IA NT SinglFuse™ SF-0603S Series Features ■ Thin film chip fuse oH S CO M PL ■ Single blow fuse for overcurrent *R ■ ■ ■ ■ protection 1608 (EIA 0603) miniature footprint Slow blow fuse UL certified RoHS compliant* and halogen free ■ Surface mount packaging for automated assembly SF-0603S Series - Slow Blow Surface Mount Fuses Electrical Characteristics Resistance (mΩ) Typ.* Rated Voltage Breaking Capacity Typical I2t (A2s) 0.50 175 DC 50 V DC 50 V 50 A 0.009 SF-0603S063 SF-0603S080 SF-0603S100 SF-0603S125 SF-0603S150 SF-0603S160 0.63 0.80 1.00 1.25 1.50 1.60 130 93 65 47 36 34 SF-0603S200 2.00 SF-0603S250 SF-0603S300 SF-0603S315 SF-0603S400 2.50 3.00 3.15 4.00 20 16 15 12 0.200 0.210 0.279 0.326 SF-0603S500 5.00 9 0.622 Model Rated Current (Amps) SF-0603S050 Fusing Time Open within 5 sec. at 250 % rated current 26 DC 32 V DC 32 V 50 A 0.017 0.024 0.026 0.057 0.081 0.086 0.115 *Resistance value was measured with less than 10 % of rated current. Reliability Testing Parameter Requirement Test Method Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current Interrupting Ability .................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm, Bending: 3 mm,1time, 30 seconds Resistance to Solder Heat........................ ±20 % ........................................................260 °C ±5 °C,10 seconds ±1 second Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface temperature Resistance to Dry Heat............................. ±20 % ........................................................105 °C ±5 °C,1000 hours Resistance to Solvent............................... No evident damage on protective .............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating and marking Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles Typical Part Marking How to Order Represents total content. Layout may vary. SF - 0603 S 050 - 2 SinglFuse™ Product Designator SMD Footprint 1608 (EIA 0603) size RATING CURRENT (A) F = 0.50 S = 2.00 I = 0.63 T = 2.50 K = 0.80 3 = 3.00 L = 1.00 U = 3.15 M = 1.25 W = 4.00 P = 1.50 Y = 5.00 N = 1.60 Fuse Blow Type F = Fast acting S = Slow blow Rated Current 050-500 (500 mA - 5.00 A) Packaging Type - 2 = Tape & Reel (5,000 pcs./reel) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com SinglFuse™ SF-0603S Series Applications ■ Portable memory ■ Cell phones ■ LCD monitors ■ Rechargeable battery packs ■ Disk drives ■ Battery chargers ■ PDAs ■ Set top boxes ■ Digital cameras ■ Industrial controllers ■ DVDs SF-0603S Series - Slow Blow Surface Mount Fuses Solder Reflow Recommendations 250 Peak: 250 +0/-5 °C TEMPERATURE (°C) 230 °C or higher 200 PRE-HEATING ZONE 180 °C PEAK: 250 +0/-5 °C, 5 seconds PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds 150 °C 150 90 ± 30 Seconds 100 30 ± 10 Seconds SOLDERING ZONE 50 HEATING TIME Product Dimensions Recommended Pad Layout 1.6 ± 0.1 (.063 ± .004) 1.02 (.040) 0.45 ± 0.1 (.018 ± .004) 0.8 ± 0.1 (.031 ± .004) 1.09 (.043) 0.35 ± 0.2 (.014 ± .008) 0.3 ± 0.2 (.012 ± .008) 0.3 ± 0.2 (.012 ± .008) DIMENSIONS: PACKAGING: 5,000 pcs./reel 0.35 ± 0.2 (.014 ± .008) 2.54 (.010) MM (INCHES) Thermal Derating Curve Construction & Material Content PERCENT OF RATING (%) 120 OVERCOAT 110 Sn PLATING 100 FUSE ELEMENT Cu / Ni PLATING 90 CERAMIC SUBSTRATE 80 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications SF-0603S Series - Slow Blow Surface Mount Fuses Minimum I2T V Clear Time Curves Average Time Current Curves 1.50 A 1.25 A 1.00 A 0.80 A 0.63 A 0.50 A 1.60 A 2.00 A 2.50 A 3.00 A 3.15 A 4.00 A 5.00 A 5.00 A 4.00 A 3.15 A 3.00 A 2.50 A 100 2.00 A 1.60 A 1.50 A 1.25 A 1.00 A 100 10 0.80 A 0.63 A 0.50 A MIN. I2T (A2 SEC) CLEARING TIME (S) 10 1 1 0.1 0.1 0.01 0.01 0.001 0.1 1 10 100 CURRENT (A) REV. B 11/08 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications 0.001 0.001 0.01 0.1 CLEARING TIME (S) 1 SF-0603S Series Tape and Reel Specifications SF-0603S Series per EIA 481-2 Tape Dimensions W 8.0 ± 0.2 (.315 ± .008) P0 4.0 ± 0.1 (.157 ± .004) P1 4.0 ± 0.1 (.157 ± .004) P2 2.0 ± 0.05 (.079 ± .002) A 1.1 ± 0.1 (.043 ± .004) B 1.9 ± 0.1 (.075 ± .004) F 3.5 ± 0.05 (.138 ± .002) E 1.75 ± 0.1 (.069 ± .004) 1.5 + 0.1/-0 (.059 + .004/-0) D0 0.64 ± 0.1 (.025 ± .004) T Reel Dimensions 180 +0/-3.0 (7.087 +0/-.118) A 60.0 (2.362) B Min. C 13.0 ± 1.0 (.512 ± .039) W 9.0 ± 1.0 (.354 ± .039) T 11.4 ± 2.0 (.449 ± .079) T DIMENSIONS: MM (INCHES) W BOTTOM TAPE A DIA. C DIA. DO PO E TOP TAPE B B DIA. F PAPER TAPE RESISTOR TAPE T A P1 W P2 DIRECTION OF UNREELING Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications