VISHAY TSOP5230

TSOP52..
Vishay Telefunken
Photo Module for High Data Rates PCM Remote Control
Systems
Available types for different carrier frequencies
Type
TSOP5230
TSOP5236
TSOP5238
TSOP5256
fo
30 kHz
36 kHz
38 kHz
56 kHz
Type
TSOP5233
TSOP5237
TSOP5240
fo
33 kHz
36.7 kHz
40 kHz
Description
The TSOP52.. – series are miniaturized SMD–IR
Receiver Modules for infrared remote control systems.
PIN diode and preamplifier are assembled on lead
frame, the epoxy package is designed as IR filter.
The demodulated output signal can directly be
decoded by a microprocessor. TSOP52.. is the
standard IR remote control SMD–Receiver series,
supporting all major transmission codes.
16797
Features
Photo detector and preamplifier in one package
Low power consumption
Internal filter for PCM frequency
High immunity against ambient light
Continuous data transmission possible
Suitable burst length ≥10 cycles/burst
TTL and CMOS compatibility
Taping available for topview and sideview
assembly
Output active low
Block Diagram
4
Control
Circuit
Input
30 k
3
PIN
AGC
Band
Pass
VS
OUT
Demodulator
1
GND
16798
Document Number 82154
Rev. 1, 08-Mar-01
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1 (8)
TSOP52..
Vishay Telefunken
Absolute Maximum Ratings
Tamb = 25_C
Parameter
Supply Voltage
Supply Current
Output Voltage
Output Current
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Power Consumption
Test Conditions
Symbol
VS
IS
VO
IO
Tj
Tstg
Tamb
Ptot
Pin 4
Pin 4
Pin 3
Pin 3
Tamb 85C
Value
–0.3...6.0
5
–0.3...6.0
15
100
–40...+85
–25...+85
50
Unit
V
mA
V
mA
C
C
C
mW
Typ
1.1
1.4
Unit
mA
mA
V
m
Basic Characteristics
Tamb = 25_C
Parameter
Supply
Su
ly Current
Supply Voltage
Transmission Distance
Output Voltage Low (Pin 3)
Irradiance (30–40 kHz)
Irradiance (56 kHz)
Irradiance
Directivity
Test Conditions
VS = 5 V, Ev = 0
VS = 5 V, Ev = 40 klx, sunlight
Symbol
ISD
ISH
VS
d
Ev = 0, test signal see fig.7,
IR diode TSAL6200, IF = 400 mA
IOSL = 0.5 mA,Ee = 0.7 mW/m2
Pulse width tolerance:
tpii – 5/fo < tpo < tpii + 6/fo,
test signal see fig.7
tpi – 5/fo < tpo < tpi + 6/fo
Angle of half transmission distance
VOSL
Ee min
Ee min
Ee max
ϕ1/2
Min
0.8
4.5
Max
1.5
5.5
30
0.5
250
0.6
mV
mW/m 2
0.6
0.7
mW/m 2
W/m 2
deg
30
±50
Application Circuit
100 W *)
4
TSOP52..
TSAL62..
4.7 mF *)
+ 5V
>10 kW
optional
3
2
N.C.
mC
**)
1
16799
GND
*) recommended to suppress power supply disturbances
**) the output voltage should not be hold continuously at a voltage below 3.3V by the external circuit.
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2 (8)
Document Number 82154
Rev. 1, 08-Mar-01
TSOP52..
Vishay Telefunken
Suitable Data Format
The circuit of the TSOP52.. is designed in that way that
unexpected output pulses due to noise or disturbance
signals are avoided. A bandpassfilter, an integrator
stage and an automatic gain control are used to
suppress such disturbances.
The distinguishing mark between data signal and
disturbance signal are carrier frequency, burst length
and duty cycle.
The data signal should fullfill the following condition:
• Carrier frequency should be close to center
frequency of the bandpass (e.g. 38kHz).
• Burst length should be 10 cycles/burst or longer.
• After each burst which is between 10 cycles and 70
cycles a gap time of at least 14 cycles is
necessary.
• For each burst which is longer than 1.8ms a
corresponding gap time is necessary at some time
in the data stream. This gap time should be at least
4 times longer than the burst.
• Up to 800 short bursts per second can be received
continuously.
0
5
Some examples for suitable data format are:
NEC Code, Toshiba Micom Format, Sharp Code, RC5
Code, RC6 Code, R–2000 Code.
When a disturbance signal is applied to the TSOP52..
it can still receive the data signal. However the
sensitivity is reduced to that level that no unexpected
pulses will occure.
Some examples for such disturbance signals which
are suppressed by the TSOP52.. are:
• DC light (e.g. from tungsten bulb or sunlight)
• Continuous signal at 38kHz or at any other
frequency
• Signals from fluorescent lamps with electronic
ballast with high or low modulation (see Figure A or
Figure B).
10
15
20
time [ms]
Figure A: IR Signal from Fluorescent Lamp with low Modulation
0
5
10
15
20
time [s]
Figure B: IR Signal from Fluorescent Lamp with high Modulation
Document Number 82154
Rev. 1, 08-Mar-01
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3 (8)
TSOP52..
Vishay Telefunken
Typical Characteristics (Tamb = 25_C unless otherwise specified)
0.8
0.6
0.4
0.2
f = f0"5%
Df ( 3 dB ) = f0 / 10
0.0
0.7
0.8
0.9
1.0
1.1
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1.3
1.2
f / f0 – Relative Frequency
94 8143
4.0
E e min – Threshold Irradiance (mW/m2 )
E
e min
/e E – Rel. Responsitivity
1.0
0
0.5
1.0
1.5
E – Field Strength of Disturbance (kV/m)
16802
Figure 1. Frequency Dependence of Responsivity
tpo – Output Pulse Length (ms)
0.9
0.8
Input burst duration
0.7
0.6
0.5
l = 950 nm,
optical test signal, fig.7
0.4
Figure 4. Threshold Irradiance vs.
Field Strength of Disturbance
10
Ee min – Threshold Irradiance ( mW/m2 )
1.0
0.3
0.2
0.1
f = f0
1 kHz
10 kHz
1
100 Hz
0
0.1
1.0
10.0
4.0
3.5
Correlation with ambient light sources
( Disturbance effect ) : 10W/m2^1.4 klx
( Stand.illum.A,T = 2855 K )^8.2 klx
( Daylight, T = 5900 K )
3.0
2.5
2.0
Ambient, l = 950 nm
1.5
1.0
0.5
0
0.01
96 12111
0.10
1.00
10.00
E – DC Irradiance (W/m2)
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10
100
1000
1.0
0.9
0.8
Sensitivity in dark ambient
0.7
0.6
0.5
0.4
0.3
0.2
0.1
100.00
Figure 3. Sensitivity in Bright Ambient
1
Figure 5. Sensitivity vs. Supply Voltage Disturbances
E e min – Threshold Irradiance (mW/m2 )
E e min – Threshold Irradiance (mW/m2 )
5.0
0.1
DVs RMS – AC Voltage on DC Supply Voltage ( mV )
94 9106
Figure 2. Sensitivity in Dark Ambient
4.5
0.1
0.01
100.0 1000.0 10000.0
Ee – Irradiance ( mW/m2 )
96 12110
2.0
96 12112
0
–30 –15 0
15 30 45 60 75
Tamb – Ambient Temperature ( °C )
90
Figure 6. Sensitivity vs. Ambient Temperature
Document Number 82154
Rev. 1, 08-Mar-01
TSOP52..
Vishay Telefunken
Optical Test Signal
Ee
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms)
tpi *
T
* tpi w 10/fo is recommended for optimal function
Output Signal
VO
1)
2)
VOH
16110
7/f0 < td < 15/f0
tpo = tpi " 6/f0
Ton ,Toff – Output Pulse Length (ms)
t
1.0
0.9
0.8
Ton
0.7
0.6
0.5
Toff
0.4
0.3
l = 950 nm,
optical test signal, fig.8
0.2
0.1
0
0.1
VOL
td1 )
t
tpo2
)
100.0 1000.0 10000.0
t
600 ms
T = 60 ms
94 8134
Output Signal, ( see Fig.10 )
VOH
S ( l )rel – Relative Spectral Sensitivity
Optical Test Signal
600 ms
VO
10.0
Figure 10. Output Pulse Diagram
Figure 7. Output Function
Ee
1.0
Ee – Irradiance (mW/m2)
96 12114
1.2
1.0
0.8
0.6
0.4
0.2
0
750
VOL
Ton
t
Toff
850
950
1150
1050
l – Wavelength ( nm )
94 8408
Figure 11. Relative Spectral Sensitivity vs. Wavelength
Figure 8. Output Function
0°
10°
20°
30°
0.8
f = 38 kHz
Envelope Duty Cycle
0.7
0.6
40°
0.5
1.0
0.4
0.9
50°
0.3
0.8
60°
0.2
70°
0.7
80°
0.1
0
10
16156
20 30 40 50 60 70 80
Burstlength [number of cycles/burst]
Figure 9. Max. Envelope Duty Cycle vs. Burstlength
Document Number 82154
Rev. 1, 08-Mar-01
0.6
90
16801
0.6
0.4
0.2
0
0.2
0.4
drel – Relative Transmission Distance
Figure 12. Directivity
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TSOP52..
Vishay Telefunken
Operating Instructions
Reflow Soldering
D Reflow soldering must be done within 48 hours
stored under max. 30°C, 80% RH after opening
envelop
D Recommended soldering paste
(composition: SN 63%, Pb 37%)
Melting temperature 178 to 192°C
D Apply solder paste to the specified soldering
pads, by using a dispenser or by screen printing.
D Recommended thickness of metal mask is 0.2 mm
for screen printing.
D The recommended reflow furnace is a
combinationtype with upper and lower heaters.
D Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230_C. The
following temperature profile means the tempera–
ture at the device surface. Since temperature differ–
ence occurs between the work and the surface of
the circuit board depending on the pes of circuit
board or reflow furnace, the operating conditions
should be verified prior to start of operation.
D Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
D Use the 6/4 solder or the solder containing silver.
D Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300_C.
D Finish soldering within three seconds.
D Handle products only after the temperature is
cooled off.
Cleaning
D Perform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 m
corresponding to a conductivity of 2 mS/m.
D Temperature and time: 30 seconds under the
temperature below 50_C or 3 minutes below 30_C.
D Ultrasonic cleaning: Below 20 W.
94 8625
300
max. 240 °C
ca. 230 °C
10 s
250
215 °C
Temperature (° C )
200
150
max. 160 °C
max. 40 s
100
90 – 120 s
full line
: typical
dotted line : process limits
50
2–4 K / s
Lead Temperature
0
50
100
150
200
250
Time ( s )
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6 (8)
Document Number 82154
Rev. 1, 08-Mar-01
TSOP52..
Vishay Telefunken
Dimensions in mm
16776
Document Number 82154
Rev. 1, 08-Mar-01
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7 (8)
TSOP52..
Vishay Telefunken
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 )7131 67 2831, Fax number: 49 ( 0 )7131 67 2423
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8 (8)
Document Number 82154
Rev. 1, 08-Mar-01