may return an approximation due to truncation
of LSBs
– Good accuracy of the CORDIC calculated result data, especially in circular mode
Interrupt
– On completion of a calculation
Data Sheet
84
V1.2, 2009-07
XC886/888CLM
Functional Description
– Interrupt enabling and corresponding flag
3.13
UART and UART1
The XC886/888 provides two Universal Asynchronous Receiver/Transmitter (UART and
UART1) modules for full-duplex asynchronous reception/transmission. Both are also
receive-buffered, i.e., they can commence reception of a second byte before a
previously received byte has been read from the receive register. However, if the first
byte still has not been read by the time reception of the second byte is complete, one of
the bytes will be lost.
Features
•
•
•
•
Full-duplex asynchronous modes
– 8-bit or 9-bit data frames, LSB first
– Fixed or variable baud rate
Receive buffered
Multiprocessor communication
Interrupt generation on the completion of a data transmission or reception
The UART modules can operate in the four modes shown in Table 29.
Table 29
UART Modes
Operating Mode
Baud Rate
Mode 0: 8-bit shift register
fPCLK/2
Mode 1: 8-bit shift UART
Variable
Mode 2: 9-bit shift UART
fPCLK/32 or fPCLK/641)
Mode 3: 9-bit shift UART
Variable
1) For UART1 module, the baud rate is fixed at fPCLK/64.
There are several ways to generate the baud rate clock for the serial port, depending on
the mode in which it is operating. In mode 0, the baud rate for the transfer is fixed at
fPCLK/2. In mode 2, the baud rate is generated internally based on the UART input clock
and can be configured to eitherfPCLK/32 or fPCLK/64. For UART1 module, only fPCLK/64 is
available. The variable baud rate is set by the underflow rate on the dedicated baud-rate
generator. For UART module, the variable baud rate alternatively can be set by the
overflow rate on Timer 1.
3.13.1
Baud-Rate Generator
Both UART modules have their own dedicated baud-rate generator, which is based on
a programmable 8-bit reload value, and includes divider stages (i.e., prescaler and
Data Sheet
85
V1.2, 2009-07
XC886/888CLM
Functional Description
fractional divider) for generating a wide range of baud rates based on its input clock fPCLK,
see Figure 30.
Fractional Divider
8-Bit Reload Value
FDSTEP
1
FDM
1
FDEN&FDM
0
Adder
fDIV
00
01
0
FDRES
FDEN
fMOD (overflow)
0
1
11
8-Bit Baud Rate Timer
fBR
10
R
fPCLK
Prescaler
fDIV
clk
11
10
NDOV
01
‘0’
Figure 30
00
Baud-rate Generator Circuitry
The baud rate timer is a count-down timer and is clocked by either the output of the
fractional divider (fMOD) if the fractional divider is enabled (FDCON.FDEN = 1), or the
output of the prescaler (fDIV) if the fractional divider is disabled (FDEN = 0). For baud rate
generation, the fractional divider must be configured to fractional divider mode
(FDCON.FDM = 0). This allows the baud rate control run bit BCON.R to be used to start
or stop the baud rate timer. At each timer underflow, the timer is reloaded with the 8-bit
reload value in register BG and one clock pulse is generated for the serial channel.
Enabling the fractional divider in normal divider mode (FDEN = 1 and FDM = 1) stops the
baud rate timer and nullifies the effect of bit BCON.R. See Section 3.14.
The baud rate (fBR) value is dependent on the following parameters:
•
•
•
•
Input clock fPCLK
Prescaling factor (2BRPRE) defined by bit field BRPRE in register BCON
Fractional divider (STEP/256) defined by register FDSTEP
(to be considered only if fractional divider is enabled and operating in fractional
divider mode)
8-bit reload value (BR_VALUE) for the baud rate timer defined by register BG
Data Sheet
86
V1.2, 2009-07
XC886/888CLM
Functional Description
The following formulas calculate the final baud rate without and with the fractional divider
respectively:
f PCLK
BRPRE
baud rate = ------------------------------------------------------------------------------------ where 2
× ( BR_VALUE + 1 ) > 1
BRPRE
16 × 2
× ( BR_VALUE + 1 )
(3.5)
f PCLK
STEP
baud rate = ------------------------------------------------------------------------------------ × --------------BRPRE
256
16 × 2
× ( BR_VALUE + 1 )
(3.6)
The maximum baud rate that can be generated is limited to fPCLK/32. Hence, for a module
clock of 24 MHz, the maximum achievable baud rate is 0.75 MBaud.
Standard LIN protocol can support a maximum baud rate of 20 kHz, the baud rate
accuracy is not critical and the fractional divider can be disabled. Only the prescaler is
used for auto baud rate calculation. For LIN fast mode, which supports the baud rate of
20 kHz to 115.2 kHz, the higher baud rates require the use of the fractional divider for
greater accuracy.
Table 30 lists the various commonly used baud rates with their corresponding parameter
settings and deviation errors. The fractional divider is disabled and a module clock of
24 MHz is used.
Table 30
Typical Baud rates for UART with Fractional Divider disabled
Baud rate
Prescaling Factor
(2BRPRE)
Reload Value
(BR_VALUE + 1)
Deviation Error
19.2 kBaud
1 (BRPRE=000B)
78 (4EH)
0.17 %
9600 Baud
1 (BRPRE=000B)
156 (9CH)
0.17 %
4800 Baud
2 (BRPRE=001B)
156 (9CH)
0.17 %
2400 Baud
4 (BRPRE=010B)
156 (9CH)
0.17 %
The fractional divider allows baud rates of higher accuracy (lower deviation error) to be
generated. Table 31 lists the resulting deviation errors from generating a baud rate of
115.2 kHz, using different module clock frequencies. The fractional divider is enabled
(fractional divider mode) and the corresponding parameter settings are shown.
Data Sheet
87
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 31
fPCLK
Deviation Error for UART with Fractional Divider enabled
Prescaling Factor Reload Value
STEP
(2BRPRE)
(BR_VALUE + 1)
Deviation
Error
24 MHz
1
10 (AH)
197 (C5H)
+0.20 %
12 MHz
1
6 (6H)
236 (ECH)
+0.03 %
8 MHz
1
4 (4H)
236 (ECH)
+0.03 %
6 MHz
1
3 (3H)
236 (ECH)
+0.03 %
3.13.2
Baud Rate Generation using Timer 1
In UART modes 1 and 3 of UART module, Timer 1 can be used for generating the
variable baud rates. In theory, this timer could be used in any of its modes. But in
practice, it should be set into auto-reload mode (Timer 1 mode 2), with its high byte set
to the appropriate value for the required baud rate. The baud rate is determined by the
Timer 1 overflow rate and the value of SMOD as follows:
SMOD
2
× f PCLK
Mode 1, 3 baud rate = ---------------------------------------------------32 × 2 × ( 256 – TH1 )
(3.7)
3.14
Normal Divider Mode (8-bit Auto-reload Timer)
Setting bit FDM in register FDCON to 1 configures the fractional divider to normal divider
mode, while at the same time disables baud rate generation (see Figure 30). Once the
fractional divider is enabled (FDEN = 1), it functions as an 8-bit auto-reload timer (with
no relation to baud rate generation) and counts up from the reload value with each input
clock pulse. Bit field RESULT in register FDRES represents the timer value, while bit
field STEP in register FDSTEP defines the reload value. At each timer overflow, an
overflow flag (FDCON.NDOV) will be set and an interrupt request generated. This gives
an output clock fMOD that is 1/n of the input clock fDIV, where n is defined by 256 - STEP.
The output frequency in normal divider mode is derived as follows:
1
f MOD = f DIV × -----------------------------256 – STEP
(3.8)
Data Sheet
88
V1.2, 2009-07
XC886/888CLM
Functional Description
3.15
LIN Protocol
The UART module can be used to support the Local Interconnect Network (LIN) protocol
for both master and slave operations. The LIN baud rate detection feature, which
consists of the hardware logic for Break and Synch Byte detection, provides the
capability to detect the baud rate within LIN protocol using Timer 2. This allows the UART
to be synchronized to the LIN baud rate for data transmission and reception.
Note: The LIN baud rate detection feature is available for use only with UART. To use
UART1 for LIN communication, software has to be implemented to detect the
Break and Synch Byte.
LIN is a holistic communication concept for local interconnected networks in vehicles.
The communication is based on the SCI (UART) data format, a single-master/multipleslave concept, a clock synchronization for nodes without stabilized time base. An
attractive feature of LIN is self-synchronization of the slave nodes without a crystal or
ceramic resonator, which significantly reduces the cost of hardware platform. Hence, the
baud rate must be calculated and returned with every message frame.
The structure of a LIN frame is shown in Figure 31. The frame consists of the:
•
•
•
•
Header, which comprises a Break (13-bit time low), Synch Byte (55H), and ID field
Response time
Data bytes (according to UART protocol)
Checksum
Frame slot
Frame
Header
Synch
Figure 31
3.15.1
Response
space
Protected
identifier
Response
Data 1
Data 2
Data N
Checksum
Structure of LIN Frame
LIN Header Transmission
LIN header transmission is only applicable in master mode. In the LIN communication,
a master task decides when and which frame is to be transferred on the bus. It also
identifies a slave task to provide the data transported by each frame. The information
Data Sheet
89
V1.2, 2009-07
XC886/888CLM
Functional Description
needed for the handshaking between the master and slave tasks is provided by the
master task through the header portion of the frame.
The header consists of a break and synch pattern followed by an identifier. Among these
three fields, only the break pattern cannot be transmitted as a normal 8-bit UART data.
The break must contain a dominant value of 13 bits or more to ensure proper
synchronization of slave nodes.
In the LIN communication, a slave task is required to be synchronized at the beginning
of the protected identifier field of frame. For this purpose, every frame starts with a
sequence consisting of a break field followed by a synch byte field. This sequence is
unique and provides enough information for any slave task to detect the beginning of a
new frame and be synchronized at the start of the identifier field.
Upon entering LIN communication, a connection is established and the transfer speed
(baud rate) of the serial communication partner (host) is automatically synchronized in
the following steps:
STEP 1: Initialize interface for reception and timer for baud rate measurement
STEP 2: Wait for an incoming LIN frame from host
STEP 3: Synchronize the baud rate to the host
STEP 4: Enter for Master Request Frame or for Slave Response Frame
Note: Re-synchronization and setup of baud rate are always done for every Master
Request Header or Slave Response Header LIN frame.
Data Sheet
90
V1.2, 2009-07
XC886/888CLM
Functional Description
3.16
High-Speed Synchronous Serial Interface
The High-Speed Synchronous Serial Interface (SSC) supports full-duplex and
half-duplex synchronous communication. The serial clock signal can be generated by
the SSC internally (master mode), using its own 16-bit baud-rate generator, or can be
received from an external master (slave mode). Data width, shift direction, clock polarity
and phase are programmable. This allows communication with SPI-compatible devices
or devices using other synchronous serial interfaces.
Features
•
•
•
•
•
•
Master and slave mode operation
– Full-duplex or half-duplex operation
Transmit and receive buffered
Flexible data format
– Programmable number of data bits: 2 to 8 bits
– Programmable shift direction: LSB or MSB shift first
– Programmable clock polarity: idle low or high state for the shift clock
– Programmable clock/data phase: data shift with leading or trailing edge of the shift
clock
Variable baud rate
Compatible with Serial Peripheral Interface (SPI)
Interrupt generation
– On a transmitter empty condition
– On a receiver full condition
– On an error condition (receive, phase, baud rate, transmit error)
Data is transmitted or received on lines TXD and RXD, which are normally connected to
the pins MTSR (Master Transmit/Slave Receive) and MRST (Master Receive/Slave
Transmit). The clock signal is output via line MS_CLK (Master Serial Shift Clock) or input
via line SS_CLK (Slave Serial Shift Clock). Both lines are normally connected to the pin
SCLK. Transmission and reception of data are double-buffered.
Figure 32 shows the block diagram of the SSC.
Data Sheet
91
V1.2, 2009-07
XC886/888CLM
Functional Description
PCLK
Baud-rate
Generator
SS_CLK
MS_CLK
Clock
Control
Shift
Clock
RIR
SSC Control Block
Register CON
Status
Receive Int. Request
TIR
Transmit Int. Request
EIR
Error Int. Request
Control
TXD(Master)
Pin
Control
16-Bit Shift
Register
RXD(Slave)
TXD(Slave)
RXD(Master)
Transmit Buffer
Register TB
Receive Buffer
Register RB
Internal Bus
Figure 32
Data Sheet
SSC Block Diagram
92
V1.2, 2009-07
XC886/888CLM
Functional Description
3.17
Timer 0 and Timer 1
Timer 0 and Timer 1 can function as both timers or counters. When functioning as a
timer, Timer 0 and Timer 1 are incremented every machine cycle, i.e. every 2 input
clocks (or 2 PCLKs). When functioning as a counter, Timer 0 and Timer 1 are
incremented in response to a 1-to-0 transition (falling edge) at their respective external
input pins, T0 or T1.
Timer 0 and 1 are fully compatible and can be configured in four different operating
modes for use in a variety of applications, see Table 32. In modes 0, 1 and 2, the two
timers operate independently, but in mode 3, their functions are specialized.
Table 32
Timer 0 and Timer 1 Modes
Mode
Operation
0
13-bit timer
The timer is essentially an 8-bit counter with a divide-by-32 prescaler.
This mode is included solely for compatibility with Intel 8048 devices.
1
16-bit timer
The timer registers, TLx and THx, are concatenated to form a 16-bit
counter.
2
8-bit timer with auto-reload
The timer register TLx is reloaded with a user-defined 8-bit value in THx
upon overflow.
3
Timer 0 operates as two 8-bit timers
The timer registers, TL0 and TH0, operate as two separate 8-bit counters.
Timer 1 is halted and retains its count even if enabled.
Data Sheet
93
V1.2, 2009-07
XC886/888CLM
Functional Description
3.18
Timer 2 and Timer 21
Timer 2 and Timer 21 are 16-bit general purpose timers (THL2) that are fully compatible
and have two modes of operation, a 16-bit auto-reload mode and a 16-bit one channel
capture mode, see Table 33. As a timer, the timers count with an input clock of PCLK/12
(if prescaler is disabled). As a counter, they count 1-to-0 transitions on pin T2. In the
counter mode, the maximum resolution for the count is PCLK/24 (if prescaler is
disabled).
Table 33
Timer 2 Modes
Mode
Description
Auto-reload Up/Down Count Disabled
• Count up only
• Start counting from 16-bit reload value, overflow at FFFFH
• Reload event configurable for trigger by overflow condition only, or by
negative/positive edge at input pin T2EX as well
• Programmble reload value in register RC2
• Interrupt is generated with reload event
Up/Down Count Enabled
• Count up or down, direction determined by level at input pin T2EX
• No interrupt is generated
• Count up
– Start counting from 16-bit reload value, overflow at FFFFH
– Reload event triggered by overflow condition
– Programmble reload value in register RC2
• Count down
– Start counting from FFFFH, underflow at value defined in register
RC2
– Reload event triggered by underflow condition
– Reload value fixed at FFFFH
Channel
capture
Data Sheet
•
•
•
•
•
•
•
Count up only
Start counting from 0000H, overflow at FFFFH
Reload event triggered by overflow condition
Reload value fixed at 0000H
Capture event triggered by falling/rising edge at pin T2EX
Captured timer value stored in register RC2
Interrupt is generated with reload or capture event
94
V1.2, 2009-07
XC886/888CLM
Functional Description
3.19
Capture/Compare Unit 6
The Capture/Compare Unit 6 (CCU6) provides two independent timers (T12, T13), which
can be used for Pulse Width Modulation (PWM) generation, especially for AC-motor
control. The CCU6 also supports special control modes for block commutation and
multi-phase machines.
The timer T12 can function in capture and/or compare mode for its three channels. The
timer T13 can work in compare mode only.
The multi-channel control unit generates output patterns, which can be modulated by
T12 and/or T13. The modulation sources can be selected and combined for the signal
modulation.
Timer T12 Features
•
•
•
•
•
•
•
•
•
Three capture/compare channels, each channel can be used either as a capture or
as a compare channel
Supports generation of a three-phase PWM (six outputs, individual signals for
highside and lowside switches)
16-bit resolution, maximum count frequency = peripheral clock frequency
Dead-time control for each channel to avoid short-circuits in the power stage
Concurrent update of the required T12/13 registers
Generation of center-aligned and edge-aligned PWM
Supports single-shot mode
Supports many interrupt request sources
Hysteresis-like control mode
Timer T13 Features
•
•
•
•
•
One independent compare channel with one output
16-bit resolution, maximum count frequency = peripheral clock frequency
Can be synchronized to T12
Interrupt generation at period-match and compare-match
Supports single-shot mode
Additional Features
•
•
•
•
•
•
•
Implements block commutation for Brushless DC-drives
Position detection via Hall-sensor pattern
Automatic rotational speed measurement for block commutation
Integrated error handling
Fast emergency stop without CPU load via external signal (CTRAP)
Control modes for multi-channel AC-drives
Output levels can be selected and adapted to the power stage
The block diagram of the CCU6 module is shown in Figure 33.
Data Sheet
95
V1.2, 2009-07
XC886/888CLM
Functional Description
module kernel
compare
1
channel 2
1
multichannel
control
compare
channel 3
compare
capture
T13
compare
start
compare
interrupt
control
1
2
3
2
2
trap
control
3
trap input
clock
control
channel 1
deadtime
control
output select
T12
1
Hall input
address
decoder
output select
channel 0
1
CTRAP
CCPOS2
CCPOS1
CCPOS0
CC62
COUT62
CC61
COUT61
CC60
COUT60
COUT63
T13HR
T12HR
input / output control
port control
CCU6_block_diagram
Figure 33
Data Sheet
CCU6 Block Diagram
96
V1.2, 2009-07
XC886/888CLM
Functional Description
3.20
Controller Area Network (MultiCAN)
The MultiCAN module contains two Full-CAN nodes operating independently or
exchanging data and remote frames via a gateway function. Transmission and reception
of CAN frames is handled in accordance to CAN specification V2.0 B active. Each CAN
node can receive and transmit standard frames with 11-bit identifiers as well as extended
frames with 29-bit identifiers.
Both CAN nodes share a common set of message objects, where each message object
may be individually allocated to one of the CAN nodes. Besides serving as a storage
container for incoming and outgoing frames, message objects may be combined to build
gateways between the CAN nodes or to setup a FIFO buffer.
The message objects are organized in double chained lists, where each CAN node has
it’s own list of message objects. A CAN node stores frames only into message objects
that are allocated to the list of the CAN node. It only transmits messages from objects of
this list. A powerful, command driven list controller performs all list operations.
The bit timings for the CAN nodes are derived from the peripheral clock (fCAN) and are
programmable up to a data rate of 1 MBaud. A pair of receive and transmit pins connects
each CAN node to a bus transceiver.
MultiCAN Module Kernel
CANSRC[7:0]
Interrupt
Controller
fCAN
Clock
Control
Message
Object
Buffer
32
Objects
Address
Decoder &
Data
control
Linked
List
Control
CAN
Node 1
CAN
Node 0
TXDC1
RXDC1
TXDC0
Port
Control
RXDC0
A[13: 2]
D[31:0]
Access Mediator
CAN Control
MultiCAN_XC8_overview
Figure 34
Overview of the MultiCAN
Features
•
Compliant to ISO 11898.
Data Sheet
97
V1.2, 2009-07
XC886/888CLM
Functional Description
•
•
•
•
•
•
•
•
•
•
CAN functionality according to CAN specification V2.0 B active.
Dedicated control registers are provided for each CAN node.
A data transfer rate up to 1 MBaud is supported.
Flexible and powerful message transfer control and error handling capabilities are
implemented.
Advanced CAN bus bit timing analysis and baud rate detection can be performed for
each CAN node via the frame counter.
Full-CAN functionality: A set of 32 message objects can be individually
– allocated (assigned) to any CAN node
– configured as transmit or receive object
– setup to handle frames with 11-bit or 29-bit identifier
– counted or assigned a timestamp via a frame counter
– configured to remote monitoring mode
Advanced Acceptance Filtering:
– Each message object provides an individual acceptance mask to filter incoming
frames.
– A message object can be configured to accept only standard or only extended
frames or to accept both standard and extended frames.
– Message objects can be grouped into 4 priority classes.
– The selection of the message to be transmitted first can be performed on the basis
of frame identifier, IDE bit and RTR bit according to CAN arbitration rules.
Advanced Message Object Functionality:
– Message Objects can be combined to build FIFO message buffers of arbitrary
size, which is only limited by the total number of message objects.
– Message objects can be linked to form a gateway to automatically transfer frames
between 2 different CAN buses. A single gateway can link any two CAN nodes. An
arbitrary number of gateways may be defined.
Advanced Data Management:
– The Message objects are organized in double chained lists.
– List reorganizations may be performed any time, even during full operation of the
CAN nodes.
– A powerful, command driven list controller manages the organization of the list
structure and ensures consistency of the list.
– Message FIFOs are based on the list structure and can easily be scaled in size
during CAN operation.
– Static Allocation Commands offer compatibility with TwinCAN applications, which
are not list based.
Advanced Interrupt Handling:
– Up to 8 interrupt output lines are available. Most interrupt requests can be
individually routed to one of the 8 interrupt output lines.
– Message postprocessing notifications can be flexibly aggregated into a dedicated
register field of 64 notification bits.
Data Sheet
98
V1.2, 2009-07
XC886/888CLM
Functional Description
3.21
Analog-to-Digital Converter
The XC886/888 includes a high-performance 10-bit Analog-to-Digital Converter (ADC)
with eight multiplexed analog input channels. The ADC uses a successive approximation
technique to convert the analog voltage levels from up to eight different sources. The
analog input channels of the ADC are available at Port 2.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Successive approximation
8-bit or 10-bit resolution
(TUE of ± 1 LSB and ± 2 LSB, respectively)
Eight analog channels
Four independent result registers
Result data protection for slow CPU access
(wait-for-read mode)
Single conversion mode
Autoscan functionality
Limit checking for conversion results
Data reduction filter
(accumulation of up to 2 conversion results)
Two independent conversion request sources with programmable priority
Selectable conversion request trigger
Flexible interrupt generation with configurable service nodes
Programmable sample time
Programmable clock divider
Cancel/restart feature for running conversions
Integrated sample and hold circuitry
Compensation of offset errors
Low power modes
3.21.1
ADC Clocking Scheme
A common module clock fADC generates the various clock signals used by the analog and
digital parts of the ADC module:
•
•
•
fADCA is input clock for the analog part.
fADCI is internal clock for the analog part (defines the time base for conversion length
and the sample time). This clock is generated internally in the analog part, based on
the input clock fADCA to generate a correct duty cycle for the analog components.
fADCD is input clock for the digital part.
The internal clock for the analog part fADCI is limited to a maximum frequency of 10 MHz.
Therefore, the ADC clock prescaler must be programmed to a value that ensures fADCI
does not exceed 10 MHz. The prescaler ratio is selected by bit field CTC in register
Data Sheet
99
V1.2, 2009-07
XC886/888CLM
Functional Description
GLOBCTR. A prescaling ratio of 32 can be selected when the maximum performance of
the ADC is not required.
f ADC = fPCLK
fADCD
arbiter
registers
interrupts
digital part
fADCA
CTC
÷ 32
f ADCI
÷4
MUX
÷3
÷2
clock prescaler
analog
components
analog part
Condition: f ADCI ≤ 10 MHz, where t ADCI =
Figure 35
1
f ADCI
ADC Clocking Scheme
For module clock fADC = 24 MHz, the analog clock fADCI frequency can be selected as
shown in Table 34.
Table 34
fADCI Frequency Selection
Module Clock fADC
CTC
Prescaling Ratio
Analog Clock fADCI
24 MHz
00B
÷2
12 MHz (N.A)
01B
÷3
8 MHz
10B
÷4
6 MHz
11B (default)
÷ 32
750 kHz
As fADCI cannot exceed 10 MHz, bit field CTC should not be set to 00B when fADC is
24 MHz. During slow-down mode where fADC may be reduced to 12 MHz, 6 MHz etc.,
CTC can be set to 00B as long as the divided analog clock fADCI does not exceed 10 MHz.
Data Sheet
100
V1.2, 2009-07
XC886/888CLM
Functional Description
However, it is important to note that the conversion error could increase due to loss of
charges on the capacitors, if fADC becomes too low during slow-down mode.
3.21.2
ADC Conversion Sequence
The analog-to-digital conversion procedure consists of the following phases:
•
•
•
•
Synchronization phase (tSYN)
Sample phase (tS)
Conversion phase
Write result phase (tWR)
conversion start
trigger
Source
interrupt
Sample Phase
Channel
interrupt
Result
interrupt
Conversion Phase
fADCI
BUSY Bit
SAMPLE Bit
tSYN
tS
Write Result Phase
tCONV
Figure 36
Data Sheet
tWR
ADC Conversion Timing
101
V1.2, 2009-07
XC886/888CLM
Functional Description
3.22
On-Chip Debug Support
The On-Chip Debug Support (OCDS) provides the basic functionality required for the
software development and debugging of XC800-based systems.
The OCDS design is based on these principles:
•
•
•
•
Use the built-in debug functionality of the XC800 Core
Add a minimum of hardware overhead
Provide support for most of the operations by a Monitor Program
Use standard interfaces to communicate with the Host (a Debugger)
Features
•
•
•
•
•
Set breakpoints on instruction address and on address range within the Program
Memory
Set breakpoints on internal RAM address range
Support unlimited software breakpoints in Flash/RAM code region
Process external breaks via JTAG and upon activating a dedicated pin
Step through the program code
The OCDS functional blocks are shown in Figure 37. The Monitor Mode Control (MMC)
block at the center of OCDS system brings together control signals and supports the
overall functionality. The MMC communicates with the XC800 Core, primarily via the
Debug Interface, and also receives reset and clock signals.
After processing memory address and control signals from the core, the MMC provides
proper access to the dedicated extra-memories: a Monitor ROM (holding the code) and
a Monitor RAM (for work-data and Monitor-stack).
The OCDS system is accessed through the JTAG1), which is an interface dedicated
exclusively for testing and debugging activities and is not normally used in an
application. The dedicated MBC pin is used for external configuration and debugging
control.
Note: All the debug functionality described here can normally be used only after
XC886/888 has been started in OCDS mode.
1) The pins of the JTAG port can be assigned to either the primary port (Port 0) or either of the secondary ports
(Ports 1 and 2/Port 5).
User must set the JTAG pins (TCK and TDI) as input during connection with the OCDS system.
Data Sheet
102
V1.2, 2009-07
XC886/888CLM
Functional Description
JTAG Module
Debug
Interface
TMS
TCK
TDI
TDO
JTAG
Memory
Control
Unit
TCK
TDI
TDO
Control
User
Program
Memory
Boot/
Monitor
ROM
User
Internal
RAM
Monitor
RAM
Reset
Monitor Mode Control
MBC
Monitor &
Bootstrap loader
Control line
System
Control
Unit
Suspend
Control
Reset
Clock
- parts of
OCDS
Reset Clock Debug PROG PROG Memory
Interface & IRAM Data Control
Addresses
XC800 Core
OCDS_XC886C-Block_Diagram-UM-v0.2
Figure 37
3.22.1
OCDS Block Diagram
JTAG ID Register
This is a read-only register located inside the JTAG module, and is used to recognize the
device(s) connected to the JTAG interface. Its content is shifted out when
INSTRUCTION register contains the IDCODE command (opcode 04H), and the same is
also true immediately after reset.
The JTAG ID register contents for the XC886/888 Flash devices are given in Table 35.
Table 35
JTAG ID Summary
Device Type
Device Name
JTAG ID
Flash
XC886/888*-8FF
1012 0083H
XC886/888*-6FF
1012 5083H
XC886/888*-8RF
1013 C083H
XC886/888*-6RF
1013 D083H
ROM
Note: The asterisk (*) above denotes all possible device configurations.
Data Sheet
103
V1.2, 2009-07
XC886/888CLM
Functional Description
3.23
Chip Identification Number
The XC886/888 identity (ID) register is located at Page 1 of address B3H. The value of
ID register is 09H for Flash devices and 22H for ROM devices. However, for easy
identification of product variants, the Chip Identification Number, which is an unique
number assigned to each product variant, is available. The differentiation is based on the
product, variant type and device step information.
Two methods are provided to read a device’s chip identification number:
•
•
In-application subroutine, GET_CHIP_INFO
Bootstrap loader (BSL) mode A
Table 36 lists the chip identification numbers of available XC886/888 Flash and ROM
device variants.
Table 36
Chip Identification Number
Product Variant
Chip Identification Number
AA-Step
AB-Step
AC-Step
XC886CLM-8FFA 3V3
-
09500102H
0B500102H
XC888CLM-8FFA 3V3
-
09500103H
0B500103H
XC886LM-8FFA 3V3
-
09500122H
0B500122H
XC888LM-8FFA 3V3
-
09500123H
0B500123H
XC886CLM-6FFA 3V3
-
09551502H
0B551502H
XC888CLM-6FFA 3V3
-
09551503H
0B551503H
XC886LM-6FFA 3V3
-
09551522H
0B551522H
XC888LM-6FFA 3V3
-
09551523H
0B551523H
XC886CM-8FFA 3V3
-
09580102H
0B580102H
XC888CM-8FFA 3V3
-
09580103H
0B580103H
XC886C-8FFA 3V3
-
09580142H
0B580142H
XC888C-8FFA 3V3
-
09580143H
0B580143H
XC886-8FFA 3V3
-
09580162H
0B580162H
XC888-8FFA 3V3
-
09580163H
0B580163H
XC886CM-6FFA 3V3
-
095D1502H
0B5D1502H
XC888CM-6FFA 3V3
-
095D1503H
0B5D1503H
XC886C-6FFA 3V3
-
095D1542H
0B5D1542H
XC888C-6FFA 3V3
-
095D1543H
0B5D1543H
Flash Devices
Data Sheet
104
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 36
Chip Identification Number (cont’d)
Product Variant
Chip Identification Number
AA-Step
AB-Step
AC-Step
XC886-6FFA 3V3
-
095D1562H
0B5D1562H
XC888-6FFA 3V3
-
095D1563H
0B5D1563H
XC886CLM-8FFA 5V
-
09900102H
0B900102H
XC888CLM-8FFA 5V
-
09900103H
0B900103H
XC886LM-8FFA 5V
-
09900122H
0B900122H
XC888LM-8FFA 5V
-
09900123H
0B900123H
XC886CLM-6FFA 5V
-
09951502H
0B951502H
XC888CLM-6FFA 5V
-
09951503H
0B951503H
XC886LM-6FFA 5V
-
09951522H
0B951522H
XC888LM-6FFA 5V
-
09951523H
0B951523H
XC886CM-8FFA 5V
-
09980102H
0B980102H
XC888CM-8FFA 5V
-
09980103H
0B980103H
XC886C-8FFA 5V
-
09980142H
0B980142H
XC888C-8FFA 5V
-
09980143H
0B980143H
XC886-8FFA 5V
-
09980162H
0B980162H
XC888-8FFA 5V
-
09980163H
0B980163H
XC886CM-6FFA 5V
-
099D1502H
0B9D1502H
XC888CM-6FFA 5V
-
099D1503H
0B9D1503H
XC886C-6FFA 5V
-
099D1542H
0B9D1542H
XC888C-6FFA 5V
-
099D1543H
0B9D1543H
XC886-6FFA 5V
-
099D1562H
0B9D1562H
XC888-6FFA 5V
-
099D1563H
0B9D1563H
XC886CLM-8RFA 3V3
22400502H
-
-
XC888CLM-8RFA 3V3
22400503H
-
-
XC886LM-8RFA 3V3
22400522H
-
-
XC888LM-8RFA 3V3
22400523H
-
-
XC886CLM-6RFA 3V3
22411502H
-
-
XC888CLM-6RFA 3V3
22411503H
-
-
ROM Devices
Data Sheet
105
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 36
Chip Identification Number (cont’d)
Product Variant
Chip Identification Number
AA-Step
AB-Step
AC-Step
XC886LM-6RFA 3V3
22411522H
-
-
XC888LM-6RFA 3V3
22411523H
-
-
XC886CM-8RFA 3V3
22480502H
-
-
XC888CM-8RFA 3V3
22480503H
-
-
XC886C-8RFA 3V3
22480542H
-
-
XC888C-8RFA 3V3
22480543H
-
-
XC886-8RFA 3V3
22480562H
-
-
XC888-8RFA 3V3
22480563H
-
-
XC886CM-6RFA 3V3
22491502H
-
-
XC888CM-6RFA 3V3
22491503H
-
-
XC886C-6RFA 3V3
22491542H
-
-
XC888C-6RFA 3V3
22491543H
-
-
XC886-6RFA 3V3
22491562H
-
-
XC888-6RFA 3V3
22491563H
-
-
XC886CLM-8RFA 5V
22800502H
-
-
XC888CLM-8RFA 5V
22800503H
-
-
XC886LM-8RFA 5V
22800522H
-
-
XC888LM-8RFA 5V
22800523H
-
-
XC886CLM-6RFA 5V
22811502H
-
-
XC888CLM-6RFA 5V
22811503H
-
-
XC886LM-6RFA 5V
22811522H
-
-
XC888LM-6RFA 5V
22811523H
-
-
XC886CM-8RFA 5V
22880502H
-
-
XC888CM-8RFA 5V
22880503H
-
-
XC886C-8RFA 5V
22880542H
-
-
XC888C-8RFA 5V
22880543H
-
-
XC886-8RFA 5V
22880562H
-
-
XC888-8RFA 5V
22880563H
-
-
XC886CM-6RFA 5V
22891502H
-
-
Data Sheet
106
V1.2, 2009-07
XC886/888CLM
Functional Description
Table 36
Chip Identification Number (cont’d)
Product Variant
Chip Identification Number
AA-Step
AB-Step
AC-Step
XC888CM-6RFA 5V
22891503H
-
-
XC886C-6RFA 5V
22891542H
-
-
XC888C-6RFA 5V
22891543H
-
-
XC886-6RFA 5V
22891562H
-
-
XC888-6RFA 5V
22891563H
-
-
Data Sheet
107
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4
Electrical Parameters
Chapter 4 provides the characteristics of the electrical parameters which are
implementation-specific for the XC886/888.
4.1
General Parameters
The general parameters are described here to aid the users in interpreting the
parameters mainly in Section 4.2 and Section 4.3.
4.1.1
Parameter Interpretation
The parameters listed in this section represent partly the characteristics of the
XC886/888 and partly its requirements on the system. To aid interpreting the parameters
easily when evaluating them for a design, they are indicated by the abbreviations in the
“Symbol” column:
•
•
CC
These parameters indicate Controller Characteristics, which are distinctive features
of the XC886/888 and must be regarded for a system design.
SR
These parameters indicate System Requirements, which must be provided by the
microcontroller system in which the XC886/888 is designed in.
Data Sheet
108
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.1.2
Absolute Maximum Rating
Maximum ratings are the extreme limits to which the XC886/888 can be subjected to
without permanent damage.
Table 4-1
Absolute Maximum Rating Parameters
Parameter
Symbol
TA
Storage temperature
TST
Junction temperature
TJ
Voltage on power supply pin with VDDP
respect to VSS
Voltage on any pin with respect VIN
to VSS
Ambient temperature
Input current on any pin during
overload condition
IIN
Absolute sum of all input currents Σ|IIN|
during overload condition
Limit Values
Unit Notes
min.
max.
-40
125
°C
under bias
-65
150
°C
1)
-40
150
°C
under bias1)
-0.5
6
V
1)
-0.5
VDDP +
V
whichever is
lower1)
-10
10
mA
1)
–
50
mA
1)
0.5 or
max. 6
1) Not subjected to production test, verified by design/characterization.
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pin with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
109
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.1.3
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the XC886/888. All parameters mentioned in the following table refer to
these operating conditions, unless otherwise noted.
Table 37
Operating Condition Parameters
Parameter
Digital power supply voltage
Digital power supply voltage
Digital ground voltage
Digital core supply voltage
System Clock Frequency1)
Ambient temperature
Symbol
VDDP
VDDP
VSS
VDDC
fSYS
TA
Limit Values
min.
max.
Unit Notes/
Conditions
4.5
5.5
V
5V Device
3.0
3.6
V
3.3V Device
0
V
2.3
2.7
V
88.8
103.2
MHz
-40
85
°C
SAFXC886/888...
-40
125
°C
SAKXC886/888...
1) fSYS is the PLL output clock. During normal operating mode, CPU clock is fSYS / 4. Please refer to Figure 26
for detailed description.
Data Sheet
110
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.2
DC Parameters
The electrical characteristics of the DC Parameters are detailed in this section.
4.2.1
Input/Output Characteristics
Table 38 provides the characteristics of the input/output pins of the XC886/888.
Table 38
Input/Output Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
min.
Unit Test Conditions
max.
VDDP = 5 V Range
Output low voltage
VOL
CC –
1.0
V
–
1.0
V
IOL = 15 mA
IOL = 5 mA, current into
all pins > 60 mA
–
0.4
V
IOL = 5 mA, current into
all pins ≤ 60 mA
Output high voltage
VOH
CC VDDP - –
1.0
V
IOH = -15 mA
VDDP - –
V
IOH = -5 mA, current
VDDP - –
V
from all pins > 60 mA
1.0
from all pins ≤ 60 mA
0.4
Input low voltage on
VILP
port pins
(all except P0.0 & P0.1)
0.3 ×
SR –
VILP0
SR -0.2
Input low voltage on
RESET pin
VILR
SR –
Input low voltage on
TMS pin
VILT
SR –
Input high voltage on
P0.0 & P0.1
Data Sheet
VIHP0
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
–
V
CMOS Mode
VDDP
V
CMOS Mode
VDDP
Input low voltage on
P0.0 & P0.1
Input high voltage on
VIHP
port pins
(all except P0.0 & P0.1)
IOH = -5 mA, current
0.3 ×
VDDP
0.3 ×
VDDP
0.3 ×
VDDP
SR 0.7 ×
VDDP
SR 0.7 ×
VDDP
111
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 38
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values
min.
Unit Test Conditions
max.
Input high voltage on
RESET pin
VIHR
SR 0.7 ×
–
V
CMOS Mode
Input high voltage on
TMS pin
VIHT
SR 0.75 × –
V
CMOS Mode
V
CMOS Mode1)
V
1)
VDDP
VDDP
Input Hysteresis on port HYSP CC 0.07 × –
pins
VDDP
Input Hysteresis on
XTAL1
Input low voltage at
XTAL1
Input high voltage at
XTAL1
Pull-up current
HYSX CC 0.07 × –
VDDC
VILX
SR VSS 0.3 ×
VDDC
0.5
VIHX
SR 0.7 × VDDC +
VDDC 0.5
IPU
SR –
-10
IPD
IOZ1
IILX
Overload current on any IOV
Input current at XTAL1
µA
µA
10
µA
–
µA
CC -1
1
µA
CC -10
10
µA
SR -5
5
mA
SR –
150
Input leakage current
V
–
-150
Pull-down current
V
VIHP,min
VILP,max
VILP,max
VIHP,min
0 < VIN < VDDP,
TA ≤ 125°C2)
pin
Absolute sum of
overload currents
Σ|IOV|
SR –
25
mA
3)
Voltage on any pin
during VDDP power off
VPO
SR –
0.3
V
4)
Maximum current per
IM SR SR –
pin (excluding VDDP and
VSS)
15
mA
Maximum current for all Σ|IM|
pins (excluding VDDP
and VSS)
90
mA
120
mA
Maximum current into
VDDP
Data Sheet
SR –
IMVDDP SR –
112
3)
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 38
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values
min.
Maximum current out of IMVSS
Unit Test Conditions
max.
SR –
120
mA
3)
CC –
1.0
V
–
0.4
V
VSS
VDDP = 3.3 V Range
Output low voltage
Output high voltage
VOL
VOH
CC VDDP - –
1.0
V
IOL = 8 mA
IOL = 2.5 mA
IOH = -8 mA
VDDP - –
V
IOH = -2.5 mA
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
V
CMOS Mode
–
V
CMOS Mode
VDDP
V
CMOS Mode
0.4
Input low voltage on
VILP
port pins
(all except P0.0 & P0.1)
0.3 ×
SR –
VDDP
Input low voltage on
P0.0 & P0.1
VILP0
SR -0.2
Input low voltage on
RESET pin
VILR
SR –
Input low voltage on
TMS pin
VILT
SR –
Input high voltage on
VIHP
port pins
(all except P0.0 & P0.1)
0.3 ×
VDDP
0.3 ×
VDDP
0.3 ×
VDDP
SR 0.7 ×
VDDP
Input high voltage on
P0.0 & P0.1
VIHP0
SR 0.7 ×
Input high voltage on
RESET pin
VIHR
SR 0.7 ×
–
V
CMOS Mode
Input high voltage on
TMS pin
VIHT
SR 0.75 × –
V
CMOS Mode
Input Hysteresis
HYS
CC 0.03 × –
V
CMOS Mode1)
V
1)
VDDP
VDDP
VDDP
VDDP
Input Hysteresis on
XTAL1
Input low voltage at
XTAL1
Data Sheet
HYSX CC 0.07 × –
VDDC
VILX
SR VSS 0.3 ×
VDDC
0.5
113
V
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 38
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values
min.
Input high voltage at
XTAL1
VIHX
SR 0.7 ×
Pull-up current
IPU
SR –
VDDC
Input leakage current
IPD
IOZ1
IILX
Overload current on any IOV
Input current at XTAL1
max.
VDDC + V
0.5
-5
µA
–
µA
5
µA
50
–
µA
CC -1
1
µA
CC - 10
10
µA
SR -5
5
mA
-50
Pull-down current
Unit Test Conditions
SR –
VIHP,min
VILP,max
VILP,max
VIHP,min
0 < VIN < VDDP,
TA ≤ 125°C2)
pin
Absolute sum of
overload currents
Σ|IOV|
SR –
25
mA
3)
Voltage on any pin
during VDDP power off
VPO
SR –
0.3
V
4)
Maximum current per
IM SR SR –
pin (excluding VDDP and
VSS)
15
mA
Maximum current for all Σ|IM|
pins (excluding VDDP
and VSS)
90
mA
120
mA
3)
120
mA
3)
Maximum current into
VDDP
SR –
IMVDDP SR –
Maximum current out of IMVSS
SR –
VSS
1) Not subjected to production test, verified by design/characterization. Hysteresis is implemented to avoid meta
stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses
switching due to external system noise.
2) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. TMS pin and
RESET pin have internal pull devices and are not included in the input leakage current characteristic.
3) Not subjected to production test, verified by design/characterization.
4) Not subjected to production test, verified by design/characterization. However, for applications with strict low
power-down current requirements, it is mandatory that no active voltage source is supplied at any GPIO pin
when VDDP is powered off.
Data Sheet
114
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.2.2
Supply Threshold Characteristics
Table 39 provides the characteristics of the supply threshold in the XC886/888.
5.0V
VDDPPW
VDDP
2.5V
VDDCPW
VDDCBO
VDDC
VDDCRDR
VDDCBOPD
VDDCPOR
Figure 38
Supply Threshold Parameters
Table 39
Supply Threshold Parameters (Operating Conditions apply)
Parameters
Symbol
1)
Limit Values
Unit
min.
typ.
max.
CC
2.2
2.3
2.4
V
VDDC prewarning voltage
VDDC brownout voltage in
VDDCPW
VDDCBO
CC
2.0
2.1
2.2
V
RAM data retention voltage
VDDCRDR CC
VDDCBOPD CC
0.9
1.0
1.1
V
1.3
1.5
1.7
V
VDDPPW
VDDCPOR
CC
3.4
4.0
4.6
V
CC
1.3
1.5
1.7
V
1)
active mode
VDDC brownout voltage in
2)
power-down mode
VDDP prewarning voltage3)
2)4)
Power-on reset voltage
1) Detection is disabled in power-down mode.
2) Detection is enabled in both active and power-down mode.
3) Detection is enabled for external power supply of 5.0V.
Detection must be disabled for external power supply of 3.3V.
4) The reset of EVR is extended by 300 µs typically after the VDDC reaches the power-on reset voltage.
Data Sheet
115
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.2.3
ADC Characteristics
The values in the table below are given for an analog power supply between 4.5 V to
5.5 V. The ADC can be used with an analog power supply down to 3 V. But in this case,
the analog parameters may show a reduced performance. All ground pins (VSS) must be
externally connected to one single star point in the system. The voltage difference
between the ground pins must not exceed 200mV.
Table 40
ADC Characteristics (Operating Conditions apply; VDDP = 5V Range)
Parameter
Symbol
Limit Values
min.
typ .
max.
Unit Test Conditions/
Remarks
Analog reference
voltage
VAREF
SR VAGND VDDP
+1
VDDP
V
1)
Analog reference
ground
VAGND
SR VSS 0.05
VAREF V
1)
Analog input
voltage range
VAIN
SR VAGND –
ADC clocks
fADC
fADCI
VSS
+ 0.05
-1
VAREF V
–
24
25.8
MHz module clock1)
–
–
10
MHz internal analog clock1)
See Figure 35
1)
tS
CC (2 + INPCR0.STC) × µs
Conversion time
tC
CC See Section 4.2.3.1
µs
Total unadjusted
error
|TUE|
CC –
–
1
LSB 8-bit conversion2)
–
–
2
LSB 10-bit conversion2)
Differential
Nonlinearity
|EADNL|
CC –
1
–
LSB 10-bit conversion1)
Integral
Nonlinearity
|EAINL|
CC –
1
–
LSB 10-bit conversion1)
Offset
|EAOFF|
CC –
1
–
LSB 10-bit conversion1)
Gain
|EAGAIN| CC –
1
–
LSB 10-bit conversion1)
Overload current
coupling factor for
analog inputs
KOVA
CC –
–
1.0 x
10-4
–
IOV > 01)3)
–
–
1.5 x
10-3
–
IOV < 01)3)
Sample time
Data Sheet
tADCI
116
1)
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 40
ADC Characteristics (Operating Conditions apply; VDDP = 5V Range)
Parameter
Symbol
Limit Values
min.
Unit Test Conditions/
Remarks
typ .
max.
CC –
–
5.0 x
10-3
–
IOV > 01)3)
–
–
1.0 x
10-2
–
IOV < 01)3)
Overload current
coupling factor for
digital I/O pins
KOVD
Switched
capacitance at the
reference voltage
input
CAREFSW CC –
10
20
pF
1)4)
Switched
capacitance at the
analog voltage
inputs
CAINSW
CC –
5
7
pF
1)5)
Input resistance of RAREF
the reference input
CC –
1
2
kΩ
1)
Input resistance of RAIN
the selected analog
channel
CC –
1
1.5
kΩ
1)
1) Not subjected to production test, verified by design/characterization
2) TUE is tested at VAREF = 5.0 V, VAGND = 0 V, VDDP = 5.0 V.
3) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pin’s leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it. The total current through a pin is |ITOT| = |IOZ1|
+ (|IOV| × KOV). The additional error current may distort the input voltage on analog inputs.
4) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this, smaller capacitances are successively switched to the reference voltage.
5) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before connecting the input to
the C-Network. Because of the parasitic elements, the voltage measured at ANx is lower than VAREF/2.
Data Sheet
117
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Analog Input Circuitry
REXT
VAIN
RAIN, On
ANx
CEXT
C AINSW
VAGNDx
Reference Voltage Input Circuitry
R AREF, On
VAREFx
VAREF
C AREFSW
VAGNDx
Figure 39
Data Sheet
ADC Input Circuits
118
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.2.3.1
ADC Conversion Timing
Conversion time, tC = tADC × ( 1 + r × (3 + n + STC) ) , where
r = CTC + 2 for CTC = 00B, 01B or 10B,
r = 32 for CTC = 11B,
CTC = Conversion Time Control (GLOBCTR.CTC),
STC = Sample Time Control (INPCR0.STC),
n = 8 or 10 (for 8-bit and 10-bit conversion respectively),
tADC = 1 / fADC
Data Sheet
119
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.2.4
Power Supply Current
Table 41, Table 42, Table 43 and Table 44 provide the characteristics of the power
supply current in the XC886/888.
Table 41
Power Supply Current Parameters (Operating Conditions apply;
VDDP = 5V range)
Parameter
Symbol
Limit Values
typ.1)
Unit Test Condition
max.2)
VDDP = 5V Range
Active Mode
Idle Mode
IDDP
IDDP
Active Mode with slow-down
enabled
IDDP
Idle Mode with slow-down
enabled
IDDP
27.2
32.8
mA
Flash Device3)
24.3
29.8
mA
ROM Device3)
21.1
25.3
mA
Flash Device4)
18.2
21.6
mA
ROM Device4)
14.1
17.0
mA
Flash Device5)
11.9
14.3
mA
ROM Device5)
11.7
15.0
mA
Flash Device6)
9.7
11.9
mA
ROM Device6)
1) The typical IDDP values are periodically measured at TA = + 25 °C and VDDP = 5.0 V.
2) The maximum IDDP values are measured under worst case conditions (TA = + 125 °C and VDDP = 5.5 V).
3) IDDP (active mode) is measured with: CPU clock and input clock to all peripherals running at 24 MHz(set by
on-chip oscillator of 9.6 MHz and NDIV in PLL_CON to 1001B), RESET = VDDP, no load on ports.
4) IDDP (idle mode) is measured with: CPU clock disabled, watchdog timer disabled, input clock to all peripherals
enabled and running at 24 MHz, RESET = VDDP, no load on ports.
5) IDDP (active mode with slow-down mode) is measured with: CPU clock and input clock to all peripherals
running at 8 MHz by setting CLKREL in CMCON to 0110B, RESET = VDDP, no load on ports.
6) IDDP (idle mode with slow-down mode) is measured with: CPU clock disabled, watchdog timer disabled, input
clock to all peripherals enabled and running at 8 MHz by setting CLKREL in CMCON to 0110B, RESET = VDDP,
no load on ports.
Data Sheet
120
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 42
Power Down Current (Operating Conditions apply; VDDP = 5V range)
Parameter
Symbol
Limit Values
typ.1)
Unit Test Condition
max.2)
VDDP = 5V Range
Power-Down Mode
IPDP
1
10
µA
-
30
µA
TA = + 25 °C3)4)
TA = + 85 °C4)5)
1) The typical IPDP values are measured at VDDP = 5.0 V.
2) The maximum IPDP values are measured at VDDP = 5.5 V.
3) IPDP has a maximum value of 200 µA at TA = + 125 °C.
4) IPDP is measured with: RESET = VDDP, VAGND= VSS, RXD/INT0 = VDDP; rest of the ports are programmed to be
input with either internal pull devices enabled or driven externally to ensure no floating inputs.
5) Not subjected to production test, verified by design/characterization.
Data Sheet
121
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 43
Power Supply Current Parameters (Operating Conditions apply;
VDDP = 3.3V range)
Parameter
Symbol
Limit Values
typ.1)
Unit Test Condition
max.2)
VDDP = 3.3V Range
Active Mode
Idle Mode
IDDP
IDDP
Active Mode with slow-down
enabled
IDDP
Idle Mode with slow-down
enabled
IDDP
25.6
31.0
mA
Flash Device3)
23.4
28.6
mA
ROM Device3)
19.9
24.7
mA
Flash Device4)
17.5
20.7
mA
ROM Device4)
13.3
16.2
mA
Flash Device5)
11.5
13.7
mA
ROM Device5)
11.1
14.4
mA
Flash Device6)
9.3
11.4
mA
ROM Device6)
1) The typical IDDP values are periodically measured at TA = + 25 °C and VDDP = 3.3 V.
2) The maximum IDDP values are measured under worst case conditions (TA = + 125 °C and VDDP = 3.6 V).
3) IDDP (active mode) is measured with: CPU clock and input clock to all peripherals running at 24 MHz(set by
on-chip oscillator of 9.6 MHz and NDIV in PLL_CON to 1001B), RESET = VDDP, no load on ports.
4) IDDP (idle mode) is measured with: CPU clock disabled, watchdog timer disabled, input clock to all peripherals
enabled and running at 24 MHz, RESET = VDDP, no load on ports.
5) IDDP (active mode with slow-down mode) is measured with: CPU clock and input clock to all peripherals
running at 8 MHz by setting CLKREL in CMCON to 0110B, RESET = VDDP, no load on ports.
6) IDDP (idle mode with slow-down mode) is measured with: CPU clock disabled, watchdog timer disabled, input
clock to all peripherals enabled and running at 8 MHz by setting CLKREL in CMCON to 0110B,,
RESET = VDDP, no load on ports.
Data Sheet
122
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 44
Power Down Current (Operating Conditions apply; VDDP = 3.3V
range)
Parameter
Symbol
Limit Values
typ.1)
Unit Test Condition
max.2)
VDDP = 3.3V Range
Power-Down Mode
IPDP
1
10
µA
-
30
µA
TA = + 25 °C3)4)
TA = + 85 °C4)5)
1) The typical IPDP values are measured at VDDP = 3.3 V.
2) The maximum IPDP values are measured at VDDP = 3.6 V.
3) IPDP has a maximum value of 200 µA at TA = + 125 °C.
4) IPDP is measured with: RESET = VDDP, VAGND= VSS, RXD/INT0 = VDDP; rest of the ports are programmed to be
input with either internal pull devices enabled or driven externally to ensure no floating inputs.
5) Not subjected to production test, verified by design/characterization.
Data Sheet
123
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3
AC Parameters
The electrical characteristics of the AC Parameters are detailed in this section.
4.3.1
Testing Waveforms
The testing waveforms for rise/fall time, output delay and output high impedance are
shown in Figure 40, Figure 41 and Figure 42.
VDDP
90%
10%
10%
VSS
Figure 40
90%
tF
tR
Rise/Fall Time Parameters
VDDP
VDDE / 2
Test Points
VDDE / 2
VSS
Figure 41
Testing Waveform, Output Delay
VLoad + 0.1 V
VLoad - 0.1 V
Figure 42
Data Sheet
Timing
Reference
Points
VOH - 0.1 V
VOL - 0.1 V
Testing Waveform, Output High Impedance
124
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3.2
Output Rise/Fall Times
Table 45 provides the characteristics of the output rise/fall times in the XC886/888.
Table 45
Output Rise/Fall Times Parameters (Operating Conditions apply)
Parameter
Symbol
Limit
Values
Unit Test Conditions
min. max.
VDDP = 5V Range
Rise/fall times
t R , tF
–
10
ns
20 pF.1)2)3)
t R , tF
–
10
ns
20 pF.1)2)4)
VDDP = 3.3V Range
Rise/fall times
1) Rise/Fall time measurements are taken with 10% - 90% of pad supply.
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
3) Additional rise/fall time valid for CL = 20pF - 100pF @ 0.125 ns/pF.
4) Additional rise/fall time valid for CL = 20pF - 100pF @ 0.225 ns/pF.
VDDP
90%
90%
VSS
10%
10%
tF
tR
Figure 43
Data Sheet
Rise/Fall Times Parameters
125
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3.3
Power-on Reset and PLL Timing
Table 49 provides the characteristics of the power-on reset and PLL timing in the
XC886/888.
Table 46
Power-On Reset and PLL Timing (Operating Conditions apply)
Parameter
Symbol
Limit Values
min. typ.
Pad operating voltage
On-Chip Oscillator
start-up time
Flash initialization time
RESET hold time
PLL lock-in in time
PLL accumulated jitter
Unit Test Conditions
max.
VPAD
tOSCST
CC 2.3
–
–
V
1)
CC –
–
500
ns
1)
tFINIT
tRST
CC –
160
–
µs
1)
SR –
500
–
µs
VDDP rise time
tLOCK
DP
CC –
–
200
µs
1)
–
–
0.7
ns
1)3)
(10% – 90%) ≤
500µs1)2)
1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
2) RESET signal has to be active (low) until VDDC has reached 90% of its maximum value (typ. 2.5 V).
3) PLL lock at 96 MHz using a 4 MHz external oscillator. The PLL Divider settings are K = 2, N = 48 and P = 1.
Data Sheet
126
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
VDDP
VPAD
VDDC
tOSCST
OSC
PLL unlock
PLL
PLL lock
tLOCK
Flash State
Reset
Initialization
tFINIT
tRST
Ready to Read
RESET
Pads
1)
3)
2)
1)Pad state undefined
I)until EVR is stable
Figure 44
Data Sheet
2)ENPS control 3)As Programmed
II)until PLL is locked
III) until Flash go IV) CPU reset is released; Boot
to Ready-to-Read ROM software begin execution
Power-on Reset Timing
127
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3.4
On-Chip Oscillator Characteristics
Table 47 provides the characteristics of the on-chip oscillator in the XC886/888.
Table 47
On-chip Oscillator Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Unit Test Conditions
min. typ. max.
Nominal frequency
fNOM CC
Long term frequency ∆fLT
deviation
CC
Short term frequency ∆fST CC
deviation
9.36 9.6
9.84
MHz under nominal
conditions1)
-5.0
–
5.0
%
with respect to fNOM, over
lifetime and temperature
(-10°C to 125°C), for one
given device after
trimming
-6.0
–
0
%
with respect to fNOM, over
lifetime and temperature
(-40°C to
-10°C), for one given
device after trimming
-1.0
–
1.0
%
within one LIN message
(<10 ms .... 100 ms)
1) Nominal condition: VDDC = 2.5 V, TA = + 25°C.
Data Sheet
128
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3.5
External Clock Drive XTAL1
Table 48 shows the parameters that define the external clock supply for XC886/888.
These timing parameters are based on the direct XTAL1 drive of clock input signals.
They are not applicable if an external crystal or ceramic resonator is considered.
Table 48
External Clock Drive Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Min.
tosc
t1
t2
t3
t4
Oscillator period
High time
Low time
Rise time
Fall time
Unit Test Conditions
Max.
SR 83.3
250
ns
1)2)
SR 25
-
ns
2)3)
SR 25
-
ns
2)3)
SR -
20
ns
2)3)
SR -
20
ns
2)3)
1) The clock input signals with 45-55% duty cycle are used.
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
3) The clock input signal must reach the defined levels VILX and VIHX.
t1
t3
t4
VIHX
0.5 V DDC
VILX
t2
tOSC
Figure 45
Data Sheet
External Clock Drive XTAL1
129
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3.6
JTAG Timing
Table 49 provides the characteristics of the JTAG timing in the XC886/888.
Table 49
TCK Clock Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
Limits
min
TCK clock period
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
tTCK
t1
t2
t3
t4
Unit
Test Conditions
max
SR
50
-
ns
1)
SR
20
−
ns
1)
SR
20
-
ns
1)
SR
-
4
ns
1)
SR
-
4
ns
1)
1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
0.9 V DDP
0.5 V DDP
TCK
0.1 V DDP
t1
t TCK
t2
t4
t3
Figure 46
TCK Clock Timing
Table 50
JTAG Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
Limits
min
Unit
Test
Conditions
max
TMS setup to TCK
t1
SR
8
-
ns
1)
TMS hold to TCK
t2
SR
24
-
ns
1)
TDI setup to TCK
t1
SR
11
-
ns
1)
TDI hold to TCK
t2
SR
24
-
ns
1)
TDO valid output from TCK
t3
CC
-
21
ns
5V Device1)
-
28
ns
3.3V Device1)
Data Sheet
130
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
Table 50
JTAG Timing (Operating Conditions apply; CL = 50 pF) (cont’d)
Parameter
Symbol
Limits
min
TDO high impedance to valid
output from TCK
t4
TDO valid output to high
impedance from TCK
t5
CC
CC
Unit
Test
Conditions
max
-
27
ns
5V Device1)
-
36
ns
3.3V Device1)
-
22
ns
5V Device1)
-
28
ns
3.3V Device1)
1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
TCK
t1
t2
t1
t2
TMS
TDI
t4
t3
t5
TDO
Figure 47
Data Sheet
JTAG Timing
131
V1.2, 2009-07
XC886/888CLM
Electrical Parameters
4.3.7
SSC Master Mode Timing
Table 51 provides the characteristics of the SSC timing in the XC886/888.
Table 51
SSC Master Mode Timing (Operating Conditions apply; CL = 50 pF)
Parameter
Symbol
Limit Values
min.
max.
Unit
Test
Conditions
CC
2*TSSC
–
ns
1)2)
MTSR delay from SCLK
t0
t1
CC
0
8
ns
2)
MRST setup to SCLK
t2
SR
24
–
ns
2)
MRST hold from SCLK
t3
SR
0
–
ns
2)
SCLK clock period
1) TSSCmin = TCPU = 1/fCPU. When fCPU = 24 MHz, t0 = 83.3ns. TCPU is the CPU clock period.
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
t0
SCLK1)
t1
t1
MTSR1)
t2
t3
Data
valid
MRST1)
t1
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
SSC_Tmg1
Figure 52
Data Sheet
SSC Master Mode Timing
132
V1.2, 2009-07
XC886/888CLM
Package and Quality Declaration
5
Package and Quality Declaration
Chapter 5 provides the information of the XC886/888 package and reliability section.
5.1
Package Parameters
Table 1 provides the thermal characteristics of the package used in XC886 and XC888.
Table 1
Thermal Characteristics of the Packages
Parameter
Symbol
Limit Values
Min.
Unit
Notes
Max.
PG-TQFP-48 (XC886)
Thermal resistance junction RTJC
case
CC -
13
K/W
1)2)
Thermal resistance junction RTJL
lead
CC -
32.5
K/W
1)2)
Thermal resistance junction RTJC
case
CC -
12.6
K/W
1)2)
Thermal resistance junction RTJL
lead
CC -
33.4
K/W
1)2)
-
PG-TQFP-64 (XC888)
1) The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead
(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
Data Sheet
133
V1.2, 2009-07
XC886/888CLM
Package and Quality Declaration
5.2
Package Outline
H
0.5
7˚ MAX.
0.125 +0.075
-0.035
0.1 ±0.05
1 ±0.05
1.2 MAX.
Figure 48 shows the package outlines of the XC886.
0.6 ±0.15
C
5.5
0.22 ±0.05
0.08
2)
0.08 M A-B D C 48x
9
7 1)
0.2 A-B D 48x
0.2 A-B D H 4x
D
9
B
7 1)
A
48
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
2) Does not include dambar protrusion of 0.08 max. per side
GPP09237
Figure 48
Data Sheet
PG-TQFP-48 Package Outline
134
V1.2, 2009-07
XC886/888CLM
Package and Quality Declaration
Figure 49 shows the package outlines of the XC888.
Figure 49
Data Sheet
PG-TQFP-64 Package Outline
135
V1.2, 2009-07
XC886/888CLM
Package and Quality Declaration
5.3
Quality Declaration
Table 2 shows the characteristics of the quality parameters in the XC886/888.
Table 2
Quality Parameters
Parameter
Symbol Limit Values
Min.
Unit
Notes
Max.
ESD susceptibility
VHBM
according to Human Body
Model (HBM)
-
2000
V
Conforming to
EIA/JESD22A114-B1)
VCDM
-
500
V
Conforming to
JESD22-C101-C1)
ESD susceptibility
according to Charged
Device Model (CDM) pins
1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
Data Sheet
136
V1.2, 2009-07
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG