BOURNS SF-0402S160

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CO
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PL
IA
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SinglFuse™ SF-0402S Series Features
■ Single blow fuse for overcurrent
■ Thin film chip fuse
protection
■ 1005 (EIA 0402) miniature footprint
■ Slow blow fuse
■ UL certified
■ RoHS compliant* and
halogen free
■ Surface mount packaging for automated
assembly
SF-0402S Series - Slow Blow Surface Mount Fuses
Electrical Characteristics
Model
SF-0402S050
SF-0402S080
SF-0402S100
SF-0402S125
SF-0402S150
SF-0402S160
SF-0402S200
SF-0402S250
SF-0402S300
SF-0402S315
SF-0402S400
Rated Current
(Amps)
0.50
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
Fusing Time
Open within 5
sec. at 250 %
rated current
Resistance
(mΩ) Typ.*
235
86
64
45
35
32
24
19
15
14
10.5
Rated
Voltage
Breaking
Capacity
DC 24 V
DC24 V 35 A
Typical
I2t (A2s)
0.00370
0.00947
0.01479
0.02310
0.02400
0.03734
0.04040
0.06760
0.09860
0.10868
0.11450
*Resistance value was measured with less than 10 % of rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability .................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................ ±20 % ........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % ........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent............................... No evident damage on protective .............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
How to Order
Represents total content. Layout may
vary.
SF - 0402 S 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1005 (EIA 0402) size
RATING CURRENT (A)
F = 0.50
S = 2.00
K = 0.80
T = 2.50
L = 1.00
3 = 3.00
M = 1.25
U = 3.15
P = 1.50
W = 4.00
N = 1.60
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-400 (500 mA - 4.00 A)
Packaging Type
- 2 = Tape & Reel (10,000 pcs./reel)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
SinglFuse™ SF-0402S Series Applications
■ Portable memory
■ Cell phones
■ LCD monitors
■ Rechargeable battery packs
■ Disk drives
■ Battery chargers
■ PDAs
■ Set top boxes
■ Digital cameras
■ Industrial controllers
■ DVDs
SF-0402S Series - Slow Blow Surface Mount Fuses
Solder Reflow Recommendations
250
Peak: 250 +0/-5 °C
TEMPERATURE (°C)
230 °C or higher
200
PRE-HEATING ZONE
180 °C
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
150 °C
150
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
Product Dimensions
Recommended Pad Layout
1.0 ± 0.1
(.039 ± .004)
0.381
(.015)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
0.558
(.022)
0.25 ± 0.1
(.010 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.2 ± 0.1
(.008 ± .004)
DIMENSIONS:
PACKAGING: 10,000 pcs./reel
1.55
(.061)
MM
(INCHES)
Thermal Derating Curve
Construction & Material Content
PERCENT OF RATING (%)
120
OVERCOAT
110
Sn PLATING
100
FUSE ELEMENT
Cu / Ni PLATING
90
CERAMIC SUBSTRATE
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
SF-0402S Series - Slow Blow Surface Mount Fuses
Minimum I2T V Clear Time Curves
Average Time Current Curves
1.50 A
1.25 A
1.00 A
0.80 A
0.50 A
1.60 A
2.00 A
2.50 A
3.00 A
3.15 A
4.00 A
4.00 A
100
3.15 A
3.00 A
2.50 A
2.00 A
1.60 A
1.50 A
1.25 A
100
10
1.00 A
0.80 A
MIN. I2T (A2 SEC)
CLEARING TIME (S)
10
1
0.50 A
1
0.1
0.1
0.01
0.01
0.001
0.1
1
10
100
CURRENT (A)
REV. A 08/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
0.001
0.001
0.01
0.1
CLEARING TIME (S)
1
SF-0402S Series Tape and Reel Specifications
SF-0402S Series
per EIA 481-2
Tape Dimensions
W
8.0 ± 0.2
(.315 ± .008)
P0
4.0 ± 0.1
(.157 ± .004)
P1
2.0 ± 0.1
(.079 ± .004)
P2
2.0 ± 0.05
(.079 ± .002)
A
0.7 ± 0.05
(.028 ± .002)
B
1.2 ± 0.05
(.047 ± .002)
F
3.5 ± 0.05
(.138 ± .002)
E
1.75 ± 0.1
(.069 ± .004)
D0
1.5 + 0.1
(.059 + .004)
T
0.45 ± 0.01
(.018 ± .004)
Reel Dimensions
180 +0/-3.0
(7.087 +0/-.118)
A
60.0
(2.362)
B Min.
C
13.0 ± 1.0
(.512 ± .039)
W
9.0 ± 1.0
(.354 ± .039)
T
11.4 ± 2.0
(.449 ± .079)
T
DIMENSIONS:
MM
(INCHES)
W
BOTTOM
TAPE
A
DIA.
C DIA.
DO
PO
E
TOP
TAPE
B
B
DIA.
F
PAPER
TAPE
RESISTOR
TAPE
T
A
P1
W
P2
DIRECTION OF UNREELING
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications