NT IA SinglFuse™ SF-0402F Series Features ■ Thin film chip fuse oH S CO M PL ■ Single blow fuse for overcurrent *R ■ ■ ■ ■ protection 1005 (EIA 0402) miniature footprint Fast-acting fuse UL certified RoHS compliant* and halogen free ■ Surface mount packaging for automated assembly SF-0402F Series - Fast Acting Surface Mount Fuses Electrical Characteristics Rated Current Resistance Fusing Time (Amps) (mΩ) Typ.* SF-0402F050 0.50 320 SF-0402F075 0.75 110 SF-0402F080 0.80 120 SF-0402F100 1.00 90 SF-0402F125 1.25 67 Open within 1 SF-0402F150 1.50 51 min. at 200 % SF-0402F160 1.60 46 rated current SF-0402F200 2.00 33 SF-0402F250 2.50 25 SF-0402F300 3.00 20 SF-0402F315 3.15 19 SF-0402F400 4.00 16 *Resistance value was measured with less than 10 % of rated current. Model Rated Voltage Breaking Capacity DC 24 V DC24 V 35 A Typical I2t (A2s) 0.00317 0.0049 0.00532 0.00724 0.01344 0.01356 0.01672 0.01983 0.03763 0.05427 0.06304 0.0896 Reliability Testing Parameter Requirement Test Method Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current Interrupting Ability .................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm, Bending: 3 mm,1time, 30 seconds Resistance to Solder Heat........................ ±20 % ........................................................260 °C ±5 °C,10 seconds ±1 second Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface temperature Resistance to Dry Heat............................. ±20 % ........................................................105 °C ±5 °C,1000 hours Resistance to Solvent............................... No evident damage on protective .............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating and marking Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles Typical Part Marking How to Order Represents total content. Layout may vary. SF - 0402 F 050 - 2 SinglFuse™ Product Designator SMD Footprint 1005 (EIA 0402) size RATING CURRENT (A) F = 0.50 N = 1.60 • = 0.75 S = 2.00 K = 0.80 T = 2.50 L = 1.00 3 = 3.00 M = 1.25 U = 3.15 P = 1.50 W = 4.00 Fuse Blow Type F = Fast acting S = Slow blow Rated Current 050-400 (500 mA - 4.00 A) Packaging Type - 2 = Tape & Reel (10,000 pcs./reel) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com SinglFuse™ SF-0402F Series Applications ■ Portable memory ■ Cell phones ■ LCD monitors ■ Rechargeable battery packs ■ Disk drives ■ Battery chargers ■ PDAs ■ Set top boxes ■ Digital cameras ■ Industrial controllers ■ DVDs SF-0402F Series - Fast Acting Surface Mount Fuses Solder Reflow Recommendations 250 Peak: 250 +0/-5 °C TEMPERATURE (°C) 230 °C or higher 200 PRE-HEATING ZONE 180 °C PEAK: 250 +0/-5 °C, 5 seconds PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds 150 °C 150 90 ± 30 Seconds 100 30 ± 10 Seconds SOLDERING ZONE 50 HEATING TIME Product Dimensions Recommended Pad Layout 1.0 ± 0.1 (.039 ± .004) 0.381 (.015) 0.35 ± 0.05 (.014 ± .002) 0.52 ± 0.05 (.020 ± .002) 0.558 (.022) 0.25 ± 0.1 (.010 ± .004) 0.2 ± 0.1 (.008 ± .004) 0.25 ± 0.1 (.010 ± .004) 0.2 ± 0.1 (.008 ± .004) DIMENSIONS: PACKAGING: 10,000 pcs./reel 1.55 (.061) MM (INCHES) Thermal Derating Curve Construction & Material Content PERCENT OF RATING (%) 120 OVERCOAT 110 Sn PLATING 100 FUSE ELEMENT Cu / Ni PLATING 90 CERAMIC SUBSTRATE 80 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications SF-0402F Series - Fast Acting Surface Mount Fuses Minimum I2T V Clear Time Curves Average Time Current Curves 100 1.50 A 1.25 A 1.00 A 0.80 A 0.75 A 0.50 A 100 1.60 A 2.00 A 2.50 A 3.00 A 3.15 A 4.00 A 4.00 A 3.15 A 3.00 A 2.50 A 2.00 A 1.60 A 1.50 A 1.25 A 1.00 A 0.80 A 0.75 A 10 MIN. I2T (A2 SEC) CLEARING TIME (S) 10 1 0.50 A 1 0.1 0.1 0.01 0.001 0.1 0.01 1 10 100 CURRENT (A) 0.001 0.001 0.01 0.1 CLEARING TIME (S) REV. B 12/08 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications 1 3312 - 2 mm SMD Trimming SF-0402F Series Tape and ReelPotentiometer Specifications SF-0402F Series per EIA 481-2 Tape Dimensions W 8.0 ± 0.2 (.315 ± .008) P0 4.0 ± 0.1 (.157 ± .004) P1 2.0 ± 0.1 (.079 ± .004) P2 2.0 ± 0.05 (.079 ± .002) A 0.7 ± 0.05 (.028 ± .002) B 1.2 ± 0.05 (.047 ± .002) F 3.5 ± 0.05 (.138 ± .002) E 1.75 ± 0.1 (.069 ± .004) D0 1.5 + 0.1 (.059 + .004) T 0.45 ± 0.01 (.018 ± .004) Reel Dimensions 180 +0/-3.0 (7.087 +0/-.118) A 60.0 (2.362) B Min. C 13.0 ± 1.0 (.512 ± .039) W 9.0 ± 1.0 (.354 ± .039) T 11.4 ± 2.0 (.449 ± .079) T DIMENSIONS: MM (INCHES) W BOTTOM TAPE A DIA. C DIA. DO PO E TOP TAPE B B DIA. F PAPER TAPE RESISTOR TAPE T A P1 P2 DIRECTION OF UNREELING Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications W