CYPRESS CY7C68300A-LFC

CY7C68300A
EZ-USB AT2™
USB 2.0 to ATA/ATAPI Bridge
Cypress Semiconductor Corporation
Document #: 38-08031 Rev. *B
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised August 15, 2003
CY7C68300A
TABLE OF CONTENTS
1.0 INTRODUCTION .............................................................................................................................. 4
1.1 Features ...................................................................................................................................... 4
2.0 PIN ASSIGNMENTS ........................................................................................................................ 6
2.1 Pin Diagram ................................................................................................................................ 6
2.2 Pin Descriptions .......................................................................................................................... 8
2.3 Additional Pin Descriptions ......................................................................................................... 9
2.3.1 DPLUS, DMINUS .............................................................................................................................. 9
2.3.2 SCL, SDA .......................................................................................................................................... 9
2.3.3 XTALIN, XTALOUT ........................................................................................................................... 9
2.3.4 ATA_EN ..........................................................................................................................................10
2.3.5 ATA Interface Pins .......................................................................................................................... 10
2.3.6 VBUS_PWR_VALID ........................................................................................................................10
2.3.7 RESET# ..........................................................................................................................................10
3.0 APPLICATIONS ............................................................................................................................. 11
3.1 Additional Resources ................................................................................................................ 11
4.0 FUNCTIONAL OVERVIEW ............................................................................................................ 11
4.1 USB Signaling Speed ............................................................................................................... 11
4.2 ATA Interface ............................................................................................................................ 11
5.0 ENUMERATION ............................................................................................................................. 11
5.1 Board Manufacturing Test Mode ............................................................................................... 11
5.1.1 CfgCB .............................................................................................................................................. 11
5.1.2 MfgCB ............................................................................................................................................. 12
5.2 Normal Operation Mode ............................................................................................................ 13
5.3 EEPROM Organization ............................................................................................................. 13
6.0 ABSOLUTE MAXIMUM RATINGS ................................................................................................ 22
7.0 OPERATING CONDITIONS[6] ...................................................................................................................................................................22
8.0 DC CHARACTERISTICS ............................................................................................................... 22
9.0 AC ELECTRICAL CHARACTERISTICS ....................................................................................... 22
9.1 USB Transceiver ....................................................................................................................... 22
9.2 ATA Timing ............................................................................................................................... 22
10.0 ORDERING INFORMATION ........................................................................................................ 23
11.0 PACKAGE DIAGRAMS .............................................................................................................. 23
12.0 PCB LAYOUT RECOMMENDATIONS ........................................................................................ 24
13.0 QUAD FLAT PACKAGE NO LEADS (QFN) PACKAGE DESIGN NOTES ................................ 24
14.0 OTHER DESIGN CONSIDERATIONS ......................................................................................... 25
14.1 Proper Power-up Sequence .................................................................................................... 25
14.2 IDE Removable Media Devices .............................................................................................. 25
14.3 Devices With Small Buffers ..................................................................................................... 25
15.0 DISCLAIMERS, TRADEMARKS, AND COPYRIGHTS ............................................................... 25
Document #: 38-08031 Rev. *B
Page 2 of 26
CY7C68300A
LIST OF FIGURES
Figure 1-1. Block Diagram ....................................................................................................................... 5
Figure 2-1. 56-pin SSOP ......................................................................................................................... 6
Figure 2-2. 56-pin QFN ............................................................................................................................ 7
Figure 2-3. XTALIN, XTALOUT Diagram............................................................................................... 10
Figure 2-4. Typical Reset Circuit ........................................................................................................... 10
Figure 11-1. 56-lead Shrunk Small Outline Package 056...................................................................... 23
Figure 11-2. 56-lead Quad Flatpack No Lead (8 x 8 mm) LF56 ............................................................ 23
Figure 13-1. Cross-Section of the Area Underneath the QFN Package ................................................ 24
Figure 13-2. Plot of the Solder Mask (White Area) ................................................................................ 25
Figure 13-3. X-ray Image of the Assembly ............................................................................................ 25
LIST OF TABLES
Table 5-1. Command Block Wrapper ................................................................................................... 12
Table 5-2. Example CfgCB ................................................................................................................... 12
Table 5-3. Example MfgCB ................................................................................................................... 12
Table 5-4. Mfg_load Data Format ......................................................................................................... 12
Table 5-5. Mfg_read Data Format ........................................................................................................ 13
Table 5-6. EEPROM Organization ........................................................................................................ 14
Document #: 38-08031 Rev. *B
Page 3 of 26
CY7C68300A
1.0
Introduction
The CY7C68300A implements a fixed-function bridge between one USB port and one ATA- or ATAPI-based mass storage device
port. This bridge adheres to the Mass Storage Class Bulk-Only Transport Specification and is intended for self-powered devices.
The USB port of the CY7C68300A is connected to a host computer directly or via the downstream port of a USB hub. Host
software issues commands and data to the CY7C68300A and receives status and data from the CY7C68300A using standard
USB protocol.
The ATA/ATAPI port of the CY7C68300A is connected to a mass storage device. A 4-Kbyte buffer maximizes ATA/ATAPI data
transfer rates by minimizing losses due to device seek times. The ATA interface supports ATA PIO modes 0, 3, and 4, and Ultra
DMA modes 2 and 4.
The device initialization process is configurable, enabling the CY7C68300A to initialize ATA/ATAPI devices without software
intervention.
1.1
Features
• Complies with USB-IF specifications for USB 2.0, the USB Mass Storage Class, and the USB Mass Storage Class
Bulk-Only Transport Specification
• Operates at high (480-Mbps) or full (12-Mbps) speed
• Complies with T13’s ATA/ATAPI-6 Draft Specification
• Supports 48-bit addressing for large hard drives
• Supports PIO modes 0, 3, 4, and UDMA modes 2, 4
• Uses one external serial EEPROM containing the USB device serial number, vendor and product identification data,
and device configuration data
• ATA interface IRQ signal support
• Support for a single ATA/ATAPI device configured either as master or slave
• “ATA-Enable” input signal, which three-states all signals on the ATA interface in order to allow sharing of the bus
with another controller (e.g., an IEEE-1394 to ATA bridge chip)
• Support for board-level manufacturing test via USB interface
• 3.3V operation for self-powered devices
• 56-pin SSOP and 56-pin QFN packages.
Document #: 38-08031 Rev. *B
Page 4 of 26
CY7C68300A
I2C-Compatible
Bus Controller
SDA
24
MHz
XTAL
RESET
SCL
PLL
ATA_EN (ATA Interf ace 3-state)
AT2 Internal Logic
ATA Interf ace
ControlSignals
Control
ATA
16 Bit ATA Data
Interf ace
Logic
VBUS
D+
D-
USB 2.0 XCVR
CY SmartUSB
FS/HSEngine
4kBy teFIFO
Data
Figure 1-1. Block Diagram
Document #: 38-08031 Rev. *B
Page 5 of 26
CY7C68300A
2.0
2.1
Pin Assignments
Pin Diagram
1
DD13
DD12
56
2
DD14
DD11
55
3
DD15
DD10
54
4
GND
DD9
53
5
NC
DD8
52
6
Vcc
ATA_EN
51
7
GND
Vcc
50
8
IORDY
RESET#
49
9
DMARQ
GND
48
10
AVcc
ARESET#
47
11
XTALOUT
VBUS_PWR_VALID
46
12
XTALIN
CS1#
45
13
AGND
CS0#
44
14
Vcc
DA2
43
15
DPLUS
DA1
42
16
DMINUS
DA0
41
17
GND
INTRQ
40
18
Vcc
Vcc
39
19
GND
DMACK#
38
20
PU10K
DIOR#
37
21
RESERVED
DIOW#
36
22
SCL
GND
35
23
SDA
Vcc
34
24
Vcc
GND
33
25
DD0
DD7
32
26
DD1
DD6
31
27
DD2
DD5
30
28
DD3
DD4
29
EZ-USB AT2
CY7C68300A
56-pin SSOP
Figure 2-1. 56-pin SSOP
Document #: 38-08031 Rev. *B
Page 6 of 26
GND
VCC
NC
GND
DD15
DD14
DD13
DD12
DD11
DD10
DD9
DD8
ATA_EN
VCC
56
55
54
53
52
51
50
49
48
47
46
45
44
43
CY7C68300A
IORDY
1
42
RESET#
DMARQ
2
41
GND
AVCC
3
40
ARESET#
XTALOUT
4
39
VBUS_PWR_VALID
XTALIN
5
38
CS1#
AGND
6
37
CS0#
VCC
7
36
DA2
DPLUS
8
35
DA1
DMINUS
9
34
DA0
GND
10
33
INTRQ
VCC
11
32
VCC
GND
12
31
DMACK#
PU10K
13
30
DIOR#
RESERVED
14
29
DIOW#
24
25
26
DD6
DD7
GND
28
23
DD5
27
22
DD4
VCC
21
DD3
GND
20
18
DD0
DD2
17
VCC
19
16
DD1
15
SCL
SDA
EZ-USB AT2
CY7C68300A
56-pin QFN
Figure 2-2. 56-pin QFN
Document #: 38-08031 Rev. *B
Page 7 of 26
CY7C68300A
2.2
Pin Descriptions
SSOP QFN
Pin
Pin Pin Name
Pin
Type
Default State at Start-up
Pin Description
1
50
DD13
I/O[1]
Hi-Z
ATA Data bit 13.
2
51
DD14
I/O[1]
Hi-Z
ATA Data bit 14.
3
52
DD15
I/O[1]
Hi-Z
ATA Data bit 15.
4
53
GND
GND
5
54
NC
6
55
VCC
PWR
VCC. Connect to 3.3V power source.
7
56
GND
GND
Ground.
[1]
I
ATA Control.
I
ATA Control.
Ground.
Hi-Z
8
1
IORDY
I
9
2
DMARQ
I[1]
10
3
AVCC
PWR
Reserved. This pin should remain a no-connect.
Analog VCC. Connect the VCC through the shortest path
possible.
11
4
XTALOUT
Xtal
Xtal
24-MHz Crystal Output (see section 2.3.3).
12
5
XTALIN
Xtal
Xtal
24-MHz Crystal Input (see section 2.3.3).
13
6
AGND
GND
14
7
VCC
PWR
15
8
DPLUS
I/O
16
9
DMINUS
I/O
17
10
GND
GND
Ground.
Analog Ground. Connect to ground with as short a path as
possible.
VCC. Connect to 3.3V power source.
Pulled high when Reset is USB D+ Signal (see section 2.3.1).
active. When Reset is
released, the pull-up is
controlled by pin 46(SSOP)/
39(QFN). When VBUS_
PWR_VALID is high, the line
is pulled up. VBUS_PWR
_VALID is polled at start-up
and then every 20 ms.
Hi-Z
USB D- Signal (see section 2.3.1).
18
11
VCC
PWR
VCC. Connect to 3.3V power source.
19
12
GND
GND
Ground.
20
13
PU10K
21
14
RESERVED
22
15
SCL
O
23
16
SDA
I/O
24
17
VCC
PWR
25
18
DD0
I/O
Hi-Z
ATA Data bit 0.
26
19
DD1
I/O
Hi-Z
ATA Data bit 1.
27
20
DD2
I/O
Hi-Z
ATA Data bit 2.
28
21
DD3
I/O
Hi-Z
ATA Data bit 3.
29
22
DD4
I/O
Hi-Z
ATA Data bit 4.
30
23
DD5
I/O
Hi-Z
ATA Data bit 5.
31
24
DD6
I/O
Hi-Z
ATA Data bit 6.
32
25
DD7
I/O
Hi-Z
ATA Data bit 7.
33
26
GND
GND
Ground.
34
27
VCC
PWR
VCC. Connect to 3.3V power source.
Hi-Z
Tied to 10k ± 5% pull-up resistor.
Reserved. Tie to GND.
SCL/SDA will be active for Clock signal for I2C-compatible interface (see section 2.3.2).
several ms at start-up. Then Data signal for I2C-compatible interface (see section 2.3.2).
driven high.
VCC. Connect to 3.3V power source.
Note:
1. ATA interface pins are not active when ATA_EN is not asserted.
Document #: 38-08031 Rev. *B
Page 8 of 26
CY7C68300A
2.2
Pin Descriptions (continued)
SSOP QFN
Pin
Pin Pin Name
35
28
GND
36
29
DIOW#[2]
37
30
DIOR#
38
31
DMACK#
39
32
40
33
Pin
Type
Default State at Start-up
Pin Description
GND
Ground.
O/Z[1] Driven high (CMOS)
ATA Control.
O/Z
[1]
Driven high (CMOS)
ATA Control.
O/Z[1] Driven high (CMOS)
ATA Control.
VCC
PWR
VCC. Connect to 3.3V power source.
INTRQ
I[1]
[1]
Input
IDE ATA Interrupt request.
41
34
DA0
O/Z
42
35
DA1
O/Z[1] Driven high after 2 ms delay ATA Address.
Driven high after 2 ms delay ATA Address.
43
36
DA2
O/Z[1] Driven high after 2 ms delay ATA Address.
44
37
CS0#
O/Z[1] Driven high after 2 ms delay ATA Chip Select.
45
38
CS1#
O/Z[1] Driven high after 2 ms delay ATA Chip Select.
46
39
VBUS_PW
R_VALID
I
47
40
ARESET#
O/Z[1]
ATA Reset.
48
41
GND
GND
Ground.
49
42
RESET#
I
50
43
VCC
PWR
51
44
ATA_EN
I
52
45
DD8
I/O[1] Hi-Z
ATA Data bit 8.
53
46
DD9
I/O[1] Hi-Z
ATA Data bit 9.
Input
VBUS detection. Indicates to the CY7C68300A that VBUS
power is present.
Active LOW Reset. Resets the entire chip. This pin is normally
tied to VCC through a 100K resistor, and to GND through a
0.1-µF capacitor, supplying a 10-ms reset.
VCC. Connect to 3.3V power source.
Input – If CY7C68300A is not
in mfg mode, polled every 20
ms after start-up. If LOW,
SSOP pins 36–38, 41–45
and 47 or QFN pins 29–31,
34–38 and 40 are threestated.
Active HIGH. ATA interface enable. Allows ATA bus sharing
with other host devices. Setting ATA_EN=1 enables the ATA
interface for normal operation. Disabling ATA_EN three-states
(High-Z) the ATA interface and halts the ATA interface state
machine logic.
54
47
DD10
I/O[1]
Hi-Z
ATA Data bit 10.
55
48
DD11
I/O[1] Hi-Z
ATA Data bit 11.
DD12
I/O[1]
ATA Data bit 12.
56
49
Hi-Z
2.3
Additional Pin Descriptions
2.3.1
DPLUS, DMINUS
DPLUS and DMINUS are the USB signaling pins, and they should be tied to the D+ and D– pins of the USB connector. Because
they operate at high frequencies, the USB signals require special consideration when designing the layout of the PCB.
2.3.2
SCL, SDA
The clock and data pins for the I2C-compatible port should be connected to your configuration EEPROM and to VCC through 2.2k
resistors.
2.3.3
XTALIN, XTALOUT
The CY7C68300A requires a 24-MHz signal to derive internal timing. Typically a 24-MHz parallel-resonant fundamental mode
crystal is used, but a 24-MHz square wave from another source can also be used. If a crystal is used, connect the pins to XTALIN
and XTALOUT, and also through 20-pF capacitors to GND. If an alternate clock source is used, apply it to XTALIN and leave
XTALOUT open.
Note:
2. A # sign after the signal name indicates that it is an active LOW signal.
Document #: 38-08031 Rev. *B
Page 9 of 26
CY7C68300A
2 4 M H z crys ta l
20pF
20pF
Figure 2-3. XTALIN, XTALOUT Diagram
2.3.4
ATA_EN
ATA_EN allows bus sharing with other host devices. Setting ATA_EN = 1 enables the ATA interface for normal operation. Setting
ATA_EN = 0 disables (High-Z) the ATA interface pins and removes the CY7C68300A from the USB. Because the CY7C68300A
supports a true low-power USB suspend state, new functionality was added to ensure that transitions of the ATA_EN signal could
be detected properly under all circumstances. The CY7C68300A will behave in the following manner:
• If ATA_EN transitions to '0' during normal operation, the CY7C68300A will disconnect from the USB and drop to a low-power
mode.
• If ATA_EN transitions to '1' when in low-power mode and no other condition is causing the low-power state, the CY7C68300A
will return to a post-reset state and reconnect to the USB.
• If the CY7C68300A is already in suspend and ATA_EN transitions to '0', the CY7C68300A will resume only long enough to
stop driving the ATA interface (High-Z) and drop back to low-power again.
• If the CY7C68300A is already in suspend and ATA_EN transitions to '1', the CY7C68300A will resume only long enough to
start driving the ATA interface and drop to low-power again.
The ATA_EN pin is sampled at a rate of 50 times per second by the CY7C68300A internal logic. This pin should be set to a HIGH
at start-up. Note that disabling the ATA bus with the ATA_EN pin during the middle of a data transfer will result in data loss and
can cause the operating system on the Host computer to crash.
2.3.5
ATA Interface Pins
If a cable is used to connect the CY7C68300A to a UDMA device, the cable must be an 80-pin cable as shown in the ATA-6 spec,
Annex A.
2.3.6
VBUS_PWR_VALID
VBUS_PWR_VALID indicates to the CY7C68300A that power is present on VBUS. This pin is polled by the CY7C68300A at
start-up and then every 20ms thereafter. If this pin is ‘1’, the 1.5K pull-up is attached to D+. If this pin is ‘0’, the CY7C68300A will
release the pullup on D+ as required by the USB specification.
2.3.7
RESET#
Asserting RESET# for 10 ms will reset the entire chip. This pin is normally tied to VCC through a 100k resistor, and to GND through
a 0.1-µF capacitor.
R 8
1 0 0 K
N R E S E T
C 1
0 .1 u F d
Figure 2-4. Typical Reset Circuit
Document #: 38-08031 Rev. *B
Page 10 of 26
CY7C68300A
3.0
Applications
The CY7C68300A is a high-speed USB 2.0 peripheral device that connects a single ATA or ATAPI storage device to a USB host
using the USB Mass Storage Class protocol.
3.1
•
•
•
•
Additional Resources
CY4615 EZ-USB AT2 Reference Design Kit
USB Specification version 2.0
ATA Specification T13/1410D Rev 3B
USB Mass Storage Class Bulk Only Transport Specification, http://www.usb.org/developers/data/devclass/
usbmassbulk_10.pdf.
4.0
4.1
Functional Overview
USB Signaling Speed
CY7C68300A operates at two of the three rates defined in the USB Specification Revision 2.0 dated April 27, 2000:
• Full speed, with a signaling bit rate of 12 Mbits/sec
• High speed, with a signaling bit rate of 480 Mbits/sec.
CY7C68300A does not support the low-speed signaling rate of 1.5 Mbits/sec.
4.2
ATA Interface
The ATA/ATAPI port on the CY7C68300A is compliant with the Information Technology AT Attachment with Packet Interface 6
(ATA/ATAPI-6) Specification, T13/1410D Rev 3B. The CY7C68300A supports ATAPI packet commands over USB. Additionally,
the CY7C68300A translates ATAPI SFF-8070i commands to ATA commands for seamless integration of ATA devices with generic
Mass Storage Class Bulk Only Transport drivers.
5.0
Enumeration
During the power-up sequence, internal logic checks the I2C-compatible port for an EEPROM whose first two bytes are both
0x4D. If a valid signature is found, the CY7C68300A uses the values stored in the EEPROM to configure the USB descriptors
for normal operation. If an invalid EEPROM signature is read, or if no EEPROM is detected, the CY7C68300A defaults into Board
Manufacturing Test Mode. The two modes of operation are described in subsections 5.1 and 5.2, below.
5.1
Board Manufacturing Test Mode
In Board Manufacturing Test Mode, the chip behaves as a USB 2.0 device but the ATA/ATAPI interface is not active. The
CY7C68300A allows for reading and writing an EEPROM and for board level testing through vendor specific ATAPI commands
utilizing the CBW Command Block as described in the USB Mass Storage Class Bulk-Only Transport Specification. There is a
vendor-specific ATAPI command for the EEPROM access (CfgCB) and one for the board level testing (MfgCB).
5.1.1
CfgCB
The cfg_load and cfg_read vendor-specific commands are passed down through the bulk pipe in the CBWCB portion of the CBW.
The format of this CfgCB is shown below. Byte 0 will be a vendor-specific command designator whose value is configurable and
set in the configuration data (EEPROM address 0x04). Byte 1 must be set to 0x26 to identify CfgCB. Byte 2 is reserved and must
be set to zero. Byte 3 is used to determine the memory source to write/read. For the CY7C68300A, this byte must be set to 0x02,
meaning the EEPROM. Bytes 4 and 5 will be used to determine the start address. For the CY7C68300A, this must always be
0x0000. Bytes 6 through 15 are reserved and should be set to zero.
The data transferred to the EEPROM must be in the format specified in Table 5-6 of this data sheet. Maximum data transfer size
is 255 bytes.
The data transfer length is determined by the CBW Data Transfer Length specified in bytes 8 through 11 (dCBWDataTransferLength) of the CBW. The type/direction of the command will be determined by the direction bit specified in byte 12, bit 7 (bmCBWFlags) of the CBW.
Document #: 38-08031 Rev. *B
Page 11 of 26
CY7C68300A
Table 5-1. Command Block Wrapper
7
6
5
4
3
2
0–3
DCBWSignature
4–7
dCBWTag
8–11 (08h-0Bh)
1
0
dCBWDataTransferLength
12 (0Ch)
bwCBWFLAGS
Dir
Obsolete
13 (0Dh)
Reserved (0)
Reserved (0)
14 (0Eh)
bCBWLUN
Reserved (0)
bCBWCBLength
15–30 (0Fh1Eh)
CBWCB (CfgCB or MfgCB)
Table 5-2. Example CfgCB
CfgCB Byte Descriptions
Bits
7
6
5
4
3
2
1
0
0 bVSCBSignature (set in configuration bytes)
0
0
1
0
0
1
0
0
1 bVSCBSubCommand (must be 0x26)
0
0
1
0
0
1
1
0
2 Reserved (must be set to zero)
0
0
0
0
0
0
0
0
3 Data Source (must be set to 0x02)
0
0
0
0
0
0
1
0
4 Start Address (LSB) (must be set to zero)
0
0
0
0
0
0
0
0
5 Start Address (MSB) (must be set to zero)
0
0
0
0
0
0
0
0
6–15 Reserved (must be set to zero)
0
0
0
0
0
0
0
0
5.1.2
MfgCB
The mfg_load and mfg_read vendor-specific commands will be passed down through the bulk pipe in the CBWCB portion of the
CBW. The format of this MFGCB is shown below. Byte 0 is a vendor-specific command designator whose value is configurable
and set in the configuration data. Byte 1 must be 0x27 to identify MfgCB. Byte 2–15 are reserved and must be set to zero.
The data transfer length will be determined by the CBW Data Transfer Length specified in bytes 8 through 11 (dCBWDataTransferLength) of the CBW. The type/direction of the command is determined by the direction bit specified in byte 12, bit 7 (bmCBWFlags) of the CBW.
Table 5-3. Example MfgCB
MfgCB Byte Description
0 bVSCBSignature (set in configuration bytes)
Bits
0
0
1
0
0
1
0
0
1 bVSCBSubCommand (hardcoded 0x27)
0
0
1
0
0
1
1
1
2–15 Reserved (must be zero)
0
0
0
0
0
0
0
0
5.1.2.1 Mfg_load
During a mfg_load, the CY7C68300A goes into Manufacturing Test Mode. Manufacturing Test Mode is provided as a means to
implement board or system level interconnect tests. During Manufacturing Test Mode operation, all outputs not directly associated
with USB operation are controllable. Normal control of the output pins are disabled. Control of the select CY7C68300A IO pins
and their three-state controls are mapped to the ATAPI data packet associated with this request. (See the following table for
explanation of the required mfg_load data format.) This requires a write of seven bytes. To exit Manufacturing Test Mode, a hard
reset (#RESET) is required.
Table 5-4. Mfg_load Data Format
Byte
Bit(s)
0
0
Test/Three-state Control Function
0
3:1
DA[2:0]
0
5:4
CS#[1:0]
0
6
Reserved
0
7
ARESET#
1
0
NDIOW
Reserved
Document #: 38-08031 Rev. *B
Page 12 of 26
CY7C68300A
Table 5-4. Mfg_load Data Format (continued)
Byte
Bit(s)
1
1
Test/Three-state Control Function
NDIOR
1
2
NDMACK
1
3:6
Reserved
1
7
2
7:0
DD[7:0]
DD[15:0] Three-state (0 = three-state DD pins, 1 = enable DD pins).
3
7:0
DD[15:8]
4
7:0
Reserved
5
7:0
Reserved
6
7:0
Reserved
5.1.2.2 Mfg_read
This USB request returns a “snapshot in time” of select CY7C68300A input pins. The input pin states are bit-wise mapped to the
ATAPI data associated with this request. CY7C68300A input pins not directly associated with USB operation can be sampled at
any time during Manufacturing Test Mode operation. See the following table for an explanation of the mfg_read data format. The
data length shall always be eight bytes.
Table 5-5. Mfg_read Data Format
Byte
5.2
Bit(s)
0
0
0
5:1
Test/Three-state Control Function
INTRQ
Reserved. This data should be ignored.
0
6
VBUS_PWR_VALID
0
7
ARESET# (output value only)
1
2:0
1
3
IORDY
1
4
DMARQ
1
5
ATA_EN
1
6
Reserved. This data should be ignored.
1
7
DD[15:0] Three-state
2
7:0
DD[7:0]
3
7:0
DD[15:8]
4
7:0
Reserved. This data should be ignored.
5
7:0
Reserved. This data should be ignored.
6
7:0
Reserved. This data should be ignored.
7
7:0
Reserved. This data should be ignored.
Reserved. This data should be ignored.
Normal Operation Mode
In Normal Operation Mode, the chip behaves as a USB 2.0 to ATA/ATAPI bridge. This includes all typical USB device states
(powered, configured, etc.). The USB descriptors are returned according to the values stored in the external EEPROM. An
external EEPROM is required for Mass Storage Class Bulk-Only Transport compliance, since a unique serial number is required
for each device. Also, Cypress requires customers to use their own Vendor and Product IDs for final products.
5.3
EEPROM Organization
The contents of the 256-byte (2048-bit) two-wire serial EEPROM are arranged as follows. The column labeled “Required
Contents” contains the values that must be used for proper operation of the CY7C68300A. The column labeled “Suggested
Contents” contains suggested values for the bytes that are defined by the manufacturer. Some values, such as the Vendor ID
and device and device serial number, must be customized to meet USB compliance. See section 5.1 for details on how to use
vendor-specific ATAPI commands to read and program the EEPROM. The serial EEPROM must be hard-wired to address 0x04.
This means that A0 and A1 of the serial EEPROM must be tied to ground and that A2 must be tied to 3.3V.
Document #: 38-08031 Rev. *B
Page 13 of 26
CY7C68300A
Table 5-6. EEPROM Organization
EEPROM
Address
Field Name
Field Description
Required Suggested
Contents Contents
Configuration
0x00
I2C-compatible memory
device signature (LSB)
LSB I2C-compatible memory device signature byte.
0x4D
0x01
I2C-compatible memory
device signature (MSB)
MSB I2C-compatible memory device signature byte.
0x4D
0x02
APM Value
ATA Device Automatic Power Management Value. If an
attached ATA device supports APM and this field contains
other than 0x00, the CY7C68300A will issue a
SET_FEATURES command to Enable APM with this value
during the drive initialization process. Setting APM Value to
0x00 disables this functionality. This value is ignored with
ATAPI devices.
0x00
0x03
ATA Initialization Timeout
Time in 128-ms granularity before the CY7C68300A stops
polling the ALT STAT register for reset complete and restarts
the reset process (0x80 = 16.4 seconds).
0x80
0x04
ATA Command Designator
Value in the first byte of the CBW CB field that designates that
the CB is t o be decoded as vendor specific ATA commands
instead of the ATAPI command block. See section 4.0 for
more detail on how this byte is used.
0x24
0x05
Reserved
Bits(7:4) Set to 0
0x07
BUSY Bit Delay
Bit (3)
Enables a delay of up to 120 ms at each read of the DRQ bit
where the device data length does not match the host data
length. This allows the CY7C68300A to work with most
devices that incorrectly clear the BUSY bit before a valid
status is present.
Short Packet Before Stall
Bit (2)
Determines if a short packet is sent prior to the STALL of an
IN endpoint. The USB Mass Storage Class Bulk-Only Specification allows a device to send a short or zero-length IN
packet prior to returning a STALL handshake for certain
cases. Certain host controller drivers may require a short
packet prior to STALL.
1 = Force a short packet before STALL.
0 = Don’t force a short packet before STALL.
SRST Enable
Bit (1)
Determines if the CY7C68300A is to do a SRST reset during
drive initialization.[3]
1 = Perform SRST during initialization.
0 = Don’t perform SRST during initialization.
Skip Pin Reset
Bit (0)
Skip ATA_NRESET assertion.[4]
0 = Allow ARESET# assertion for all resets.
1 = Disable ARESET# assertion except for power-on reset
cycles.
Notes:
3. At least one reset must be enabled. Do not set SRST to 0 and Skip Pin Reset to 1at the same time.
4. SRST Enable must be set in conjunction with Skip Pin Reset. Setting this bit causes the CY7C68300A to bypass ARESET# during initialization. All reset events
except a power-on reset utilize SRST as the drive mechanism.
Document #: 38-08031 Rev. *B
Page 14 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
0x06
Field Name
Field Description
Required Suggested
Contents Contents
ATA UDMA Enable
Bit (7)
Enable Ultra DMA data transfer support for ATAPI devices. If
enabled, and if the ATAPI device reports UDMA support for
the indicated modes, the CY7C68300A will utilize UDMA data
transfers at the highest negotiated rate possible.
0 = Disable ATA device UDMA support.
1 = Enable ATA device UDMA support.
ATAPI UDMA Enable
Bit (6)
Enable Ultra DMA data transfer support for ATAPI devices. If
enabled, and if the ATAPI device reports UDMA support for
the indicated modes, the CY7C68300A will utilize UDMA data
transfers at the highest negotiated rate possible.
0 = Disable ATAPI device UDMA support.
1 = Enable ATAPI device UDMA support.
UDMA Modes
Bit (5:0)
These bits select which UDMA modes, if supported, are
enabled. Setting to 1 enables. Multiple bits may be set. The
CY7C68300A will operate in the highest enabled UDMA
mode supported by the device. The CY7C68300A supports
UDMA modes 2 and 4 only.
Bit Descriptions
5 Reserved. Must be set to 0.
4 Enable UDMA mode 4.
3 Reserved. Must be set to 0.
2 Enable UDMA mode 2.
1 Reserved. Must be set to 0.
0 Reserved. Must be set to 0.
0x07
Reserved
PIO Modes
Bits(7:2)
Bits(1:0)
These bits select which PIO modes, if supported, are
enabled. Setting to 1 enables. Multiple bits may be set. The
CY7C68300A will operate in the highest enabled PIO mode
supported by the device. The CY7C68300A supports PIO
modes 0, 3, and 4 only. PIO mode 0 is always enabled by
internal logic.
Bit Descriptions
1 Enable PIO mode 4.
0 Enable PIO mode 3.
0x08
Reserved
Must be set to 0x00.
0x00
0x09
Reserved
Must be set to 0x00.
0x00
0x0A
Reserved
Must be set to 0x00.
0x00
0x0B
Reserved
Must be set to 0x00.
0x00
0x0C
Reserved
Must be set to 0x00.
0x00
0x0D
Reserved
Must be set to 0x00.
0x00
0x0E
Reserved
Must be set to 0x00.
0x00
0x0F
Reserved
Must be set to 0x00.
0x00
bLength
Length of device descriptor in bytes.
0x12
0x11
bDescriptor Type
Descriptor type.
0x01
0x12
bcdUSB (LSB)
USB Specification release number in BCD.
0x00
0x13
bcdUSB (MSB)
0x14
bDeviceClass
Device class.
0x00
0x15
bDeviceSubClass
Device subclass.
0x00
0xD4
0x03
Device Descriptor
0x10
Document #: 38-08031 Rev. *B
0x02
Page 15 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
Field Name
Field Description
Required Suggested
Contents Contents
0x16
bDeviceProtocol
Device protocol.
0x00
0x17
bMaxPacketSize0
USB packet size supported for default pipe.
0x40
0x18
idVendor (LSB)
idVendor (MSB)
Vendor ID. Cypress’s Vendor ID may only be used for evaluation purposes, and not in released products.
0xB4
0x19
0x1A
idProduct (LSB)
Product ID.
0x30
0x04
0x1B
idProduct (MSB)
0x1C
bcdDevice (LSB)
Device release number in BCD LSB (product release
number).
0x68
0x01
0x1D
bcdDevice (MSB)
Device release number in BCD MSB (silicon release
number).
0x00
0x1E
iManufacturer
Index to manufacturer string. This entry must equal half of the
address value where the string starts or 0x00 if the string does
not exist.
0x38
0x1F
iProduct
Index to product string. This entry must equal half of the
address value where the string starts or 0x00 if the string does
not exist.
0x4E
0x20
iSerialNumber
Index to serial number string. This entry must equal half of
the address value where the string starts or 0x00 if the string
does not exist. The USB Mass Storage Class Bulk-Only
Transport Specification requires a unique serial number (in
upper case, hexidecimal characters) for each device.
0x64
0x21
bNumConfigurations
Number of configurations supported.
0x01
bLength
Length of device descriptor in bytes.
0x0A
0x23
bDescriptor
Type Descriptor type.
0x06
0x24
bcdUSB (LSB)
USB Specification release number in BCD.
0x00
0x25
bcdUSB (MSB)
USB Specification release number in BCD.
0x02
0x26
bDeviceClass
Device class.
0x00
0x27
bDeviceSubClass
Device subclass.
0x00
0x28
bDeviceProtocol
Device protocol.
0x00
0x29
bMaxPacketSize0
USB packet size supported for default pipe.
0x40
Device Qualifier
0x22
0x2A
bNumConfigurations
Number of configurations supported.
0x01
0x2B
bReserved
Reserved for future use. Must be set to zero.
0x00
bLength
Length of configuration descriptor in bytes.
0x09
0x2D
bDescriptorType
Descriptor type.
0x02
0x2E
bTotalLength (LSB)
0x20
0x2F
bTotalLength (MSB)
Number of bytes returned in this configuration. This includes
the configuration descriptor plus all the interface and
endpoint descriptors.
High-speed Configuration Descriptor
0x2C
0x00
0x30
bNumInterfaces
Number of interfaces supported.
0x01
0x31
bConfiguration Value
The value to use as an argument to Set Configuration to
select the configuration. This value must be set to 0x01.
0x01
0x32
iConfiguration
Index to the configuration string. This entry must equal half
of the address value where the string starts or 0x00 if the
string does not exist.
Document #: 38-08031 Rev. *B
0x00
Page 16 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
Field Name
Field Description
0x33
bmAttributes
Device attributes for this configuration.
Bit Descriptions
7 Reserved. Must be set to 1.
6 Self-powered. Must be set to 1.
5 Remote wake-up. Must be set to 0.
4–0 Reserved. Must be set to 0.
0x34
bMaxPower
Maximum power consumption for this configuration. Units
used are mA*2 (i.e., 0x31 = 98 mA, 0xF9 = 498 mA). 0x00
reported for self-powered devices.
Required Suggested
Contents Contents
0xC0
0x00
High-speed Interface and Endpoint Descriptors
Interface Descriptor
0x35
bLength
Length of interface descriptor in bytes.
0x09
0x36
bDescriptorType
Descriptor type.
0x04
0x37
bInterfaceNumber
Interface number.
0x00
0x38
bAlternateSetting
Alternate setting.
0x00
0x39
bNumEndpoints
Number of endpoints.
0x02
0x3A
bInterfaceClass
Interface class.
0x08
0x3B
bInterfaceSubClass
Interface subclass.
0x3C
bInterfaceProtocol
Interface protocol.
0x3D
iInterface
Index to first interface string. This entry must equal half of the
address value where the string starts or 0x00 if the string does
not exist.
0x06
0x50
0x00
USB Bulk In Endpoint
0x3E
bLength
Length of this descriptor in bytes.
0x3F
bDescriptorType
Endpoint descriptor type.
0x05
0x40
bEndpointAddress
This is an In endpoint, endpoint number 8.
0x88
0x41
bmAttributes
This is a bulk endpoint.
0x02
0x42
wMaxPacketSize (LSB)
Max data transfer size.
0x00
HS interval for polling (max. NAK rate).
0x00
0x43
wMaxPacketSize (MSB)
0x44
bInterval
0x07
0x02
USB Bulk Out Endpoint
0x45
bLength
Length of this descriptor in bytes.
0x07
0x46
bDescriptorType
Endpoint descriptor type.
0x05
0x47
bEndpointAddress
This is an Out endpoint, endpoint number 2.
0x02
0x48
bmAttributes
This is a bulk endpoint.
0x02
0x49
wMaxPacketSize (LSB)
Max data transfer size.
0x4A
wMaxPacketSize (MSB)
0x4B
bInterval
0x00
0x02
HS interval for polling (max. NAK rate).
0x00
bLength
Length of configuration descriptor in bytes.
0x09
0x4D
bDescriptorType
Descriptor type.
0x02
0x4E
bTotalLength (LSB)
0x20
0x4F
bTotalLength (MSB)
Number of bytes returned in this configuration. This includes
the configuration descriptor plus all the interface and
endpoint descriptors.
Full-speed Configuration Descriptor
0x4C
0x00
0x50
bNumInterfaces
Number of interfaces supported.
0x01
0x51
bConfiguration Value
The value to use as an argument to Set Configuration to
select the configuration.
0x01
Document #: 38-08031 Rev. *B
Page 17 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
Field Name
Field Description
0x52
iConfiguration
Index to configuration string. This entry must equal half of the
address value where the string starts or 0x00 if the string does
not exist.
0x53
bmAttributes
Device attributes for this configuration.
Bit Descriptions
7 Reserved. Must be set to 1.
6 Self-powered. Must be set to 1.
5 Remote wake-up. Must be set to 0.
4–0 Reserved. Must be set to 0.
0x54
bMaxPower
Maximum power consumption for the second configuration.
Units used are mA*2 (i.e., 0x31 = 98 mA, 0xF9 = 498 mA).
Required Suggested
Contents Contents
0x00
0xC0
0x00
Full-speed Interface and Endpoint Descriptors
Interface Descriptor
0x55
bLength
Length of interface descriptor in bytes.
0x09
0x56
bDescriptorType
Descriptor type.
0x04
0x57
bInterfaceNumber
Interface number.
0x00
0x58
bAlternateSettings
Alternate settings.
0x00
0x59
bNumEndpoints
Number of endpoints.
0x02
0x5A
bInterfaceClass
Interface class.
0x08
0x5B
bInterfaceSubClass
Interface subclass.
0x5C
bInterfaceProtocol
Interface protocol.
0x50
0x06
0x5D
iInterface
Index to first interface string. This entry must equal half of the
address value where the string starts or 0x00 if the string does
not exist.
0x00
bLength
Length of this descriptor in bytes.
0x07
0x5F
bDescriptorType
Endpoint descriptor type.
0x05
0x60
bEndpointAddress
This is an In endpoint, endpoint number 8.
0x88
0x61
bmAttributes
This is a bulk endpoint.
0x02
0x62
wMaxPacketSize (LSB)
Max data transfer size.
0x63
wMaxPacketSize (MSB)
0x64
bInterval
USB Bulk InEndpoint
0x5E
0x40
0x00
Does not apply to FS bulk endpoints. Must be set to 0.
0x00
USB Bulk Out Endpoint
0x65
bLength
Length of this descriptor in bytes.
0x07
0x66
bDescriptorType
Endpoint descriptor type.
0x05
0x67
bEndpointAddress
This is an Out endpoint, endpoint number 2.
0x02
0x68
bmAttributes
This is a bulk endpoint.
0x02
0x69
wMaxPacketSize (LSB)
Max data transfer size.
0x6A
wMaxPacketSize (MSB)
0x6B
bInterval
0x40
0x00
Does not apply to FS bulk endpoints. Must be set to 0.
0x00
String Descriptor Examples (Note: The values in these strings are given as examples only and should not be used in final
products. Designers are encouraged to modify the string values to reflect the final product, since they are what users will see
with their operating systems.)
USB String Descriptor–Index 0 (LANGID)
0x6C
bLength
LANGID string descriptor length in bytes.
0x04
0x6D
bDescriptorType
Descriptor type.
0x03
Document #: 38-08031 Rev. *B
Page 18 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
Field Name
0x6E
LANGID (LSB)
0x6F
LANGID (MSB)
Field Description
Required Suggested
Contents Contents
Language supported.[5]
0x09
0x04
USB String Descriptor–Manufacturer
0x70
bLength
String descriptor length in bytes (including bLength).
0x71
bDescriptorType
Descriptor type.
0x72
bString
Unicode character.
0x73
bString
(“NUL”)
0x74
bString
Unicode character.
0x75
bString
(“NUL”)
0x76
bString
Unicode character.
0x77
bString
(“NUL”)
0x78
bString
Unicode character.
0x79
bString
(“NUL”)
0x7A
bString
Unicode character.
0x7B
bString
(“NUL”)
0x7C
bString
Unicode character.
0x7D
bString
(“NUL”)
0x7E
bString
Unicode character.
0x7F
bString
(“NUL”)
0x80
bString
Unicode character.
0x81
bString
(“NUL”)
0x82
bString
Unicode character.
0x83
bString
(“NUL”)
0x84
bString
Unicode character.
0x85
bString
(“NUL”)
0x86
bString
Unicode character.
0x87
bString
(“NUL”)
0x88
bString
Unicode character.
0x89
bString
(“NUL”)
0x8A
bString
Unicode character.
0x8B
bString
(“NUL”)
0x8C
bString
Unicode character.
0x8D
bString
(“NUL”)
0x8E
bString
Unicode character.
0x8F
bString
(“NUL”)
0x90
bString
Unicode character.
0x91
bString
(“NUL”)
0x92
bString
Unicode character.
0x93
bString
(“NUL”)
0x94
bString
Unicode character.
0x95
bString
(“NUL”)
0x96
bString
Unicode character.
0x97
bString
(“NUL”)
0x2C
0x03
“C” 0x43
0x00
“y” 0x79
0x00
“p” 0x70
0x00
“r” 0x72
0x00
“e” 0x65
0x00
“s” 0x73
0x00
“s” 0x73
0x00
“ ” 0x20
0x00
“S” 0x53
0x00
“e” 0x65
0x00
“m” 0x6D
0x00
“i” 0x69
0x00
“c” 0x63
0x00
“o” 0x6F
0x00
“n” 0x6E
0x00
“d” 0x64
0x00
“u” 0x75
0x00
“c” 0x63
0x00
“t” 0x74
0x00
Note:
5. See http://www.usb.org for LANGID documentation (the code for English is 0x0409).
Document #: 38-08031 Rev. *B
Page 19 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
Field Name
Field Description
0x98
bString
Unicode character.
0x99
bString
(“NUL”)
0x9A
bString
Unicode character.
0x9B
bString
(“NUL”)
Required Suggested
Contents Contents
“o” 0x6F
0x00
“r” 0x72
0x00
USB String Descriptor–Product
0x9C
bLength
String descriptor length in bytes (including bLength).
0x9D
bDescriptorType
Descriptor type.
0x9E
bString
Unicode character.
0x9F
bString
(“NUL”)
0xA0
bString
Unicode character.
0xA1
bString
(“NUL”)
0xA2
bString
Unicode character.
0xA3
bString
(“NUL”)
0xA4
bString
Unicode character.
0xA5
bString
(“NUL”)
0xA6
bString
Unicode character.
0xA7
bString
(“NUL”)
0xA8
bString
Unicode character.
0xA9
bString
(“NUL”)
0xAA
bString
Unicode character.
0xAB
bString
(“NUL”)
0xAC
bString
Unicode character.
0xAD
bString
(“NUL”)
0xAE
bString
Unicode character.
0xAF
bString
(“NUL”)
0xB0
bString
Unicode character.
0xB1
bString
(“NUL”)
0xB2
bString
Unicode character.
0xB3
bString
(“NUL”)
0xB4
bString
Unicode character.
0xB5
bString
(“NUL”)
0xB6
bString
Unicode character.
0xB7
bString
(“NUL”)
0xB8
bString
Unicode character.
0xB9
bString
(“NUL”)
0xBA
bString
Unicode character.
0xBB
bString
(“NUL”)
0xBC
bString
Unicode character.
0xBD
bString
(“NUL”)
0xBE
bString
Unicode character.
0xBF
bString
(“NUL”)
0xC0
bString
Unicode character.
0xC1
bString
(“NUL”)
0xC2
bString
Unicode character.
Document #: 38-08031 Rev. *B
0x2C
0x03
“U” 0x55
0x00
“S” 0x53
0x00
“B” 0x42
0x00
“2” 0x32
0x00
“.” 0x2E
0x00
“0” 0x30
0x00
“ ” 0x20
0x00
“S” 0x53
0x00
“t” 0x74
0x00
“o” 0x6F
0x00
“r” 0x72
0x00
“a” 0x61
0x00
“g” 0x67
0x00
“e” 0x65
0x00
“ ” 0x20
0x00
“D” 0x44
0x00
“e” 0x65
0x00
“v” 0x76
0x00
“i” 0x69
Page 20 of 26
CY7C68300A
Table 5-6. EEPROM Organization (continued)
EEPROM
Address
Field Name
Field Description
0xC3
bString
(“NUL”)
0xC4
bString
Unicode character.
0xC5
bString
(“NUL”)
0xC6
bString
Unicode character.
0xC7
bString
(“NUL”)
Required Suggested
Contents Contents
0x00
“c” 0x63
0x00
“e” 0x65
0x00
USB String Descriptor–Serial Number (Note: The USB Mass Storage Class requires a unique serial number in each device.
Not providing a unique serial number will crash the operating system. The serial number must be at least a minimum size of 12
characters. Some hosts will only treat the last 12 characters of the serial number as unique.)
0xC8
bLength
String descriptor length in bytes (including bLength).
0xC9
bDescriptor Type
Descriptor type.
0xCA
bString
Unicode character.
0xCB
bString
(“NUL”)
0xCC
bString
Unicode character.
0xCD
bString
(“NUL”)
0xCE
bString
Unicode character.
0xCF
bString
(“NUL”)
0xD0
bString
Unicode character.
0xD1
bString
(“NUL”)
0xD2
bString
Unicode character.
0xD3
bString
(“NUL”)
0xD4
bString
Unicode character.
0xD5
bString
(“NUL”)
0xD6
bString
Unicode character.
0xD7
bString
(“NUL”)
0xD8
bString
Unicode character.
0xD9
bString
(“NUL”)
0xDA
bString
Unicode character.
0xDB
bString
(“NUL”)
0xDC
bString
Unicode character.
0xDD
bString
(“NUL”)
0xDE
bString
Unicode character.
0xDF
bString
(“NUL”)
0xE0
bString
Unicode character.
0xE1
bString
(“NUL”)
0xE2
bString
Unicode character.
0xE3
bString
(“NUL”)
0x22
0x03
“1” 0x31
0x00
“2” 0x32
0x00
“3” 0x33
0x00
“4” 0x34
0x00
“5” 0x35
0x00
“6” 0x36
0x00
“7” 0x37
0x00
“8” 0x38
0x00
“9” 0x39
0x00
“0” 0x30
0x00
“A” 0x41
0x00
“B” 0x42
0x00
“C” 0x43
0x00
0xE4
bString
Unicode character.
0xE5
bString
(“NUL”)
0xE6
bString
Unicode character.
0xE7
bString
(“NUL”)
0xE8
bString
Unicode character.
0xE9
bString
(“NUL”)
0x00
0xEA to
0xFF
Unused ROM Space
Amount of unused ROM space will vary depending on strings.
0xFF
Document #: 38-08031 Rev. *B
“D” 0x44
0x00
“E” 0x45
0x00
“F” 0x46
Page 21 of 26
CY7C68300A
6.0
Absolute Maximum Ratings
Storage Temperature ............................................................................................................................................–65°C to +150°C
Ambient Temperature with power supplied .................................................................................................................0°C to +70°C
Supply Voltage to Ground Potential ......................................................................................................................... –0.5V to +4.0V
DC Input Voltage to Any Input Pin ......................................................................................................................................... 5.25V
DC Voltage Applied to Outputs in High-Z State ............................................................................................. –0.5V to VCC + 0.5V
Power Dissipation .............................................................................................................................................................. 936 mW
Static Discharge Voltage .................................................................................................................................................... > 2000V
Max Output Current per IO port ............................................................................................................................................ 10 mA
7.0
Operating Conditions[6]
TA (Ambient Temperature Under Bias) .......................................................................................................................0°C to +70°C
Supply Voltage .........................................................................................................................................................+3.0V to +3.6V
Ground Voltage ........................................................................................................................................................................... 0V
Fosc (Oscillator or Crystal Frequency) .............................................................................................................. 24 MHz ± 100 ppm
............................................................................................................................................................................ Parallel Resonant
8.0
DC Characteristics
Parameter
Description
Conditions
VCC
Supply Voltage
VIH
Input High Voltage
VIL
Input Low Voltage
II
Input Leakage Current
VOH
Output Voltage High
IOUT = 4 mA
VOL
Output Voltage Low
IOUT = –4 mA
Min.
Typ.
3.0
3.3
2
–0.5
0 < VIN < VCC
Max.
Unit
3.6
V
5.25
V
0.8
V
+ 10
µA
0.4
V
2.4
V
IOH
Output Current High
4
mA
IOL
Output Current Low
4
mA
CIN
Input Pin Capacitance
All but D+/D-
10
pF
Only D+/D-
15
pF
ICC
Supply Current
USB High Speed
235
260
mA
ICC
Supply Current
USB Full Speed
90
150
mA
ISUSP
Suspend Current
Connected
250
400
µA
Disconnected
30
180
µA
TRESET
9.0
9.1
Reset Time After Valid Power
VCC min = 3.0V
1.91
ms
AC Electrical Characteristics
USB Transceiver
Complies with the USB 2.0 specification.
9.2
ATA Timing
The ATA interface supports ATA PIO modes 0, 3, and 4, and Ultra DMA modes 2 and 4 per the ATA Specification T13/1410D
Rev. 3B.
Note:
6. If an alternate clock source is input on XTALIN it must be supplied with standard 3.3V signaling characteristics and XTALOUT must be left floating.
Document #: 38-08031 Rev. *B
Page 22 of 26
CY7C68300A
10.0
Ordering Information
Part Number
CY7C68300A-PVC
CY7C68300A-LFC
CY4615A
11.0
Package Type
56 SSOP
56 QFN
EZ-USB AT2 Reference Design Kit
Package Diagrams
.020
1
28
0.395
0.420
0.292
0.299
29
DIMENSIONS IN INCHES MIN.
MAX.
56
0.720
0.730
SEATING PLANE
0.088
0.092
0.095
0.110
0.005
0.010
.010
GAUGE PLANE
0.110
0.025
BSC
0.024
0.040
0°-8°
0.008
0.016
0.008
0.0135
51-85062-*C
Figure 11-1. 56-lead Shrunk Small Outline Package 056
56-Lead QFN 8 x 8 MM LF56A
TOP VIEW
BOTTOM VIEW
SIDE VIEW
0.08[0.003]
C
1.00[0.039] MAX.
7.90[0.311]
8.10[0.319]
A
0.05[0.002] MAX.
0.80[0.031] MAX.
7.70[0.303]
7.80[0.307]
0.18[0.007]
0.28[0.011]
0.20[0.008] REF.
0.80[0.031]
DIA.
PIN1 ID
0.20[0.008] R.
N
N
1
1
2
2
0.45[0.018]
6.45[0.254]
6.55[0.258]
7.90[0.311]
8.10[0.319]
7.70[0.303]
7.80[0.307]
E-PAD
(PAD SIZE VARY
BY DEVICE TYPE)
0.30[0.012]
0.50[0.020]
0°-12°
0.50[0.020]
C
SEATING
PLANE
0.24[0.009]
0.60[0.024]
(4X)
6.45[0.254]
6.55[0.258]
51-85144-*D
Figure 11-2. 56-lead Quad Flatpack No Lead (8 x 8 mm) LF56A
Document #: 38-08031 Rev. *B
Page 23 of 26
CY7C68300A
12.0
PCB Layout Recommendations
The following recommendations should be followed to ensure reliable high-performance operation.
• At least a four-layer impedance controlled boards are required to maintain signal quality.
• Specify impedance targets (ask your board vendor what they can achieve).
• To control impedance, maintain trace widths and trace spacing.
• Minimize stubs to minimize reflected signals.
• Connections between the USB connector shell and signal ground must be done near the USB connector.
• Bypass/flyback caps on VBus, near connector, are recommended.
• DPLUS and DMINUS trace lengths should be kept to within 2 mm of each other in length, with preferred length of 20-30mm.
• Maintain a solid ground plane under the DPLUS and DMINUS traces. Do not allow the plane to be split under these traces.
• It is preferred is to have no vias placed on the DPLUS or DMINUS trace routing.
• Isolate the DPLUS and DMINUS traces from all other signal traces by no less than 10 mm.
Source for recommendations:
• EZ-USB FX2 PCB Design Recommendations, http:///www.cypress.com/cfuploads/support/app_notes/FX2_PCB.pdf.
• High-speed USB Platform Design Guidelines, http://www.usb.org/developers/data/hs_usb_pdg_r1_0.pdf.
13.0
Quad Flat Package No Leads (QFN) Package Design Notes
Electrical contact of the part to the Printed Circuit Board (PCB) is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the heat transfer area below the package to provide a good thermal
bond to the circuit board. A Copper (Cu) fill is to be designed into the PCB as a thermal pad under the package. Heat is transferred
from the CY7C68300A through the device’s metal paddle on the bottom side of the package. Heat from here is conducted to the
PCB at the thermal pad. It is then conducted from the thermal pad to the PCB inner ground plane by a 5 x 5 array of Via. A Via
is a plated through-hole in the PCB with a finished diameter of 13 mil. The QFN’s metal die paddle must be soldered to the PCB’s
thermal pad. Solder mask is placed on the board top side over each Via to resist solder flow into the Via. The mask on the top
side also minimizes outgassing during the solder reflow process.
For further information on this package design please refer to the application note “Surface Mount Assembly of AMKOR’s
MicroLeadFrame (MLF) Technology.” This application note can be downloaded from AMKOR’s website from the following URL
http://www.amkor.com/products/notes_papers/MLF_AppNote_0301.pdf. The application note provides detailed information on
board mounting guidelines, soldering flow, rework process, etc.
Figure 13-1 below display a cross-sectional area underneath the package. The cross section is of only one via. The solder paste
template needs to be designed to allow at least 50% solder coverage. The thickness of the solder paste template should be 5 mil.
It is recommended that “No Clean,” type 3 solder paste is used for mounting the part. Nitrogen purge is recommended during
reflow.
0.017” dia
Solder Mask
Cu Fill
Cu Fill
PCB Material
Via hole for thermally connecting the
QFN to the circuit board ground plane.
0.013” dia
PCB Material
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane
Figure 13-1. Cross-Section of the Area Underneath the QFN Package
Figure 13-2 is a plot of the solder mask pattern and Figure 13-3 displays an X-Ray image of the assembly (darker areas indicate
solder.)
Document #: 38-08031 Rev. *B
Page 24 of 26
CY7C68300A
Figure 13-2. Plot of the Solder Mask (White Area)
Figure 13-3. X-ray Image of the Assembly
14.0
Other Design Considerations
Certain design considerations must be followed to ensure proper operation of the CY7C68300A. The following items should be
taken into account when designing a USB device with the CY7C68300A.
14.1
Proper Power-up Sequence
Power must be applied to the CY7C68300A before, or at the same time as the ATA/ATAPI device. If power is supplied to the drive
first, the CY7C68300A will start up in an undefined state. Designs that utilize separate power supplies for the CY7C68300A and
the ATA/ATAPI device are not recommended.
14.2
IDE Removable Media Devices
The CY7C68300A does not fully support IDE removable media devices. Changes in media state are not reported to the operating
system so users will be unable to eject/reinsert media properly. This may result in lost or corrupted data.
14.3
Devices With Small Buffers
The size of the ATA/ATAPI device’s buffer can greatly affect the overall data transfer performance. Care should be taken to ensure
that devices have large enough buffers to handle the flow of data to/from the drive. The exact buffer size needed depends on a
number of variables, but a good rule of thumb is:
(aprox min buffer size) = (data rate) * (seek time + rotation time + other)
where (other) may include things like time to switch heads, power-up a laser, etc. Devices with buffers that are too small to handle
the extra data may perform considerably slower than expected.
15.0
Disclaimers, Trademarks, and Copyrights
Purchase of I2C components from Cypress, or one of its sublicensed Associated Companies, conveys a license under the Philips
I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification
as defined by Philips. EZ-USB AT2 is a trademark, and EZ-USB is a registered trademark, of Cypress Semiconductor. All product
and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-08031 Rev. *B
Page 25 of 26
© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CY7C68300A
Document History Page
Description Title: CY7C68300A EZ-USB AT2™ USB 2.0 to ATA/ATAPI Bridge
Document Number: 38-08031
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
124022
02/13/03
GIR
New Data Sheet
*A
124857
06/06/03
GIR
Updated overall language/layout for “Final” status
Revised description of DPLUS pin in section 2.2
Revised text in sections 2.3.4, 2.3.5, and 2.3.6
Updated ISUSP and TRESET values in section 8.0
Updated Figure 11-2 to include new QFN package drawing number
Swapped In and Out bulk endpoints in section 5.3
*B
129094
08/18/03
GIR
Minor Change - Rework existing package drawing to improve clarity.
Document #: 38-08031 Rev. *B
Page 26 of 26